CN109868104A - A kind of flexible epoxy glue and preparation method thereof - Google Patents
A kind of flexible epoxy glue and preparation method thereof Download PDFInfo
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- CN109868104A CN109868104A CN201910149179.XA CN201910149179A CN109868104A CN 109868104 A CN109868104 A CN 109868104A CN 201910149179 A CN201910149179 A CN 201910149179A CN 109868104 A CN109868104 A CN 109868104A
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- component
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- epoxy glue
- flexible epoxy
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- 229920006335 epoxy glue Polymers 0.000 title claims abstract description 34
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 239000003822 epoxy resin Substances 0.000 claims abstract description 18
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 18
- 229920000570 polyether Polymers 0.000 claims abstract description 18
- 239000003054 catalyst Substances 0.000 claims abstract description 11
- 229920002635 polyurethane Polymers 0.000 claims abstract description 11
- 239000004814 polyurethane Substances 0.000 claims abstract description 11
- ROSDSFDQCJNGOL-UHFFFAOYSA-N protonated dimethyl amine Natural products CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 claims abstract description 7
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 claims abstract description 6
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims abstract description 6
- -1 hexamethylene dimethylamine Chemical compound 0.000 claims abstract description 5
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 15
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 14
- 229920005862 polyol Polymers 0.000 claims description 14
- 150000003077 polyols Chemical class 0.000 claims description 14
- 238000003756 stirring Methods 0.000 claims description 14
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 8
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical group CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 5
- 239000012948 isocyanate Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 claims description 5
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 4
- 229960004889 salicylic acid Drugs 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 claims description 2
- 150000002924 oxiranes Chemical class 0.000 claims description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 2
- 229940106691 bisphenol a Drugs 0.000 claims 2
- 150000003851 azoles Chemical class 0.000 claims 1
- 239000003085 diluting agent Substances 0.000 claims 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 1
- 150000005846 sugar alcohols Polymers 0.000 claims 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 4
- 230000035939 shock Effects 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- KSCAZPYHLGGNPZ-UHFFFAOYSA-N 3-chloropropyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)CCCCl KSCAZPYHLGGNPZ-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
The present invention relates to a kind of flexible epoxy glue and preparation method thereof, including component A and B component；In parts by mass, the formula of the component A is as follows: 90~100 parts of TDI, 430~640 parts of polyethers, 4000~5000 parts of epoxy resin, 40~100 parts of organosilicon；The formula of the B component is as follows: 1,3- 80~100 parts of hexamethylene dimethylamine, 140~170 parts of epoxy propane butyl ether, 4~10 parts of catalyst.The present invention uses organosilicon and polyurethane modified epoxy resin, can not only increase flexibility, improves shock resistance, antistripping ability, it can also be ensured that epoxy resin is not crystallized at 0 DEG C.Solidfied material temperature tolerance, elongation at break are substantially improved.
Description
Technical field
The present invention relates to a kind of epoxy glues and preparation method thereof, and in particular to a kind of flexible epoxy glue and preparation method thereof.
Background technique
Currently, domestic and international market is improving epoxy adhesive temperature tolerance on this, four-functional group epoxy resin is mostly used greatly
Or novolac epoxy resin and polysulfones compound are used cooperatively.Use single rubber or polyurethanes for epoxy curing compound increase
Flexibility.Four-functional group epoxy resin temperature tolerance is good, and due to containing amino, activity is big, and Storage period shortens.Novolac epoxy resin is resistance to
Warm performance boost is limited, and about 120 DEG C.High-temperature plastic on the market needs to be heating and curing more, cumbersome.
Do not have epoxy adhesive modified, solidfied material is generally partially crisp, antistripping, shock resistance, and anti-cracking performance is poor.It uses
Temperature range is limited, and generally 0 DEG C to 100 DEG C.Lower than 0 DEG C, epoxy resin crystal influences to be higher than 100 DEG C, ring using operation
The decline of oxygen condensate performance is obvious, cannot be chronically under high-temperature work environment.
