CN219627855U - Microphone assembly and electronic device - Google Patents

Abstract

The utility model relates to the technical field of electronics and provides a microphone assembly and electronic equipment. The microphone assembly comprises a first circuit board and a second circuit board which are opposite to each other; a first wall portion fixed to the first opposing surface of the first circuit board; the first wall part and the second wall part are opposite to each other in the same direction as the direction in which the first circuit board and the second circuit board are opposite to each other and are fixed to each other, the first circuit board, the second circuit board, the first wall part and the second wall part jointly enclose a containing space, the microphone assembly further comprises a first element and a second element which are positioned in the containing space, and the first element is arranged on the first opposite surface; the second element is arranged on the second opposite surface. By disposing the two elements on the two circuit boards, respectively, and disposing the wall portions on the two circuit boards, respectively, the performance of the microphone assembly can be improved and the yield can be improved.

Description

Microphone assembly and electronic device

Technical Field

The present utility model relates to the field of electronic technologies, and in particular, to a microphone assembly and an electronic device.

Background

In electronic products, microphones are widely used, for example, in mobile phones, recording pens, bluetooth headsets, and other electronic products.

With the increasing demand for miniaturization and weight saving of electronic products, conventional electret condenser microphones (Electret Capacitance Microphone, abbreviated as "EMC") have failed to meet certain weight saving requirements, and then microelectromechanical systems (Micro Electro Mechanical Systems, abbreviated as "MEMS") technology has been proposed to manufacture microphones.

MEMS microphones can generally be made very small in size compared to conventional ECM microphones. Also, MEMS microphones typically require an external bias provided by an application specific integrated circuit (Application Specific Integrated Circuit, simply "ASIC"), the effective bias provided by the ASIC allowing the MEMS microphone to maintain stable acoustic and electrical parameters throughout the operating temperature range.

It should be noted that the foregoing description of the background art is only for the purpose of providing a clear and complete description of the technical solution of the present utility model and is presented for the convenience of understanding by those skilled in the art. The above-described solutions are not considered to be known to the person skilled in the art simply because they are set forth in the background of the utility model section.

Disclosure of Invention

The inventor found that in the existing MEMS microphone, the MEMS sensor and the ASIC are usually disposed on the same printed circuit board (Printed Circuit Board, abbreviated as "PCB") so that the ASIC is affected when the MEMS sensor is post-processed, and the MEMS is also affected when the ASIC is post-processed (e.g., dispensing), thereby causing performance degradation of the MEMS microphone; in addition, in the production process, the PCB is heated and warped, so that the yield is reduced.

To solve at least one of the above problems or other similar problems, embodiments of the present utility model provide a microphone assembly and an electronic device.

According to an embodiment of the present utility model, there is provided a microphone assembly including: a first circuit board and a second circuit board which are opposite to each other; a first wall portion fixed to a first opposing face of the first circuit board facing the second circuit board; and a second wall portion fixed to a second opposing surface of the second circuit board, the second opposing surface facing the first circuit board, the first wall portion and the second wall portion being opposite to each other in the same direction as the direction in which the first circuit board and the second circuit board are opposing, the first circuit board, the second circuit board, the first wall portion, and the second wall portion collectively enclosing a housing space, the microphone assembly further comprising a first element and a second element located in the housing space, the first element being provided to the first opposing surface of the first circuit board; the second element is disposed on the second opposite surface of the second circuit board.

Further, optionally, the number of the first elements is at least one.

In addition, optionally, in a case where the number of the first elements is plural, a plurality of the first elements are stacked and disposed on the first circuit board or a plurality of the first elements are respectively disposed on the first opposing surfaces of the first circuit board.

Additionally, optionally, the microphone assembly further includes a third element located within the receiving space, the third element being disposed on the second opposing face of the second circuit board.

Further optionally, the third element is an application specific integrated circuit.

In addition, optionally, the first element is an application specific integrated circuit, the second element is a mems sensor, an acoustic hole penetrating through the second circuit board is formed on the second circuit board, and the second element covers the acoustic hole.

Additionally, optionally, the first circuit board and the second circuit board are electrically connected through the first wall portion and the second wall portion.

According to an embodiment of the present utility model, there is further provided an electronic device including the microphone assembly described in any one of the above embodiments.

One of the beneficial effects of the embodiment of the utility model is that: through setting up the first component and the second component of microphone subassembly respectively on two circuit boards, can avoid when carrying out the aftertreatment to first component and second component each other to improve the performance of microphone subassembly, in addition, through setting up wall portion respectively on two circuit boards, can increase the intensity of circuit board, restrain the circuit board warpage, thereby improve the yield.

