CN210168225U

CN210168225U - Waterproof dustproof silicon microphone that shocks resistance

Info

Publication number: CN210168225U
Application number: CN201920840731.5U
Authority: CN
Inventors: 张绍年; 罗小虎
Original assignee: Dongguan Rui Qin Electronics Co Ltd
Current assignee: Dongguan Rui Qin Electronics Co Ltd
Priority date: 2019-06-03
Filing date: 2019-06-03
Publication date: 2020-03-20
Anticipated expiration: 2029-06-03

Abstract

The utility model discloses a waterproof dustproof shock resistance silicon microphone, the silicon microphone comprises a shell, a PCB, an ASIC chip and an MEMS chip, wherein the PCB forms a containing space with the shell, the ASIC chip and the MEMS chip are contained in the containing space, the sound inlet of the waterproof dustproof shock resistance silicon microphone is arranged at the top of the shell, and the top of the shell is provided with a dustproof net which covers the sound inlet and has waterproof and dustproof functions; the MEMS chip and the ASIC chip are respectively installed on the PCB in a BGA mode, and gold wires are not connected between the MEMS chip and the ASIC chip. The utility model discloses a silicon microphone has good waterproof dustproof function, and cancels the gold thread completely and binds the process, and production assembly simple process.

Description

Waterproof dustproof silicon microphone that shocks resistance

Technical Field

The utility model relates to a silicon microphone technical field, concretely relates to waterproof dustproof silicon microphone that shocks resistance.

Background

A silicon microphone, i.e., an MEMS (micro electro mechanical Systems) microphone, is an electric transducer manufactured by using a micromachining technology, and has the characteristics of small volume, good frequency response, low noise, and the like. With the development of miniaturization and thinning of electronic devices, MEMS microphones are increasingly widely used for these devices.

A silicon microphone generally includes a PCB (Printed Circuit Board), a case, a MEMS chip, an ASIC (Application Specific Integrated Circuit) chip, and other components, wherein the PCB and the case enclose a housing space, and the MEMS chip and the ASIC chip are housed in the housing space.

In the traditional silicon microphone with sound entering from the bottom, the sound inlet hole is formed in the PCB, and the dust screen cannot be directly attached to the outside like the traditional electret microphone due to the fact that the welding surface is arranged on one side of the sound inlet hole.

In addition, in the traditional silicon microphone, the ASIC chip, the MEMS chip and the PCB are electrically connected in a gold thread binding mode, so that the production and assembly process is complex and the efficiency is low.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a waterproof dustproof silicon microphone that shocks resistance.

In order to solve the technical problems, the technical scheme is as follows:

a waterproof dustproof shock-resistant silicon microphone comprises a shell, a PCB surrounding a containing space with the shell, an ASIC chip and an MEMS chip contained in the containing space,

the sound inlet of the waterproof, dustproof and impact-resistant silicon microphone is arranged at the top of the shell, and the top of the shell is provided with a dustproof net which covers the sound inlet and has waterproof and dustproof functions;

the MEMS chip and the ASIC chip are respectively installed on the PCB in a BGA mode, and gold wires are not connected between the MEMS chip and the ASIC chip.

Optionally, a layer of filling glue is coated between the MEMS chip and the PCB and/or between the ASIC chip and the PCB.

Optionally, the pad of the waterproof, dustproof and impact-resistant silicon microphone for electrically connecting with the outside is disposed on a surface of the PCB facing away from the housing.

According to the technical solution provided by the utility model, the embodiment of the utility model has the following advantage:

establish at the casing top through advancing the sound hole to can not receive the influence of PCB face of weld, cover the dust screen that has dustproof and waterproof function in sound hole department, make silicon microphone realize waterproof and dustproof function, can make silicon microphone reach IP68 rank in dustproof and waterproof ability through selecting the dust screen, have extensive application demand in the market. Moreover, the proposal of the utility model also has the advantages of low price, being assembled in advance in the microphone manufacturing factory, etc.

