CN211702388U - Sensor packaging structure and electronic equipment - Google Patents
Sensor packaging structure and electronic equipment Download PDFInfo
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- CN211702388U CN211702388U CN202020390896.XU CN202020390896U CN211702388U CN 211702388 U CN211702388 U CN 211702388U CN 202020390896 U CN202020390896 U CN 202020390896U CN 211702388 U CN211702388 U CN 211702388U
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- casing
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- 238000004806 packaging method and process Methods 0.000 title abstract description 12
- 239000012528 membrane Substances 0.000 claims abstract description 17
- 229920000295 expanded polytetrafluoroethylene Polymers 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 11
- 230000000694 effects Effects 0.000 abstract description 4
- 238000005538 encapsulation Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 239000004814 polyurethane Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
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Abstract
The utility model relates to a sensor packaging structure and electronic equipment. This packaging structure includes base plate, first casing and second casing, the base plate with first casing encloses into first cavity, second casing lock is in the first casing outside, the base plate first casing with the second casing encloses into the second cavity jointly, the second casing include with the relative roof of base plate with center on the lateral wall that the roof set up, be equipped with at least one passageway of losing heart on the roof, the second cavity passes through lose heart passageway and outside intercommunication, the internal surface of roof is equipped with waterproof ventilated membrane, waterproof ventilated membrane covers lose heart passageway. The utility model provides an encapsulation structure has the characteristics that water-proof effects is good.
Description
Technical Field
The utility model relates to an acoustoelectric conversion technology field, more specifically, the utility model relates to a sensor packaging structure and electronic equipment.
Background
The existing MEMS microphone packaging structure includes a PCB board and a housing, which enclose a cavity capable of accommodating the MEMS microphone assembly. The shell comprises an inner shell and an outer shell. The MEMS microphone assembly comprises a diaphragm, a back pole and an electronic device.
When the reflow soldering process is performed, the gas inside the cavity expands. In order to avoid the influence of gas on the performance of the MEMS microphone assembly, the shell needs to be deflated, so that the PCB is reserved with a notch for deflation. And after the reflow soldering process is finished, the reserved gap of the PCB has the risk of air leakage. In addition, when the scribing process is performed, the gap reserved in the PCB has the problem of water inflow, thereby affecting the performance of the MEMS microphone.
Therefore, a new technical solution is needed to solve at least one of the above technical problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a sensor packaging structure and electronic equipment's new technical scheme.
According to an aspect of the utility model, a sensor packaging structure is provided, including base plate, first casing and second casing, the base plate with first casing encloses into first cavity, second casing lock is in the first casing outside, the base plate first casing with the second casing encloses into the second cavity jointly, the second casing include with the relative roof of base plate with center on the lateral wall that the roof set up, be equipped with at least one disappointing passageway on the roof, the second cavity passes through disappointing passageway and outside intercommunication, the internal surface of roof is equipped with waterproof ventilated membrane, waterproof ventilated membrane covers disappointing passageway.
Optionally or alternatively, the waterproof breathable film is an expanded polytetrafluoroethylene film.
Optionally or alternatively, the waterproof breathable film is a PU film.
Optionally or alternatively, the waterproof breathable film comprises an expanded polytetrafluoroethylene film and a PU film, and the expanded polytetrafluoroethylene film and the PU film are compositely bonded on the inner surface of the top wall.
Optionally or alternatively, the bleed channels are perpendicular to the substrate.
Optionally or alternatively, the bleed passage is arranged obliquely with respect to the base plate.
Optionally or alternatively, the angle between the air escape passage and the top wall is greater than 0 ° and less than 90 °.
Optionally or alternatively, the inner diameter of the air leakage channel is 10-100 um.
Optionally or alternatively, the second housing is shaped as a cuboid or cylindrical body.
According to another aspect of the present invention, there is provided an electronic device, including the sensor package structure described above.
The sensor package structure of this embodiment is owing to have the passageway of disappointing on the roof of second casing, and has the waterproof ventilated membrane that covers the passageway of disappointing on the internal surface of roof, so, when reflow soldering, the gas in the second casing is through waterproof ventilated membrane, the passageway of disappointing discharges. When scribing, water can not enter the second shell through the waterproof breathable film. Therefore, the sensor packaging structure has stable performance in use, and the service life of the sensor packaging structure is prolonged.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic cross-sectional structure diagram of a package structure according to an embodiment of the present invention.
