CN103819679A - Preparation method for single-component POSS/addition type silicon resin nanocomposite - Google Patents
Preparation method for single-component POSS/addition type silicon resin nanocomposite Download PDFInfo
- Publication number
- CN103819679A CN103819679A CN201410073582.6A CN201410073582A CN103819679A CN 103819679 A CN103819679 A CN 103819679A CN 201410073582 A CN201410073582 A CN 201410073582A CN 103819679 A CN103819679 A CN 103819679A
- Authority
- CN
- China
- Prior art keywords
- poss
- add
- silanol
- silicone resin
- composite material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002114 nanocomposite Substances 0.000 title claims abstract description 45
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title abstract description 6
- 229920005989 resin Polymers 0.000 title abstract description 6
- 239000011347 resin Substances 0.000 title abstract description 6
- 229910052710 silicon Inorganic materials 0.000 title abstract description 6
- 239000010703 silicon Substances 0.000 title abstract description 6
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000000047 product Substances 0.000 claims abstract description 15
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 13
- 125000000524 functional group Chemical group 0.000 claims abstract description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000006227 byproduct Substances 0.000 claims abstract description 11
- 239000003112 inhibitor Substances 0.000 claims abstract description 11
- 239000003054 catalyst Substances 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 44
- 229920002050 silicone resin Polymers 0.000 claims description 41
- 238000006243 chemical reaction Methods 0.000 claims description 28
- 125000003545 alkoxy group Chemical group 0.000 claims description 20
- 238000002156 mixing Methods 0.000 claims description 16
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 14
- 239000012752 auxiliary agent Substances 0.000 claims description 11
- 229920000642 polymer Polymers 0.000 claims description 11
- FSIJKGMIQTVTNP-UHFFFAOYSA-N bis(ethenyl)-methyl-trimethylsilyloxysilane Chemical compound C[Si](C)(C)O[Si](C)(C=C)C=C FSIJKGMIQTVTNP-UHFFFAOYSA-N 0.000 claims description 10
- -1 catalyzer Substances 0.000 claims description 10
- 230000006837 decompression Effects 0.000 claims description 10
- 229960000935 dehydrated alcohol Drugs 0.000 claims description 10
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- 239000001257 hydrogen Substances 0.000 claims description 8
- 229910052697 platinum Inorganic materials 0.000 claims description 7
- 239000012265 solid product Substances 0.000 claims description 7
- 239000008367 deionised water Substances 0.000 claims description 6
- 229910021641 deionized water Inorganic materials 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 claims description 5
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 4
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 claims description 4
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 claims description 4
- 239000003153 chemical reaction reagent Substances 0.000 claims description 3
- 238000006460 hydrolysis reaction Methods 0.000 claims description 3
- 238000006068 polycondensation reaction Methods 0.000 claims description 3
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 3
- AUEJBKCWXPYRGZ-UHFFFAOYSA-N 1,1'-biphenyl diethoxysilane Chemical compound C(C)O[SiH2]OCC.C1(=CC=CC=C1)C1=CC=CC=C1 AUEJBKCWXPYRGZ-UHFFFAOYSA-N 0.000 claims description 2
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 claims description 2
- 239000012429 reaction media Substances 0.000 claims description 2
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 claims 1
- 239000011259 mixed solution Substances 0.000 abstract 3
- 230000002194 synthesizing effect Effects 0.000 abstract 2
- 239000003431 cross linking reagent Substances 0.000 abstract 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 20
- 239000007787 solid Substances 0.000 description 20
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 10
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 10
- 239000003643 water by type Substances 0.000 description 10
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 238000013019 agitation Methods 0.000 description 5
- 150000001298 alcohols Chemical class 0.000 description 5
