CN201011742Y - Improved silicon microphone - Google Patents
Improved silicon microphone Download PDFInfo
- Publication number
- CN201011742Y CN201011742Y CNU2007200187916U CN200720018791U CN201011742Y CN 201011742 Y CN201011742 Y CN 201011742Y CN U2007200187916 U CNU2007200187916 U CN U2007200187916U CN 200720018791 U CN200720018791 U CN 200720018791U CN 201011742 Y CN201011742 Y CN 201011742Y
- Authority
- CN
- China
- Prior art keywords
- wiring board
- air filter
- silicon microphone
- circuit board
- improved silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model discloses an improved silicon microphone, comprising a circuit board, an electroacoustic groupware which is arranged on one side surface of the circuit board, and a metal shell which is fixedly connected with the circuit board so as to cover the electric acoustic groupware. The circuit board is provided with a sound hole for pass of sound wave; the other side of the circuit relative to the electroacoustic groupware is provided with a bonding pad; the outside of the sound hole on the circuit board is provided with a dustproof net; a heightening device is arranged between the circumscribed mounting surface of the bonding pad and the dustproof net mounting surface on the circuit board to increase the distance between the circumscribed mounting surface of the bonding pad and the dust proof net mounting surface and to contain the dustproof net. The utility model is characterized in simple and easy manufacture, few processing procedures, saving cost, and improving the reliability and acoustic capability of the product, which can satisfy the requirements of thinness and miniaturization of the product; at the same time, the position of the sound hole is arranged at the bottom surface of the circuit board in order to effectively satisfy the demand of thinner product of the mobile phone manufacturer.
Description
Technical field
The utility model relates to a kind of microphone, relates in particular to a kind of silicon microphone.
Background technology
Accompanying drawing 6 is micro silicon microphones of a kind of original structure, original silicon microphone is mainly by the electronics, the acoustic assembly 6 that are installed on the wiring board 2, be installed in the cavity 10 on the wiring board 2, being installed on the cavity 10 loam cake 11 grades partly constitutes, the cavity 10 top wiring boards 2 that connect the bottom surface by conducting resinl connection loam cake 11, below by conducting resinl of square hollow, weld electronics, acoustic assembly 6 on the wiring board 2 of bottom surface, sound hole 4 is arranged on the loam cake 11.After silicon microphone is welded on the mobile phone support plate, can have influence on the height in mobile phone front, be unfavorable for the development trend of following design microminiaturization and ultra-thinization.Because being connected between cavity 10 and loam cake 11 and the bottom surface wiring board 2 all is the plane connection, be subjected to the little restriction of volume simultaneously, and the sidewall thickness of cavity is limited, causes bonding strength not high, and anti-High-frequency Interference aspect performance produces be not as good as phenomenons such as electret capcitor microphone.
For this reason, engineers and technicians have designed micro silicon microphone as shown in Figure 7, the structure of the micro silicon microphone of it and accompanying drawing 6 is basic identical, it comprises wiring board 2, be installed in the electronics on described wiring board 2 one side surfaces, acoustic assembly 6, fixedly connected with described wiring board 2 and contain described electronics, the metal shell of acoustic assembly 6, described wiring board 2 is provided with the sound hole of passing through for sound wave 4, described wiring board 2 with respect to described electronics, the opposite side surface of acoustic assembly 6 is provided with pad 3, but the technical problem that causes thus is no Air Filter installing space, it is dustproof that microphone has been lost, moistureproof function, and therefore reduced sound quality and product reliability.
The utility model content
Technical problem to be solved in the utility model provides and a kind ofly can reduce the height that silicon microphone is welded to defensive position machine face on the mobile phone support plate, possesses dustproof, moisture-proof function, make that simultaneously the mechanical strength of product is higher, and the stronger improved silicon microphone of antijamming capability.
For solving the problems of the technologies described above, the technical solution of the utility model is: improved silicon microphone, comprise wiring board, be installed in the electronics on described wiring board one side surface, acoustic assembly, fixedly connected with described wiring board and contain described electronics, the metal shell of acoustic assembly, described wiring board is provided with the sound hole of passing through for sound wave, described wiring board with respect to described electronics, the opposite side surface of acoustic assembly is provided with pad, the arranged outside in sound hole has Air Filter on the described wiring board, is provided with the rising device that increases the two distance and be enough to hold described Air Filter between the external installed surface of described pad and the Air Filter installed surface on the wiring board.
