CN102516914A - Halogen-free flame-retardant epoxy resin electronic pouring sealant - Google Patents
Halogen-free flame-retardant epoxy resin electronic pouring sealant Download PDFInfo
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- CN102516914A CN102516914A CN2011103716611A CN201110371661A CN102516914A CN 102516914 A CN102516914 A CN 102516914A CN 2011103716611 A CN2011103716611 A CN 2011103716611A CN 201110371661 A CN201110371661 A CN 201110371661A CN 102516914 A CN102516914 A CN 102516914A
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Abstract
The invention relates to a halogen-free flame-retardant epoxy resin electronic pouring sealant which is formed by mixing an A component and an amine curing agent according to the weight ratio of 100:4-13, wherein the A component comprises the following raw materials in parts by weight: 30-40 parts of halogen-free epoxy resin, 40-65 parts of flame-retardant fillers, 2-7 parts of halogen-free active diluting agents, 2-7 parts of halogen-free liquid flame retardants, 1-5 parts of toughening agents, 0.1-0.5 part of coupling agent and 0.1-0.5 part of pigment. The invention has the beneficial effects that the pouring sealant is free from halogen and satisfies the halogen-free requirements; the flame retardance is independent of a halogen-added flame retardant, so that the environment friendliness is achieved; the fame retardant ability is strong and can achieve the grade UL94-V0; and with the adoption of a double-component system, not only can the room-temperature curing be achieved, but also the thermal curing can be achieved, so that the operation is covneneint.
Description
Technical field
The present invention relates to a kind of joint sealant, relate in particular to a kind of epoxy resin electron pouring sealant of halogen-free flame-retardant, belong to the joint sealant technical field.
Background technology
The epoxy resin electron pouring sealant is because its cured article has cohesiveness, temperature tolerance, electrical insulating property preferably; The good mechanical performance; Good moulding process property and lower advantages such as cost; Being widely used in the embedding and the encapsulation of electronic devices and components, is one of present of paramount importance Electronic Packaging chemical material.Yet the same with most of organic polymer materials, the curable epoxide thing is more inflammable, causes fire easily, annual huge loss of life and personal injury and the property damage of therefore having caused in the whole world.Therefore people have carried out fire-retardant finish to the epoxy pouring sealant that is applied in electric field, have added fire retardant.
What in recent decades, use was maximum is exactly halogenated flame retardant.Its advantage is a flame retardant resistance efficiently, adds in a small amount to reach higher fire-retardant rank, and to less by the influence of ignition resistant substrate inherent physical and mechanical properties.Yet a large amount of hydrogen halide that halogenated flame retardant discharged in when burning are not only toxic but also be corrosive; Can produce carcinogenic substances such as dioxin simultaneously; Also can generate the material that damages the ozone layer in addition, so the healthy halogen flame with the destruction environment of harm humans is forbidden by countries in the world gradually in recent years.To halogen; A plurality of in the world countries and tissue have been put into effect a series of rules; The environmental protection mechanism of many non-government tissues is also promoting non-halogen motion energetically; Some large multinational companies have all formulated corresponding with it environmental requirement simultaneously, comprise that company's statements such as Dell, HP, Apple, Intel, AMD will import halogen-free material from beginning in 2008 in its electronic devices and components, this shows that non-halogen requirement has become a trend of global evolution.Certainly the epoxy resin electron pouring sealant as packaging electronic parts also must satisfy non-halogen requirement.This shows that the epoxy resin electron pouring sealant for preparing high performance halogen-free flame-retardant is a kind of inexorable trend.
Summary of the invention
Technical problem to be solved by this invention provides the epoxy resin electron pouring sealant of the strong halogen-free flame-retardant of a kind of fire retardancy.
The technical scheme that the present invention solves the problems of the technologies described above is following: a kind of epoxy resin electron pouring sealant of halogen-free flame-retardant is mixed by 100: 4～13 weight ratio by A component and amine curing agent; Wherein, said A component is made up of each raw material of following parts by weight: 0.1～0.5 part in 30～40 parts of halogen epoxy resin, 40～65 parts of fire-retardant fillers, 2～7 parts of halogen reactive thinners, 2～7 parts of halogen liquid flame retardants, 1～5 part of toughner, 0.1～0.5 part of coupling agent and colorant.