Summary of the invention
The purpose of the present invention is to provide a kind of flexible epoxy glue, the flexible epoxy glue includes component A and B component, is pressed
Mass parts meter, the component A include as following formula:
The formula of the component A is as follows:
The formula of the B component is as follows:
1,3- 80~110 parts of hexamethylene dimethylamine
140~170 parts of epoxy propane butyl ether
4-10 parts of catalyst.
Preferably, in parts by mass, the component A includes as following formula:
The formula of the B component is as follows:
The mass ratio of component A and B component is 1.5~2.5:1, preferably 2:1 in the flexible epoxy glue.
Present invention further propose that, the polyether polyol is selected from polyether polyol 3050,3010 and of polyether polyol
At least one of polyether polyol 2070；
Wherein, 3050,3010,2070 size for representing degree of functionality and molecular weight.
Wherein, when the polyether polyol specifically selects polyethers 3050 and polyethers 3010 simultaneously, effect is best.
Present invention further propose that, the epoxy resin in bisphenol a resin E51 and bisphenol a resin E44 at least
It is a kind of.
Wherein, E51, E44 routinely represent epoxide number.
The activity of organosilicon of the present invention is larger, and when reaction is easy to produce particle, in preparation process, needs suitable control
Reaction rate and reaction temperature.
Present invention further propose that, the organosilicon is selected from γ-chloropropyl triethoxysilane, N- phenyl-γ-ammonia third
At least one of base trimethoxy silane；Preferably γ-chloropropyl triethoxysilane.
The γ-chloropropyl triethoxysilane thermal stability is high, high temperature resistant, and can effectively improve the flexible of solidfied material
Property.
Present invention further propose that, the catalyst is selected from methylimidazole, salicylic acid, three-(dimethylamino methyls)
Phenol；
Preferably, the catalyst is methylimidazole and salicylic mixture；
It is highly preferred that the catalyst is the methylimidazole and salicylic acid of 1:1.
The present invention provides a kind of preferred embodiment, and the flexible epoxy glue includes component A and B component, in parts by mass, described
Component A includes as following formula:
The formula of the B component is as follows:
Or, the flexible epoxy glue includes component A and B component, in parts by mass, the component A includes as following formula:
The formula of the B component is as follows:
The preferred embodiment further provided for, the flexible epoxy glue include component A and B component, in parts by mass, the A
Component includes as following formula:
The formula of the B component is as follows:
Another object of the present invention is to provide a kind of preparation methods of above-mentioned flexible epoxy glue, wherein the component A
Preparation method the following steps are included:
1) polyether polyol is mixed with toluene di-isocyanate(TDI), is placed at a temperature of 70~90 DEG C, with 150~250rpm
Revolving speed stir 3~5h after, be cooled to 25~35 DEG C, organosilicon be added, modified polyurethane is made；
2) epoxy resin is heated to 70~90 DEG C, modified polyurethane made from step 1) is added, temperature is maintained, with 150
The revolving speed of~250rpm stir be cooled to room temperature after 3~5h to get；
The preparation method of the B component specifically: by epoxy propane butyl ether and 1, the mixing of 3- hexamethylene dimethylamine is placed in 70
At a temperature of~90 DEG C, after stirring 3.5~5.5h with the revolving speed of 200~300rpm, temperature is adjusted to 30~50 DEG C, adds and urges
Agent, stir evenly to get.