As a kind of improvement, described rising device is the conducting terminal that is welded on the described pad.
As a kind of improvement, described rising device is the power spring that is welded on the described pad.
As a kind of improvement, described rising device is the tin ball that is welded on the described pad.
As a kind of improvement, described rising device is that surface that described wiring board is installed described Air Filter is provided with because of the Air Filter of corrosion attenuation depression is installed.
Improve as another kind, described Air Filter comprises high temperature glue-line and the dustproof layer of cloth of heatproof.
Improve as another kind, described Air Filter is the metal Air Filter.
Owing to adopted technique scheme, improved silicon microphone, comprise wiring board, be installed in the electronics on described wiring board one side surface, acoustic assembly, fixedly connected with described wiring board and contain described electronics, the metal shell of acoustic assembly, described wiring board is provided with the sound hole of passing through for sound wave, described wiring board with respect to described electronics, the opposite side surface of acoustic assembly is provided with pad, the arranged outside in sound hole has Air Filter on the described wiring board, is provided with the rising device that increases the two distance and be enough to hold described Air Filter between the external installed surface of described pad and the Air Filter installed surface on the wiring board; The utility model has not only that preparation is simple, and the characteristics that manufacturing procedure is few can also be saved cost, improves the reliability of product and the characteristics of electroacoustic performance, can satisfy current demand to product slimming and miniaturization preferably.Simultaneously the position in sound hole is arranged on the bottom surface of wiring board, the demand that more and more approaches in the time that cell phone manufacturer's deisgn product can effectively being satisfied.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment one;
Fig. 2 is the structural representation of the utility model embodiment two;
Fig. 3 is the structural representation of the utility model embodiment three;
Fig. 4 is the structural representation of the utility model embodiment four;
Fig. 5 is the structural representation of the utility model embodiment five;
Fig. 6 is the structural representation of background technology;
Fig. 7 is another structural representation of background technology.
Embodiment
Embodiment one:
As shown in Figure 1, improved silicon microphone, its loam cake 11 and cavity 10 are one, technologies such as employing punching press are one-body molded, form the metal shell 1 of a groove shape, this technical scheme will reduce the step of above-mentioned loam cake 11 and cavity 10 bondings, strengthen the intensity of metal shell 1.Metal shell 1 is connected by conducting resinl or solder(ing) paste with wiring board 2, forms the cavity of shielding.Sound hole 4 is opened in the bottom surface of wiring board 2, and sound 4 outsides, hole cover one deck and prevent that dust, moisture or foreign material from entering the Air Filter 5 of the inside of silicon microphone.Simultaneously, in order to reserve certain space in welding, for Air Filter 5, present embodiment increases the pad at the silicon microphone back side by the Copper Foil growth technique, Air Filter 5 and covering sound hole 4 are settled in position on the wiring board 2 beyond the pad, adopt the silicon microphone of this structure, pad 3 is when being welded to the electronic product main circuit board, and Air Filter 5 is unlikely to hinder the carrying out of welding, causes various failure weldings.
Embodiment two:
As shown in Figure 2, improved silicon microphone, its loam cake 11 and cavity 10 are one, technologies such as employing punching press are one-body molded, form the metal shell 1 of a groove shape, this technical scheme will reduce the step of above-mentioned loam cake 11 and cavity 10 bondings, strengthen the intensity of shell 1.Metal shell 1 is connected by conducting resinl or solder(ing) paste with wiring board 2, forms the cavity of shielding.Sound hole 4 is opened in the bottom surface of wiring board 2, and sound 4 outsides, hole cover one deck and prevent that dust, moisture or foreign material from entering the Air Filter 5 of the inside of silicon microphone.Simultaneously, in order to reserve certain space in welding, for Air Filter 5, present embodiment plays the purpose that the Air Filter position is reserved in the welding back by connect a conducting terminal 7 in pad locations, and Air Filter 5 and covering sound hole 4 are settled in the position on the wiring board 2 beyond the conducting terminal 7.Adopt the silicon microphone of this structure, pad 3 is when being welded to the electronic product main circuit board, and Air Filter 5 is unlikely to hinder the carrying out of welding, causes various failure weldings.