The invention has the beneficial effects as follows: joint sealant halogen of the present invention, satisfy non-halogen requirement; Flame retardant resistance does not rely on interpolation halogenated flame retardant, environmental protection; Fire retardancy is strong, can reach the UL94-V0 grade; Adopting two component systems is ambient temperature curable, can be heating and curing again, easy to operate.
On the basis of technique scheme, the present invention can also do following improvement.
Further, said amine curing agent is a kind of or any several kinds mixture in aliphatic amide, aliphatic cyclic amine, the polyetheramine.Like triethylene tetramine, isophorone diamine, aminoethyl piperazine, polyetheramine D-230 or polyetheramine D-400 etc.
Adopt the beneficial effect of above-mentioned further scheme to be, i.e. ambient temperature curable, heating curable again, the low viscosity of mixing makes easy construction, and gives good electric property of cured article and mechanical property.
Further, said epoxy resin is a kind of or any several kinds mixture in halogen bisphenol A type epoxy resin, the halogen bisphenol f type epoxy resin.
Adopt the beneficial effect of above-mentioned further scheme to be, give system halogen, low-shrinkage, high bond strength.
Further, said fire-retardant filler is a white lake.
Adopt the beneficial effect of above-mentioned further scheme to be, absorb heat 1.96KJ/g when white lake decomposes, can reduce the temperature of burning surface, good flame retardation effect can reach the UL94-V0 grade standard; The water vapour that generates can be caught obnoxious flavour, reduces smog and poison gas, has the cigarette effect of pressing down; Do not produce toxic gas during decomposition, do not produce the corrodibility products of combustion yet.
Further, said halogen reactive thinner is glycidyl ester type reactive thinner (CARDURA E-10 originates from Hexion).
Adopt the beneficial effect of above-mentioned further scheme to be, give the system halogen, reduce the joint sealant system viscosity, improve manufacturability, improve wellability, increase amount of filler.
Further, said halogen liquid flame retardant is a phosphorus flame retardant, and like the Doher601R of Dongguan Dao Er chemical industry, Qingdao joins FR-XS704, the FR-XS701 that beautifies the worker.
Adopt the beneficial effect of above-mentioned further scheme to be, have good flame retardant resistance, give the system halogen, good with epoxy resin compatibility property, reduce resin viscosity, increase amount of filler.
Further, said toughner is carboxyl end of the liquid acrylonitrile-butadiene rubber (CTBN), hydroxyl terminated butyl nitrile (HTBN) rubber (HTBN).
Adopt the beneficial effect of above-mentioned further scheme to be, improve epoxy resin cured product fragility, improve the epoxy resin cured product anti-cracking performance.
Further, said coupling agent is the organo silane coupling agent of trade mark KH560.
Adopt the beneficial effect of above-mentioned further scheme to be, be of value to the dispersion of filler, can strengthen the filling of filler; Guarantee more media-resistant, water-fast, ageing-resistant of splicing face simultaneously.
Further, said colorant is a black cream.
Adopt the beneficial effect of above-mentioned further scheme to be, in order to satisfy the product appearance requirement.
During use, said A component and amine curing agent are taken by weighing by 100: 4～13 weight ratio, even in stirring at room, solidified 24～48 hours or solidified in 25 ℃ and got final product in 4 hours in 80 ℃.
Embodiment
Below principle of the present invention and characteristic are described, institute gives an actual example and only is used to explain the present invention, is not to be used to limit scope of the present invention.
Embodiment 1
15 parts of bisphenol A type epoxy resin 828EL (originating from Hexion), 15 parts of bisphenol f type epoxy resin 830LVP (originating from big Japanese ink), 65 parts in white lake; 2 parts of CARDURA E-10, Doher 601R2 part, 1 part of carboxyl end of the liquid acrylonitrile-butadiene rubber; 0.1 part of KH560,0.1 part of black cream (Degussa T4 carbon black and 828EL proportional mixing, concrete weight ratio is 2: 8); At room temperature stir, make the A component; Polyetheramine D-400 and isophorone diamine weight ratio are mixed and are formed amine curing agent at 8: 2.A component and amine curing agent mixed by weight 100: 13, and at room temperature vacuum stirring is even, and mixture is poured in the mould and solidified survey cured article flame retardant rating 4 hours in 80 ℃.
