CN219019032U

CN219019032U - Waterproof and dustproof unidirectional silicon microphone

Info

Publication number: CN219019032U
Application number: CN202223265502.6U
Authority: CN
Inventors: 雷本群
Original assignee: Individual
Current assignee: Individual
Priority date: 2022-12-05
Filing date: 2022-12-05
Publication date: 2023-05-12
Anticipated expiration: 2032-12-05

Abstract

The application discloses a waterproof and dustproof unidirectional silicon microphone, which comprises a PCB, a shell arranged on the PCB, an MEMS chip and an ASIC chip which are arranged on the PCB and accommodated in the shell, wherein a first sound hole opposite to the MEMS chip is formed in the PCB, and a first damping part between the PCB and the MEMS chip is covered at the first sound hole; a second sound hole is formed in the side wall of the shell, and a second damping located in the shell is covered at the second sound hole; the first damping and the second damping are waterproof and dustproof multi-layer grid structures, and acoustic resistances of the first damping and the second damping are different. The damping of waterproof and dustproof multilayer grid structure is set up through seting up two sound holes and respectively, and the lateral wall at the shell is seted up to the second sound hole, has better unidirectional nature, and has better waterproof dustproof ability, and is applicable to ultra-thin electronic product.

Description

Waterproof and dustproof unidirectional silicon microphone

Technical Field

The utility model relates to the technical field of silicon microphones, in particular to a waterproof and dustproof unidirectional silicon microphone.

Background

A silicon microphone, i.e., a MEMS (micro electro mechanical systems) microphone, is an electrical transducer manufactured by a micromachining technology, and has the characteristics of small volume, good frequency response, low noise, and the like. Silicon microphones typically include components such as PCBs (printed circuit boards), housings, MEMS chips, and ASIC (application specific integrated circuit) chips.

The directional microphone has different sound receiving capacities in different directions, so that the requirements of specific scenes can be met. However, the directionality of the existing silicon microphone cannot meet the requirements, and the existing silicon microphone has insufficient waterproof and dustproof capabilities and is not suitable for ultrathin electronic products.

Disclosure of Invention

The embodiment of the utility model provides a waterproof and dustproof unidirectional silicon microphone, which is used for realizing better unidirectional property and waterproof and dustproof capacity and is suitable for ultrathin electronic products.

In order to solve the technical problems, the technical scheme adopted is as follows: the waterproof and dustproof unidirectional silicon microphone comprises a PCB, a shell arranged on the PCB, an MEMS chip and an ASIC chip, wherein the MEMS chip and the ASIC chip are arranged on the PCB and contained in the shell, a first sound hole opposite to the MEMS chip is formed in the PCB, and a first damping part between the PCB and the MEMS chip is covered at the first sound hole; a second sound hole is formed in the side wall of the shell, and a second damping located in the shell is covered at the second sound hole; the first damping and the second damping are waterproof and dustproof multi-layer grid structures, and acoustic resistances of the first damping and the second damping are different.

In some alternative embodiments, the first damper is disposed on the PCB by a glue material, and the MEMS chip is disposed on the first damper by a glue material.

In some alternative embodiments, the second damping is attached to the inner side of the side wall of the housing by a high temperature resistant pressure sensitive adhesive.

In some alternative embodiments, the first damping and the second damping are high temperature resistant damping.

In some alternative embodiments, the first acoustic port has a height that is less than a width.

From the above technical solutions, the embodiment of the present utility model has the following advantages:

the damping device has the advantages that the damping device is provided with two sound holes and is respectively provided with the waterproof and dustproof multi-layer grid structure, so that the damping device has good unidirectional property and good waterproof and dustproof capabilities; in addition, the conventional unidirectional microphone has two sound inlet holes respectively positioned on two opposite surfaces of the microphone, when the microphone is installed on an electronic product, the two opposite surfaces of the electronic product are required to be subjected to hole opening design, but certain ultrathin electronic products cannot meet the design, and the second sound inlet holes are formed in the side wall of the shell, so that the microphone can be correspondingly installed on the electronic product, hole opening design can be performed on the side surface of the electronic product, side sound inlet is realized, and the microphone can be suitable for some ultrathin electronic products with two surfaces unsuitable for hole opening at the same time, and further wider application requirements are met.