Moreover, the MEMS chip and the ASIC chip are respectively installed on the PCB in a BGA mode, compared with the traditional COB packaging mode, the process of gold wire binding (wierbonding) is reduced in the processing technology, the production and assembly technology is simple, the efficiency is improved, and the processing cost is saved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive work.

Fig. 1 is a schematic structural diagram of a waterproof, dustproof, and impact-resistant silicon microphone according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a waterproof, dustproof and impact-resistant silicon microphone according to another embodiment of the present invention.

Detailed Description

In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.

The terms "first," "second," "third," and the like in the description and in the claims, and in the drawings described above, are used for distinguishing between different objects and not necessarily for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions.

The following are detailed descriptions of the respective embodiments.

Referring to fig. 1, an embodiment of the present invention provides a waterproof, dustproof and impact-resistant silicon microphone 10.

The silicon microphone 10 includes a housing 12, a PCB11 enclosing a housing space with the housing 12, an ASIC chip 14 and a MEMS chip 13 housed in the housing space.

The housing 12 and the PCB11 are attached together to form a package structure, and a chip accommodating space is formed inside the package structure. The housing 12 is made of metal material to ensure the electromagnetic shielding effect of the package structure. The housing 12 and the PCB11 are secured to one another and electrically connected. Alternatively, the housing 12 and the PCB11 may be secured to one another by conductive glue or solder paste, or the like.

The housing 12 may include a top portion opposite the PCB11 and side wall portions extending from peripheral edges of the top portion in a direction toward the PCB. The side wall portion and the top portion form a semi-enclosed structure of the housing, and the PCB11 is fixed at the open end of the housing 12, and the two together form an encapsulation structure with a containing space.

The MEMS chip 13 and the ASIC chip 14 are located in the closed housing space, and may be mounted on the PCB 11. The MEMS chip 13 is a transducer for converting a sound signal into an electrical signal, and the MEMS chip 13 is manufactured by a MEMS (micro electro mechanical system) process. The MEMS chip and the ASIC chip are connected together, so that the electric signal output by the MEMS chip can be transmitted into the ASIC chip, processed and output by the ASIC chip.

The PCB11 is provided with sound holes 15 at locations corresponding to the MEMS chips 13 for sound to enter.

In this embodiment, the sound inlet 15 of the waterproof, dustproof, and impact-resistant silicon microphone is disposed at the top of the casing 12, and the top of the casing 12 is provided with a dustproof mesh 17 having a waterproof and dustproof function and covering the sound inlet 15. The dust screen 17 may be bonded to the top of the housing 12 by a self-adhesive glue 20.

The MEMS chip 13 and the ASIC chip 14 are mounted on the PCB11 in a BGA manner, respectively, without connecting gold wires to each other. That is, the MEMS chip 13 and the ASIC chip 14 are electrically connected to the PCB11 through solder balls 21, respectively.

Optionally, a layer of underfill 16 is applied between the MEMS chip 13 and the PCB11, and/or between the ASIC chip 14 and the PCB 11.

The PCB11 has a first side 111 for mounting the housing 12 and the MEMS chip and the ASIC chip, and a second side 112 facing away from the housing 12.

In this embodiment, the pads 18 of the waterproof, dustproof and impact resistant silicon microphone for electrical connection with the outside are disposed on the side of the PCB11 facing away from the case 12, i.e., the second side 112.

The pads 18 are pads that can be mounted by an SMT (Surface Mounting Technology) process.

The silicon microphone with the structure can be directly stuck with a waterproof, dustproof and high-temperature-resistant dustproof net on the surface of the PCB sound hole; because the pad (pad) with the SMT function is arranged on the surface of the PCB, which is far away from the shell 12, and the dustproof net 17 is arranged on the shell 12, the automatic mounting cannot be influenced by the sticking of the waterproof dustproof net. The silicon microphone of the scheme can realize excellent waterproof and dustproof performance, and has the advantages of low price, capability of being assembled in advance in a microphone factory and the like.

