CN104974475A - Chip packaging material for computer - Google Patents
Chip packaging material for computer Download PDFInfo
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- CN104974475A CN104974475A CN201510414278.8A CN201510414278A CN104974475A CN 104974475 A CN104974475 A CN 104974475A CN 201510414278 A CN201510414278 A CN 201510414278A CN 104974475 A CN104974475 A CN 104974475A
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Abstract
The invention relates to a chip packaging material for a computer. The chip packaging material comprises the following components, by mass: 15-19 parts of an o-cresol formaldehyde epoxy resin, 6-12 parts of methylene diphenyl diisocyanate, 4-8 parts of vinyltrimethoxy silane, 18-22 parts of phenylvinylsilicone oil, 8-10 parts of a phenyl hydrogen-containing silicon resin, 3-5 parts of ethylene glycol diglycidyl ether, 6-10 parts of methylhexahydrophthalic anhydride, 8-12 parts of poly-p-phenylene terephthalamide, and 8-10 parts of a nanometer vinylmethyl MQ silicon resin. According to the invention, by optimizing the chip packaging material for the computer, the refractive index, hardness, and bonding strength of the chip packaging material for the computer are obviously improved. The chip packaging material, prepared by a method in the invention, for the computer has the shore hardness from 68A to 74A, and the bonding strength from 6.8 MPa to 7.6 MPa.
Description
Technical field
The present invention relates to a kind of computer chip encapsulation material, belong to computer chip technology field.
Background technology
Computer chip is that an electronic component contains thousands upon thousands resistance capacitance and other little elements in a computer chip in fact.Computer has a lot of chips, the black that memory bar lastblock is one piece is rectangular is chip, and mainboard, hard disk, video card etc. have a lot of chips, and CPU is also block computer chip, and only he is more more complicated than common computer chip more accurate.Chip has South Bridge chip, north bridge chips, and chip is the heart of mainboard, and CPU is the heart of computer.But chip has divided multiple, and such as CPU also can say as being chip, and also have display card chip, sound card chip etc., their major part is calculating effect.For the encapsulation of chip, need to adopt suitable material, require to possess certain characteristic.
Summary of the invention
The object of the present invention is to provide a kind of computer chip encapsulation material, to encapsulate for computer chip better, improve the result of use of computer chip.
To achieve these goals, technical scheme of the present invention is as follows.
A kind of computer chip encapsulation material, is made up of the component of following mass fraction: o-cresol formaldehyde epoxy resin is 15 ~ 19 parts, MDI 6 ~ 12 parts, vinyltrimethoxy silane are 4 ~ 8 parts, phenyl-vinyl silicon oil is 18 ~ 22 parts, phenyl Silicon Containing Hydrogen resin is 8 ~ 10 parts, ethylene glycol diglycidylether is 3 ~ 5 parts, methyl hexahydrophthalic anhydride 6 ~ 10 parts, PPTA 8 ~ 12 parts, vinyl methyl nano MQ silicon resin 8 ~ 10 parts.
Further, above-mentioned packaged material, is made up of the component of following mass fraction: o-cresol formaldehyde epoxy resin is 17 parts, MDI 9 parts, vinyltrimethoxy silane are 6 parts, phenyl-vinyl silicon oil is 20 parts, phenyl Silicon Containing Hydrogen resin is 9 parts, ethylene glycol diglycidylether is 4 parts, methyl hexahydrophthalic anhydride 8 parts, PPTA 10 parts, vinyl methyl nano MQ silicon resin 9 parts.
The preparation method of above-mentioned packaged material is following steps:
(1) o-cresol formaldehyde epoxy resin, MDI, o-cresol formaldehyde epoxy resin, the ethylene glycol diglycidylether of above-mentioned mass fraction is got, dissolve after o-cresol formaldehyde epoxy resin, MDI, phenyl Silicon Containing Hydrogen resin, ethylene glycol diglycidylether four kinds of composition heating, be stirred to after dissolving and mix;
(2) add the vinyltrimethoxy silane of above-mentioned mass fraction, phenyl-vinyl silicon oil and clout again, stir;
(3) mixture is carried out deaeration in vacuum defoamation machine, inclined heated plate is 3h;
(4) added in mould by mixture and be cured, solidification value is 140 DEG C ~ 150 DEG C, is cooled to room temperature after solidification, prepares computer chip encapsulation material.
