CN220629461U - Photosensitive assembly, camera module and electronic equipment - Google Patents

Abstract

The application proposes a photosensitive assembly, it includes: a circuit board having a connection surface; the photosensitive element is arranged on the connecting surface and is electrically connected with the circuit board; the bracket is arranged on the connecting surface, at least part of the bracket is arranged on one side of the photosensitive element, which is away from the circuit board, and a window for allowing light to pass through is arranged at the position of the bracket corresponding to the photosensitive element; the optical filter is arranged at the window and connected to one side of the support, which is away from the photosensitive element, wherein the part of the support, which is connected with the optical filter, is made of metal; the packaging body is arranged on the connecting surface and packages the support, and an opening is arranged at the position of the packaging body corresponding to the window. The light sensing component is characterized in that the support is connected with the light filtering piece and is made of metal, so that the support strength of the support is high, the support is packaged by the packaging body, the support strength is high, the light sensing component can be normally used in various complex and harsh environments without cracking, and the reliability of the camera module is improved. The application also provides a camera module and electronic equipment.

Description

Photosensitive assembly, camera module and electronic equipment

Technical Field

The application relates to the technical field of camera shooting, in particular to a photosensitive assembly, a camera shooting module and electronic equipment.

Background

With the development of electronic equipment technology, existing terminal equipment is generally equipped with a camera module. Users often use the camera module in the terminal equipment to take pictures and record videos, and especially, the application of the terminal equipment such as mobile phones, tablet computers and the like is most widely used.

Among the prior art, the module of making a video recording generally includes the support, and the support has the portion of bearing, is provided with the light filter on the portion of bearing, and the top of light filter is provided with the camera, and the below of light filter is provided with the circuit board, is provided with the sensitization chip on the circuit board. However, since the bracket is generally made of plastic, the support strength of the bracket is low, and the bracket is used in various complex and harsh environments with cracking risks, so that the reliability of the camera module is affected.

Disclosure of Invention

In view of the foregoing, it is necessary to provide a photosensitive assembly, a camera module and an electronic device, so as to enhance the supporting strength of the bracket and improve the reliability of the camera module.

An embodiment of the present application provides a photosensitive assembly, including: a circuit board having a connection surface; the photosensitive element is arranged on the connecting surface and is electrically connected with the circuit board; the bracket is arranged on the connecting surface, at least part of the bracket is arranged on one side of the photosensitive element, which is away from the circuit board, and a window for allowing light to pass through is arranged at the position of the bracket corresponding to the photosensitive element; the light filtering piece is arranged at the window and connected to one side of the support, which is away from the photosensitive element, wherein the part of the support, which is connected with the light filtering piece, is made of metal; the packaging body is arranged on the connecting surface and packages the support, and an opening is arranged at the position of the packaging body corresponding to the window.

In the above photosensitive assembly, the portion of the bracket connected with the filter element is made of metal, so that the support strength of the bracket is high. And the strength of the bracket can be further improved by the encapsulation body for encapsulating the bracket, and the bracket can be normally used in various complex and harsh environments without cracking, thereby being beneficial to improving the reliability of the camera module.

In some embodiments, the stent comprises: the protruding part is connected with the connecting surface and protrudes away from the connecting surface; and one end of the extending part is connected with one end of the protruding part, which is away from the connecting surface, and the other end of the extending part extends to one side of the photosensitive element, which is away from the circuit board, wherein the window is formed at the other end of the extending part.

So, buckle between protruding portion and the extension, photosensitive element can hold in protruding portion, extension and the space that the junction surface formed, not only can form the protection to photosensitive element, can also make whole structural layout compact, be favorable to the miniaturization of camera module.

In some embodiments, the extension is made of metal, and the protrusion is made of metal and is integrally formed with the extension; or the protruding part is made of nonmetal materials and is in a split structure with the extending part.