Drawings

Fig. 1 is a schematic structural diagram of a waterproof and dustproof unidirectional silicon microphone according to an embodiment of the present utility model.

Detailed Description

In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.

The terms first, second, third and the like in the description and in the claims and in the above drawings, are used for distinguishing between different objects and not necessarily for describing a particular sequential or chronological order. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.

The following will each explain in detail by means of specific examples.

Referring to fig. 1, an embodiment of the present utility model provides a waterproof and dustproof unidirectional silicon microphone. The waterproof and dustproof unidirectional silicon microphone comprises: a PCB11, a housing 12 provided on the PCB11, a MEMS chip 13 and an ASIC chip 14 provided on the PCB11 and accommodated in the housing 12.

Wherein, the shell 12 and the PCB11 are attached together to form a packaging structure, and the inside forms a containing space of the chip. The housing 12 is made of metal material to ensure electromagnetic shielding effect of the package structure. The housing 12 and the PCB11 are fixed to each other and electrically connected. Alternatively, the housing 12 and the PCB11 may be physically and electrically connected by conductive paste or solder paste.

The housing 12 may include a top opposite the PCB11 and a sidewall extending from a peripheral edge of the top toward the PCB. The side walls and the top part enclose a semi-enclosed structure of the housing, and the PCB11 is fixed at the position of the open end of the housing 12, which together form a package structure with a receiving space.

The MEMS chip 13, the ASIC chip 14 are located in the closed accommodation space and mounted on the PCB11. The MEMS chip 13 is a transducer for converting an acoustic signal into an electrical signal (capacitance change), and the MEMS chip 13 is fabricated by a MEMS (micro electro mechanical system) process. The MEMS chip 13 and the ASIC chip 14 may be connected together by a bonding wire 19, so that an electrical signal output from the MEMS chip 13 may be transmitted to the ASIC chip 14, and processed (converted into an electrical signal) by the ASIC chip 14 and then output. The ASIC chip 14 may be electrically connected to the PCB11 by bond wires 19. The bond wire 19, which may also be referred to herein as a bond wire or wire bond, is a metal wire that serves as an electrical connection, including but not limited to a gold wire.

The PCB11 is provided with a first sound hole 15 at a position opposite to the MEMS chip 13, the shell 12 is provided with a second sound hole 16, and the second sound hole 16 is arranged on the side wall of the shell 12. The first sound hole 15 is covered with a first damping 17 between the PCB11 and the MEMS chip 13, and the second sound hole 16 is covered with a second damping 18 inside the housing 12. The first damper 17 and the second damper 18 are waterproof and dustproof dampers, and the acoustic resistances of the first damper 17 and the second damper 18 are different. Therefore, the silicon microphone has strong unidirectional property and good waterproof and dustproof performances.

Alternatively, the first damper 17 is disposed on the PCB11 by bonding technology through the adhesive 20 by using a semiconductor packaging process, and the MEMS chip 13 is disposed on the first damper 17 by bonding technology through the adhesive 20.

Optionally, the second damper 18 is disposed on the inner side of the side wall of the housing 12 in a bonding manner through a high temperature resistant adhesive 21, and is located inside the housing 12 and protected by the housing 12.

Optionally, the first damping 17 and the second damping 18 are high temperature resistant damping, e.g. damping that is resistant to high temperatures above 400 degrees celsius.

Alternatively, the first damping 17 and the second damping 18 are multi-layered grid structures, which naturally have dustproof and waterproof capabilities.

Optionally, a plurality of pads 21 are provided on a side of the PCB11 facing away from the housing 12 for external connection, and the pads 21 are electrically connected to the MEMS chip 13 and/or the ASIC chip 14 through wiring on the PCB11.