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 238000001291 vacuum drying Methods 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 239000013339 polymer-based nanocomposite Substances 0.000 description 2
- 150000003384 small molecules Chemical class 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 229910002808 Si–O–Si Inorganic materials 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000003968 arylidene group Chemical group [H]C(c)=* 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000012074 organic phase Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 125000002769 thiazolinyl group Chemical group 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
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- Silicon Polymers (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410073582.6A CN103819679B (en) | 2014-03-03 | 2014-03-03 | A kind of preparation method of one pack system POSS/ add-on type silicones nano composite material |
Applications Claiming Priority (1)
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CN201410073582.6A CN103819679B (en) | 2014-03-03 | 2014-03-03 | A kind of preparation method of one pack system POSS/ add-on type silicones nano composite material |
Publications (2)
Publication Number | Publication Date |
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CN103819679A true CN103819679A (en) | 2014-05-28 |
CN103819679B CN103819679B (en) | 2016-09-21 |
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CN201410073582.6A Active CN103819679B (en) | 2014-03-03 | 2014-03-03 | A kind of preparation method of one pack system POSS/ add-on type silicones nano composite material |
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104387590A (en) * | 2014-11-07 | 2015-03-04 | 广州市白云化工实业有限公司 | Antenna-structure cage-type organic silicon resin, and preparation method and application thereof |
CN104525260A (en) * | 2014-12-25 | 2015-04-22 | 江南大学 | Polymeric solid acid catalyst for esterification reaction and preparation method thereof |
CN104610549A (en) * | 2015-01-29 | 2015-05-13 | 苏州大学 | Modified fluorine-containing silicone oil and preparation method thereof |
CN105368053A (en) * | 2015-11-23 | 2016-03-02 | 苏州盖德精细材料有限公司 | Single-component organosilicon heat-conducting glue and preparation method thereof |
CN106243982A (en) * | 2016-08-31 | 2016-12-21 | 阜南县大自然工艺品有限公司 | A kind of nano double component rattan paint and preparation method thereof |
CN107090238A (en) * | 2016-12-23 | 2017-08-25 | 宁波慧谷特种纤维科技有限公司 | A kind of POSS crosslinkings polyarylate ultraviolet light solidified protection coating and preparation method thereof |
CN107936254A (en) * | 2017-11-24 | 2018-04-20 | 李伟文 | LED chip bonds the synthetic method with organosilicon Special Resin |
CN110387054A (en) * | 2019-08-14 | 2019-10-29 | 北京化工大学 | A kind of preparation method of low-cost transparent hydridization silicon rubber |
CN116769317A (en) * | 2023-08-11 | 2023-09-19 | 揭阳市顺佳和化工有限公司 | Preparation process of high-strength polyvinyl chloride resin material |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109651615A (en) * | 2017-10-12 | 2019-04-19 | 弗洛里光电材料(苏州)有限公司 | Nano hybridization molecular compound and application containing multiple si-h bonds and phenyl |
Citations (7)
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JP2008084986A (en) * | 2006-09-26 | 2008-04-10 | Matsushita Electric Works Ltd | Sealant for optical semiconductor, and semiconductor optical device |
CN101974227A (en) * | 2010-05-20 | 2011-02-16 | 复旦大学 | Low-stress epoxy/organic silicon/POSS nano hybrid material, and preparation method and application thereof |
JP4639685B2 (en) * | 2004-07-26 | 2011-02-23 | Jsr株式会社 | Photocurable composition and optical waveguide using the same |
CN102181159A (en) * | 2011-03-15 | 2011-09-14 | 杭州师范大学 | Polysilsesquioxane reinforced light emitting diode (LED) encapsulation organic silicon rubber and preparation method thereof |
US20120112211A1 (en) * | 2010-11-05 | 2012-05-10 | Nitto Denko Corporation | Silicone resin, sealing material, and optical semiconductor device |
US20120319154A1 (en) * | 2011-06-16 | 2012-12-20 | Nitto Denko Corporation | Silicone resin composition, encapsulating layer, reflector, and optical semiconductor device |
EP2586831A1 (en) * | 2011-10-25 | 2013-05-01 | Nitto Denko Corporation | Silicone resin composition, encapsulating layer, reflector, and optical semiconductor device |