Specific embodiments of the utility model are disclosed in detail below with reference to the following description and drawings, indicating the manner in which the principles of the utility model may be employed. It should be understood that the embodiments of the utility model are not limited in scope thereby. The embodiments of the utility model include many variations, modifications and equivalents within the scope of the terms of the appended claims.

Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments in combination with or instead of the features of the other embodiments.

It should be emphasized that the term "comprises/comprising" when used herein is taken to specify the presence of stated features, integers, steps or components but does not preclude the presence or addition of one or more other features, integers, steps or components.

Drawings

Elements and features described in one drawing or one implementation of an embodiment of the utility model may be combined with elements and features shown in one or more other drawings or implementations. Furthermore, in the drawings, like reference numerals designate corresponding parts throughout the several views, and may be used to designate corresponding parts as used in more than one embodiment.

The accompanying drawings, which are included to provide a further understanding of embodiments of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model. It is evident that the drawings in the following description are only some embodiments of the present utility model and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art. In the drawings:

fig. 1 is a cross-sectional view of one implementation of a microphone assembly in accordance with an embodiment of the utility model.

Fig. 2 is an exploded view of the microphone assembly shown in fig. 1.

Fig. 3 is an exploded view of a first circuit board side of another implementation of a microphone assembly in accordance with an embodiment of the utility model.

Fig. 4 is an exploded view of a second circuit board side of another implementation of a microphone assembly in accordance with an embodiment of the utility model.

Detailed Description

The foregoing and other features of the utility model will become apparent from the following description, taken in conjunction with the accompanying drawings. In the specification and drawings, there have been specifically disclosed specific embodiments of the utility model that are indicative of some of the ways in which the principles of the utility model may be employed, it being understood that the utility model is not limited to the specific embodiments described, but, on the contrary, the utility model includes all modifications, variations and equivalents falling within the scope of the appended claims. Various embodiments of the present utility model are described below with reference to the accompanying drawings. These embodiments are merely illustrative and not limiting of the utility model.

In the embodiments of the present utility model, the terms "first," "second," "upper," "lower," etc. are used to distinguish between different elements from each other by reference, but do not denote a spatial arrangement or a temporal order of the elements, which should not be limited by the terms. The term "and/or" includes any and all combinations of one or more of the associated listed terms. The terms "comprises," "comprising," "including," "having," and the like, are intended to reference the presence of stated features, elements, components, or groups of components, but do not preclude the presence or addition of one or more other features, elements, components, or groups of components.

In embodiments of the present utility model, the singular forms "a," an, "and" the "include plural referents and should be construed broadly to mean" one "or" one type "and not limited to" one "or" another; furthermore, the term "comprising" is to be interpreted as including both the singular and the plural, unless the context clearly dictates otherwise. Furthermore, the term "according to" should be understood as "at least partially according to … …", and the term "based on" should be understood as "based at least partially on … …", unless the context clearly indicates otherwise.

Embodiments of the present utility model provide a microphone assembly. Fig. 1 is a cross-sectional view of one implementation of a microphone assembly in accordance with an embodiment of the utility model, and fig. 2 is an exploded schematic view of the microphone assembly shown in fig. 1.

As shown in fig. 1 and 2, the microphone assembly 1 includes a first circuit board 10, a second circuit board 20, a first wall portion 30, and a second wall portion 40, the first circuit board 10 and the second circuit board 20 are opposed to each other in a first direction z, the first circuit board 10 has a first opposed surface 110 facing the second circuit board 20, the second circuit board 20 has a second opposed surface 210 facing the first circuit board 10, the first wall portion 30 is fixed to the first opposed surface 110 of the first circuit board 10, the second wall portion 40 is fixed to the second opposed surface 210 of the second circuit board 20, and the first wall portion 30 and the second wall portion 40 are also opposed to each other in the first direction z and are fixed to each other in the first direction z, and the first circuit board 10, the second circuit board 20, the first wall portion 30, and the second wall portion 40 collectively enclose a housing space S. In addition, the second direction x and the third direction y are directions perpendicular to the first direction z, and the second direction x and the third direction y are perpendicular to each other.

As shown in fig. 1, the microphone assembly 1 further includes a first element 50 and a second element 60 disposed in the accommodating space S, the first element 50 is disposed on the first opposite surface 110 of the first circuit board 10, and the second element 60 is disposed on the second opposite surface 210 of the second circuit board 20.

Thus, by disposing the first element 50 and the second element 60 on the first circuit board 10 and the second circuit board 20, respectively, it is possible to avoid mutual influence in post-processing the first element 50 and the second element 60, thereby improving the performance of the microphone assembly 1; in addition, by providing the first wall portion 30 and the second wall portion 40 on the first circuit board 10 and the second circuit board 20, respectively, the strength of the first circuit board 10 and the second circuit board 20 can be increased, respectively, and warping of the first circuit board 10 and the second circuit board 20 can be suppressed, thereby improving the yield.