Therefore, when the extension part and the protruding part are both made of metal materials, the strength of the bracket can be further improved, so that the reliability of the camera module is improved; when the protruding part and the extending part are of a split structure, the protruding part and the extending part can be respectively processed and connected together after being processed, and the processing is simple and the cost is low.

In some embodiments, the photosensitive assembly further includes a carrier, and a receiving cavity is formed between the protruding portion, the extending portion, the photosensitive element, and the connecting surface, and the carrier is disposed in the receiving cavity to carry the extending portion.

In this way, the support strength of the extension part to the filter can be further improved.

In some embodiments, the package includes: the first packaging part is connected to the connecting surface and protrudes away from the connecting surface, and the first packaging part is connected with the outer side wall of the protruding part; the second encapsulation portion, the one end of second encapsulation portion is connected first encapsulation portion deviates from the one end of junction surface, the other end of second encapsulation portion extends to the extension deviates from the one side of junction surface and connects the extension, the trompil form in the other end of second encapsulation portion.

Therefore, the first packaging part and the second packaging part can be respectively connected with the protruding part and the extending part, so that the bracket is fixed on the connecting surface, and the fixing effect is good; and the lens is directly arranged at the joint of the first packaging part and the second packaging part, so that the lens acts on the joint of the first packaging part and the second packaging part and the first packaging part when being stressed and does not act on the bracket, the protection of the bracket can be formed, and the acting force born by the photosensitive assembly is increased.

In some embodiments, the support has a plurality of corners, the corners are located at the connection positions of the protruding portion and the extending portion, and the positions of the corresponding plurality of corners of the second packaging portion are respectively provided with a communication hole, and the communication holes are communicated with the holes.

Therefore, the corner is located at the joint of the protruding portion and the extending portion, so that the corner of the support is thicker, bearing capacity is stronger, the communication hole is formed in the position, corresponding to the corner, of the second packaging portion, pressing force can be transmitted to the corner of the support, and the support is prevented from collapsing due to the fact that the middle of the support is of a suspended structure when the packaging body is pressed on the support.

In some embodiments, a space exists between an end of the second encapsulation portion remote from the first encapsulation portion and an outer sidewall of the filter.

Therefore, the filter can be conveniently installed after the support is packaged by the packaging body.

In some embodiments, an end of the second encapsulation portion remote from the first encapsulation portion abuts or partially encapsulates an outer sidewall of the filter.

Therefore, after the filter piece is arranged on the support, the packaging body is arranged on the packaging support, and the fixing effect of the filter piece and the support is good.

The embodiment of the application also provides a camera shooting module, which comprises the photosensitive assembly and the lens module, wherein the lens module is arranged on the packaging body. The camera module with the photosensitive assembly has good reliability.

The embodiment of the application also provides electronic equipment, which comprises the camera module and a shell, wherein the camera module is arranged on the shell. The electronic equipment with the camera module has good reliability.

Drawings

Fig. 1 is a schematic perspective view of a photosensitive assembly according to a first embodiment of the present application.

Fig. 2 is an exploded view of the photosensitive assembly of fig. 1.

FIG. 3 is a schematic cross-sectional view of the photosensitive member shown in FIG. 1 along line III-III.

Fig. 4 is a schematic perspective view of a photosensitive assembly according to a second embodiment of the present application.

Fig. 5 is an exploded view of the photosensitive assembly of fig. 4.

Fig. 6 is a schematic perspective view of a photosensitive assembly according to a third embodiment of the present application.

Fig. 7 is a schematic cross-sectional view of the photosensitive member shown in fig. 6 along line VII-VII.

Fig. 8 is a schematic perspective view of an image capturing module according to an embodiment of the present application.

Fig. 9 is a schematic perspective view of an electronic device according to an embodiment of the present application.

Description of the main reference signs

Photosensitive assemblies 10, 30, 50

Circuit board 11

Connection surface 111

Photosensitive element 12

Bracket 13

Window 131

Protruding portion 132

Extension 133

Corner 134

Optical filter 14

Package 15

Opening 151

First encapsulation portion 152

Second package portion 153

Communication hole 1531

Carrier 16

Accommodation chamber 17

Lens module 20

Camera module 100

Housing 200

Electronic device 1000

Detailed Description

Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

Embodiments of the present application are further described below with reference to the accompanying drawings.