Further, above-mentioned material performance is as follows:
(1) o-cresol formaldehyde epoxy resin: the multi-functional epoxy resin of a kind of line style phenolic aldehyde thermotolerance; be widely used as the capsulation material of the electronic components such as semi-conductor equipment, unicircuit; to protect electronic component from environmental corrosion, keep product performance and work-ing life.
(2) MDI: the main raw material producing urethane, manufactures rigid foam lagging material, high-performance flex foam, reaction injection moulding goods, tackiness agent, coating, synthetic leather etc.
(3) vinyltrimethoxy silane: universal organo silane coupling agent, is mainly used in doing polyvinyl crosslinking agents; Fiberglass surface treating agent; Synthesis speciality coating; The surperficial damp-proof treatment of electronic devices and components; The surface treatment etc. of inorganic silicon-containing filler.
(4) phenyl-vinyl silicon oil: mainly for the manufacture of high-power height refraction LED organic silicon packaging glue, the embedding of photoelectricity, electronics and microelectronic industry, sealing, bonding and coating, high printing opacity, high rigidity eyeglass and user other purposes independently developed, film hardness after this product solidification is large, specific refractory power is high, and light transmission is good, has stronger solvent resistant water tolerance and resistance to ablating radiation, simultaneously resistance to elevated temperatures is good, not the advantage such as thickening.Made product have that ageing resistance is strong, anti-ultraviolet property is good and life-time service without the excellent specific property of xanthochromia.
(5) phenyl Silicon Containing Hydrogen resin: high light transmittance can high refraction performance.Extremely low volatile matter and foreign matter content, foreign matter content is less than 50ppm.The snappiness of good film-forming properties, appropriateness, and corrosion-resistant, uvioresistant irradiation.
(6) ethylene glycol diglycidylether: normal mixing with bisphenol A type epoxy resin is used as low-viscosity mixture, casting material, steeping fluid, sizing agent, modifier, fabric-treating agent etc.Also the reactive thinner of epoxy resin, the stablizer of clorafin is used as.
(7) methyl hexahydrophthalic anhydride: be mainly used in epoxy curing agent, be mainly used in electric and electronic applications, it has the advantages such as fusing point title complex viscosity that is low, that form with cycloaliphatic epoxy resin is low, working life is grown, the thermotolerance of cured article is high, electrical properties in high temperatures is good, can be used for the sealing of the dipping of electric installation coil and the casting of electrical element and semi-conductor.
(8) PPTA: have high heat resistance, second-order transition temperature is more than 300 DEG C, and heat decomposition temperature is up to 560 DEG C, and placing strength retention after 48 hours in 180 DEG C of air is 84%.High-tensile and initial elastic modulus, at fibre strength 0.215 newton/dawn, at modulus 4.9 ~ 9.8 newton/dawn, specific tenacity is 5 times of steel.Thermal contraction and creep property are stablized, and also have high-insulativity and chemical resistance in addition.
(9) vinyl methyl nano MQ silicon resin: have benefited from its long-chain globular molecule structure, gives its premium properties such as good mechanical property and high-low temperature resistant, electric insulation, protection against the tide, waterproof.High light transmittance energy, transmittance can reach more than 98%.Physical strength is excellent, and resistance to atmospheric performance is remarkable, can use for a long time under-30 DEG C ~ 250 DEG C environment.The snappiness of good film-forming properties, appropriateness, and corrosion-resistant, uvioresistant irradiation.
This beneficial effect of the invention is: the present invention, by being optimized the packaged material of computer chip, improves the specific refractory power of computer chip encapsulation material, hardness and cohesive strength significantly.The computer chip encapsulation material shore hardness that method of the present invention prepares is 68A to 74A, and cohesive strength is 6.8MPa to 7.6MPa.
