CN106281174B - A kind of high tenacity, impact resistance, high flexibility epoxy pouring sealant and preparation method thereof - Google Patents
A kind of high tenacity, impact resistance, high flexibility epoxy pouring sealant and preparation method thereof Download PDFInfo
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- CN106281174B CN106281174B CN201610841333.6A CN201610841333A CN106281174B CN 106281174 B CN106281174 B CN 106281174B CN 201610841333 A CN201610841333 A CN 201610841333A CN 106281174 B CN106281174 B CN 106281174B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5026—Amines cycloaliphatic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/04—Polymer mixtures characterised by other features containing interpenetrating networks
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- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Sealing Material Composition (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses a kind of high tenacity, impact resistance, high flexibility epoxy pouring sealants, including component A and B component, in parts by weight, the composition of the component A includes following raw material: epoxy resin toughened 0~130 part, 5~20 parts of bisphenol A type epoxy resin, 1~18 part of reactive diluent, 1~10 part of thixotropic agent, 160~320 parts of aluminium oxide；The composition of the B component includes following raw material: 20~50 parts of Flexible Curing Agent, 25~50 parts of hyperbranched curing agent, and 1~5 part of promotor；The mass ratio of component A and B component is (10:1)~(20:1).Preparation method of the invention carries out ingredient mixing according to the formula of A, B component respectively.Not only glue flexibility also has excellent heat resistance and rigidity to epoxy resin of the invention.
Description
Technical field
The present invention relates to casting glue technical field more particularly to a kind of high tenacity, impact resistance, high flexibility epoxy pouring sealant and
Preparation method.
Background technique
Epoxy resin refers to the organic high molecular compound in molecule containing two or more epoxy groups, has
Good dielectric properties, mechanical property, adhesive property and corrosion resistance, and cure shrinkage and linear expansion coefficient are small, solidfied material
Size is relatively stable, has splendid comprehensive performance.Since epoxy resin has fabulous electric insulating quality and operative weldability
It is widely used in encapsulating field.
There is fabulous globality and dimensional stability using the product that epoxy resin is potted protection, can effectively extend
2~3 times of service life.But since crosslink density leads to greatly that brittleness is big, impact resistance after common epoxy resin cure
The breaking strain amplitude of difference, material is small, easy to crack；And it can be often because swollen with the line of packed material after epoxy resin cure
Swollen coefficient difference, interface disengagement, bulge etc. are easy to appear in variation of ambient temperature.These factors largely all limit
Applications of the epoxy fill-sealing materials in certain fields, therefore, the toughening Journal of Sex Research to epoxy resin solidifying system is always people
To the important research direction of modified epoxy.
The appearance of flexible-epoxy casting glue changes people it has long been believed that epoxy resin cured product is brittleness material
The concept of material has greatly widened the application field of epoxy pouring sealant, or even having designed in certain field research staff will be soft
Property epoxy resin replace organic silicon rubber and polyurethane material, opened up a completely new field for the application of epoxy resin.?
In terms of electric insulation, increasing tougheness epoxy glue is used for electrician's mould material, helps to solve long-standing problem transformer, mutual inductor, electricity
The problem of cracking in the electric products use process such as sub switch, improves the service life of product；In power electronics encapsulating field, increase
The cohesive force between resin and inner components can be improved in the epoxy glue of toughness, reduces because cracking, protecting caused by temperature change
The problem of shield failure, improve the operational reliability of product.Epoxy resin roughening processing method common at present has very much, such as utilizes
Interaction between resin macromolecule segment and small molecule replaces the interaction force between macromolecular chain segment；As added small molecule
Increasing tougheness diluent reduces solidfied material by glass transition temperature, epoxy glue flexibility is assigned, to improve its elongation at break and impact
Intensity, but this method of modifying is often due to crosslink density not enough causes its solidfied material rigidity insufficient；It is in resin there are also method
It is total that middle addition elastomer such as polyurethane, vinylite, acrylic resin, chlorinated rubber, carboxybutyl rubber etc. carries out physics
It is mixed, but such modification mode is not the blending on molecular level truly, can reduce its heat resistance instead.
