CN106281174A - A kind of high tenacity, impact resistance, high flexibility epoxy pouring sealant and preparation method thereof - Google Patents
A kind of high tenacity, impact resistance, high flexibility epoxy pouring sealant and preparation method thereof Download PDFInfo
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- CN106281174A CN106281174A CN201610841333.6A CN201610841333A CN106281174A CN 106281174 A CN106281174 A CN 106281174A CN 201610841333 A CN201610841333 A CN 201610841333A CN 106281174 A CN106281174 A CN 106281174A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5026—Amines cycloaliphatic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/04—Polymer mixtures characterised by other features containing interpenetrating networks
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- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
- Sealing Material Composition (AREA)
Abstract
The invention discloses a kind of high tenacity, impact resistance, high flexibility epoxy pouring sealant, including component A and B component, in parts by weight, the composition of described component A includes following raw material: epoxy resin toughened 0～130 part, bisphenol A type epoxy resin 5～20 parts, reactive diluent 1～18 parts, thixotropic agent 1～10 parts, aluminium oxide 160～320 parts；The composition of described B component includes following raw material: Flexible Curing Agent 20～50 parts, hyperbranched firming agent 25～50 parts, accelerator 1～5 parts；Component A is (10:1)～(20:1) with the mass ratio of B component.The preparation method of the present invention carries out dispensing according to the formula of A, B component respectively and mixes.The epoxy resin of the present invention not only glue pliability also has heat resistance and the rigidity of excellence.
Description
Technical field
The present invention relates to casting glue technical field, particularly relate to a kind of high tenacity, impact resistance, high flexibility epoxy pouring sealant and
Its preparation method.
Background technology
Epoxy resin refers to the organic high molecular compound in molecule containing two or more epoxide groups, and it has
Good dielectric properties, mechanical property, adhesive property and corrosion resistance, and cure shrinkage and linear expansion coefficient little, solidfied material
Size is the most stable, has splendid combination property.Owing to epoxy resin has fabulous electric insulating quality and operative weldability
It is widely used in embedding field.
The product using epoxy resin to carry out embedding protection has fabulous globality and dimensional stability, can effectively extend
The service life of 2～3 times.But cause greatly due to crosslink density after common epoxy resin cure that fragility is big, impact resistance
Difference, the breaking strain amplitude of material is little, easy to crack；And meeting is often as swollen with the line of packed material after epoxy resin cure
Swollen coefficient differs, and interface disengagement, bulge etc. easily occurs when variation of ambient temperature.These factors the most all limit
The epoxy fill-sealing materials application in some field, therefore, studies always people to the increasing tougheness of epoxy resin solidifying system
Important research direction to modified epoxy.
The appearance of flexible-epoxy casting glue, changes people it has long been believed that epoxy resin cured product is fragility material
The concept of material, has widened the application of epoxy pouring sealant greatly, has even designed soft some field research staff
Property epoxy resin replace organic silicon rubber and polyurethane material, a brand-new field has been opened up in the application for epoxy resin.?
Electric insulation aspect, increasing tougheness epoxy glue is used for electrician's mould material, contributes to solving long-standing problem transformator, transformer, electricity
The problem that the electric products such as sub-switch ftracture during using, improves the service life of product；In power electronics embedding field, increase
The epoxy glue of toughness can improve the cohesive force between resin and inner components, reduces the cracking because variations in temperature causes, guarantor
The problem protecting inefficacy, improves the operational reliability of product.The most common epoxy resin roughening processing method has a lot, as utilized
Resin macromolecular chain segment and the little intermolecular interaction force replacing macromolecular chain intersegmental that interacts；As added little molecule
Increasing tougheness diluent makes solidfied material reduce vitrification point, gives epoxy glue pliability, to improve its elongation at break and impact
Intensity, but this method of modifying is often due to crosslink density causes its solidfied material rigidity not enough not；Also having method is at resin
Middle interpolation elastomer such as polyurethane, vinylite, acrylic resin, chlorinated rubber, carboxybutyl rubber etc. carry out physics altogether
Mixed, but this kind of modification mode is not being blended on molecular level truly, can reduce its thermostability on the contrary.
Summary of the invention
The technical problem to be solved in the present invention is to overcome the deficiencies in the prior art, it is provided that a kind of high tenacity, impact resistance, Gao Rou
Property epoxy pouring sealant and preparation method thereof.