The silicon microphone with the structure is characterized in that the MEMS chip and the ASIC chip are mounted on the PCB in a BGA (Ball Grid Array) mode respectively, and compared with the traditional COB (chip on Board) packaging mode, the process of gold wire binding is reduced in the processing technology, the production and assembly technology is simple, the efficiency is improved, and the processing cost is saved.

The silicon microphone with the structure changes the flow sheet process of the MEMS chip, and changes the signal output mode of the MEMS chip from a metal bonding pad (pad) to BGA solder ball output; meanwhile, the chip flow process of the ASIC chip is changed, and the COB packaging mode is changed into the BGA mode; then, the electrical signal on the MEMS chip is sequentially conducted through the solder balls on the MEMS chip, the PCB and the solder balls on the ASIC chip by the matched PCB, and finally the ASIC chip is achieved. And after the ASIC signal processing and the signal amplification, the electric signal is transmitted to a client side welding Pad through a tin ball on the ASIC and the PCB.

Because the MEMS chip (die) is electrically connected with the PCB through the solder balls, in order to further ensure that the MEMS chip and the PCB achieve the effect of complete sealing, and meanwhile, in consideration of the process operability, in some embodiments of the invention, the bottom filling glue is coated on the PCB, so that the sealing performance of the MEMS die and the PCB is ensured, and the bonding firmness between the ASIC chip and the PCB is greatly enhanced.

Referring to fig. 2, in some embodiments, the top center of the housing 12 has a protrusion 121, and the dust-proof net 17 is disposed on the protrusion 121; the top of the shell 12 is also adhered by sealing glue and sleeved with a sealing cover 19, a concave part 191 is arranged in the center of the sealing cover 19, and a convex part 121 on the top of the shell 12 is accommodated in the concave part 191. And the sealing cover 19 has an opening 192 corresponding to the sound inlet hole 15. The sealing cover 19 is used for compressing the dust screen to prevent the dust screen from warping and falling off to influence the waterproof and dustproof performance.

Furthermore, the outer surface of the sealing cover 19 has a plurality of elastic bumps 193 for buffering the external pressure on the silicon microphone and avoiding affecting the sensitivity of the silicon microphone.

Optionally, the dust screen 17 includes a damping material, or a damping material located inside the dust screen 17 is disposed in the sound inlet 15, and the damping material has a smaller damping effect on sound signals within a specific frequency range and a larger damping effect on sound signals outside the specific frequency range. For example, the damping material layer or damping material damps sound signals of 10KHz, 5KHz or more than 2KHz, which is more than 2 times the damping of sound signals in the range of 100Hz-1 KHz. So that the silicon microphone mainly responds to sound signals within a specific frequency range to meet the requirements of specific scenes. Silicon wafers or other materials may be employed as the damping material.

To sum up, the embodiment of the utility model provides a waterproof dustproof protecting against shock silicon microphone is through establishing the sound inlet at the casing top to can not receive the influence of PCB face of weld, cover the dust screen that has dustproof and waterproof function in sound inlet department, make silicon microphone realize waterproof and dustproof function, can make silicon microphone reach the IP68 rank on dustproof and waterproof ability through selecting the dust screen, have extensive application demand in market. Moreover, the proposal of the utility model also has the advantages of low price, being assembled in advance in the microphone manufacturing factory, etc.

And, after the underfill is added between the chip and the PCB, the shock resistance of the silicon microphone can be improved.

In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to the related descriptions of other embodiments.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; those of ordinary skill in the art will understand that: the technical solutions described in the above embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. A waterproof dustproof shock resistance silicon microphone, the silicon microphone includes a shell, a PCB enclosing with the shell to form a containing space, an ASIC chip and an MEMS chip contained in the containing space, characterized in that,

2. The waterproof dustproof impact-resistant silicon microphone according to claim 1,

and a layer of filling glue is coated between the MEMS chip and the PCB and/or between the ASIC chip and the PCB.

3. The waterproof dustproof impact-resistant silicon microphone according to claim 1,

and a bonding pad of the waterproof dustproof anti-impact silicon microphone, which is used for being electrically connected with the outside, is arranged on one surface of the PCB, which is deviated from the shell.