Summary of the invention
The technical problem to be solved by the present invention is to overcome the deficiencies in the prior art, a kind of high tenacity, impact resistance, Gao Rou are provided
Property epoxy pouring sealant and preparation method thereof.
In order to solve the above technical problems, technical solution proposed by the present invention are as follows:
A kind of high tenacity, impact resistance, high flexibility epoxy pouring sealant, including component A and B component, in parts by weight, the A
The composition of component includes following raw material:
The composition of the B component includes following raw material:
20~50 parts of Flexible Curing Agent,
25~50 parts of hyperbranched curing agent,
1~5 part of promotor；
Wherein, the mass ratio of component A and B component is (10:1)~(20:1) in the epoxy pouring sealant.
Above-mentioned epoxy pouring sealant, it is preferred that the hyperbranched curing agent is hyperbranched polyethyleneimine and isophorone
The compound of diamines.
Above-mentioned epoxy pouring sealant, it is preferred that the Flexible Curing Agent is polyether amine curing agent；The polyether amine is solid
Agent is selected from model D230, D400, D2000, D4000, HK-511, ED-600, ED-900, ED-2003, EDR-148, EDR-
176, one or more of T-403, T-3000, T-5000, XTJ-436.
Above-mentioned epoxy pouring sealant, it is preferred that described epoxy resin toughened selected from acrylonitrile butadiene rubber modified bisphenol-A epoxy tree
Rouge, acrylonitrile butadiene rubber modified bisphenol F epoxy resin, polyfunctionality glycidyl ether type epoxy resin, in phenol aldehyde type epoxy resin
One or more.
Above-mentioned epoxy pouring sealant, it is preferred that the bisphenol A type epoxy resin refers to epoxide equivalent in 450~1200g/
The high molecular weight bisphenol A type epoxy resin of eq, softening point at 45~107 DEG C.Such as 0192 type epoxy resin, the blue star of blue star chemical industry
The 0193H type epoxy resin of chemical industry, 0191H type epoxy resin of blue star chemical industry etc..Using the higher epoxy resin energy of molecular weight
The mechanical strength and toughness of epoxy sealing resin solidfied material are improved, and advantageously reduces crosslink density, reduces what solidfied material was shunk
Possibility has the stability of size very big benefit, in addition, the epoxy resin that collocation is acrylonitrile butadiene rubber modified, can assign solid
Compound is flexible well.
Above-mentioned epoxy pouring sealant, it is preferred that the reactive diluent is carboxyl or hydroxy-end capped hyperbranched poly esters
Toughener.The hyperbranched reactive diluent of such as CYH-277-S, the hyperbranched reactive diluent of CYH-277.
Above-mentioned epoxy pouring sealant, it is preferred that the aluminium oxide is ball-aluminium oxide of the partial size at 5~30 μm；Aluminium oxide
It is the inorganic filler with fine thermal conductivity, has thermal coefficient high, performance is stablized, the lower advantage of price；Select partial size for 5
~30 μm of ball-aluminium oxide not only will not cause sedimentation serious because partial size is too big, will not because of the too small meeting of partial size and
Appearance system thickens obvious phenomenon.
Above-mentioned epoxy pouring sealant, it is preferred that the thixotropic agent is the hydrophily gas phase titanium dioxide of vapour deposition process preparation
Silicon.The R974 fumed silica produced such as goldschmidt chemical corporation.The adjustable epoxy sealing resin of hydrophilic fumed silica
Viscosity, while also acting the risk for reducing alumina packing sedimentation, the two mutually cooperates with.
The promotor be selected from DMP-30 (2,4,6-three (dimethylamino methyl) phenol), triethanolamine, resorcinol or
One or more of 2-ethyl-4-methylimidazole.
The inventive concept total as one, the present invention also provides a kind of preparation methods of above-mentioned epoxy pouring sealant, including
Following steps:
(1) component A is prepared: by 70~130 parts epoxy resin toughened, 5~20 parts of bisphenol A type epoxy resins, 1~18 part
Reactive diluent, 1~10 part of thixotropic agent and 160~320 parts of aluminium oxide be added in high speed dispersers and carry out high speed dispersion, obtain
Component A；
(2) B component is prepared: by 20~50 parts of Flexible Curing Agent, 25~50 parts of hyperbranched curing agent and 1~5 rush
It is added in stirred tank and stirs evenly into agent, obtain component B.