Description of reference numerals:
1-substrate, 2-first shell, 3-second shell, 31-top wall, 311-air escape channel, 32-side wall, 4-first cavity, 5-second cavity and 6-waterproof breathable film.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail, but are intended to be considered a part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
As shown in fig. 1, an embodiment of the present invention discloses a sensor package structure, which includes a substrate 1, a first housing 2 and a second housing 3. The sensor may be, but is not limited to, a MEMS microphone, a temperature sensor, a pressure sensor, a chemical sensor, and the like. The following description will be made by taking the MEMS microphone package structure as an example.
The substrate 1 is a PCB board, and the PCB board is provided with an MEMS chip, an ASIC chip and a sound hole of a flat capacitor structure. The MEMS chip and the ASIC chip are connected with each other, the sound hole corresponds to the MEMS chip, and the sound hole is communicated with the outside. External sound acts on the MEMS chip through the sound hole to form an electric signal, and the ASIC chip amplifies the electric signal and outputs the amplified electric signal.
The substrate 1 and the first housing 2 enclose a first cavity 4, and the MEMS chip and the ASIC chip are respectively disposed in the first cavity 4.
The second housing 3 is fastened at the outer side of the first housing 2, and the substrate 1, the first housing 2 and the second housing 3 jointly enclose a second cavity 5. The first cavity 4 and the second cavity 5 may be sealed from each other, or may be in communication with each other. For example, the first case 2 and the second case 3 are hermetically attached to the substrate 1, respectively.
The second housing 3 is made of any one of metal, plastic, and composite materials. The first housing 2 is made of any one of metal, plastic, and composite materials.
The second housing 3 includes a top wall 31 opposed to the base plate 1 and a side wall 32 provided around the top wall, the top wall 31 and the side wall 32 being integrally formed. Of course, the top wall 31 and the side wall 32 may be formed separately and finally joined together. The connection method can adopt gluing. Those skilled in the art can flexibly select the forming mode of the second housing 3 according to actual requirements.
The top wall 31 is provided with at least one air release passage 311, and the second cavity 4 is communicated with the outside through the air release passage 311. The number of air escape channels 321 can be set by one skilled in the art according to actual needs.
The inner surface of the top wall 31 is provided with a waterproof breathable film 6, and the air leakage channel 311 is covered by the waterproof breathable film 6. The waterproof breathable film 6 is made of a high-molecular waterproof material, and the waterproof breathable film 6 is provided with breathable micropores densely distributed on the film, so that liquid leakage can be blocked, gas can smoothly pass through the breathable micropores, and the breathable film has the functions of breathable blocking and water isolation.
In the sensor package structure of the present embodiment, since the top wall 31 of the second housing 3 has the air release channel 311, and the inner surface of the top wall 31 has the waterproof breathable film 6 covering the air release channel 311, during reflow soldering, the gas in the second housing 3 is discharged through the waterproof breathable film 6 and the air release channel 311. During scribing, water cannot enter the second housing 3 through the waterproof breathable film. Therefore, the sensor has stable performance in use and the service life of the sensor is prolonged.
Furthermore, since the waterproof breathable film 6 is provided on the inner surface of the ceiling wall 1, the waterproof breathable film 6 can be effectively prevented from being damaged.
In one embodiment, the waterproof breathable membrane 6 is an ePTFE membrane, i.e., an expanded polytetrafluoroethylene membrane. The surface of the expanded polytetrafluoroethylene membrane has hydrophobicity or extremely strong water resistance. The intermolecular force of the liquid water is very strong and is larger than the attraction force between the water molecules and the expanded polytetrafluoroethylene film. Therefore, water generated by the scribing cannot pass through the polytetrafluoroethylene film.
In one embodiment, the waterproof breathable film 6 is a PU film, namely polyurethane. The PU film has good effects on air permeability and water resistance. For example, the PU film has a thickness of 12 μm to 35 μm, and the waterproof, breathable and structural stability of the waterproof, breathable film 6 is excellent in this range.
In one embodiment, the waterproof breathable membrane 6 comprises an expanded polytetrafluoroethylene membrane and a PU membrane, and the expanded polytetrafluoroethylene membrane and the PU membrane are compositely bonded on the inner surface of the top wall 31. The combination of the expanded polytetrafluoroethylene film and the PU film improves the strength of the waterproof breathable film 6 and prolongs the service life of the waterproof breathable film 6.