Embodiment three:
As shown in Figure 3, improved silicon microphone, its loam cake 11 and cavity 10 are one, technologies such as employing punching press are one-body molded, form the metal shell 1 of a groove shape, this technical scheme will reduce the step of above-mentioned loam cake 11 and cavity 10 bondings, strengthen the intensity of metal shell 1.Metal shell 1 is connected by conducting resinl or solder(ing) paste with wiring board 2, forms the cavity of shielding.Sound hole 4 is opened in the bottom surface of wiring board 2, and sound 4 outsides, hole cover one deck and prevent that dust, moisture or foreign material from entering the Air Filter 5 of the inside of silicon microphone.Simultaneously, in order to reserve certain space in welding, for Air Filter 5, present embodiment plays the purpose that the Air Filter position is reserved in the welding back by connect an electrically conductive elastic spring 8 in pad locations, and Air Filter 5 and covering sound hole 4 are settled in the position on the wiring board 2 beyond the electrically conductive elastic spring 8.Adopt the silicon microphone of this structure, pad 3 is when being welded to the electronic product main circuit board, and Air Filter 5 is unlikely to hinder the carrying out of welding, causes various failure weldings.The scheme of this connection electrically conductive elastic spring is also helpful to the shockproof effect of silicon microphone simultaneously.
Embodiment four:
As shown in Figure 4, improved silicon microphone, its loam cake 11 and cavity 10 are one, technologies such as employing punching press are one-body molded, form the metal shell 1 of a groove shape, this technical scheme will reduce the step of above-mentioned loam cake 12 and cavity 14 bondings, strengthen the intensity of metal shell 1.Metal shell 1 is connected by conducting resinl or solder(ing) paste with wiring board 2, forms the cavity of shielding.Sound hole 4 is opened in the bottom surface of wiring board 2, and sound 4 outsides, hole cover one deck and prevent that dust, moisture or foreign material from entering the Air Filter 5 of the inside of silicon microphone.Simultaneously, in order to reserve certain space in welding, for Air Filter 5, present embodiment plays the purpose that Air Filter 5 positions are reserved in the welding back by place a tin ball 9 in pad locations, and Air Filter 5 and covering sound hole 4 are settled in the position on the wiring board 2 beyond the tin ball 9.Adopt the silicon microphone of this structure, pad 3 is when being welded to the electronic product main circuit board, and Air Filter 5 is unlikely to hinder the carrying out of welding, causes various failure weldings.
Embodiment five:
As shown in Figure 5, improved silicon microphone, its loam cake 11 and cavity 10 are one, technologies such as employing punching press are one-body molded, form the metal shell 1 of a groove shape, this technical scheme will reduce the step of above-mentioned loam cake 11 and cavity 10 bondings, strengthen the intensity of metal shell 1.Metal shell 1 is connected by conducting resinl or solder(ing) paste with wiring board 2, forms the cavity of shielding.Sound hole 4 is opened in the bottom surface of wiring board 2, and sound 4 outsides, hole cover one deck and prevent that dust, moisture or foreign material from entering the Air Filter 5 of the inside of silicon microphone.Simultaneously, in order to reserve certain space in welding, for Air Filter 5, present embodiment forms a dented space can holding Air Filter by the technology such as corrosion of board substrate, this just the has been equivalent to covert increase height of pad 3 at the silicon microphone back side, Air Filter 5 and covering sound hole 4 are settled in the position on the wiring board 2 beyond the pad 3.Adopt the silicon microphone of this structure, pad 3 is when being welded to the electronic product main circuit board, and Air Filter 5 is unlikely to hinder the carrying out of welding, causes various failure weldings.
In above embodiment, Air Filter can be that high-temp glue and high temperature resistant dustcloth two parts bonding form, and also can be that wire netting and high-temp glue bonding forms.
Claims (8)
1. improved silicon microphone, comprise wiring board (2), be installed in the electronics on described wiring board (2) one side surfaces, acoustic assembly (6), fixedly connected with described wiring board (2) and contain described electronics, the metal shell (1) of acoustic assembly (6), described wiring board (2) is provided with the sound hole of passing through for sound wave (4), described wiring board (2) with respect to described electronics, the opposite side surface of acoustic assembly (6) is provided with pad (3), it is characterized in that: the arranged outside that described wiring board (2) is gone up sound hole (4) has Air Filter (5), is provided with between Air Filter (5) installed surface on the external installed surface of described pad (3) and the wiring board (2) to increase the two distance and be enough to hold the rising device of described Air Filter (5).
2. improved silicon microphone as claimed in claim 1 is characterized in that: described rising device is the Copper Foil thickening layer (31) that described pad (3) is provided with.
