TWI416696B - Lid component and method of forming same, package structure having lid component and method of forming same - Google Patents

Lid component and method of forming same, package structure having lid component and method of forming same Download PDF

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Publication number
TWI416696B
TWI416696B TW098132668A TW98132668A TWI416696B TW I416696 B TWI416696 B TW I416696B TW 098132668 A TW098132668 A TW 098132668A TW 98132668 A TW98132668 A TW 98132668A TW I416696 B TWI416696 B TW I416696B
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TW
Taiwan
Prior art keywords
opening
plate
metal layer
surface
layer
Prior art date
Application number
TW098132668A
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Chinese (zh)
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TW201112381A (en
Inventor
Pao Hung Chou
Chih Hao Hsu
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Unimicron Technology Corp
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Application filed by Unimicron Technology Corp filed Critical Unimicron Technology Corp
Priority to TW098132668A priority Critical patent/TWI416696B/en
Publication of TW201112381A publication Critical patent/TW201112381A/en
Application granted granted Critical
Publication of TWI416696B publication Critical patent/TWI416696B/en

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Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Abstract

A lid component is proposed, comprising a first board body having opposing first and second surfaces whereon first and second metallic layers and openings are respectively formed, wherein the openings penetrate through the first metallic layer, the first board body and the second metallic layer; a conductor layer disposed on the wall surface of the opening, the first and second metallic layers; an adhesive layer disposed on the conductor layer of the second metallic layer; and a second board body having opposing third and fourth surfaces, the third surface connecting with the adhesive layer to seal one end of the opening, thereby forming conductor layers on the openings and saving costs. The invention further provides a method for forming the lid component as described above, as well as a package structure having the lid component and a fabrication method thereof.

Description

Covering member, preparation method thereof and package structure with cover member and preparation method thereof

The invention relates to a package structure and a preparation method thereof, in particular to a package structure with a cover member and a preparation method thereof.

At present, microelectromechanical devices such as a microphone are widely used in mobile communication devices, audio devices, etc., and the size of the loudspeaker is miniaturized to make a capacitor for a hearing aid unit. Condenser microphone, but the condenser loudspeaker is easily disturbed by external noise such as light and electromagnetic waves, which causes internal components such as a transducer to be easily damaged, and its transmission signal is easily affected by the environment. Therefore, the conventional condenser microphone not only needs the sound pressure to match the function, but also needs to shield the internal components to avoid external noise interference such as light and electromagnetic waves. For common condenser loudspeakers, please refer to Figure 1.

As shown in FIG. 1 , the conventional condenser speaker includes a first substrate 10 , a conductive plate body 11 bonded to the first substrate 10 with a first conductive adhesive layer 13 , and a second conductive adhesive layer. 13' is coupled to the second substrate 12 on the conductive plate body 11; the first and second substrates 10, 12 are respectively formed by the die 100 and the back plate 101, and the first substrate 10 is provided with an audible hole 102. The semiconductor chip 14 and the transmitter 15 on the audible hole 102; the conductive plate body 11 is formed with a through hole 110 to form a space having different sound pressures, and the semiconductor element 14 and the signal 15 are correspondingly accommodated.

The conventional condenser microphone forms a protective space by the first substrate 10, the conductive plate body 11, and the second substrate 12, so that the semiconductor element 14 and the signal 15 are isolated from the outside to achieve the shielding effect. However, the conductive plate body 11 is made of a monolithic metal plate, resulting in an increase in the cost of the capacitive microphone.

Therefore, how to avoid and overcome the problems in the prior art has become a problem that is currently being solved.

In view of the above-mentioned various deficiencies of the prior art, the main object of the present invention is to provide a cost-saving covering member, a manufacturing method thereof and a package structure having a covering member and a manufacturing method thereof.