Above-mentioned preparation method, it is preferred that in the step (1), the time of high speed dispersion is 25~45min, high speed point
Revolving speed when dissipating is 2500rpm~3500rpm；
In the step (2), the time of stirring is 20~50min, revolving speed 50rpm~100rpm of stirring.
Component A and B component are mixed according to the amount that mass ratio is (10:1)~(20:1) using preceding, first with 1000r/min
Mixing speed mix 25~30min, then deaeration handles 30min under the vacuum environment less than -0.1MPa, that is, is made described
Epoxy pouring sealant.The time of component A and B component mixing must be strictly controlled, and too short two component of incorporation time cannot be thoroughly mixed
Uniformly, incorporation time is too long, and A and B component may react, and expected effect is not achieved.
The present invention using flexible molecule it is chain modified it is epoxy resin toughened with by carboxyl or hydroxy-end capped hyper-branched polyester
Class active epoxy toughening agent collocation, compounds through low molecular weight Flexible Curing Agent, hyperbranched polyethyleneimine with isophorone diamine
After the curing agent solidification that object is formed, merge soft segment " " with epoxy resin, also using hyperbranched
Endurable active toughener forms interpenetrating polymer networks to guarantee epoxy curing compound crosslink density, is assigning epoxy glue solidfied material flexibility
While also ensure its heat resistance and rigidity.
The present invention is using the chain modified increasing tougheness epoxy resin of flexible molecule and by carboxyl or hydroxy-end capped hyperbranched poly
Esters active epoxy toughening agent collocation, cooperation low molecular weight Flexible Curing Agent, hyperbranched polyethyleneimine and isophorone diamine
Compound formed curing agent solidification after, make epoxy glue solidfied material have fabulous flexibility, shore hardness A 60~70 it
Between, tensile strength > 10MPa, elongation at break > 100%, and solidify casting glue solidification rate and stablize, operable time is long, Gu
Change process thermal discharge is small, shrinks small.
Compared with the prior art, the advantages of the present invention are as follows:
(1) present invention using the chain modified increasing tougheness epoxy resin of flexible molecule with by carboxyl or hydroxy-end capped hyperbranched
The base resin that polyesters active epoxy toughening agent is arranged in pairs or groups as the resin system, the epoxy resin toughened of chemical modification make flexibility
Segment can really " merge " on molecular level with epoxy resin, and hyperbranched type toughener can form interpenetrating polymerization in epoxy glue
Object network, assigning, epoxy glue is flexible while also ensuring its heat resistance and rigidity.
(2) present invention makes flexible chain using hyperbranched polyethyleneimine and isophorone diamine compound as curing agent
Section (the carbon-carbon bond segment in hyperbranched polyethyleneimine) forms interpenetrating polymer networks in epoxy glue to guarantee curable epoxide
Object crosslink density is beneficial to prevent cracking and is formed firm, rich to more effectively reduce the contraction in casting glue solidification process
The good resin layer of flexible and heating conduction.
(3) present invention matches low molecular weight Flexible Curing Agent and hyperbranched polyethyleneimine with isophorone diamine compound
Conjunction, which uses, can also make the anti-cracking performance of epoxy pouring sealant of the invention more excellent.
(4) preparation method of the invention is very simple, it is only necessary to which A, B component can be made by being uniformly mixed each raw material.
Specific embodiment
To facilitate the understanding of the present invention, present invention work more comprehensively, is meticulously described below in conjunction with preferred embodiment,
But the protection scope of the present invention is not limited to the following specific embodiments.
Unless otherwise defined, all technical terms used hereinafter and the normally understood meaning of those skilled in the art
It is identical.Technical term used herein is intended merely to the purpose of description specific embodiment, is not intended to the limitation present invention
Protection scope.
Except there is a special instruction, the various reagents used in the present invention, raw material be can commodity commercially or
Person can the product as made from well known method.
Embodiment 1:
A kind of high tenacity of the invention, impact resistance, high flexibility epoxy pouring sealant, the component A and B for being 10:1 including mass ratio
Component, wherein component A is made of following raw material:
B component is made of following raw material:
Hensel steps the mixture 35g of D230 and T403；
Hyperbranched curing agent (compound of hyperbranched polyethyleneimine and isophorone diamine) 25g and DMP-302g.