Optionally, the first acoustic port 15 has a height less than the width, i.e., is a flat port, to accommodate ultra-thin designs.

Optionally, in order to ensure that the unidirectional silicon microphone in the embodiment of the application has the high-temperature reflow oven temperature resistance of an SMD component, a PTFE (polytetrafluoroethylene) material capable of resisting the temperature of 370 ℃ for a long time (more than 5 minutes) can be selected to manufacture the diaphragm.

As above, the embodiments of the present application provide a waterproof and dustproof unidirectional silicon microphone.

According to the embodiment of the application, on the basis of the all-directional silicon microphone packaging structure, the shell is changed into the side wall hole (second sound hole) from airtight, the second damping with a certain acoustic resistance coefficient is attached to the inner side, and the second damping and the shell are adhered together through the self-adhesive tape capable of resisting 400 ℃. In addition, a first damping with a certain acoustic resistance coefficient is bound to the PCB through a bonding technology at one side of the PCB sound inlet hole (a first sound hole) close to the MEMS chip, and then the MEMS chip is attached on the PCB through the bonding technology. The acoustic resistances of the first damping and the second damping have a certain difference value, and can be flexibly allocated according to actual needs. If more sound is required to enter at the PCB face, the acoustic resistance of the first damping may be selected to be relatively small; conversely, the second damping is chosen to be smaller in acoustic resistance.

according to the damping device, the damping of the waterproof and dustproof multilayer grid structure is respectively arranged through the two sound holes, so that better unidirectional performance is obtained, and the waterproof and dustproof capability is better; in addition, the side sound is realized by arranging the second sound hole on the side wall of the shell, and the shell is suitable for some ultrathin electronic products with two sides unsuitable for being simultaneously perforated, so that wider application requirements are met.

In addition, the two sound inlet holes of the conventional unidirectional microphone are respectively positioned on two opposite surfaces of the microphone, when the microphone is installed on an electronic product, two wanted surfaces of the electronic product are required to be provided with holes, but certain ultrathin electronic products cannot meet the design, and the side wall of the shell provided with the second sound inlet holes is correspondingly installed on the electronic product, so that the microphone can be provided with holes on the side surface of the electronic product, and the microphone can be suitable for some ultrathin electronic products with two surfaces unsuitable for being provided with holes simultaneously.

In the foregoing embodiments, the descriptions of the embodiments are each focused, and for those portions of one embodiment that are not described in detail, reference may be made to the related descriptions of other embodiments.

The above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; those of ordinary skill in the art will appreciate that: the technical scheme described in the above embodiments can be modified or some technical features thereof can be replaced equivalently; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims

1. A waterproof and dustproof unidirectional silicon microphone comprises a PCB, a shell arranged on the PCB, a MEMS chip and an ASIC chip which are arranged on the PCB and accommodated in the shell, and is characterized in that,

the PCB is provided with a first sound hole which is opposite to the MEMS chip, and a first damping part positioned between the PCB and the MEMS chip is covered at the first sound hole;

a second sound hole is formed in the side wall of the shell, and a second damping located in the shell is covered at the second sound hole;

the first damping and the second damping are waterproof and dustproof multi-layer grid structures, and acoustic resistances of the first damping and the second damping are different.

2. A waterproof and dustproof unidirectional silicon microphone as claimed in claim 1, characterized in that,

the first damping is arranged on the PCB through a glue material, and the MEMS chip is arranged on the first damping through the glue material.

3. A waterproof and dustproof unidirectional silicon microphone as claimed in claim 1, characterized in that,

the second damping is adhered to the inner side of the side wall of the shell through high-temperature-resistant adhesive.

4. A waterproof and dustproof unidirectional silicon microphone as claimed in claim 1, characterized in that,

the first damping and the second damping are high temperature resistant damping.

5. A waterproof and dustproof unidirectional silicon microphone as claimed in claim 1, characterized in that,

the first acoustic port has a height that is less than a width.