For solving above-mentioned technical problem, the technical scheme that the present invention proposes is:
A kind of high tenacity, impact resistance, high flexibility epoxy pouring sealant, including component A and B component, in parts by weight, described A
The composition of component includes following raw material:
The composition of described B component includes following raw material:
Flexible Curing Agent 20～50 parts,
Hyperbranched firming agent 25～50 parts,
Accelerator 1～5 parts；
Wherein, in described epoxy pouring sealant, the mass ratio of component A and B component is (10:1)～(20:1).
Above-mentioned epoxy pouring sealant, it is preferred that described hyperbranched firming agent is hyperbranched polyethyleneimine and isophorone
The compound of diamidogen.
Above-mentioned epoxy pouring sealant, it is preferred that described Flexible Curing Agent is polyether amine firming agent；Described polyether amine is solid
Agent is D230, D400, D2000, D4000, HK-511, ED-600, ED-900, ED-2003, EDR-148, EDR-selected from model
176, one or more in T-403, T-3000, T-5000, XTJ-436.
Above-mentioned epoxy pouring sealant, it is preferred that described epoxy resin toughened selected from acrylonitrile butadiene rubber modified bisphenol-A epoxy tree
In fat, acrylonitrile butadiene rubber modified bisphenol F epoxy resin, polyfunctionality glycidyl ether type epoxy resin, phenol aldehyde type epoxy resin
One or more.
Above-mentioned epoxy pouring sealant, it is preferred that described bisphenol A type epoxy resin refers to that epoxide equivalent is 450～1200g/
Eq, softening point are at the high molecular weight bisphenol A type epoxy resin of 45～107 DEG C.0192 type epoxy resin, blue star such as blue star chemical industry
The 0193H type epoxy resin of chemical industry, the 0191H type epoxy resin etc. of blue star chemical industry.Use molecular weight higher epoxy resin energy
Improve mechanical strength and the toughness of epoxy sealing resin solidfied material, and advantageously reduce crosslink density, reduce what solidfied material shrank
Probability, the stability for size has the biggest benefit, it addition, acrylonitrile butadiene rubber modified epoxy resin of arranging in pairs or groups, can give solid
Compound is the most flexible.
Above-mentioned epoxy pouring sealant, it is preferred that described reactive diluent is carboxyl or hydroxy-end capped hyperbranched poly esters
Toughener.Reactive diluent as hyperbranched in CYH-277-S, the hyperbranched reactive diluent of CYH-277 etc..
Above-mentioned epoxy pouring sealant, it is preferred that described aluminium oxide is the particle diameter ball-aluminium oxide in 5～30 μm；Aluminium oxide
It is the inorganic filler with fine heat conductivity, there is heat conductivity high, stable performance, the advantage that price is relatively low；Selecting particle diameter is 5
～30 ball-aluminium oxides of μm, not only sedimentation will be caused serious because particle diameter is too big, also will not be because of the least meeting of particle diameter
The obvious phenomenon of appearance system thickening.
Above-mentioned epoxy pouring sealant, it is preferred that described thixotropic agent is hydrophilic gas phase titanium dioxide prepared by vapour deposition process
Silicon.The R974 aerosil produced such as goldschmidt chemical corporation.Hydrophilic fumed silica can regulate epoxy sealing resin
Viscosity, simultaneously also act reduce alumina packing sedimentation risk, the two is the most collaborative.
Described accelerator selected from DMP-30 (2,4,6 three (dimethylamino methyl) phenol), triethanolamine, resorcinol or
One or more in 2-ethyl-4-methylimidazole.
As a total inventive concept, the present invention also provides for the preparation method of a kind of above-mentioned epoxy pouring sealant, including
Following steps:
(1) prepare component A: by epoxy resin toughened, 5～20 parts of bisphenol A type epoxy resins of 70～130 parts, 1～18 part
Reactive diluent, 1～10 part of thixotropic agent and 160～320 parts of aluminium oxidies add in high speed dispersors and carry out high speed dispersion, obtain
Component A；
(2) B component is prepared: by the Flexible Curing Agents of 20～50 parts, the hyperbranched firming agent of 25～50 parts and the rush of 1～5
Enter in agent addition stirred tank and stir, obtain component B.
Above-mentioned preparation method, it is preferred that in described step (1), the time of high speed dispersion is 25～45min, divides at a high speed
Rotating speed when dissipating is 2500rpm～3500rpm；
In described step (2), the time of stirring is 20～50min, rotating speed 50rpm～100rpm of stirring.
Before using, component A and B component are mixed according to the amount that mass ratio is (10:1)～(20:1), first with 1000r/min
Mixing speed mixing 25～30min, then under the vacuum environment less than-0.1MPa, deaeration processes 30min, i.e. makes described
Epoxy pouring sealant.The time of component A and B component mixing must strictly control, and the shortest two components of incorporation time can not be thoroughly mixed
Uniformly, incorporation time is oversize, and A and B component, it may happen that reaction, do not reach expected effect.
