CN211702386U - Sensor packaging structure and electronic equipment - Google Patents
Sensor packaging structure and electronic equipment Download PDFInfo
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- CN211702386U CN211702386U CN202020390495.4U CN202020390495U CN211702386U CN 211702386 U CN211702386 U CN 211702386U CN 202020390495 U CN202020390495 U CN 202020390495U CN 211702386 U CN211702386 U CN 211702386U
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- casing
- adhesive tape
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- 238000004806 packaging method and process Methods 0.000 title abstract description 9
- 239000012528 membrane Substances 0.000 claims description 26
- 239000002390 adhesive tape Substances 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 9
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011127 biaxially oriented polypropylene Substances 0.000 claims description 3
- 229920006378 biaxially oriented polypropylene Polymers 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims description 2
- 239000006260 foam Substances 0.000 claims description 2
- 239000002655 kraft paper Substances 0.000 claims description 2
- 230000000873 masking effect Effects 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000005476 soldering Methods 0.000 description 7
- 239000007769 metal material Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000004078 waterproofing Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
The utility model relates to a sensor packaging structure and electronic equipment, this packaging structure include base plate, first casing and second casing, the base plate with first casing encloses into first cavity, second casing lock is in the first casing outside, the base plate first casing with the second casing encloses into the second cavity jointly, the second casing include with the relative roof of base plate with center on the lateral wall that the roof set up, be equipped with at least one disappointing passageway on the roof, the second cavity passes through disappointing passageway and outside intercommunication, the surface of roof is equipped with the waterproof rete that can remove, waterproof rete covers in the disappointing passageway.
Description
Technical Field
The utility model relates to an acoustoelectric conversion technology field, more specifically, the utility model relates to a sensor packaging structure and electronic equipment.
Background
The existing sensor packaging structure comprises a PCB and a shell, wherein the PCB and the shell enclose a cavity capable of containing a sensor assembly. The shell comprises an inner shell and an outer shell. The sensor assembly includes a diaphragm, a back electrode, and electronics.
During the reflow process, the gas inside the cavity expands. In order to avoid the influence of gas on the performance of the sensor assembly, the shell needs to be deflated, so that the PCB is reserved with a notch for deflation. And after the reflow soldering process is finished, the reserved gap of the PCB has the risk of air leakage. In addition, when the scribing process is carried out, the reserved gap of the PCB still has the problem of water inflow, so that the performance of the sensor is influenced.
Therefore, a new technical solution is needed to solve at least one of the above technical problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a sensor packaging structure and electronic equipment's new technical scheme.
According to an aspect of the utility model, a sensor package structure is provided, including base plate, first casing and second casing, the base plate with first casing encloses into first cavity, the second casing lock is in the first casing outside, the base plate first casing with the second casing encloses into the second cavity jointly, the second casing include with the relative roof of base plate and center on the lateral wall that the roof set up, be equipped with at least one disappointing passageway on the roof, the second cavity passes through disappointing passageway and outside intercommunication, it is configured to be used for the exhaust when reflow soldering to lose heart passageway, the surface of roof is equipped with the waterproof rete that can remove, the waterproof rete covers it loses heart passageway, the waterproof rete is configured to be used for preventing water from getting into when the scribing in the second cavity.
Optionally or alternatively, the waterproof film layer comprises any one of a magnetic film, an adhesive tape layer, and a UV film.
Optionally or alternatively, when the waterproof membrane layer is a magnetic membrane, the magnetic membrane is adsorbed on the outer surface of the top wall.
Optionally or alternatively, when the waterproof membrane layer is an adhesive tape layer, an adhesive face of the adhesive tape layer is bonded to the outer surface of the top wall.
Optionally or alternatively, the tape layer comprises any one of BOPP tape, cloth-based tape, kraft tape, crepe paper tape, fiber tape, PVC tape, PE foam tape, and aluminum foil tape.
Optionally or alternatively, where the waterproof membrane layer is a UV film, the UV film is adhered to the outer surface of the top wall and is removable by removal by UV irradiation.
Optionally or alternatively, the bleed passage is arranged obliquely to the base plate.
Optionally or alternatively, the angle between the air escape passage and the top wall is greater than 0 ° and less than 90 °.
Optionally or alternatively, the inner diameter of the air escape passage is 10-500 um.
According to another aspect of the present invention, there is provided an electronic device, including the sensor package structure described above.