In the embodiment of the present utility model, as shown in fig. 2, the first circuit board 10 and the first wall portion 30 may be adhered and fixed by the adhesive 70, the second circuit board 20 and the second wall portion 40 may be adhered and fixed by the adhesive 71, the first wall portion 30 and the second wall portion 40 may be fixed by the adhesive 72, and the adhesives 70, 71, 72 may be solder paste, for example, but the embodiment of the present utility model is not limited thereto, and the adhesives 70, 71, 72 may be other adhesive materials. In addition, the adhesives 70, 71, 72 may be the same adhesive or may be different adhesives, and the embodiment of the present utility model is not limited thereto.

In addition, as shown in fig. 1 and 2, the first component 50 may be, for example, fixed on the first circuit board 10 by the package 510, where the first component 50 includes, for example, a semiconductor chip, and the package 510 includes, for example, leads, pins, molding compound, etc., and reference may be made to the related art, which is not limited in this embodiment of the present utility model.

In an embodiment of the utility model, the first element 50 is, for example, an Application Specific Integrated Circuit (ASIC), and the second element 60 is, for example, a microelectromechanical system (MEMS) sensor. For example, as shown in fig. 1 and 2, the second circuit board 20 is formed with an acoustic hole 220 penetrating the second circuit board 20, and the second element 60 covers the acoustic hole 220. For example, the acoustic wave signal is transmitted to the second element 60 through the acoustic port 220, the second element 60 converts the sensed acoustic wave signal into an electrical signal, and the first element 50 performs signal processing on the electrical signal converted by the second element 60, and for details of processing, reference may be made to the related art, and embodiments of the present utility model are not limited thereto.

In an embodiment of the present utility model, the first circuit board 10 and the second circuit board 20 may be electrically connected through the first wall portion 30 and the second wall portion 40. For example, a printed circuit may be formed on the first wall portion 30 and the second wall portion 40, and after the first circuit board 10, the second circuit board 20, the first wall portion 30, and the second wall portion 40 are bonded, the first circuit board 10 and the second circuit board 20 are electrically connected through the first wall portion 30 and the second wall portion 40, thereby realizing signal transmission between the first element 50 and the second element 60. In addition, the first element 50 and the second element 60 may also be signal-transmitted through wireless communication, which is not limited in the embodiment of the present utility model.

In addition, only the second element 60, e.g., a MEMS sensor, may be provided on the second circuit board 20, thereby providing sufficient space for the MEMS sensor to be improved, thereby further improving the performance of the microphone assembly, e.g., further improving the signal-to-noise ratio, further reducing noise, etc.

As shown in fig. 2, the contour of the projection of the first wall portion 30 in the xy plane coincides with the contour of the projection of the first circuit board 10 in the xy plane, but the embodiment of the present utility model is not limited thereto, and the contour of the projection of the first wall portion 30 in the xy plane may be slightly smaller or slightly larger than the contour of the projection of the first circuit board 10 in the xy plane, as long as the warpage of the first circuit board 10 can be suppressed.

As shown in fig. 2, the contour of the projection of the second wall portion 40 in the xy plane coincides with the contour of the projection of the second circuit board 20 in the xy plane, but the embodiment of the present utility model is not limited thereto, and the contour of the projection of the second wall portion 40 in the xy plane may be slightly smaller or slightly larger than the contour of the projection of the second circuit board 20 in the xy plane, as long as the warpage of the second circuit board 20 can be suppressed.

Fig. 3 is an exploded view of a first circuit board side of another implementation of a microphone assembly in accordance with an embodiment of the utility model.

In the embodiment of the present utility model, the number of the first elements 50 is at least one, and for example, as shown in fig. 1 and 2, one first element 50 is mounted on the first circuit board 10. As another example, as shown in fig. 3, the number of the first elements 50 is two, and two first elements 50 are stacked on the first circuit board 10, for example. In addition, the embodiment of the present utility model is not limited thereto, and for example, the number of the first elements 50 may be more than three, and more than three first elements 50 may be stacked on the first circuit board 10. The plurality of first elements 50 may be laid flat, for example, the plurality of first elements 50 may be disposed on the first opposing surface 110 of the first circuit board 10, and for example, the plurality of first elements 50 may be disposed side by side on the first opposing surface 110 of the first circuit board 10.

In addition, as shown in fig. 3, the plurality of first elements 50 may be encapsulated together by the encapsulation 510, but the embodiment of the present utility model is not limited thereto, and the plurality of first elements 50 may be encapsulated separately.

Fig. 4 is an exploded view of a second circuit board side of another implementation of a microphone assembly in accordance with an embodiment of the utility model.

