CN211977963U

CN211977963U - Sensor packaging structure and electronic equipment

Info

Publication number: CN211977963U
Application number: CN202020381758.5U
Authority: CN
Inventors: 闫文明
Original assignee: Goertek Microelectronics Inc
Current assignee: Goertek Microelectronics Inc
Priority date: 2020-03-23
Filing date: 2020-03-23
Publication date: 2020-11-20
Anticipated expiration: 2030-03-23

Abstract

The utility model discloses a sensor packaging structure and electronic equipment. The packaging structure comprises: the waterproof breathable film comprises a substrate, a first shell, a second shell and a waterproof breathable film, wherein the first shell is connected with the substrate, the first shell and the substrate are enclosed to form a closed accommodating cavity, the second shell is arranged outside the first shell, the first shell and the second shell are provided with collecting holes which are oppositely arranged, the waterproof breathable film is positioned between the first shell and the second shell and covers two collecting holes, the waterproof breathable film is provided with a sealing part which surrounds the collecting holes, and the sealing part is respectively connected with the first shell and the second shell in a sealing manner.

Description

Sensor packaging structure and electronic equipment

Technical Field

The utility model relates to an packaging structure technical field, more specifically relates to a sensor packaging structure and electronic equipment.

Background

The sensor is widely applied to the Internet system and equipment of the Internet of things system. With the increase of application scenes, the dustproof and waterproof grade requirements on the sensor are higher and higher. The existing sensor packaging structure is usually to attach a waterproof and breathable film to the air holes of the housing. However, the width of the adhesive film is difficult to be made large due to the size of the package structure. When the waterproof breathable film is used, the problem of poor adhesion of the waterproof breathable film often occurs, so that the waterproof grade of the sensor packaging structure is low, and the water leakage of the adhesive surface is serious.

Therefore, a new technical solution is needed to solve the above technical problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a sensor packaging structure's new technical scheme.

According to the utility model discloses an aspect provides a sensor packaging structure. The packaging structure comprises: the waterproof breathable film comprises a substrate, a first shell, a second shell and a waterproof breathable film, wherein the first shell is connected with the substrate, the first shell and the substrate are enclosed to form a closed accommodating cavity, the second shell is arranged outside the first shell, the first shell and the second shell are provided with collecting holes which are oppositely arranged, the waterproof breathable film is positioned between the first shell and the second shell and covers two collecting holes, the waterproof breathable film is provided with a sealing part which surrounds the collecting holes, and the sealing part is respectively connected with the first shell and the second shell in a sealing manner.

Optionally, the collection holes of the first shell are multiple and arranged in an array, and the waterproof breathable film covers the collection holes of the first shell.

Optionally, the aperture of the collecting hole of the first shell is 15 μm-30 μm.

Optionally, the sealing portions are bonded to the first housing and the second housing, respectively.

Optionally, the sealing portion is bonded to the first housing and the second housing respectively by using a pressure-sensitive adhesive or a heat-sensitive adhesive.

Optionally, the first housing or the second housing has a recess in which the collection aperture is formed, the waterproof breathable membrane being disposed within the recess.

Optionally, the first housing and the second housing are attached together at a position outside the groove.

Optionally, the second housing is fastened outside the first housing, the second housing is connected to the substrate, and the second housing and the first housing form an interference fit.

Optionally, the first housing includes a top wall and a side wall, the top wall is opposite to the base plate, the side wall is disposed around the top wall, the side wall is connected to the base plate, and the collecting hole is disposed on at least one of the top wall and the side wall.

According to another embodiment of the present disclosure, an electronic device is provided. The electronic equipment comprises the sensor packaging structure.

According to an embodiment of the present disclosure, the waterproof and dustproof effect and durability of the sensor package structure are better.

Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a cross-sectional view of a sensor package structure according to one embodiment of the present disclosure.

Fig. 2 is a partially enlarged view of a in fig. 1.

Fig. 3 is a top view of a sensor package structure according to one embodiment of the present disclosure.