3. improved silicon microphone as claimed in claim 1 is characterized in that: described rising device is for being welded on the conducting terminal (7) on the described pad (3).
4. improved silicon microphone as claimed in claim 1 is characterized in that: described rising device is for being welded on the power spring (8) on the described pad (3).
5. improved silicon microphone as claimed in claim 1 is characterized in that: described rising device is for being welded on the tin ball (9) on the described pad (3).
6. improved silicon microphone as claimed in claim 1 is characterized in that: described rising device is that surface that described wiring board (2) is installed described Air Filter (5) is provided with because of the Air Filter of corrosion attenuation depression (21) is installed.
7. as the described improved silicon microphone of the arbitrary claim of claim 1 to 6, it is characterized in that: described Air Filter (5) comprises high temperature glue-line and the dustproof layer of cloth of heatproof.
8. as the described improved silicon microphone of the arbitrary claim of claim 1 to 6, it is characterized in that: described Air Filter (5) is the metal Air Filter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200187916U CN201011742Y (en) | 2007-02-15 | 2007-02-15 | Improved silicon microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200187916U CN201011742Y (en) | 2007-02-15 | 2007-02-15 | Improved silicon microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201011742Y true CN201011742Y (en) | 2008-01-23 |
Family
ID=39046685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200187916U Expired - Fee Related CN201011742Y (en) | 2007-02-15 | 2007-02-15 | Improved silicon microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201011742Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107707709A (en) * | 2017-09-30 | 2018-02-16 | 广东欧珀移动通信有限公司 | The housing unit of terminal and there is its terminal |
| CN111225331A (en) * | 2020-03-16 | 2020-06-02 | 瑞声声学科技(深圳)有限公司 | MEMS microphone |
| WO2020134449A1 (en) * | 2018-12-28 | 2020-07-02 | 瑞声声学科技(深圳)有限公司 | Microphone |
-
2007
- 2007-02-15 CN CNU2007200187916U patent/CN201011742Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107707709A (en) * | 2017-09-30 | 2018-02-16 | 广东欧珀移动通信有限公司 | The housing unit of terminal and there is its terminal |
| WO2020134449A1 (en) * | 2018-12-28 | 2020-07-02 | 瑞声声学科技(深圳)有限公司 | Microphone |
| CN111225331A (en) * | 2020-03-16 | 2020-06-02 | 瑞声声学科技(深圳)有限公司 | MEMS microphone |
| CN111225331B (en) * | 2020-03-16 | 2022-04-29 | 瑞声声学科技(深圳)有限公司 | MEMS microphone |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8818010B2 (en) | Microphone unit | |
| US8385569B2 (en) | Acoustic transducer unit | |
| CN201114761Y (en) | Dustproof silicon microphone | |
| WO2010095596A1 (en) | Acoustic transducer unit | |
| US8155366B2 (en) | Transducer package with interior support frame | |
| CN212183709U (en) | Miniature vibration sensor | |
| CN103200472A (en) | Piezoelectric ceramic speaker and mobile terminal | |
| CN201138866Y (en) | Silicon microphone with improved structure | |
| CN201011742Y (en) | Improved silicon microphone | |
| CN201383873Y (en) | Silicon condenser microphone with enlarged back cavity | |
| CN219019032U (en) | Waterproof and dustproof unidirectional silicon microphone | |
| CN101257736B (en) | Miniature capacitor type microphone | |
| CN201226593Y (en) | Silicon microphone capable of being welding on two sides | |
| CN1886008B (en) | Silicon microphone with long sound channel | |
| CN110769357A (en) | Microphone packaging structure adopting lead frame plastic shell | |
| CN101257737B (en) | Miniature capacitance type microphone | |
| CN201294630Y (en) | Anti-interference capacitance microphone | |
| CN2888785Y (en) | A miniature silicon microphone | |
| CN201167414Y (en) | Miniature capacitance microphone | |
| CN2817273Y (en) | Long channel silicon microphone | |
| CN216905295U (en) | Microphone structure and electronic equipment | |
| CN219780383U (en) | Condenser microphone pole head | |
| CN217037408U (en) | All-directional noise reduction microphone | |
| CN213694155U (en) | Intelligent microphone packaging structure and electronic equipment | |
| US20200351596A1 (en) | Microphone device and method for manufacturing same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080123 Termination date: 20160215 |