The high tenacity of the present embodiment, impact resistance, high flexibility epoxy pouring sealant preparation method, comprising the following steps:
(1) the liquid butyronitrile rubber of 70g the preparation of matrix resin components system (component A): is added in high speed disperser kettle
The modified bisphenol A epoxide resin of glue, and sequentially add the CYH-277 over-expense of 0192 type epoxy resin of the blue star chemical industry of 5g, 5g
Change reactive diluent after mixing, adds the R974 fumed silica and 320g aluminium oxide of the production of 1g goldschmidt chemical corporation
(ball-aluminium oxide of the partial size at 5~30 μm) carries out high speed dispersion 25min, revolving speed 2500rpm in high speed disperser；
(2) preparation of curing agent B component: by Flexible Curing Agent (mixture that Hensel steps D230 and T403), the 25g of 35g
Hyperbranched curing agent (compound of hyperbranched polyethyleneimine and isophorone diamine), 2g DMP-30 mixture stirring
It mixes and stirs 25min in kettle, revolving speed 50rpm.
The component A and 5g B component of the above-mentioned preparation of 50g are accurately weighed, 30min is stirred, epoxy pouring sealant is made, to its property
It can be carried out test, as a result referring to the following table 1.
Embodiment 2:
A kind of high tenacity of the invention, impact resistance, high flexibility epoxy pouring sealant, the component A and B for being 15:1 including mass ratio
Component, wherein component A is made of following raw material:
B component is made of following raw material:
Hensel steps the mixture 20g of D2000 and T403；
Hyperbranched curing agent (compound of hyperbranched polyethyleneimine and isophorone diamine) 40g and triethanolamine 3g.
The high tenacity of the present embodiment, impact resistance, high flexibility epoxy pouring sealant preparation method, comprising the following steps:
(1) the liquid butyronitrile rubber of 100g the preparation of matrix resin components system (component A): is added in high speed disperser kettle
The modified bisphenol F epoxy resin of glue, and sequentially add the CYH-277-S of the 0193H type epoxy resin of the blue star chemical industry of 10g, 10g
Hyperbranched reactive diluent after mixing, adds R974 fumed silica and the 160g oxidation of the production of 5g goldschmidt chemical corporation
Aluminium (ball-aluminium oxide of the partial size at 5~30 μm) carries out high speed dispersion 25min, revolving speed 2500rpm in high speed disperser；
(2) preparation of curing agent B component: by Flexible Curing Agent (mixture that Hensel steps D2000 and T403), the 40g of 20g
Hyperbranched curing agent (compound of hyperbranched polyethyleneimine and isophorone diamine), 3g triethanolamine mixture stirring
It mixes and stirs 25min in kettle, revolving speed 50rpm.
The component A and 5g B component of the above-mentioned preparation of 70g are accurately weighed, 30min is stirred, that is, epoxy pouring sealant is made, to it
Performance is tested, as a result referring to the following table 1.
Embodiment 3:
A kind of high tenacity of the invention, impact resistance, high flexibility epoxy pouring sealant, the component A and B for being 20:1 including mass ratio
Component, wherein component A is made of following raw material:
B component is made of following raw material:
Hensel steps ED-600 and EDR-176 mixture 50g；
Hyperbranched curing agent (compound of hyperbranched polyethyleneimine and isophorone diamine) 50g and resorcinol 5g.
The high tenacity of the present embodiment, impact resistance, high flexibility epoxy pouring sealant preparation method, comprising the following steps:
(1) the liquid butyronitrile rubber of 130g the preparation of matrix resin components system (component A): is added in high speed disperser kettle
The modified bisphenol A epoxide resin of glue, and sequentially add 0191H type epoxy resin, 18 parts of the CYH-277- of the blue star chemical industry of 20g
The hyperbranched reactive diluent of S after mixing, adds the R974 fumed silica and 240 parts that 10 parts of goldschmidt chemical corporations produce
Aluminium oxide (ball-aluminium oxide of the partial size at 5~30 μm) carries out high speed dispersion 25min, revolving speed in high speed disperser
2500rpm；
(2) preparation of curing agent B component: by the Flexible Curing Agent of 50g, (Hensel steps the mixing of ED-600 and EDR-176
Object), the hyperbranched curing agent (compound of hyperbranched polyethyleneimine and isophorone diamine) of 50g, 5g resorcinol it is mixed
It closes object and stirs 25min, revolving speed 50rpm in a stirring kettle.