The present invention use flexible molecule chain modified epoxy resin toughened with by carboxyl or hydroxy-end capped hyper-branched polyester
Class active epoxy toughening agent is arranged in pairs or groups, and compounds with isophorone diamine through low-molecular-weight Flexible Curing Agent, hyperbranched polyethyleneimine
After the firming agent solidification that thing is formed, not only make soft segment and epoxy resin " merge " on molecular level, also utilize hyperbranched
Endurable active toughener formation interpenetrating polymer networks, to ensure curable epoxide thing crosslink density, is giving epoxy glue solidfied material pliability
While also ensure that its heat resistance and rigidity.
The present invention use the chain modified increasing tougheness epoxy resin of flexible molecule with by carboxyl or hydroxy-end capped hyperbranched poly
Esters active epoxy toughening agent is arranged in pairs or groups, and coordinates low-molecular-weight Flexible Curing Agent, hyperbranched polyethyleneimine and isophorone diamine
Compound formed firming agent solidification after, make epoxy glue solidfied material have fabulous pliability, its shore hardness A 60～70 it
Between, hot strength ＞ 10MPa, elongation at break ＞ 100%, and solidification casting glue solidification rate is stable, operable time is long, Gu
Change process thermal discharge is little, shrinks little.
Compared with prior art, it is an advantage of the current invention that:
(1) present invention use the chain modified increasing tougheness epoxy resin of flexible molecule with by carboxyl or hydroxy-end capped hyperbranched
Polyesters active epoxy toughening agent collocation is as the base resin of this resin system, and the epoxy resin toughened of chemical modification makes flexibility
Segment can really " merge " with epoxy resin on molecular level, and hyperbranched type toughener can form IPN polymerization in epoxy glue
Thing network, epoxy glue is flexible also ensure that its heat resistance and rigidity simultaneously giving.
(2) present invention uses hyperbranched polyethyleneimine and isophorone diamine compound as firming agent, makes flexible chain
Section (the carbon-carbon bond segment in hyperbranched polyethyleneimine) forms interpenetrating polymer networks to ensure curable epoxide in epoxy glue
Thing crosslink density, thus more effectively reduce the contraction in casting glue solidification process, desirably prevent cracking and formed firm, rich
The resin bed that flexible and heat conductivility is good.
(3) low-molecular-weight Flexible Curing Agent and hyperbranched polyethyleneimine are joined by the present invention with isophorone diamine compound
Close and use the anti-cracking performance of epoxy pouring sealant that also can make the present invention the most excellent.
(4) preparation method of the present invention is the simplest, it is only necessary to each raw material mix homogeneously can be made into A, B component.
Detailed description of the invention
For the ease of understanding the present invention, below in conjunction with preferred embodiment, the present invention is made more comprehensively, describes meticulously,
But protection scope of the present invention is not limited to embodiment in detail below.
Unless otherwise defined, the implication that all technical term used hereinafter is generally understood that with those skilled in the art
Identical.Technical term used herein is intended merely to describe the purpose of specific embodiment, is not intended to limit the present invention
Protection domain.
Except there being special instruction, the various reagent used in the present invention, raw material be can commodity commercially or
The product that person can be prepared by known method.
Embodiment 1:
The high tenacity of a kind of present invention, impact resistance, high flexibility epoxy pouring sealant, including the component A that mass ratio is 10:1 and B
Component, wherein component A is made up of following raw material:
B component is made up of following raw material:
Hensel steps the mixture 35g of D230 Yu T403；
Hyperbranched firming agent (hyperbranched polyethyleneimine and the compound of isophorone diamine) 25g and DMP-302g.
The high tenacity of the present embodiment, impact resistance, the preparation method of high flexibility epoxy pouring sealant, comprise the following steps:
(1) preparation of matrix resin components system (component A): add the nitrile (HTBN) rubber of 70g in high speed dispersor still
The bisphenol A epoxide resin that glue is modified, and it is sequentially added into the CYH-277 over-expense of 0192 type epoxy resin of the blue star chemical industry of 5g, 5g
After changing reactive diluent mix homogeneously, add R974 aerosil and 320g aluminium oxide that 1g goldschmidt chemical corporation produces
(particle diameter is at the ball-aluminium oxide of 5～30 μm), carries out high speed dispersion 25min, rotating speed 2500rpm in high speed dispersor；
(2) preparation of firming agent B component: by the Flexible Curing Agent of the 35g mixture of D230 Yu T403 (Hensel step), 25g
The hyperbranched firming agent compound of isophorone diamine (hyperbranched polyethyleneimine with), the mixture of 2g DMP-30 stirring
Mix stirring 25min, rotating speed 50rpm in still.