Referring to fig. 1 and 2, a first embodiment of the present application provides a photosensitive assembly 10, which includes a circuit board 11, a photosensitive element 12, a bracket 13, a filter 14 and a package 15.

The circuit board 11 has a connection surface 111. The photosensitive element 12 is adhered to the connection surface 111 by an adhesive such as glue, and is electrically connected to the circuit board 11 by a conductive wire or solder. The support 13 is disposed on the connection surface 111, and at least a portion of the support 13 is disposed on a side of the photosensitive element 12 away from the circuit board 11, and a window 131 for allowing light to pass through is disposed at a position of the support 13 corresponding to the photosensitive element 12. The filter 14 is disposed at the window 131 and connected to a side of the support 13 facing away from the photosensitive element 12, wherein a portion of the support 13 connected to the filter 14 is metal. The package body 15 is disposed on the connection surface 111 and encapsulates the bracket 13, and an opening 151 is disposed at a position of the package body 15 corresponding to the window 131.

In the above-mentioned photosensitive assembly 10, since the portion of the bracket 13 to which the filter 14 is connected is made of metal, the supporting strength of the bracket 13 is high. And the support 13 is encapsulated by the encapsulation body 15, so that the strength of the support 13 can be further improved, the support can be normally used in various complex and harsh environments without cracking, and the reliability of the camera module 100 is improved.

The circuit board 11 is a hard circuit board. It is understood that in other embodiments, the circuit board 11 may be a flexible circuit board or a flexible bonding board, but is not limited thereto.

The photosensitive element 12 is a photosensitive chip. The filter 14 is a filter.

Referring to fig. 3, the bracket 13 includes a protruding portion 132 and an extending portion 133, where the protruding portion 132 is connected to the connecting surface 111 and protrudes away from the connecting surface 111. One end of the extension portion 133 is connected to one end of the protruding portion 132 away from the connection surface 111, and the other end of the extension portion 133 extends to one side of the photosensitive element 12 away from the circuit board 11, where the window 131 is opened at the other end of the extension portion 133. In the present embodiment, the protruding portion 132 and the extending portion 133 are vertically disposed. In this way, the protruding portion 132 and the extending portion 133 are bent, the photosensitive element 12 can be accommodated in the space formed by the protruding portion 132, the extending portion 133 and the connecting surface 111, so that protection for the photosensitive element 12 can be formed, the whole structural layout can be compact, and miniaturization of the camera module is facilitated.

The extension portion 133 is made of metal, and the protruding portion 132 is made of metal and is integrally formed with the extension portion 133. Thus, when the protruding portion 132 and the extending portion 133 are made of metal, the strength of the bracket 13 can be further improved, so that the reliability of the camera module is improved.

The package body 15 includes a first package portion 152 and a second package portion 153, where the first package portion 152 is connected to the connection surface 111 and protrudes away from the connection surface 111, and the first package portion 152 is connected to an outer sidewall of the protruding portion 132. One end of the second package portion 153 is connected to one end of the first package portion 152 away from the connection surface 111, the other end of the second package portion 153 extends to one side of the extension portion 133 away from the connection surface 111 and is connected to the extension portion 133, and the opening 151 is formed at the other end of the second package portion 153. In the present embodiment, the first and second encapsulation parts 152 and 153 are disposed vertically. In this way, the first packaging part 152 and the second packaging part 153 can be respectively connected with the protruding part 132 and the extending part 133, so that the bracket 13 is fixed on the connection surface 111, and the fixing effect is good; and the lens is directly arranged at the joint of the first packaging part 152 and the second packaging part 153, so that the lens only acts on the joint of the first packaging part 152 and the second packaging part 153 and the first packaging part 152 when stressed and does not act on the bracket 13, the protection of the bracket 13 can be formed, and the acting force born by the photosensitive assembly 10 is increased.