To achieve the above and other objects, the present invention discloses a covering member comprising: a first plate body having opposite first and second surfaces, and the first and second surfaces respectively having first and second metals a layer having an opening penetrating the first metal layer, the first plate body and the second metal layer; the conductor layer is disposed on the first metal layer, the wall surface of the opening, and the second metal layer; the adhesive layer is And the second plate body has opposite third and fourth surfaces, and the third surface of the second plate body is coupled to the adhesive layer to bond the first surface a plate body and sealing one end of the opening.

In the above covering member, the third surface of the second plate has a third metal layer, and the fourth surface of the second plate has a fourth metal layer, and the third metal layer is corresponding to the opening. in.

The invention discloses a method for manufacturing a covering member, comprising: providing a first plate body having opposite first and second surfaces, wherein the first and second surfaces respectively have first and second metal layers; a first through hole is formed in the first metal layer, the first plate body and the second metal layer; a conductor layer is formed on the first metal layer, the wall surface of the opening, and the second metal layer; and the second metal layer is formed on the second metal layer Forming an adhesive layer on the conductor layer, and the adhesive layer seals one end of the opening; and providing a second plate body having opposite third and fourth surfaces, so that the third surface of the second plate body is bonded to the adhesive And the adhesive layer corresponding to the opening is removed by laser to expose a portion of the third surface of the second plate to the opening.

In the above method for manufacturing the covering member, after the third surface of the second plate is bonded to the adhesive layer, the adhesive layer corresponding to the opening is removed by laser; in another embodiment, the second Before the third surface of the plate is bonded to the adhesive layer, the adhesive layer corresponding to the opening is removed by laser.

In the above method for manufacturing the covering member, the third surface of the second plate has a third metal layer, and the fourth surface of the second plate has a fourth metal layer, and the third metal layer is correspondingly located. In the opening.

The present invention discloses a package structure having a cover member, comprising: a first plate body having opposite first and second surfaces, and the first and second surfaces respectively have first and second metal layers, And having an opening extending through the first metal layer, the first plate body and the second metal layer; the conductor layer is disposed on the first metal layer, the inner wall of the opening, and the second metal layer; the adhesive layer is fastened On the conductor layer on the second metal layer; the second plate has opposite third and fourth surfaces, and the third surface of the second plate is bonded to the adhesive layer to bond the first plate And sealing one end of the opening; the third plate is disposed on the conductor layer on the first metal layer and sealing the other end of the opening; and the electronic component is disposed on the third plate And located in the opening.

In the above package structure, the third surface of the second plate has a third metal layer, and the fourth surface of the second plate has a fourth metal layer, and the third metal layer is corresponding to the opening. in.

In the above package structure, the second plate body has a through hole for exposing a part of the surface of the third plate body in the opening, and the third plate system is a circuit board having an inner layer circuit, so that the The third plate body is not provided with solder balls on the surface of the first plate body to electrically connect the circuit board, and the electronic component is a semiconductor wafer, a microelectromechanical component, or a photoelectric component.

The invention discloses a method for fabricating a package structure with a cover member, comprising: providing a first plate body having opposite first and second surfaces, wherein the first and second surfaces respectively have first and second metals a layer forming a through opening in the first metal layer, the first plate body and the second metal layer; forming a conductor layer on the first metal layer, the wall surface of the opening, and the second metal layer; and the second metal Forming an adhesive layer on the conductor layer on the layer, and the adhesive layer seals one end of the opening; providing a second plate body having opposite third and fourth surfaces, so that the third surface of the second plate body is bonded to In the adhesive layer, the adhesive layer corresponding to the opening is removed by laser to expose a portion of the third surface of the second plate to the opening; and the conductor layer on the first metal layer A third plate body is disposed to seal the other end of the opening, and the third plate body is connected with electronic components located in the opening.

In the above method for manufacturing the package structure, the third surface of the second plate has a third metal layer; after the third surface of the second plate is bonded to the adhesive layer, the corresponding opening is removed by laser Adhesive layer, the third metal layer is exposed to the opening; in another embodiment, before the third surface of the second plate is bonded to the adhesive layer, the corresponding opening is removed by laser Adhesive layer.