Embodiment 2
20 parts of bisphenol A type epoxy resin 828EL (originating from Hexion), 15 parts of bisphenol f type epoxy resin EP-4901E (originating from Japanese Ai Dike), 53 parts in white lake; 4.5 parts of CARDURA E-10,4.5 parts of Doher601R, 2.5 parts of carboxyl end of the liquid acrylonitrile-butadiene rubber; 0.25 part of KH560,0.25 part of black cream (Degussa T4 carbon black and 828EL proportional mixing, concrete weight ratio is 2: 8); At room temperature stir, make the A component; Isophorone diamine is formed amine curing agent.A component and amine curing agent mixed by weight 100: 8.5, and at room temperature vacuum stirring is even, and mixture is poured in the mould and solidified survey cured article flame retardant rating 4 hours in 80 ℃.
Embodiment 3
20 parts of bisphenol A type epoxy resin DER 331P (originating from Tao Shi), 20 parts of bisphenol f type epoxy resin 830LVP (originating from big Japanese ink), 40 parts in white lake; 7 parts of CARDURA E-10, Doher 601R7 part, 5 parts of carboxyl end of the liquid acrylonitrile-butadiene rubber; 0.5 part of KH560,0.5 part of black cream (Degussa T4 carbon black and 828EL proportional mixing, concrete weight ratio is 2: 8); At room temperature stir, make the A component; Triethylene tetramine is formed amine curing agent.A component and amine curing agent mixed by weight 100: 4, and at room temperature vacuum stirring is even, and mixture is poured in the mould and solidified survey cured article flame retardant rating 48 hours in 25 ℃.
Embodiment 4
12 parts of bisphenol A type epoxy resin DER 331P (originating from Tao Shi), 23 parts of bisphenol f type epoxy resin EP-4901E (originating from Japanese Ai Dike), 52 parts in white lake; 4 parts of CARDURA E-10,5 parts of FR-XS704,3.5 parts of hydroxyl terminated butyl nitrile (HTBN) rubber; 0.2 part of KH560,0.3 part of black cream (Degussa T4 carbon black and 828EL proportional mixing, concrete weight ratio is 2: 8); At room temperature stir, make the A component; Aminoethyl piperazine is formed amine curing agent.A component and amine curing agent mixed by weight 100: 7, and at room temperature vacuum stirring is even, and mixture is poured in the mould and solidified survey cured article flame retardant rating 24 hours in 25 ℃.
Embodiment 5
24 parts of bisphenol A type epoxy resin 828EL (originating from Hexion), 14 parts of bisphenol f type epoxy resin 830S (originating from big Japanese ink), 45 parts in white lake; 6.5 parts of CARDURA E-10, FR-XS7016 part, 4 parts of hydroxyl terminated butyl nitrile (HTBN) rubber; 0.3 part of KH560,0.2 part of black cream (Degussa T4 carbon black and 828EL proportional mixing, concrete weight ratio is 2: 8); At room temperature stir, make the A component; Polyetheramine D-230 and isophorone diamine weight ratio are mixed and are formed amine curing agent at 7: 3.A component and amine curing agent mixed by weight 100: 11, and at room temperature vacuum stirring is even, and mixture is poured in the mould and solidified survey cured article flame retardant rating 36 hours in 25 ℃.
Test the performance of epoxy resin electron pouring sealant of the present invention through following test experiments.
Test experiments 1: flame retardant rating test
Embodiment is solidified in the mould of the wide * thickness=125*13*6mm of long *, pouring into the epoxy resin electron pouring sealant that has mixed, obtains the strip sample of the wide * thickness=125*13*6mm of long *.The contrast test that sample that embodiment 1～5 is made according to the normal beam technique of GB/T2408-1996 prescribed by standard and the prepared sample of existing ordinary epoxy resin electron pouring sealant carry out flame retardant rating.Can find out that from the result 5 embodiment can both reach the UL94-V0 flame retardant rating of 6mm thickness, the prepared sample of ordinary epoxy resin electron pouring sealant does not then have flame retardant properties.
The result is as shown in table 1 for the test gained.
Table 1
Test experiments 2: content of halogen test
Embodiment after the burning, is filtered through constant volume in the oxygen bottle for taking by weighing a certain amount of glue appearance, analyzes with ion chromatograph then, obtains the halogen data at last.According to the Halogen standard, cl content≤900ppm, bromine content≤900ppm, overall content of halogen≤1500ppm just calculates and is Halogen (HF).Can find out that from the result 5 embodiment can both satisfy the Halogen requirement; Common epoxy resin electron pouring sealant then can not satisfy the Halogen requirement.
The result is as shown in table 2 for the test gained.