When the optical filter 14 is mounted on the bracket 13 and then the package 15 is packaged, the end of the second package 153 away from the first package 152 abuts against or partially covers the outer sidewall of the optical filter 14, so that the fixing effect of the optical filter 14 and the bracket 13 is better.

When the package body 15 is first packaged on the holder 13 and then the filter 14 is mounted, there is a space between an end of the second package portion 153 remote from the first package portion 152 and an outer sidewall of the filter 14. In this way, it is possible to facilitate mounting of the filter 14 after the package 15 packages the holder 13.

The photosensitive assembly 30 further includes a supporting body 16, a protruding portion 132, an extending portion 133, the photosensitive element 12, and a connecting surface 111 therebetween to form a receiving cavity 17, and the supporting body 16 is filled in the receiving cavity 17 to support the extending portion 133. In this way, the support strength of the extension 133 to the filter 14 can be further improved. In this embodiment, the carrier 16 is a resin.

When in use, the bracket 13 is glued on the circuit board 11, wherein the photosensitive element is positioned in the space formed between the bracket 13 and the circuit board 11; then, the optical filter 14 is glued on the bracket 13, wherein the optical filter 14 is arranged at the window 131 and is connected to the side of the bracket 13 away from the photosensitive element 12; then, the encapsulation resin encapsulates the bracket 13 on the circuit board 11 and forms the encapsulation body 15, wherein an end of the second encapsulation portion 153 of the encapsulation body 15, which is far away from the first encapsulation portion 152, abuts against or partially encapsulates the outer sidewall of the optical filter 14.

Or when in use, the bracket 13 is glued on the circuit board 11, wherein the photosensitive element is positioned in the space formed between the bracket 13 and the circuit board 11; then, encapsulating the bracket 13 on the circuit board 11 by encapsulating resin to form an encapsulation body 15, wherein a space for installing the optical filter 14 is reserved at one end of the second encapsulation portion 153 of the encapsulation body 15, which is far away from the first encapsulation portion 152; the filter 14 is then glued to the bracket 13 in a space reserved at the end of the second encapsulation 153 remote from the first encapsulation 152, and after installation, a space exists between the end of the second encapsulation 153 remote from the first encapsulation 152 and the outer side wall of the filter 14.

Referring to fig. 4 and 5, a photosensitive assembly 30 is provided in a second embodiment of the present application, and the photosensitive assembly 30 of the second embodiment has substantially the same structure as the photosensitive assembly 10 of the first embodiment, except that:

the bracket 13 has a plurality of corners 134, for example, four corners 134, and the corners 134 are located at the connection positions of the protruding portion 132 and the extending portion 133, and the positions of the second package portion 153 corresponding to the plurality of corners 134 are respectively provided with a communication hole 1531, and the communication holes 1531 are communicated with the openings 151. In the present embodiment, the cross section of the communication hole 1531 is substantially elliptical. It is understood that in other embodiments, the cross section of the communication hole 1531 may be rectangular, but is not limited thereto. Therefore, since the corner 134 is located at the connection between the protruding portion 132 and the extending portion 133, the corner 134 of the bracket 13 has a thicker thickness and a stronger bearing capacity, and the communication hole 1531 is provided at the position of the second package portion 153 corresponding to the corner 134, so that the pressing force can be transferred to the corner 134 of the bracket 13, and the bracket 13 is prevented from collapsing due to the suspended structure in the middle of the bracket 13 when the second package portion 153 is pressed on the bracket 13.

Referring to fig. 6 and 7, a photosensitive assembly 50 is provided in a third embodiment of the present application, and the photosensitive assembly 50 of the third embodiment has substantially the same structure as the photosensitive assembly 10 of the first embodiment, except that:

the protruding portion 132 is made of non-metal material and is separated from the extending portion 133. Thus, the protruding portion 132 and the extending portion 133 can be processed separately and connected together after processing, and the processing is simple and the cost is low. In this embodiment, the protruding portion 132 is an annular adhesive layer and is disposed around the periphery of the photosensitive element 12, and there is a space between the protruding portion 132 and the photosensitive element 12 in the horizontal direction. It will be appreciated that in other embodiments, the protrusion 132 and the photosensitive element 12 are connected in a horizontal direction.