The embodiment of the utility model provides a sensor package structure's second casing's roof is owing to have disappointing passageway, and when reflow soldering, the gas of second cavity can be discharged through disappointing passageway. In addition, because the removable waterproof membrane layer covering the air leakage channel is arranged on the top wall, the air leakage channel is covered by the waterproof membrane layer after reflow soldering so as to prevent water flow during scribing from entering the second cavity, thereby ensuring stable performance of the sensor in use and prolonging the service life of the sensor. After the scribing process is completed, the waterproof membrane layer can be torn off and separated from the second shell.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic cross-sectional structure diagram of a package structure according to an embodiment of the present invention.
Description of reference numerals:
1-substrate, 2-first shell, 3-second shell, 31-top wall, 311-air escape channel, 32-side wall, 4-first cavity, 5-second cavity and 6-waterproof membrane layer.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail, but are intended to be considered a part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
As shown in fig. 1, an embodiment of the present invention discloses a sensor package structure, which includes a substrate 1, a first housing 2 and a second housing 3. The sensor may be, but is not limited to, a MEMS microphone, a temperature sensor, a pressure sensor, a chemical sensor, and the like. The following description will be made by taking the MEMS microphone package structure as an example.
The substrate 1 is a PCB board, and the PCB board is provided with an MEMS chip, an ASIC chip and a sound hole of a flat capacitor structure. The MEMS chip and the ASIC chip are connected with each other, the sound hole corresponds to the MEMS chip, and the sound hole is communicated with the outside. External sound acts on the MEMS chip through the sound hole to form an electric signal, and the ASIC chip amplifies the electric signal and outputs the amplified electric signal.
The substrate 1 and the first housing 2 enclose a first cavity 4, and the MEMS chip and the ASIC chip are respectively disposed in the first cavity 4.
The second housing 3 is fastened at the outer side of the first housing 2, and the substrate 1, the first housing 2 and the second housing 3 jointly enclose a second cavity 5. The first cavity 4 and the second cavity 5 may be sealed from each other, or may be in communication with each other. For example, the first case 2 and the second case 3 are hermetically attached to the substrate 1, respectively.
The second housing 3 is made of any one of metal, plastic, and composite materials. The first housing 2 is made of any one of metal, plastic, and composite materials.
The second housing 3 includes a top wall 31 opposed to the base plate 1 and a side wall 32 provided around the top wall 31, the top wall 31 and the side wall 32 being integrally formed. Of course, the top wall 31 and the side wall 32 may be formed separately and finally joined together. The connection method can adopt gluing. Those skilled in the art can flexibly select the forming mode of the second housing 3 according to actual requirements.
The top wall 31 is provided with at least one air escape passage 311, the second cavity 5 is communicated with the outside through the air escape passage 311, and the air escape passage 311 is configured for exhausting air during reflow soldering. The number of air escape channels 321 can be set by one skilled in the art according to actual needs.
The outer surface of the top wall 31 is provided with a removable waterproof membrane layer 6, the waterproof membrane layer 6 covers the air leakage channel 311, and the waterproof membrane layer 6 is configured to prevent water from entering the second cavity 4 during scribing so as to ensure stable performance of the electronic device of the sensor in use; and the waterproof membrane layer 6 may be peeled off after dicing to enable the sensor to be placed in a limited space within the electronic device.
The embodiment of the utility model provides a roof 31 of sensor package structure's second casing 3 is owing to have disappointing passageway 311, and when reflow soldering, the gas in the second cavity 5 can be discharged through disappointing passageway 311. In addition, because the removable waterproof membrane layer 6 covering the air escape channel 311 is arranged on the top wall 31, the waterproof membrane layer 6 is covered on the air escape channel 311 after reflow soldering is carried out, so that water flow during scribing is prevented from entering the second cavity 5, the stable performance of the sensor in use is ensured, and the service life of the sensor is prolonged. After the dicing process is completed, the waterproof film layer 6 can be peeled off and separated from the outer surface of the top wall 31.
In one embodiment, the waterproof film layer includes any one of a magnetic film, a tape layer, and a UV film. The magnetic film, the adhesive tape layer, and the UV film can be adhered to the second housing 3 and can be easily separated from the second housing 3 after dicing.
For example, the waterproof film layer 6 is a magnetic film, the second housing 3 is made of a metal material, and the magnetic film includes a metal material and a non-metal material. For example, the waterproof film layer 6 is a PVC film which is subjected to magnetic treatment, and when dicing is required, the magnetic film is adsorbed on the outer surface of the top wall 31 of the second housing 3 and covers the air escape channel 311 to block water flow cut during dicing. And after the scribing process is finished, removing the magnetic film.