The material of the waterproof breathable film 6 is not limited to the material in the above embodiment, and may also be a polyolefin microporous breathable film, which also has good waterproof and breathable properties, and those skilled in the art can flexibly select the material of the waterproof breathable film 6 according to actual needs.
In one embodiment, the air escape passage 311 is vertically disposed with respect to the substrate 1. The number of the air release channels 311 may be 1, or may be plural, and the position of the air release channel 311 may be disposed near the edge of the top wall 31, or may be disposed at the center of the top wall 31. The number and position of the air escape channels 311 on the top wall 31 can be chosen flexibly by those skilled in the art according to actual needs.
In one embodiment, the air escape passage 311 is disposed obliquely with respect to the substrate 1. The inclined air leakage channel 311 is vertical to the substrate 1 compared with the air leakage channel 311, so that the impact of water on the waterproof breathable film 6 can be reduced, and the service life of the waterproof breathable film 6 can be prolonged.
In one embodiment, the angle between the air escape passage 311 and the top wall 31 is greater than 0 ° and less than 90 °. The inclination angle of the air release channel 311 is in the range of more than 0 degrees and less than 90 degrees, and the impact force of water on the waterproof breathable film 6 is the minimum.
In one embodiment, the inner diameter of the venting channel 311 is 10-100 um. The internal diameter of the air escape channel 31 is 1 within the range of 10 mu m to 100um, so that the air escape channel has better effect of preventing water impact. Of course, the inner diameter of the air release passage 311 is not limited to 10 μm-100 μm, and those skilled in the art can flexibly select the inner diameter of the air release passage 311 according to actual requirements.
In one embodiment, the second housing 3 is in the shape of a rectangular parallelepiped or a cylindrical body. The shape of the second housing 3 is not limited to a rectangular parallelepiped or a cylindrical body, and those skilled in the art can flexibly select the shape of the second housing 3 according to actual requirements.
The utility model discloses an on the other hand still discloses an electronic equipment, including the aforesaid sensor packaging structure.
The utility model discloses an electronic equipment is owing to contain the aforesaid sensor packaging structure, realized electronic equipment long service life, the stable effect of sound-electricity conversion performance.
The utility model discloses an electronic equipment includes any one of earphone device, panel computer, cell-phone, intelligent bracelet.
Although some specific embodiments of the present invention have been described in detail by way of illustration, it should be understood by those skilled in the art that the above illustration is only for purposes of illustration and is not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (10)
1. A sensor package structure, characterized by: including base plate, first casing and second casing, the base plate with first casing encloses into first cavity, second casing lock is in the first casing outside, the base plate first casing with the second casing encloses into the second cavity jointly, the second casing include with the relative roof of base plate with center on the lateral wall that the roof set up, be equipped with at least one passageway of losing heart on the roof, the second cavity passes through lose heart passageway and outside intercommunication, the internal surface of roof is equipped with waterproof ventilated membrane, waterproof ventilated membrane covers lose heart passageway.
2. The package structure of claim 1, wherein: the waterproof breathable film is an expanded polytetrafluoroethylene film.
3. The package structure of claim 1, wherein: the waterproof breathable film is a PU film.
4. The package structure of claim 1, wherein: the waterproof breathable film comprises an expanded polytetrafluoroethylene film and a PU film, wherein the expanded polytetrafluoroethylene film and the PU film are compositely bonded on the inner surface of the top wall.
5. The package structure of claim 1, wherein: the air leakage channel is vertically arranged relative to the substrate.
6. The package structure of claim 1, wherein: the air leakage channel is obliquely arranged relative to the base plate.
7. The package structure of claim 6, wherein: the air leakage channel and the top wall form an included angle larger than 0 degree and smaller than 90 degrees.
8. The package structure of claim 1, wherein: the inner diameter of the air leakage channel is 10-100 um.
9. The package structure of claim 1, wherein: the second shell is in a cuboid or cylindrical shape.
10. An electronic device, characterized in that: comprising the sensor package structure of any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020390896.XU CN211702388U (en) | 2020-03-24 | 2020-03-24 | Sensor packaging structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020390896.XU CN211702388U (en) | 2020-03-24 | 2020-03-24 | Sensor packaging structure and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211702388U true CN211702388U (en) | 2020-10-16 |
Family
ID=72779902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020390896.XU Active CN211702388U (en) | 2020-03-24 | 2020-03-24 | Sensor packaging structure and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211702388U (en) |
-
2020
- 2020-03-24 CN CN202020390896.XU patent/CN211702388U/en active Active
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