Referring to fig. 8, an image capturing module 100 is further provided in the embodiment of the present application, which includes the photosensitive assembly 10, 30 or 50 and the lens module 20 as described above, where the lens module 20 is disposed on the package 15 of the photosensitive assembly 10, 30 or 50. In the present embodiment, the image capturing module 100 having the above-described photosensitive member 10, 30, or 50 has good reliability.

Referring to fig. 9, the embodiment of the application further provides an electronic device 1000, including the camera module 100 and the housing 200, where the camera module 100 is disposed on the housing 200. The electronic device 1000 having the camera module 100 has good reliability. The electronic device 1000 includes, but is not limited to, a motion camera, a cell phone, and the like.

Finally, it should be noted that the above embodiments are merely for illustrating the technical solution of the present application and not for limiting, and although the present application has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solution of the present application may be modified or substituted without departing from the spirit and scope of the technical solution of the present application.

Claims (10)

1. A photosensitive assembly, comprising:

a circuit board having a connection surface;

the photosensitive element is arranged on the connecting surface and is electrically connected with the circuit board;

the bracket is arranged on the connecting surface, at least part of the bracket is arranged on one side of the photosensitive element, which is away from the circuit board, and a window for allowing light to pass through is arranged at the position of the bracket corresponding to the photosensitive element;

the light filtering piece is arranged at the window and connected to one side of the support, which is away from the photosensitive element, wherein the part of the support, which is connected with the light filtering piece, is made of metal;

the packaging body is arranged on the connecting surface and packages the support, and an opening is arranged at the position of the packaging body corresponding to the window.

2. The photosensitive assembly of claim 1, wherein the bracket comprises:

the protruding part is connected with the connecting surface and protrudes away from the connecting surface;

and one end of the extending part is connected with one end of the protruding part, which is away from the connecting surface, and the other end of the extending part extends to one side of the photosensitive element, which is away from the circuit board, wherein the window is formed at the other end of the extending part.

3. The photosensitive assembly of claim 2, wherein the extension is metallic, and the protrusion is metallic and integrally formed with the extension; or the protruding part is made of nonmetal materials and is in a split structure with the extending part.

4. The photosensitive assembly of claim 2, wherein the photosensitive assembly further comprises:

and the supporting body is arranged in the accommodating cavity to bear the extending part.

5. The photosensitive assembly of any of claims 2-4, wherein the package comprises:

the first packaging part is connected to the connecting surface and protrudes away from the connecting surface, and the first packaging part is connected with the outer side wall of the protruding part;

the second encapsulation portion, the one end of second encapsulation portion is connected first encapsulation portion deviates from the one end of junction surface, the other end of second encapsulation portion extends to the extension deviates from the one side of junction surface and connects the extension, the trompil form in the other end of second encapsulation portion.

6. The photosensitive assembly of claim 5, wherein the bracket has a plurality of corners, the corners are located at the connection between the protruding portion and the extending portion, and communication holes are respectively formed in positions of the second packaging portion corresponding to the corners, and the communication holes are communicated with the openings.

7. The photosensitive assembly of claim 5, wherein a space exists between an end of the second encapsulation portion remote from the first encapsulation portion and an outer sidewall of the filter.

8. The photosensitive assembly of claim 5, wherein an end of the second encapsulation portion remote from the first encapsulation portion abuts or partially encapsulates an outer sidewall of the filter.

9. An image pickup module, comprising the photosensitive assembly according to any one of claims 1 to 8 and a lens module, wherein the lens module is disposed on the package.

10. An electronic device, comprising the camera module of claim 9 and a housing, wherein the camera module is disposed on the housing.