Description of reference numerals:

11: a first housing; 12: a second housing; 13: a substrate; 14: a collection aperture of the second housing; 15: a collection aperture of the first housing; 16: a groove; 17: a waterproof breathable film; 18: a sealing part; 19: a top wall; 20: a side wall; 21: an MEMS chip; 22: an ASIC chip; 23: and (6) gluing.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

According to one embodiment of the present disclosure, a sensor package structure is provided. As shown in fig. 1 to 3, the package structure includes: the base plate 13, the first shell 11, the second shell 12 and the waterproof breathable film 17. The first housing 11 is connected to the substrate 13. The first housing 11 and the substrate 13 enclose a closed accommodating cavity. The second housing 12 is disposed outside the first housing 11. The first housing 11 and the second housing 12 have oppositely disposed pick-

up apertures

14, 15. The waterproof and breathable film 17 is positioned between the first shell 11 and the second shell 12 and covers the two collecting

holes

14 and 15. The waterproof and breathable film 17 has a sealing portion 18 surrounding the

collection holes

14 and 15, and the sealing portion 18 is hermetically connected to the first shell 11 and the second shell 12 respectively.

In the disclosed embodiment, the sensor package structure includes a first housing 11 and a second housing 12 stacked together. The waterproof breathable film 17 is sandwiched between the first case 11 and the second case 12. The upper and lower sides of the sealing part 18 of the waterproof breathable film 17 are respectively connected with the first shell 11 and the second shell 12 in a sealing way. Compared with the mode that only one side of the waterproof breathable film 17 is connected with the shell in a sealing mode, the connection mode enables the connection strength of the waterproof breathable film 17 and the shell to be effectively improved. The waterproof and dustproof effect and the durability of the sensor packaging structure are better.

Specifically, the sensor package structure is an MEMS package structure, a pressure sensor package structure, a temperature sensor package structure, a chemical sensor package structure, an environmental sensor package structure, or the like. The first housing 11 and the second housing 12 are made of metal, plastic, glass fiber, carbon fiber, or ceramic. The second housing 12 may be entirely covered outside the first housing 11, or may be partially covered outside the first housing 11. The second housing 12 may be fixedly connected to the first housing 11, or may be fixedly connected to the substrate 13. The housing cavity is used for housing a sensor chip (e.g., MEMS microphone chip 21), ASIC chip 22, and the like. The receiving chamber communicates with the external environment through the

collecting holes

14, 15 to collect external information. The

collection wells

14, 15 are circular, rectangular, triangular, oval or other shapes. The aperture of the collecting hole 15 of the first housing 11 is the same as or different from the aperture of the collecting hole 14 of the second housing 12.

The waterproof breathable membrane 17 may be, but is not limited to, a Polyurethane (PU) membrane, a Thermoplastic Polyurethane elastomer (TPU) membrane, and an expanded Poly Tetra fluoro ethylene (ePTFE) membrane. The sealing portion 18 is used for sealing connection with the first housing 11 and the second housing 12, for example, by bonding, hot pressing, or the like.

The substrate 13 is a Printed Circuit Board (PCB). A pad is provided on the substrate 13. The sensor chip is connected to an external circuit through a pad. Of course, the substrate 13 may be made of plastic, metal, ceramic, or the like

The sensor package structure is not limited to the above embodiments, and those skilled in the art may arrange the first case 11, the second case 12, the waterproof breathable film 17, the substrate 13, and the like according to actual needs.

In one example, as shown in fig. 2, the plurality of collecting holes 15 of the first housing 11 are arranged in an array, and the waterproof and breathable film 17 covers the plurality of collecting holes 15 of the first housing 11. The plurality of collecting holes 15 are opposed to one collecting hole 14 of the second housing 12. The plurality of collection wells 15 form micropores. The inner diameter of the micropores is in the order of microns. The aperture of the collecting hole 14 of the second housing 12 is larger than the aperture of the collecting hole 15 of the first housing 11. The waterproof air-permeable membrane 17 covers the plurality of collecting holes 15 of the first housing 11.