Embodiment
Below in conjunction with embodiment, the specific embodiment of the present invention is described, better to understand the present invention.
embodiment 1
Computer chip encapsulation material in the present embodiment, is made up of the component of following mass fraction: o-cresol formaldehyde epoxy resin is 15 parts, MDI 6 parts, vinyltrimethoxy silane are 4 parts, phenyl-vinyl silicon oil is 18 parts, phenyl Silicon Containing Hydrogen resin is 8 parts, ethylene glycol diglycidylether is 3 parts, methyl hexahydrophthalic anhydride 6 parts, PPTA 8 parts, vinyl methyl nano MQ silicon resin 8 parts.
Above-mentioned encapsulation preparation method is following steps:
(1) o-cresol formaldehyde epoxy resin of above-mentioned mass fraction, MDI, phenyl Silicon Containing Hydrogen resin, ethylene glycol diglycidylether is got, dissolve after o-cresol formaldehyde epoxy resin, MDI, phenyl Silicon Containing Hydrogen resin, ethylene glycol diglycidylether four kinds of composition heating, be stirred to after dissolving and mix;
(2) add the vinyltrimethoxy silane of above-mentioned mass fraction, phenyl-vinyl silicon oil and clout again, stir;
(3) mixture is carried out deaeration in vacuum defoamation machine, inclined heated plate is 3h;
(4) added in mould by mixture and be cured, solidification value is 140 DEG C, is cooled to room temperature after solidification, prepares computer chip encapsulation material.
The computer chip encapsulation material shore hardness that method of the present invention prepares is 68A, and cohesive strength is 6.8MPa.
embodiment 2
Computer chip encapsulation material in the present embodiment, is made up of the component of following mass fraction: o-cresol formaldehyde epoxy resin is 17 parts, MDI 9 parts, vinyltrimethoxy silane are 6 parts, phenyl-vinyl silicon oil is 20 parts, phenyl Silicon Containing Hydrogen resin is 9 parts, ethylene glycol diglycidylether is 4 parts, methyl hexahydrophthalic anhydride 8 parts, PPTA 10 parts, vinyl methyl nano MQ silicon resin 9 parts.
Above-mentioned encapsulation preparation method is following steps:
(1) o-cresol formaldehyde epoxy resin, MDI, o-cresol formaldehyde epoxy resin, the ethylene glycol diglycidylether of above-mentioned mass fraction is got, dissolve after o-cresol formaldehyde epoxy resin, MDI, phenyl Silicon Containing Hydrogen resin, ethylene glycol diglycidylether four kinds of composition heating, be stirred to after dissolving and mix;
(2) add the vinyltrimethoxy silane of above-mentioned mass fraction, phenyl-vinyl silicon oil and clout again, stir;
(3) mixture is carried out deaeration in vacuum defoamation machine, inclined heated plate is 3h;
(4) added in mould by mixture and be cured, solidification value is 145 DEG C, is cooled to room temperature after solidification, prepares computer chip encapsulation material.
The shore hardness of the computer chip encapsulation material that method of the present invention prepares is 72A, and cohesive strength is 7.4MPa.
embodiment 3
Computer chip encapsulation material in the present embodiment, is made up of the component of following mass fraction: o-cresol formaldehyde epoxy resin is 19 parts, MDI 12 parts, vinyltrimethoxy silane are 8 parts, phenyl-vinyl silicon oil is 22 parts, phenyl Silicon Containing Hydrogen resin is 10 parts, ethylene glycol diglycidylether is 5 parts, methyl hexahydrophthalic anhydride 10 parts, PPTA 12 parts, vinyl methyl nano MQ silicon resin 10 parts.
Above-mentioned encapsulation preparation method is following steps:
(1) o-cresol formaldehyde epoxy resin, MDI, o-cresol formaldehyde epoxy resin, the ethylene glycol diglycidylether of above-mentioned mass fraction is got, dissolve after o-cresol formaldehyde epoxy resin, MDI, phenyl Silicon Containing Hydrogen resin, ethylene glycol diglycidylether four kinds of composition heating, be stirred to after dissolving and mix;
(2) add the vinyltrimethoxy silane of above-mentioned mass fraction, phenyl-vinyl silicon oil and clout again, stir;
(3) mixture is carried out deaeration in vacuum defoamation machine, inclined heated plate is 3h;
(4) added in mould by mixture and be cured, solidification value is 150 DEG C, is cooled to room temperature after solidification, prepares computer chip encapsulation material.