In the above method for manufacturing the package structure, the fourth surface of the second plate has a fourth metal layer; and the second plate body is formed to form a through hole to expose the surface of the third plate in the opening.

In the manufacturing method of the package structure, the third board system is a circuit board having an inner layer line, and the third board body is not provided with a solder ball on the surface of the first board body to electrically connect a circuit board. And the electronic component is a semiconductor wafer, a microelectromechanical component, or a photovoltaic component.

As can be seen from the above, the present invention is formed on the opening wall surface of the first plate body by a conductor layer of a single material to produce a shielding effect, when it is combined with the second plate body as a covering member of the microelectromechanical package structure, compared with The monolithic metal plate used in the prior art can effectively save costs.

The other embodiments of the present invention will be readily understood by those skilled in the art from this disclosure.

Please refer to FIGS. 2A to 2E for the preparation of a covering member disclosed in the present invention.

As shown in FIG. 2A, a first plate 20 is provided opposite the first and second surfaces 20a, 20b, and the first and second surfaces 20a, 20b have first and second metal layers 200a, 200b, respectively. .

As shown in FIG. 2B, an opening 201 is formed in the first metal layer 200a, the first plate body 20, and the second metal layer 200b.

As shown in FIG. 2C, the conductor layer 202 is formed on the first metal layer 200a, the wall surface of the opening 201, and the second metal layer 200b.

As shown in FIG. 2D, an adhesive layer 21 is formed on the conductor layer 202 on the second metal layer 200b, and the adhesive layer 21 seals one end of the opening 201; and an opposite third and fourth surface is provided. a second plate 22 of 22a, 22b, a third metal layer 220a on the third surface 22a of the second plate 22, and a fourth metal layer 220b on the fourth surface 22b of the second plate 22 The third metal layer 220a on the third surface 22a of the second plate body 22 is bonded to the adhesive layer 21.

As shown in FIG. 2E, the adhesive layer 21 corresponding to the opening 201 is removed by laser to expose a portion of the third metal layer 220a on the third surface 22a of the second plate 22 to the opening 201.俾 to form the covering member of the present invention.

The present invention is formed on the wall surface of the opening 201 of the first plate body 20 by the conductor layer 202 to produce shielding effect and save cost.

Referring to FIGS. 2F and 2F', the cover member of the present invention is bonded to a third plate body 23 to form a package structure having a cover member; as shown, on the first surface of the first plate body 20 A third plate body 23 is disposed on the conductor layer 202 of the first metal layer 200a on the 20a to seal the other end of the opening 201, and the third plate body 23 is connected with electronic components located in the opening 201. The electronic component is a semiconductor wafer 24a, a microelectromechanical component 24b or a photovoltaic component; the third plate body 23 is a circuit board having an inner layer line, and is formed by the bonding layer 26 which is a glue. The surface of the three-plate body 23 is combined with the electronic component and the conductor layer 202 on the first metal layer 200a, and the surface of the third plate body 23 not forming the bonding layer 26 is provided with solder balls 25 for power supply. Connect a circuit board that is an external device.

Furthermore, a through hole 221 may be formed in the second plate body 22 to expose a part of the surface of the third plate body 23 in the opening 201, as shown in FIG. 2F.

3A to 3C are another embodiment of the covering member of the present invention; firstly, a structure as shown in FIG. 2C is provided, the first plate body 30 having opposite first and second surfaces 30a, 30b, wherein the first and second surfaces 30a, 30b are respectively provided with first and second metal layers 300a, 300b, and have a first metal layer 300a, a first plate 30 and a second metal layer 300b. The opening 301 is formed on the first metal layer 300a, the opening 301 wall surface, and the second metal layer 300b.

As shown in FIG. 3A, an adhesive layer 31 is formed on the conductor layer 302 on the second metal layer 300b of the first board 30, and the adhesive layer 31 seals one end of the opening 301.