Accurately weigh component A and the 5g B component of the above-mentioned preparation of 50g, stir 30min, make epoxy pouring sealant, to its property
Can test, result sees table 1 below.
Embodiment 2:
The high tenacity of a kind of present invention, impact resistance, high flexibility epoxy pouring sealant, including the component A that mass ratio is 15:1 and B
Component, wherein component A is made up of following raw material:
B component is made up of following raw material:
Hensel steps the mixture 20g of D2000 Yu T403；
Hyperbranched firming agent (hyperbranched polyethyleneimine and the compound of isophorone diamine) 40g and triethanolamine 3g.
The high tenacity of the present embodiment, impact resistance, the preparation method of high flexibility epoxy pouring sealant, comprise the following steps:
(1) preparation of matrix resin components system (component A): add the nitrile (HTBN) rubber of 100g in high speed dispersor still
The bisphenol F epoxy resin that glue is modified, and it is sequentially added into the 0193H type epoxy resin of the blue star chemical industry of 10g, the CYH-277-S of 10g
After hyperbranched reactive diluent mix homogeneously, add R974 aerosil and 160g oxidation that 5g goldschmidt chemical corporation produces
Aluminum (particle diameter is at the ball-aluminium oxide of 5～30 μm), carries out high speed dispersion 25min, rotating speed 2500rpm in high speed dispersor；
(2) preparation of firming agent B component: by the Flexible Curing Agent of the 20g mixture of D2000 Yu T403 (Hensel step), 40g
The hyperbranched firming agent compound of isophorone diamine (hyperbranched polyethyleneimine with), the mixture of 3g triethanolamine stirring
Mix stirring 25min, rotating speed 50rpm in still.
Accurately weigh component A and the 5g B component of the above-mentioned preparation of 70g, stir 30min, i.e. make epoxy pouring sealant, to it
Performance is tested, and result sees table 1 below.
Embodiment 3:
The high tenacity of a kind of present invention, impact resistance, high flexibility epoxy pouring sealant, including the component A that mass ratio is 20:1 and B
Component, wherein component A is made up of following raw material:
B component is made up of following raw material:
Hensel steps ED-600 and EDR-176 mixture 50g；
Hyperbranched firming agent (hyperbranched polyethyleneimine and the compound of isophorone diamine) 50g and resorcinol 5g.
The high tenacity of the present embodiment, impact resistance, the preparation method of high flexibility epoxy pouring sealant, comprise the following steps:
(1) preparation of matrix resin components system (component A): add the nitrile (HTBN) rubber of 130g in high speed dispersor still
The bisphenol A epoxide resin that glue is modified, and it is sequentially added into the 0191H type epoxy resin of the blue star chemical industry of 20g, the CYH-277-of 18 parts
After S hyperbranched reactive diluent mix homogeneously, add R974 aerosil and 240 parts that 10 parts of goldschmidt chemical corporation produce
Aluminium oxide (particle diameter is at the ball-aluminium oxide of 5～30 μm), carries out high speed dispersion 25min, rotating speed in high speed dispersor
2500rpm；
(2) preparation of firming agent B component: (Hensel steps the mixing of ED-600 and EDR-176 by the Flexible Curing Agent of 50g
Thing), the hyperbranched firming agent of 50g (hyperbranched polyethyleneimine and the compound of isophorone diamine), 5g resorcinol mixed
Compound stirs 25min, rotating speed 50rpm in stirred tank.
Accurately weigh component A and the 5g B component of the above-mentioned preparation of 100g, stir 30min, i.e. make epoxy pouring sealant, to it
Performance is tested, and result sees table 1 below.
The each embodiment of table 1 prepares epoxy pouring sealant performance test results
As shown in Table 1, the epoxy resin embedding adhesive of the present invention has good mobility, and has fabulous pliability,
During solidification, thermal discharge is low, has fabulous splitting resistance, the most also has the advantage such as high intensity, low-shrinkage, operable time
Long, technological operation is simple, safe and reliable.