The shore hardness of the computer chip encapsulation material that method of the present invention prepares is 74A, and cohesive strength is 7.6MPa.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (2)
1. a computer chip encapsulation material, is characterized in that: be made up of the component of following mass fraction: o-cresol formaldehyde epoxy resin is 15 ~ 19 parts, MDI 6 ~ 12 parts, vinyltrimethoxy silane are 4 ~ 8 parts, phenyl-vinyl silicon oil is 18 ~ 22 parts, phenyl Silicon Containing Hydrogen resin is 8 ~ 10 parts, ethylene glycol diglycidylether is 3 ~ 5 parts, methyl hexahydrophthalic anhydride 6 ~ 10 parts, PPTA 8 ~ 12 parts, vinyl methyl nano MQ silicon resin 8 ~ 10 parts.
2. computer chip encapsulation material according to claim 1, is characterized in that: the preparation method of described packaged material is following steps:
(1) o-cresol formaldehyde epoxy resin of above-mentioned mass fraction, MDI, phenyl Silicon Containing Hydrogen resin, ethylene glycol diglycidylether is got, dissolve after o-cresol formaldehyde epoxy resin, MDI, phenyl Silicon Containing Hydrogen resin, ethylene glycol diglycidylether four kinds of composition heating, be stirred to after dissolving and mix;
(2) add the vinyltrimethoxy silane of above-mentioned mass fraction, phenyl-vinyl silicon oil and clout again, stir;
(3) mixture is carried out deaeration in vacuum defoamation machine, inclined heated plate is about 3h;
(4) added in mould by mixture and be cured, solidification value is about 140 DEG C ~ 150 DEG C, is cooled to room temperature after solidification, prepares computer chip encapsulation material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510414278.8A CN104974475A (en) | 2015-07-15 | 2015-07-15 | Chip packaging material for computer |
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| CN201510414278.8A CN104974475A (en) | 2015-07-15 | 2015-07-15 | Chip packaging material for computer |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105419247A (en) * | 2015-12-11 | 2016-03-23 | 安徽律正科技信息服务有限公司 | Computer chip packaging material |
| CN107980052A (en) * | 2017-06-01 | 2018-05-01 | 苏州佳亿达电器有限公司 | LED encapsulation material with high temperature resistant and ageing-resistant performance |
| CN109336787A (en) * | 2018-12-06 | 2019-02-15 | 黑龙江大学 | Multifunctional polyurethane derivative and its preparation method and application containing tertiary aromatic amine structure and tetraphenyl ethylene group |
| CN111004606A (en) * | 2019-11-15 | 2020-04-14 | 西安思后网络科技有限公司 | Chip packaging material for computer and preparation method thereof |
| CN116606528A (en) * | 2023-07-18 | 2023-08-18 | 成都上泰科技有限公司 | Toughening modified epoxy resin high polymer for wide bandgap semiconductor packaging and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105419247A (en) * | 2015-12-11 | 2016-03-23 | 安徽律正科技信息服务有限公司 | Computer chip packaging material |
| CN107980052A (en) * | 2017-06-01 | 2018-05-01 | 苏州佳亿达电器有限公司 | LED encapsulation material with high temperature resistant and ageing-resistant performance |
| CN109336787A (en) * | 2018-12-06 | 2019-02-15 | 黑龙江大学 | Multifunctional polyurethane derivative and its preparation method and application containing tertiary aromatic amine structure and tetraphenyl ethylene group |
| CN111004606A (en) * | 2019-11-15 | 2020-04-14 | 西安思后网络科技有限公司 | Chip packaging material for computer and preparation method thereof |
| CN116606528A (en) * | 2023-07-18 | 2023-08-18 | 成都上泰科技有限公司 | Toughening modified epoxy resin high polymer for wide bandgap semiconductor packaging and preparation method thereof |
| CN116606528B (en) * | 2023-07-18 | 2023-09-29 | 成都上泰科技有限公司 | Toughening modified epoxy resin high polymer for wide bandgap semiconductor packaging and preparation method thereof |
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Application publication date: 20151014 |