For example, the waterproof film layer 6 is a tape layer, and when dicing is required, the adhesive surface of the tape layer is adhered to the outer surface of the top wall 31 to close the air leakage channel 311 to prevent water from flowing into the second cavity 5. And removing the adhesive tape layer after scribing.
For example, the tape layer includes any one of BOPP tape, PVC tape, and aluminum foil tape. In order to facilitate the removal of the adhesive tape layer, a high-temperature lamp can be used for irradiation to reduce the viscosity of the adhesive tape layer, so that the adhesive tape layer is convenient to remove.
For example, the waterproof film layer 6 is a UV film which is adhered to the outer surface of the top wall 31 and can be removed by peeling off by UV irradiation. The UV irradiation can reduce the viscosity of the UV film, thereby facilitating the peeling off of the UV film.
In one embodiment, the air escape passage 311 is disposed obliquely with respect to the substrate 1. The inclined arrangement of the air escape passage 311 with respect to the base plate 1 enables the impact of the water flow on the waterproofing membrane 6 to be reduced. Of course, the air escape channel 311 may also be disposed vertically relative to the substrate 1, and those skilled in the art can flexibly set the forming manner of the air escape channel 311 according to actual needs.
In one embodiment, the angle between the air escape passage 311 and the top wall 31 is greater than 0 ° and less than 90 °. In this angular range, the impact of the water flow on the waterproofing membrane 6 is minimal.
In one embodiment, the internal diameter of the bleed passage 311 is 10-500 um. The inner diameter of the air release passage 311 is not limited to 10-500um, and those skilled in the art can flexibly select the inner diameter of the air release passage according to actual needs.
The utility model also discloses an electronic equipment, including the aforesaid sensor packaging structure.
The utility model discloses an electronic equipment is owing to contain the aforesaid sensor packaging structure, realized electronic equipment long service life, the stable effect of sound-electricity conversion performance.
The utility model discloses an electronic equipment includes any one of earphone device, panel computer, cell-phone, intelligent bracelet.
Although some specific embodiments of the present invention have been described in detail by way of illustration, it should be understood by those skilled in the art that the above illustration is only for purposes of illustration and is not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (10)
1. A sensor package structure, characterized by: including base plate, first casing and second casing, the base plate with first casing encloses into first cavity, second casing lock is in the first casing outside, the base plate first casing with the second casing encloses into the second cavity jointly, the second casing include with the relative roof of base plate with center on the lateral wall that the roof set up, be equipped with at least one passageway of disappointing on the roof, the second cavity passes through disappointing passageway and outside intercommunication, the surface of roof is equipped with the waterproof membrane layer that can remove, waterproof membrane layer covers disappointing the passageway.
2. The package structure of claim 1, wherein: the waterproof film layer comprises any one of a magnetic film, an adhesive tape layer and a UV film.
3. The package structure of claim 2, wherein: when the waterproof membrane layer is a magnetic membrane, the magnetic membrane is adsorbed on the outer surface of the top wall.
4. The package structure of claim 2, wherein: when the waterproof membrane layer is an adhesive tape layer, the adhesive surface of the adhesive tape layer is adhered to the outer surface of the top wall.
5. The package structure according to claim 2 or 4, wherein: the adhesive tape layer comprises any one of a BOPP adhesive tape, a cloth-based adhesive tape, a kraft paper adhesive tape, a masking tape, a fiber adhesive tape, a PVC adhesive tape, a PE foam adhesive tape and an aluminum foil adhesive tape.
6. The package structure of claim 2, wherein: when the waterproof membrane layer is a UV membrane, the UV membrane is adhered to the outer surface of the top wall and can be removed by UV irradiation.
7. The package structure of claim 1, wherein: the air leakage channel is obliquely arranged relative to the substrate.
8. The package structure of claim 7, wherein: the air leakage channel and the top wall form an included angle larger than 0 degree and smaller than 90 degrees.
9. The package structure of claim 1, wherein: the inner diameter of the air leakage channel is 10-500 um.
10. An electronic device, characterized in that: comprising the sensor package structure of any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020390495.4U CN211702386U (en) | 2020-03-24 | 2020-03-24 | Sensor packaging structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020390495.4U CN211702386U (en) | 2020-03-24 | 2020-03-24 | Sensor packaging structure and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211702386U true CN211702386U (en) | 2020-10-16 |
Family
ID=72779868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020390495.4U Active CN211702386U (en) | 2020-03-24 | 2020-03-24 | Sensor packaging structure and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211702386U (en) |
-
2020
- 2020-03-24 CN CN202020390495.4U patent/CN211702386U/en active Active
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