-
2014
- 2014-03-03 CN CN201410073582.6A patent/CN103819679B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4639685B2 (en) * | 2004-07-26 | 2011-02-23 | Jsr株式会社 | Photocurable composition and optical waveguide using the same |
JP2008084986A (en) * | 2006-09-26 | 2008-04-10 | Matsushita Electric Works Ltd | Sealant for optical semiconductor, and semiconductor optical device |
CN101974227A (en) * | 2010-05-20 | 2011-02-16 | 复旦大学 | Low-stress epoxy/organic silicon/POSS nano hybrid material, and preparation method and application thereof |
US20120112211A1 (en) * | 2010-11-05 | 2012-05-10 | Nitto Denko Corporation | Silicone resin, sealing material, and optical semiconductor device |
CN102181159A (en) * | 2011-03-15 | 2011-09-14 | 杭州师范大学 | Polysilsesquioxane reinforced light emitting diode (LED) encapsulation organic silicon rubber and preparation method thereof |
US20120319154A1 (en) * | 2011-06-16 | 2012-12-20 | Nitto Denko Corporation | Silicone resin composition, encapsulating layer, reflector, and optical semiconductor device |
EP2586831A1 (en) * | 2011-10-25 | 2013-05-01 | Nitto Denko Corporation | Silicone resin composition, encapsulating layer, reflector, and optical semiconductor device |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104387590B (en) * | 2014-11-07 | 2017-01-18 | 广州市白云化工实业有限公司 | Antenna-structure cage-type organic silicon resin, and preparation method and application thereof |
CN104387590A (en) * | 2014-11-07 | 2015-03-04 | 广州市白云化工实业有限公司 | Antenna-structure cage-type organic silicon resin, and preparation method and application thereof |
CN104525260A (en) * | 2014-12-25 | 2015-04-22 | 江南大学 | Polymeric solid acid catalyst for esterification reaction and preparation method thereof |
CN104610549A (en) * | 2015-01-29 | 2015-05-13 | 苏州大学 | Modified fluorine-containing silicone oil and preparation method thereof |
CN104610549B (en) * | 2015-01-29 | 2017-03-29 | 苏州大学 | A kind of modified fluoride-containing silicone oil and preparation method thereof |
CN105368053A (en) * | 2015-11-23 | 2016-03-02 | 苏州盖德精细材料有限公司 | Single-component organosilicon heat-conducting glue and preparation method thereof |
CN105368053B (en) * | 2015-11-23 | 2018-06-12 | 苏州盖德精细材料有限公司 | A kind of single-component organic silicon heat-conducting glue and preparation method thereof |
CN106243982A (en) * | 2016-08-31 | 2016-12-21 | 阜南县大自然工艺品有限公司 | A kind of nano double component rattan paint and preparation method thereof |
CN107090238A (en) * | 2016-12-23 | 2017-08-25 | 宁波慧谷特种纤维科技有限公司 | A kind of POSS crosslinkings polyarylate ultraviolet light solidified protection coating and preparation method thereof |
CN107090238B (en) * | 2016-12-23 | 2019-06-18 | 宁波海格拉新材料科技有限公司 | A kind of POSS crosslinking polyarylate ultraviolet light solidified protection coating and preparation method thereof |
CN107936254A (en) * | 2017-11-24 | 2018-04-20 | 李伟文 | LED chip bonds the synthetic method with organosilicon Special Resin |
CN110387054A (en) * | 2019-08-14 | 2019-10-29 | 北京化工大学 | A kind of preparation method of low-cost transparent hydridization silicon rubber |
CN116769317A (en) * | 2023-08-11 | 2023-09-19 | 揭阳市顺佳和化工有限公司 | Preparation process of high-strength polyvinyl chloride resin material |
CN116769317B (en) * | 2023-08-11 | 2023-12-12 | 揭阳市顺佳和化工有限公司 | Preparation process of high-strength polyvinyl chloride resin material |
Also Published As
Publication number | Publication date |
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CN103819679B (en) | 2016-09-21 |
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Effective date of registration: 20170817 Address after: 336002 Jiangxi Yuanzhou Yichun Medicine Park Bin Jiang special mechanical and electrical industry base Patentee after: JIANGXI PROVINCE HANGYU NEW MATERIAL Co.,Ltd. Address before: 330096 Nanchang East Road, Jiangxi, No. 7777 Patentee before: Institute of Applied Chemistry, Jiangxi Academy of Sciences |
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Application publication date: 20140528 Assignee: Jiangxi Hangyu Electronic Material Co.,Ltd. Assignor: JIANGXI PROVINCE HANGYU NEW MATERIAL Co.,Ltd. Contract record no.: X2023980052595 Denomination of invention: A preparation method for single component POSS/addition molded silicone resin nanocomposites Granted publication date: 20160921 License type: Common License Record date: 20231215 |