Present invention further propose that, the preparation method of the component A the following steps are included:
1) polyether polyol is mixed with toluene di-isocyanate(TDI), is placed at a temperature of 75~85 DEG C, with 180~220rpm
Revolving speed stir 3.5~4.5h after, be cooled to 28~32 DEG C, organosilicon be added, modified polyurethane is made；
2) epoxy resin is heated to 75~85 DEG C, modified polyurethane made from step 1) is added, temperature is maintained, with 180
The revolving speed of~220rpm stir be cooled to room temperature after 3.5~4.5h to get；
The preparation method of the B component specifically: by epoxy propane butyl ether and 1, the mixing of 3- hexamethylene dimethylamine is placed in 75
At a temperature of~85 DEG C, after stirring 4.2~4.7h with the revolving speed of 230~270rpm, temperature is adjusted to 35~45 DEG C, adds and urges
Agent, stir evenly to get.
The present invention at least has the advantages that
1, the present invention uses organosilicon and polyurethane modified epoxy resin, can not only increase flexibility, improves anti-impact
It hits, antistripping ability, it can also be ensured that epoxy resin is not crystallized at 0 DEG C, is also the liquid of trickling.Solidfied material temperature tolerance at least mentions
High by 40% or more, elongation at break promotes 2 times or more.
2, each component acts synergistically, and durothermic simultaneously in raising component A, the temperature tolerance of B component is also obviously improved；And
And the mutual compatibility effect of each component, it is further provided its reactivity.
Specific embodiment
The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention..
Polyether polyol is purchased from DOW Chemical, epoxy resin purchased from the three wooden groups in following examples.
Embodiment 1
The present embodiment provides a kind of flexible epoxy glue, the flexible epoxy glue is made of component A and B component；By mass parts
Meter, the formula of the component A are as follows:
The formula of the B component is as follows:
Embodiment 2
The present embodiment provides a kind of flexible epoxy glue, the flexible epoxy glue is made of component A and B component；By mass parts
Meter, the formula of the component A are as follows:
The formula of the B component is as follows:
Embodiment 3
The present embodiment provides a kind of flexible epoxy glue, the flexible epoxy glue is made of component A and B component；By mass parts
Meter, the formula of the component A are as follows:
The formula of the B component is as follows:
Embodiment 4
The present embodiment provides a kind of flexible epoxy glue, the flexible epoxy glue is made of component A and B component；By mass parts
Meter, the formula of the component A are as follows:
The formula of the B component is as follows:
Embodiment 5
The present embodiment provides a kind of flexible epoxy glue, the difference from embodiment 1 is that by organosilicon γ-three ethoxy of chloropropyl
Base silane replaces with N- phenyl-γ-aminopropyltrimethoxysilane.
Embodiment 6
The present embodiment provides a kind of preparation methods of flexible epoxy glue, wherein the preparation method of the component A includes following
Step:
1) polyether polyol is mixed with toluene di-isocyanate(TDI), is placed at a temperature of 80 DEG C, stirred with the revolving speed of 200rpm
After mixing 4h, 28~32 DEG C are cooled to, organosilicon is added, modified polyurethane is made；
2) epoxy resin is heated to 80 DEG C, modified polyurethane made from step 1) is added, temperature is maintained, with 200rpm's
Revolving speed stirring 4h after be cooled to room temperature to get；
The preparation method of the B component specifically: by epoxy propane butyl ether and 1, the mixing of 3- hexamethylene dimethylamine is placed in 80
At a temperature of DEG C, after stirring 4.5h with the revolving speed of 250rpm, temperature is adjusted to 40 DEG C hereinafter, adding catalyst, is stirred evenly,
To obtain the final product.
Comparative example 1
This comparative example provides a kind of flexible epoxy glue, the difference from embodiment 1 is that be added without toluene di-isocyanate(TDI) and
Polyether polyol；It is prepared using the identical method of embodiment 6.
Test example 1
Using 7124 adhesive shear strength measuring method of GB/T and GB/T 2567-2008 resin-cast body performance test
Method detects epoxy glue obtained by Examples 1 to 5 and comparative example 1, the result is as follows:
Table 1
Test example 2
The storage at 0 DEG C that is placed in of Examples 1 to 5, comparative example 1 and Commercial epoxy resins is compared,.