As shown in FIG. 3B, the adhesive layer 31 corresponding to the opening 301 is removed by laser.

As shown in FIG. 3C, a second plate 32 having opposite third and fourth surfaces 32a, 32b is provided, and the third surface 32a of the second plate 32 has a third metal layer 320a thereon. The fourth surface 32b of the second plate body 32 has a fourth metal layer 320b, and the third metal layer 320a of the third surface 32a of the second plate body 32 is bonded to the adhesive layer 31. The third metal layer 320a is exposed in the opening 301 to complete the covering member of the present invention.

The present invention discloses a cover member, comprising: a first plate body 20 having opposite first and second surfaces 20a, 20b, and first and second surfaces 20a, 20b respectively provided The second metal layer 200a, 200b has an opening 201 penetrating the first metal layer 200a, the first plate body 20 and the second metal layer 200b; the conductor layer 202 is disposed on the first metal layer 200a, the wall surface of the opening 201, And the second metal layer 200b; the adhesive layer 21 is disposed on the conductor layer 202 on the second metal layer 200b; and the second plate 22 has opposite third and fourth surfaces 22a, 22b. The third surface 22a of the second plate body 22 is bonded to the adhesive layer 21 to bond the first plate body 20 and seal one end of the opening 201.

The third surface 22a and the fourth surface 22b of the second plate body 22 respectively have a third metal layer 220a and a fourth metal layer 220b, and the third metal layer 220a is correspondingly located in the opening 201.

The present invention discloses a package structure having a cover member, comprising: a first plate body 20 having opposite first and second surfaces 20a, 20b, and the first and second surfaces 20a, 20b are respectively provided The first and second metal layers 200a, 200b have openings 201 extending through the first metal layer 200a, the first plate 20 and the second metal layer 200b; the conductor layer 202 is disposed on the first metal layer 200a, The opening 201 wall and the second metal layer 200b; the adhesive layer 21 is disposed on the conductor layer 202 on the second metal layer 200b; and the second plate 22 has opposite third and fourth surfaces 22a The second surface 22a of the second plate 22 is bonded to the adhesive layer 21 to bond the first plate 20 and seal one end of the opening 201. The third plate 23 is attached to the first plate The conductor layer 202 on a metal layer 200a and the other end of the opening 201 are sealed; and an electronic component is disposed on the third board 23 and located in the opening 201.

The third surface 22a and the fourth surface 22b of the second plate body 22 respectively have a third metal layer 220a and a fourth metal layer 220b, and the third metal layer 220a is correspondingly located in the opening 201.

The second plate body 22 has a through hole 221 to expose the surface of the third plate body 23 in the opening 201, and the third plate body 23 is a circuit board having an inner layer line, and the third board The plate body 23 is not provided with a solder ball 25 on the surface of the first plate body 20 to electrically connect the circuit board, and the electronic component is a semiconductor wafer 24a, a microelectromechanical element 24b or a photovoltaic element.

In summary, the present invention is formed on the opening wall surface of the first plate body by a conductor layer of a single material to produce a shielding effect, when the second plate body is combined as a covering member of the microelectromechanical package structure, The present invention can effectively save costs by using a single piece of metal plate used in the prior art.

The above embodiments are intended to illustrate the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the appended claims.

10. . . First substrate

100. . . Mold

101. . . Backplane

102. . . Listening hole

11. . . Conductive plate

110. . . perforation

12. . . Second substrate

13. . . First conductive adhesive layer

13’. . . Second conductive adhesive layer

14, 24a. . . Semiconductor wafer

15. . . Transmitter

20, 30. . . First plate

20a, 30a. . . First surface

20b, 30b. . . Second surface

200a, 300a. . . First metal layer

200b, 300b. . . Second metal layer

201, 301. . . Opening

202, 302. . . Conductor layer

21, 31. . . Adhesive layer

22, 32. . . Second plate

22a, 32a. . . Third surface

22b, 32b. . . Fourth surface

220a, 320a. . . Third metal layer

220b, 320b. . . Fourth metal layer

221. . . Hole

twenty three. . . Third plate

24b. . . Microelectromechanical components

25. . . Solder ball

26. . . Bonding layer

Figure 1 is a schematic cross-sectional view of a conventional condenser microphone;

2A to 2F are schematic views showing a method of manufacturing a package structure having a covering member of the present invention; wherein the 2F' is another embodiment of the 2Fth image;

3A to 3C are schematic views showing another embodiment of the covering member of the present invention.