The component A and 5g B component of the above-mentioned preparation of 100g are accurately weighed, 30min is stirred, that is, epoxy pouring sealant is made, to it
Performance is tested, as a result referring to the following table 1.
Each embodiment of table 1 prepares epoxy pouring sealant performance test results
As shown in Table 1, epoxy resin embedding adhesive of the invention has good mobility, and has fabulous flexibility,
Thermal discharge is low when solidification, has many advantages, such as fabulous splitting resistance, while also having high-intensitive, low-shrinkage, operable time
Long, technological operation is simple, safe and reliable.
Claims (6)
1. a kind of high tenacity, impact resistance, high flexibility epoxy pouring sealant, which is characterized in that including component A and B component, with parts by weight
Meter, the composition of the component A includes following raw material:
It is epoxy resin toughened 70 ~ 130 parts, described epoxy resin toughened selected from acrylonitrile butadiene rubber modified bisphenol-A epoxy
One or more of resin, acrylonitrile butadiene rubber modified bisphenol F epoxy resin；
5~20 parts of bisphenol A type epoxy resin, the bisphenol A type epoxy resin refers to epoxide equivalent in 450~1200 g/
The high molecular weight bisphenol A type epoxy resin of eq, softening point at 45~107 DEG C；
1~18 part of reactive diluent, the reactive diluent is carboxyl or hydroxy-end capped hyperbranched poly esters；
1~10 part of thixotropic agent,
160~320 parts of aluminium oxide；
The composition of the B component includes following raw material:
Curing agent is Flexible Curing Agent and hyperbranched curing agent；
20~50 parts of Flexible Curing Agent, the Flexible Curing Agent is polyether amine curing agent；
25~50 parts of hyperbranched curing agent, the hyperbranched curing agent are hyperbranched polyethyleneimine and isophorone
The compound of diamines；
1~5 part of promotor；
Wherein, the mass ratio of component A and B component is (10:1)~(20:1) in the epoxy pouring sealant.
2. epoxy pouring sealant as described in claim 1, which is characterized in that the polyether amine curing agent is selected from model
D230、D400、D2000、D4000、HK-511、ED-600、ED-900、ED-2003、EDR-148、EDR-176、T-403、T-
3000, one or more of T-5000, XTJ-436.
3. epoxy pouring sealant as described in claim 1, which is characterized in that the thixotropic agent is the hydrophilic of vapour deposition process preparation
Property fumed silica.
4. epoxy pouring sealant as described in claim 1, which is characterized in that the aluminium oxide is spherical shape of the partial size at 5~30 μm
Aluminium oxide；The promotor is selected from one of DMP-30, triethanolamine, resorcinol or 2-ethyl-4-methylimidazole or several
Kind.
5. a kind of preparation method of such as described in any item epoxy pouring sealants of Claims 1 to 4, which is characterized in that including following
Step:
(1) component A is prepared: by 70 ~ 130 parts epoxy resin toughened, 5~20 parts of bisphenol A type epoxy resins, 1~18 part of work
Property diluent, 1~10 part of thixotropic agent and 160~320 parts of aluminium oxide be added in high speed dispersers and carry out high speed dispersion, obtain component
A；
(2) B component is prepared: by 20~50 parts of Flexible Curing Agent, 25~50 parts of hyperbranched curing agent and 1~5 promotor
It is added in stirred tank and stirs evenly, obtain component B.
6. preparation method as claimed in claim 5, which is characterized in that in the step (1), time of high speed dispersion is 25~
45 min, revolving speed when high speed dispersion are the rpm of 2500 rpm~3500；
In the step (2), the time of stirring is 20~50 min, revolving speed 50 rpm~100 rpm of stirring.
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| CN201610841333.6A CN106281174B (en) | 2016-09-22 | 2016-09-22 | A kind of high tenacity, impact resistance, high flexibility epoxy pouring sealant and preparation method thereof |
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