Table 2
Can find out that from above-mentioned data the flame retardant properties of embodiment sample is high, reach the UL94-V0 flame retardant rating; Content of halogen also satisfies non-halogen requirement; The epoxy resin electron pouring sealant of the highly effective flame-retardant that epoxy resin electron pouring sealant of the present invention is one type of halogen is described, is satisfied the requirement of current electric industry encapsulation, vast market is arranged.This be common epoxy resin electron pouring sealant can not accomplish.
The above is merely preferred embodiment of the present invention, and is in order to restriction the present invention, not all within spirit of the present invention and principle, any modification of being done, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. the epoxy resin electron pouring sealant of a halogen-free flame-retardant is characterized in that, is mixed by A component and the amine curing agent weight ratio by 100:4～13; Wherein, said A component is made up of each raw material of following parts by weight: 0.1～0.5 part in 30～40 parts of halogen epoxy resin, 40～65 parts of fire-retardant fillers, 2～7 parts of halogen reactive thinners, 2～7 parts of halogen liquid flame retardants, 1～5 part of toughner, 0.1～0.5 part of coupling agent and colorant.
2. joint sealant according to claim 1 is characterized in that, said amine curing agent is a kind of or any several kinds mixture in aliphatic amide, aliphatic cyclic amine, the polyetheramine.
3. joint sealant according to claim 2 is characterized in that, said amine curing agent is a triethylene tetramine, isophorone diamine, aminoethyl piperazine, a kind of or any several kinds mixture among polyetheramine D-230 or the polyetheramine D-400.
4. joint sealant according to claim 1 is characterized in that, said halogen epoxy resin is a kind of or any several kinds mixture in halogen bisphenol A type epoxy resin, the halogen bisphenol f type epoxy resin.
5. joint sealant according to claim 1 is characterized in that, said fire-retardant filler is a white lake.
6. joint sealant according to claim 1 is characterized in that, said halogen reactive thinner is the glycidyl ester type reactive thinner.
7. joint sealant according to claim 1 is characterized in that, said halogen liquid flame retardant is a phosphorus flame retardant.
8. joint sealant according to claim 1 is characterized in that, said toughner is carboxyl end of the liquid acrylonitrile-butadiene rubber or hydroxyl terminated butyl nitrile (HTBN) rubber.
9. joint sealant according to claim 1 is characterized in that, said coupling agent is an organo silane coupling agent.
10. joint sealant according to claim 1 is characterized in that, said colorant is a black cream.
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| CN2011103716611A CN102516914A (en) | 2011-11-21 | 2011-11-21 | Halogen-free flame-retardant epoxy resin electronic pouring sealant |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102816548A (en) * | 2012-09-10 | 2012-12-12 | 天津滨海津丽电子材料有限公司 | Epoxy resin potting special for high-tension ignition coil of automobile and preparation method thereof |
| CN103468193A (en) * | 2013-09-17 | 2013-12-25 | 广州聚合电子材料有限公司 | Low-halogen low-smell epoxy resin pouring sealant and preparation process thereof |
| CN103666353A (en) * | 2013-11-09 | 2014-03-26 | 高月芳 | Epoxy resin adhesive |
| CN103740060A (en) * | 2013-12-23 | 2014-04-23 | 东莞市亚聚电子材料有限公司 | Low-halogen underfill adhesive and preparation method thereof |
| CN104194703A (en) * | 2014-09-26 | 2014-12-10 | 江南大学 | Halogen-free flame retardant epoxy resin used for electronic packaging material and preparation method of halogen-free flame retardant epoxy resin |
| CN104262904A (en) * | 2014-09-11 | 2015-01-07 | 吴江固德电材系统股份有限公司 | Preparation method of halogen-free flame retardant epoxy casting agent for insulation of electrical apparatus |
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| CN104629261A (en) * | 2015-01-14 | 2015-05-20 | 惠柏新材料科技（上海）有限公司 | Filler-free halogen-free flame-retardant epoxy resin composition |