20. . . First plate

20a. . . First surface

20b. . . Second surface

200a. . . First metal layer

200b. . . Second metal layer

201. . . Opening

202. . . Conductor layer

twenty one. . . Adhesive layer

twenty two. . . Second plate

22a. . . Third surface

22b. . . Fourth surface

220a. . . Third metal layer

220b. . . Fourth metal layer

Claims (28)

  1. A cover member includes: a first plate body having opposite first and second surfaces, and the first and second surfaces respectively have first and second metal layers and having a first metal layer therethrough Openings of the first plate body and the second metal layer; the conductor layer is disposed on the first metal layer and the second metal layer of the first and second surfaces, and the conductor layer is bent from both ends of the opening Folding into the opening to cover the wall surface of the opening; the adhesive layer is disposed on the conductor layer on the second metal layer; and the second plate has opposite third and fourth surfaces, the second A third surface of the plate body is bonded to the adhesive layer to bond the first plate body and seal one end of the opening.
  2. The covering member of claim 1, wherein the second surface has a third metal layer on the third surface.
  3. The covering member of claim 2, wherein the third metal layer is correspondingly located in the opening.
  4. The covering member of claim 1, wherein the second surface has a fourth metal layer on the fourth surface.
  5. A method for manufacturing a covering member, comprising: providing a first plate body having opposite first and second surfaces, and having first and second metal layers on the first and second surfaces, respectively; a through hole formed in the layer, the first plate body and the second metal layer; a first metal layer and a second metal layer on the first and second surfaces Forming a conductor layer thereon, and the conductor layer is bent from both ends of the opening to extend into the opening to cover the wall surface of the opening; an adhesive layer is formed on the conductor layer on the second metal layer, and the adhesive layer is sealed Holding one end of the opening; and providing a second plate having opposite third and fourth surfaces, the third surface of the second plate is bonded to the adhesive layer; wherein the adhesive layer corresponding to the opening The laser is removed to expose a portion of the third surface of the second plate to the opening.
  6. The method for manufacturing a covering member according to claim 5, wherein after the third surface of the second plate is bonded to the adhesive layer, the adhesive layer corresponding to the opening is removed by laser.
  7. The method of fabricating the covering member of claim 5, wherein the adhesive layer corresponding to the opening is removed by laser before the third surface of the second plate is bonded to the adhesive layer.
  8. The method of fabricating the covering member of claim 5, wherein the second surface of the second plate has a third metal layer.
  9. The method of fabricating a covering member according to claim 8 wherein the third metal layer is exposed to the opening.
  10. The method of fabricating a covering member according to claim 5, wherein the second surface of the second plate has a fourth metal layer.
  11. A package structure having a cover member, comprising: a first plate body having opposite first and second surfaces, wherein the first and second surfaces respectively have first and second metal layers, and have a through hole Openings of the first metal layer, the first plate body and the second metal layer; The conductor layer is disposed on the first metal layer and the second metal layer of the first and second surfaces, and the conductor layer is bent from both ends of the opening to extend into the opening to cover the wall surface of the opening; An adhesive layer is disposed on the conductor layer on the second metal layer; the second plate has opposite third and fourth surfaces, and the third surface of the second plate is bonded to the adhesive layer to be bonded The first plate body and sealing one end of the opening; the third plate body is disposed on the conductor layer on the first metal layer and seals the other end of the opening; and the electronic component is disposed on the The third plate is located in the opening.
  12. The package structure of the cover member of claim 11, wherein the second surface of the second plate has a third metal layer.
  13. The package structure of the cover member of claim 12, wherein the third metal layer is correspondingly located in the opening.
  14. The package structure of the cover member of claim 11, wherein the second surface has a fourth metal layer on the fourth surface.
