CN209882089U

CN209882089U - Directional dustproof silicon microphone

Info

Publication number: CN209882089U
Application number: CN201920840735.3U
Authority: CN
Inventors: 张绍年; 罗小虎
Original assignee: Dongguan Rui Qin Electronics Co Ltd
Current assignee: Dongguan Rui Qin Electronics Co Ltd
Priority date: 2019-06-03
Filing date: 2019-06-03
Publication date: 2019-12-31
Anticipated expiration: 2029-06-03

Abstract

The utility model discloses a directive dustproof silicon microphone with maximum reception capability in a specific direction, which comprises a PCB, a shell, an MEMS chip and an ASIC chip, wherein the shell is used for enclosing a containing space with the PCB, and the MEMS chip and the ASIC chip are contained in the containing space; a second sound hole is formed in the position, corresponding to the MEMS chip, of the PCB, and a second damping net covers the second sound hole; the first damping mesh has an air permeability at least twice that of the second damping mesh. The utility model discloses a set up ventilative volume at two phonate holes and differ the damping net more than the twice for silicon microphone finally shows strong unidirectional nature, and is very outstanding in dustproof ability moreover.

Description

Directional dustproof silicon microphone

Technical Field

The utility model relates to a silicon microphone technical field, concretely relates to dustproof silicon microphone of directive property.

Background

A silicon microphone, i.e., an MEMS (micro electro mechanical Systems) microphone, is an electric transducer manufactured by using a micromachining technology, and has the characteristics of small volume, good frequency response, low noise, and the like. With the development of miniaturization and thinning of electronic devices, MEMS microphones are increasingly widely used for these devices.

A silicon microphone generally includes a PCB (Printed Circuit Board), a housing, a MEMS chip, an ASIC (Application Specific Integrated Circuit) chip, and other components, wherein the PCB and the housing enclose a housing space, and the MEMS chip and the ASIC chip are housed in the housing space.

The directional microphone has different sound receiving capabilities in different directions, so that the requirement of a specific scene can be met. However, the existing silicon microphone has directivity which cannot meet the requirement and insufficient dustproof capability.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a directive property dustproof silicon microphone that has the biggest radio reception ability in specific direction.

In order to solve the technical problems, the technical scheme is as follows:

a directional dustproof silicon microphone comprises a PCB, a shell, an MEMS chip and an ASIC chip, wherein the shell is used for enclosing with the PCB to form an accommodating space; a second sound hole is formed in the position, corresponding to the MEMS chip, of the PCB, and a second damping net covers the second sound hole; the first damping mesh has an air permeability at least twice that of the second damping mesh.

Optionally, the first damping net is arranged on the inner wall or the outer side of the shell.

Optionally, the second damping mesh is disposed between the PCB and the MEMS chip.

Optionally, the first damping net and/or the second damping net are silicon wafers with a certain damping coefficient.

Optionally, the first damping mesh and/or the second damping mesh are high-temperature-resistant damping meshes.

Optionally, the housing is a metal housing.

According to the technical solution provided by the utility model, the embodiment of the utility model has the following advantage:

by arranging the damping nets with the air permeability difference more than two times at the two sound holes, the silicon microphone finally shows strong unidirectional property and is excellent in dustproof capacity, such as IP6X or higher level, and has wider requirements in market application.

Drawings

Fig. 1 is a schematic structural diagram of a directional dustproof silicon microphone provided by an embodiment of the present invention.

Detailed Description

In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.

The terms "first," "second," "third," and the like in the description and in the claims, and in the drawings described above, are used for distinguishing between different objects and not necessarily for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions.

The following are detailed descriptions of the respective embodiments.

Referring to fig. 1, an embodiment of the present invention provides a directional dustproof silicon microphone with maximum sound receiving capability in a specific direction.

The directional dustproof silicon microphone includes: a PCB11, a housing 12 for enclosing a housing space with the PCB, a MEMS chip 13 and an ASIC chip 14 housed in the housing space.

The housing 12 and the PCB11 are attached together to form a package structure, and a chip receiving space is formed inside the package structure. The housing 12 is made of metal material to ensure the electromagnetic shielding effect of the package structure. The housing 12 and the PCB11 are secured to one another and electrically connected. Alternatively, the housing 12 and the PCB11 may be secured to one another by conductive glue or solder paste, or the like.