Claims (10)
1. a high tenacity, impact resistance, high flexibility epoxy pouring sealant, it is characterised in that include component A and B component, with weight portion
Meter, the composition of described component A includes following raw material:
The composition of described B component includes following raw material:
Flexible Curing Agent 20～50 parts,
Hyperbranched firming agent 25～50 parts,
Accelerator 1～5 parts；
Wherein, in described epoxy pouring sealant, the mass ratio of component A and B component is (10:1)～(20:1).
2. epoxy pouring sealant as claimed in claim 1, it is characterised in that described hyperbranched firming agent is that hyperbranched polyethylene is sub-
Amine and the compound of isophorone diamine.
3. epoxy pouring sealant as claimed in claim 1, it is characterised in that described Flexible Curing Agent is polyether amine firming agent；
Described polyether amine firming agent is D230, D400, D2000, D4000, HK-511, ED-600, ED-900, ED-selected from model
2003, one or more in EDR-148, EDR-176, T-403, T-3000, T-5000, XTJ-436.
4. epoxy pouring sealant as claimed in claim 1, it is characterised in that described epoxy resin toughened selected from acrylonitrile butadiene rubber modified
Bisphenol A epoxide resin, acrylonitrile butadiene rubber modified bisphenol F epoxy resin, polyfunctionality glycidyl ether type epoxy resin, phenolic aldehyde
One or more in type epoxy resin.
5. epoxy pouring sealant as claimed in claim 1, it is characterised in that described bisphenol A type epoxy resin refers to epoxide equivalent
450～1200g/eq, softening point is at the high molecular weight bisphenol A type epoxy resin of 45～107 DEG C.
6. epoxy pouring sealant as claimed in claim 1, it is characterised in that described reactive diluent is carboxyl or hydroxy-end capped
Hyperbranched poly esters toughener.
7. epoxy pouring sealant as claimed in claim 1, it is characterised in that described thixotropic agent be vapour deposition process prepare hydrophilic
Property aerosil.
8. epoxy pouring sealant as claimed in claim 1, it is characterised in that described aluminium oxide is spherical in 5～30 μm of particle diameter
Aluminium oxide；Described accelerator one or several in DMP-30, triethanolamine, resorcinol or 2-ethyl-4-methylimidazole
Kind.
9. the preparation method of the epoxy pouring sealant as described in any one of claim 1～8, it is characterised in that include following
Step:
(1) component A is prepared: by epoxy resin toughened, 5～20 parts of bisphenol A type epoxy resins, work of 1～18 part of 70～130 parts
Property diluent, 1～10 part of thixotropic agent and 160～320 parts of aluminium oxidies add high speed dispersors carry out high speed dispersion, obtain component
A；
(2) B component is prepared: by the Flexible Curing Agents of 20～50 parts, the hyperbranched firming agent of 25～50 parts and the accelerator of 1～5
Add in stirred tank and stir, obtain component B.
10. preparation method as claimed in claim 9, it is characterised in that in described step (1), the time of high speed dispersion is 25
～45min, rotating speed during high speed dispersion is 2500rpm～3500rpm；
In described step (2), the time of stirring is 20～50min, rotating speed 50rpm～100rpm of stirring.
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| CN110699026A (en) * | 2019-10-22 | 2020-01-17 | 亿铖达（深圳）新材料有限公司 | Flexible epoxy pouring sealant |
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| CN112812719A (en) * | 2020-12-30 | 2021-05-18 | 江苏天康电子合成材料有限公司 | High-sealing high-temperature-resistant high-toughness high-flame-retardance electronic pouring sealant |
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| CN112812719A (en) * | 2020-12-30 | 2021-05-18 | 江苏天康电子合成材料有限公司 | High-sealing high-temperature-resistant high-toughness high-flame-retardance electronic pouring sealant |
| CN113563835A (en) * | 2021-08-03 | 2021-10-29 | 宋华杰 | Impervious waterproof adhesive for leakage stoppage on back water surface and preparation method thereof |
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| CN114058305A (en) * | 2021-12-17 | 2022-02-18 | 江苏天康电子合成材料有限公司 | Novel insulating, heat-insulating and anti-seismic sealant and preparation method thereof |
| CN115433532A (en) * | 2022-09-09 | 2022-12-06 | 深圳市安伯斯科技有限公司 | Low-hardness high-toughness two-component epoxy resin pouring sealant and preparation method thereof |
| CN115433532B (en) * | 2022-09-09 | 2023-09-08 | 深圳市安伯斯科技有限公司 | Low-hardness high-toughness double-component epoxy resin pouring sealant and preparation method thereof |
| CN115678209A (en) * | 2022-11-15 | 2023-02-03 | 九牧厨卫股份有限公司 | Resin composition for manufacturing high-pressure die and using method thereof |
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