In this example, the plurality of collecting holes 15 of the first housing 11 form a grid structure. When being pressed by the outside, the waterproof and breathable film 17 is attached to the grid structure. The grid structure can form the structural support for waterproof ventilated membrane 17, can prevent waterproof ventilated membrane 17 to take place to warp effectively, has reduced the risk that waterproof ventilated membrane 17 is broken by external force.

In one example, the aperture of the collection well 15 of the first housing 11 is 15 μm to 30 μm. In this range, the external gas can smoothly pass through the collecting holes 15, the gas in the accommodating chamber can smoothly pass through the collecting holes 15, and the water-proof gas-permeable membrane 17 can be effectively supported by the high structural strength of the lattice structure formed by the plurality of collecting holes 15.

In one example, the sealing portions 18 are bonded to the first housing 11 and the second housing 12, respectively. For example, the bonding is performed using glue 23. For example, the glue 23 is a sub-sensitive glue or a heat sensitive glue. The two kinds of glues 23 are easy to bond and have strong bonding force. The pressure sensitive adhesive is pressure sensitive and is applied by pressing to adhere the adhesive 23 to the first housing 11 and the second housing 12. The heat-sensitive adhesive 23 is sensitive to heat, and the adhesive 23 is made to adhere to the first housing 11 and the second housing 12 by heating. For example, the pressure-sensitive adhesive is PAS adhesive, the heat-sensitive adhesive is HAF adhesive, and the two adhesives 23 have good adhesion and can resist high-temperature reflow.

For example, the glue 23 is a solid glue. When in use, firstly, the glue 23 is made into a strip shape; then, the glue 23 is provided on the upper and lower surfaces of the sealing part 18; next, the glue 23 is arranged between the two collecting

holes

14, 15 together with the waterproof breathable membrane 17; finally, the glue 23 is made tacky by pressing or heating to form a bond with the first and

second housings

11 and 12, respectively.

In one example, the first housing 11 or the second housing 12 has a groove 16. The collecting hole 15 is formed in the groove 16. The waterproof breathable membrane 17 is arranged in the groove 16.

As shown in fig. 1-2, the first housing 11 is recessed to form a groove 16. In assembly, the waterproof breathable film 17 is placed in the groove 16, and then the second shell 12 is buckled outside the first shell 11. The arrangement of the groove 16 can reduce the gap between the first shell 11 and the second shell 12 outside the groove 16, so that the overall thickness of the first shell 11 and the second shell 12 is reduced, and the space is saved. In this way, the overall volume of the sensor package structure can be reduced.

In addition, the groove 16 can play a role of positioning, which makes the installation accuracy of the waterproof breathable film 17 high.

Of course, the groove 16 may be formed on the second housing 12, or the grooves 16 may be formed on both the first housing 11 and the second housing 12, as long as the gap between the first housing 11 and the second housing 12 can be reduced.

In one example, as shown in fig. 1, the first housing 11 and the second housing 12 are attached together at a portion other than the groove 16. The fitting means that the outer surface of the first housing 11 is in contact with the inner surface of the second housing 12. For example, the shape of the second housing 12 matches the shape of at least part of the first housing 11. The size of the second housing 12 is larger than that of the first housing 11.

When assembled, the second housing 12 can be wrapped around at least a portion of the first housing 11. Since the second housing 12 and the first housing 11 are attached to each other at a portion other than the groove 16, the gap between the first housing 11 and the second housing 12 is minimized, and the overall thickness of the first housing 11 and the second housing 12 is minimized.

In one example, the second housing 12 is snap-fitted to the outside of the first housing 11. The second housing 12 is connected to the substrate 13. The second housing 12 forms an interference fit with the first housing 11.

In this example, the overall structure of the first housing 11 and the second housing 12 match. The second housing 12 is larger in size than the first housing 11, and the second housing 12 entirely covers the first housing 11. And the second housing 12 is connected to the substrate 13 by bonding, welding, or the like. Compared with the connection between the second shell 12 and the first shell 11, the connection between the second shell 12 and the substrate 13 is easier to form, and the connection strength is higher.