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| CN105820784A (en) * | 2016-04-26 | 2016-08-03 | 安徽康瑞鑫电子科技有限公司 | Flame-retardant epoxy resin pouring sealant |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002188065A (en) * | 2000-08-07 | 2002-07-05 | Toray Ind Inc | Adhesive composition for semiconductor device and adhesive sheet and cover lay film for semiconductor devices |
| CN101486883A (en) * | 2008-01-14 | 2009-07-22 | 东丽世韩株式会社 | Adhesive composition used for non-halogen coating and coating using the same |
| CN101602925A (en) * | 2008-06-15 | 2009-12-16 | 比亚迪股份有限公司 | A kind of halogen-free ethoxyline resin antiflaming tackiness agent and glued membrane thereof |
| CN101760161A (en) * | 2008-12-24 | 2010-06-30 | 深圳市道尔科技有限公司 | Environmental-protection low halogen-content surface mounting adhesive capable of quick solidification under low temperature |
| CN101875825A (en) * | 2010-04-20 | 2010-11-03 | 新高电子材料（中山）有限公司 | Halogen-free flame retardant adhesive composition and flexible copper-clad plate using same |
| CN101906280A (en) * | 2010-07-27 | 2010-12-08 | 广州宏仁电子工业有限公司 | Halogen-free epoxy adhesive for polyethylene terephthalate (PET) protective film or insulation layer and preparation method thereof |
| CN101948668A (en) * | 2010-09-21 | 2011-01-19 | 广州宏仁电子工业有限公司 | Halogen-free inflaming retarding adhesive for preparing flexible copper clad laminate (CCL) material and preparation method thereof |
| CN101974302A (en) * | 2010-10-19 | 2011-02-16 | 烟台德邦电子材料有限公司 | Low-viscosity and high-heat conduction epoxy resin electronic potting adhesive |
| CN102181252A (en) * | 2011-05-30 | 2011-09-14 | 烟台德邦科技有限公司 | Low-halogen single-component flame-retardant epoxy adhesive |
-
2011
- 2011-11-21 CN CN2011103716611A patent/CN102516914A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002188065A (en) * | 2000-08-07 | 2002-07-05 | Toray Ind Inc | Adhesive composition for semiconductor device and adhesive sheet and cover lay film for semiconductor devices |
| CN101486883A (en) * | 2008-01-14 | 2009-07-22 | 东丽世韩株式会社 | Adhesive composition used for non-halogen coating and coating using the same |
| CN101602925A (en) * | 2008-06-15 | 2009-12-16 | 比亚迪股份有限公司 | A kind of halogen-free ethoxyline resin antiflaming tackiness agent and glued membrane thereof |
| CN101760161A (en) * | 2008-12-24 | 2010-06-30 | 深圳市道尔科技有限公司 | Environmental-protection low halogen-content surface mounting adhesive capable of quick solidification under low temperature |
| CN101875825A (en) * | 2010-04-20 | 2010-11-03 | 新高电子材料（中山）有限公司 | Halogen-free flame retardant adhesive composition and flexible copper-clad plate using same |
| CN101906280A (en) * | 2010-07-27 | 2010-12-08 | 广州宏仁电子工业有限公司 | Halogen-free epoxy adhesive for polyethylene terephthalate (PET) protective film or insulation layer and preparation method thereof |
| CN101948668A (en) * | 2010-09-21 | 2011-01-19 | 广州宏仁电子工业有限公司 | Halogen-free inflaming retarding adhesive for preparing flexible copper clad laminate (CCL) material and preparation method thereof |
| CN101974302A (en) * | 2010-10-19 | 2011-02-16 | 烟台德邦电子材料有限公司 | Low-viscosity and high-heat conduction epoxy resin electronic potting adhesive |
| CN102181252A (en) * | 2011-05-30 | 2011-09-14 | 烟台德邦科技有限公司 | Low-halogen single-component flame-retardant epoxy adhesive |
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| CN102816548B (en) * | 2012-09-10 | 2014-10-15 | 天津滨海津丽电子材料有限公司 | Epoxy resin potting special for high-tension ignition coil of automobile and preparation method thereof |
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| CN104789177A (en) * | 2015-04-08 | 2015-07-22 | 浙江大学 | Nano-modified flame-retardant epoxy electronic pouring sealant and preparation method thereof |
| CN105820784A (en) * | 2016-04-26 | 2016-08-03 | 安徽康瑞鑫电子科技有限公司 | Flame-retardant epoxy resin pouring sealant |
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| CN113637441A (en) * | 2021-08-12 | 2021-11-12 | 长春艾德斯新材料有限公司 | Epoxy resin adhesive capable of being rapidly cured at room temperature and preparation method thereof |
| CN114561178A (en) * | 2022-02-25 | 2022-05-31 | 中国航空制造技术研究院 | Low-density flame-retardant filling adhesive and preparation method thereof |
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