In an embodiment of the present utility model, as shown in fig. 4, the microphone assembly 1 (not shown in fig. 4) may further include a third element 80 disposed on the second opposite surface 210 of the second circuit board 20, and the third element 80 is also located in the receiving space S (not shown in fig. 4). For example, as shown in fig. 4, the third element 80 and the second element 60 may be disposed side by side on the second opposite surface 210 of the second circuit board 20, but the embodiment of the utility model is not limited thereto, and the position of the third element 80 in the second opposite surface 210 may be set according to actual needs.

The third element 80 is, for example, an application specific integrated circuit. For example, the third element 80 and the second element 60 may perform signal transmission on the second circuit board 20, for example, the third element 80 may control the second element 60, or may process an electrical signal output by the second element 60.

In addition, the number of the third elements 80 is not limited in the embodiment of the present utility model, for example, as shown in fig. 4, the number of the third elements 80 is one, but the embodiment of the present utility model is not limited thereto, and the number of the third elements 80 may be plural, and the relative positions of the plurality of the third elements 80 is not limited in the embodiment of the present utility model, for example, the plurality of the third elements 80 may be stacked on the second circuit board 20, or may be arranged side by side on the second circuit board 20, and the plurality of the third elements 80 may be packaged together, or may be packaged individually.

As described above, according to the microphone assembly provided by the utility model, the first element and the second element of the microphone assembly are respectively arranged on the two circuit boards, so that the mutual influence on the first element and the second element during the post-processing can be avoided, and the performance of the microphone assembly is improved; in addition, by providing the wall portions on the two circuit boards, the strength of the circuit boards can be increased, and warpage of the circuit boards can be suppressed, thereby improving the yield.

An embodiment of the present utility model also provides an electronic apparatus including the microphone assembly 1 described in the above embodiment, and since the microphone assembly 1 has been described in detail in the above embodiment, the contents thereof are incorporated herein and the description thereof is omitted.

In the embodiment of the present utility model, the electronic device may be a microphone, a pickup, or the like, and may be other devices that need a microphone assembly, which is not limited in the embodiment of the present utility model.

According to the embodiment of the utility model, the first element and the second element of the microphone assembly are respectively arranged on the two circuit boards, so that mutual influence on the first element and the second element during post-processing can be avoided, and the performance of the microphone assembly is improved; in addition, by providing the wall portions on the two circuit boards, the strength of the circuit boards can be increased, and warpage of the circuit boards can be suppressed, thereby improving yield, and performance and yield of the electronic device.

While the utility model has been described in connection with specific embodiments, it will be apparent to those skilled in the art that the description is intended to be illustrative and not limiting in scope. Various modifications and alterations of this utility model will occur to those skilled in the art in light of the spirit and principles of this utility model, and such modifications and alterations are also within the scope of this utility model.

Claims (8)

1. A microphone assembly, the microphone assembly comprising:

a first circuit board and a second circuit board which are opposite to each other;

a first wall portion fixed to a first opposing face of the first circuit board facing the second circuit board; and

a second wall portion fixed to a second opposing face of the second circuit board facing the first circuit board,

the first wall part and the second wall part are opposite to each other and fixed with each other in the same direction as the opposite direction of the first circuit board and the second circuit board, the first circuit board, the second circuit board, the first wall part and the second wall part jointly enclose an accommodating space,

the microphone assembly further includes a first element and a second element within the receiving space, the first element disposed on the first opposing face of the first circuit board; the second element is disposed on the second opposite surface of the second circuit board.

2. The microphone assembly of claim 1 wherein the microphone assembly is configured to receive a microphone signal,

the number of the first elements is at least one.

3. A microphone assembly as claimed in claim 2, wherein,

when the number of the first elements is plural, a plurality of the first elements are stacked on the first circuit board or a plurality of the first elements are respectively disposed on the first opposite surfaces of the first circuit board.

4. A microphone assembly as claimed in claim 3, wherein,

the microphone assembly further includes a third element located within the receiving space, the third element disposed on the second opposing face of the second circuit board.

5. The microphone assembly of claim 4 wherein the microphone assembly is configured to receive a microphone signal,

the third element is an application specific integrated circuit.

6. The microphone assembly of any of claims 1-5 wherein,

the first element is an application specific integrated circuit, the second element is a MEMS sensor,

and the second circuit board is provided with an acoustic hole penetrating through the second circuit board, and the second element covers the acoustic hole.

7. The microphone assembly of claim 6 wherein the microphone assembly is configured to receive a microphone signal,

the first circuit board is electrically connected with the second circuit board through the first wall portion and the second wall portion.

8. An electronic device comprising the microphone assembly of any of claims 1-7.