In addition, the second shell 12 forms an interference fit with the first shell 11, which makes the relative positions of the first shell 11 and the second shell 12 more fixed, and the first shell 11 and the second shell 12 can form a durable clamping force on the waterproof breathable film 17. This makes the fixing effect of the waterproof breathable film 17 better.

Of course, the first housing 11 and the second housing 12 may be formed with a clearance fit. To form a fixed connection, the two are glued together by glue. The two may not form a direct connection.

In one example, the first housing 11 includes a top wall 19 and a side wall 20. The top wall is opposite the base plate 13. The side walls 20 are disposed around the top wall 19. The side wall 20 is connected to the substrate 13. The collecting hole 15 is provided in at least one of the top wall 19 and the side wall 20.

As shown in fig. 1 to 3, the entirety of the first housing 11 and the second housing 12 is a rectangular parallelepiped. The first housing 11 and the second housing 12 each include a top wall 19 and four side walls 20 disposed around the top wall 19. The top wall 19 is provided with collecting

holes

14 and 15. Compared with the collection holes 14 and 15 formed in the side wall 20, when reflow soldering is performed, heat conducted by the substrate 13 is less likely to be conducted to the top wall 19, and the bonding effect of the waterproof breathable film 17 is not affected.

Of course, it is also possible to provide the collecting

openings

14, 15 in the side wall 20. The first housing 11 and the second housing 12 are not limited to rectangular solids, and may have a cylindrical, circular, prismatic, or the like structure.

According to another embodiment of the present disclosure, an electronic device is provided. The electronic device is, for example, a mobile phone, a tablet computer, a smart watch, a notebook computer, a game machine, a telephone, an earphone, an interphone, or the like. The electronic equipment comprises the sensor packaging structure.

The electronic equipment has the characteristics of good waterproof and dustproof effects and long service life.

In the above embodiments, the differences between the embodiments are described in emphasis, and different optimization features between the embodiments can be combined to form a better embodiment as long as the differences are not contradictory, and further description is omitted here in consideration of brevity of the text.

Although certain specific embodiments of the present invention have been described in detail by way of example, it should be understood by those skilled in the art that the foregoing examples are for purposes of illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A sensor package structure, comprising: the waterproof breathable film comprises a substrate, a first shell, a second shell and a waterproof breathable film, wherein the first shell is connected with the substrate, the first shell and the substrate are enclosed to form a closed accommodating cavity, the second shell is arranged outside the first shell, the first shell and the second shell are provided with collecting holes which are oppositely arranged, the waterproof breathable film is positioned between the first shell and the second shell and covers two collecting holes, the waterproof breathable film is provided with a sealing part which surrounds the collecting holes, and the sealing part is respectively connected with the first shell and the second shell in a sealing manner.

2. The sensor package structure of claim 1, wherein the collection holes of the first housing are multiple and arranged in an array, and the waterproof and breathable membrane covers the collection holes of the first housing.

3. The sensor package structure of claim 2, wherein the aperture of the collection aperture of the first housing is 15 μ ι η -30 μ ι η.

4. The sensor package structure of claim 1, wherein the sealing portions are bonded to the first and second housings, respectively.

5. The sensor package structure of claim 4, wherein the sealing portion is bonded to the first and second housings using a pressure sensitive adhesive or a heat sensitive adhesive, respectively.

6. The sensor package structure of claim 1, wherein the first housing or the second housing has a groove in which the collection hole is formed, the waterproof and breathable membrane being disposed in the groove.

7. The sensor package structure of claim 6, wherein the first housing and the second housing are attached together at a location other than the recess.

8. The sensor package structure of claim 1, wherein the second housing is snap-fit to the outside of the first housing, the second housing is connected to the substrate, and the second housing forms an interference fit with the first housing.

9. The sensor package of claim 1, wherein the first housing includes a top wall opposite the substrate and a side wall disposed around the top wall, the side wall being connected to the substrate, the capture aperture being disposed on at least one of the top wall and the side wall.

10. An electronic device, characterized in that it comprises a sensor package according to any one of claims 1-9.