The housing 12 may include a top portion opposite the PCB11, and side wall portions extending from peripheral edges of the top portion in a direction toward the PCB. The side wall portion and the top portion form a semi-enclosed structure of the housing, and the PCB11 is fixed at the open end of the housing 12, and the two together form a package structure with a containing space.

The MEMS chip 13 and the ASIC chip 14 are located in the closed housing space, and may be mounted on the PCB 11. The MEMS chip 13 is a transducer for converting a sound signal into an electrical signal, and the MEMS chip 13 is manufactured by a MEMS (micro electro mechanical system) process. The MEMS chip and the ASIC chip can be connected together by a gold wire 19, so that the electrical signal output by the MEMS chip can be transmitted to the ASIC chip, processed and output by the ASIC chip.

The housing 12 is provided with a first sound hole 16, and the PCB11 is provided with a second sound hole 15 corresponding to the MEMS chip 13 for sound to enter.

A first damping net 17 covers the first sound hole 16, and a second damping net 18 covers the second sound hole 15; the first damping mesh has an air permeability at least twice that of the second damping mesh. Thus giving the silicon microphone a strong unidirectional directivity.

In one implementation, a first damping mesh covering air permeability above 1000/m ^2/24h at the first sound holes 16 and a second damping mesh covering air permeability below 500g/m ^2/24h at the second sound holes 15 may be selected. The sound reception capability of the silicon microphone is: in the 0 ° direction (i.e., the housing opening direction), the recording capability for sound is the weakest, and the recording capability for sound from the PCB direction is the strongest.

In one implementation, a first damping mesh covering an air permeability amount below 500g/m ^2/24h at the first sound holes 16 and a second damping mesh covering an air permeability amount above 1000/m ^2/24h at the second sound holes 15 may be selected. The sound reception capability of the silicon microphone is: in the 0 ° direction (i.e., the housing opening direction), the recording capability for sound is the strongest, and the recording capability for sound from the PCB direction is the weakest.

Optionally, the first damping net 17 is arranged on the inner wall or the outer side of the housing in a sticking mode.

Optionally, the second damping mesh 18 is mounted between the PCB and the MEMS chip by using a semiconductor packaging technology.

Optionally, the first damping mesh and/or the second damping mesh are silicon wafers with a certain damping coefficient or high temperature resistant damping meshes.

Optionally, the first damping mesh and/or the second damping mesh are adhered to the corresponding sound holes (the first sound holes or the second sound holes) by glue 20.

Optionally, a plurality of pads 21 are disposed on a surface of the PCB11 facing away from the housing 12 for external connection, and the pads 21 are connected to the MEMS chip 13 and/or the ASIC chip 14 through wires on the PCB.

The utility model discloses a dustproof silicon microphone of directive property of above-mentioned structure not only has strong directive property, and is very outstanding in dustproof ability moreover, for example can reach IP6X or higher level, has wider demand on market uses.

In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to the related descriptions of other embodiments.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; those of ordinary skill in the art will understand that: the technical solutions described in the above embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. A directional dustproof silicon microphone comprises a PCB, a shell used for enclosing with the PCB to form a containing space, an MEMS chip and an ASIC chip contained in the containing space, and is characterized in that,

a first sound hole is formed in the shell, and a first damping net covers the first sound hole;

a second sound hole is formed in the position, corresponding to the MEMS chip, of the PCB, and a second damping net covers the second sound hole;

the first damping mesh has an air permeability at least twice that of the second damping mesh.

2. The directional dust-proof silicon microphone of claim 1,

the first damping net is arranged on the inner wall or the outer side of the shell.

3. The directional dust-proof silicon microphone of claim 1,

the second damping mesh is disposed between the PCB and the MEMS chip.

4. The directional dust-proof silicon microphone of claim 1,

the first damping net and/or the second damping net are/is a silicon chip with a certain damping coefficient.

5. The directional dust-proof silicon microphone of claim 1,

the first damping net and/or the second damping net are/is a high-temperature-resistant damping net.

6. The directional dust-proof silicon microphone of claim 1,

the shell is a metal shell.