  15. The package structure of the cover member of claim 11, wherein the second plate has a through hole for exposing a part of the surface of the third plate in the opening.
  16. The package structure of the cover member of claim 11, wherein the third plate system is a circuit board having an inner layer circuit.
  17. The package structure of the cover member of claim 16 , wherein the third plate body is not provided with a solder ball on the surface of the first plate body to electrically connect the circuit board.
  18. The package structure of the cover member of claim 11, wherein the electronic component is a semiconductor wafer, a microelectromechanical component, or a photovoltaic component.
  19. A method of fabricating a package structure having a cover member, comprising: providing a first plate body having opposite first and second surfaces, wherein the first and second surfaces respectively have first and second metal layers; a through hole is formed in the first metal layer, the first plate body and the second metal layer; a conductor layer is formed on the first metal layer and the second metal layer of the first and second surfaces, and the conductor layer is from the opening The two ends are bent to extend into the opening to cover the wall surface of the opening; an adhesive layer is formed on the conductor layer on the second metal layer, and the adhesive layer seals one end of the opening; providing a relative a second plate of the third and fourth surfaces, the third surface of the second plate is bonded to the adhesive layer; wherein the adhesive layer corresponding to the opening is removed by laser to make the second plate a portion of the third surface is exposed to the opening; and a third plate is disposed on the conductor layer on the first metal layer to seal the other end of the opening, and the third plate is attached to the opening Electronic components in the opening.
  20. The method for manufacturing a package structure of a cover member according to claim 19, wherein after the third surface of the second plate is bonded to the adhesive layer, the adhesive layer corresponding to the opening is removed by laser.
  21. For example, the package structure of the covering member of claim 19 The method, wherein the third surface of the second plate is bonded to the adhesive layer, and the adhesive layer corresponding to the opening is removed by laser.
  22. The method for manufacturing a package structure of a cover member according to claim 19, wherein the second plate has a third metal layer on the third surface.
  23. The method for manufacturing a package structure of a cover member according to claim 22, wherein the third metal layer is exposed to the opening when the adhesive layer of the opening is removed by laser.
  24. The method for manufacturing a package structure of a cover member according to claim 19, wherein the second plate has a fourth metal layer on the fourth surface.
  25. The method for manufacturing a package structure of a cover member according to claim 19, further comprising forming a through hole in the second plate to expose a surface of the third plate in the opening.
  26. The method for manufacturing a package structure of a covering member according to claim 19, wherein the third board system is a circuit board having an inner layer line.
  27. The method for manufacturing a package structure of a cover member according to claim 26, wherein the third plate body is not provided with a solder ball on the surface of the first plate body to electrically connect a circuit board.
  28. The method of fabricating a package structure of a cover member according to claim 19, wherein the electronic component is a semiconductor wafer, a microelectromechanical component, or a photovoltaic component.
TW098132668A 2009-09-28 2009-09-28 Lid component and method of forming same, package structure having lid component and method of forming same TWI416696B (en)

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Publication number Priority date Publication date Assignee Title
CN102730619B (en) * 2011-04-07 2015-03-04 欣兴电子股份有限公司 Covering member for micro-electro mechanical device and method for manufacturing covering member
CN102745640B (en) * 2011-04-22 2015-04-15 欣兴电子股份有限公司 Covering member for micro electro mechanical device and manufacturing method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070202627A1 (en) * 2000-11-28 2007-08-30 Knowles Electronics, Llc Silicon Condenser Microphone and Manufacturing Method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070202627A1 (en) * 2000-11-28 2007-08-30 Knowles Electronics, Llc Silicon Condenser Microphone and Manufacturing Method

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