After 60min, the component A of comparative example 1 and Commercial epoxy resins obviously becomes crystalloid, loses trickling property, can not
Operation；Epoxy resin form provided by Examples 1 to 5 is kept intact.
Although above having used general explanation, specific embodiment and test, the present invention is made to retouch in detail
It states, but on the basis of the present invention, it can be made some modifications or improvements, this is apparent to those skilled in the art
's.Therefore, these modifications or improvements without departing from theon the basis of the spirit of the present invention, belong to claimed
Range.
Claims (10)
1. a kind of flexible epoxy glue, which is characterized in that including component A and B component；In parts by mass, the component A includes as follows
Formula:
The formula of the B component is as follows:
1,3- 80~110 parts of hexamethylene dimethylamine
140~170 parts of epoxy propane butyl ether
4~10 parts of catalyst.
2. flexible epoxy glue according to claim 1, which is characterized in that in parts by mass, the component A includes matching as follows
Side:
The formula of the B component is as follows:
3. flexible epoxy glue according to claim 1 or 2, which is characterized in that the mass ratio of component A and B component be 1.5~
2.5:1 preferably 2:1.
4. any flexible epoxy glue according to claim 1~3, which is characterized in that the polyether polyol is selected from polyethers
At least one of polyalcohol 3050, polyether polyol 3010 and polyether polyol 2070.
5. flexible epoxy glue according to any one of claims 1 to 4, which is characterized in that the epoxy resin is selected from bisphenol-A tree
At least one of rouge E51 and bisphenol a resin E44.
6. any flexible epoxy glue according to claim 1~5, which is characterized in that the organosilicon is selected from γ-chloropropyl
At least one of triethoxysilane, N- phenyl-γ-aminopropyltrimethoxysilane.
7. any flexible epoxy glue according to claim 1~6, which is characterized in that the catalyst is selected from dimethyl miaow
Azoles, salicylic acid, three-(dimethylamino methyl) phenol；
Preferably, the catalyst is methylimidazole and salicylic mixture；
It is highly preferred that the catalyst is the methylimidazole and salicylic acid of 1:1.
8. flexible epoxy glue according to claim 1, in parts by mass, which is characterized in that the component A includes matching as follows
Side:
The formula of the B component is as follows:
9. flexible epoxy glue according to claim 1, in parts by mass, which is characterized in that the formula of the component A is such as
Under:
The formula of the B component is as follows:
10. the preparation method of any flexible epoxy glue of claim 1~9, which is characterized in that the preparation side of the component A
Method the following steps are included:
1) polyether polyol is mixed with toluene di-isocyanate(TDI), is placed at a temperature of 70~90 DEG C, with turning for 150~250rpm
After 3~5h of speed stirring, 25~35 DEG C are cooled to, organosilicon is added, modified polyurethane is made；
2) epoxy resin is heated to 70~90 DEG C, modified polyurethane made from step 1) is added, maintain temperature, with 150~
The revolving speed of 250rpm stir be cooled to room temperature after 3~5h to get；
The preparation method of the B component specifically: by epoxide diluent and 1, the mixing of 3- hexamethylene dimethylamine is placed in 70~90 DEG C
At a temperature of, after stirring 3.5~5.5h with the revolving speed of 200~300rpm, temperature is adjusted to 30~50 DEG C, catalyst is added, stirs
Mix uniformly to get.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910149179.XA CN109868104B (en) | 2019-02-28 | 2019-02-28 | Flexible epoxy adhesive and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910149179.XA CN109868104B (en) | 2019-02-28 | 2019-02-28 | Flexible epoxy adhesive and preparation method thereof |
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| CN109868104A true CN109868104A (en) | 2019-06-11 |
| CN109868104B CN109868104B (en) | 2021-06-29 |
Family
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115011297A (en) * | 2022-07-15 | 2022-09-06 | 北京新风航天装备有限公司 | Adhesive for ceramic materials and preparation method thereof |
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