CN212183709U

CN212183709U - Miniature vibration sensor

Info

Publication number: CN212183709U
Application number: CN202021433210.7U
Authority: CN
Inventors: 王晶晶; 刘志永
Original assignee: Shandong Xingang Electronic Technology Co ltd
Current assignee: Shandong Xingang Electronic Technology Co ltd
Priority date: 2020-07-21
Filing date: 2020-07-21
Publication date: 2020-12-18
Anticipated expiration: 2030-07-21

Abstract

The utility model discloses a miniature vibration sensor, constitute the vibration chamber between first casing and the second casing, its characterized in that: the vibration cavity is internally provided with a vibration component which separates the vibration cavity into a first vibration cavity and a second vibration cavity which are not communicated with each other, the second vibration cavity is internally provided with an MEMS chip, the MEMS chip is provided with an inner recess, and the inner recess of the MEMS chip and the shell component form a back sound cavity which is not communicated with the second vibration cavity. The sensor has the vibration cavity for shielding the introduction of the noisy sound, the vibration component for picking up the audio vibration signal in the vibration cavity is used for picking up the sound, the information of the vibration signal is consistent with that of the sound signal of a person in speaking in a certain frequency band, and the sensor can shield the sound conducted through the air to a great extent, so that the sensor is very suitable for extracting the clear sound in a noisy environment; the height of the product is effectively reduced by adopting the fusion structure, and compared with the existing product, the volume can be reduced by more than 20%.

Description

Miniature vibration sensor

Technical Field

The utility model relates to a vibration sensor technical field, specifically say and relate to a miniature vibration sensor.

Background

The vibration sensor is a sensor for picking up audio vibration signals, in particular to a sensor for picking up skull audio vibration signals when a person speaks, and is a sound pick-up. Traditional adapter is microphone product promptly, and the product design is more mature, and the adapterization is effectual, and the sound fidelity is high. However, in the situation where miniaturized application scenarios are increasingly important, especially in noisy environments, conventional microphones are difficult to meet. The main reason is that under the application scenes such as similar bluetooth headset, the environment that the adapter faced is often noisy, and the environment is numerous, and traditional microphone is difficult to pick up the audio signal that needs, shields the environment noise.

Therefore, the miniature vibration sensor is used as a sound pick-up in the industry to pick up an audio signal generated by the vibration of the skull of a person during speaking, the information of the vibration signal is consistent with that of a sound signal of the person during speaking in a certain frequency band, and the purpose of picking up the sound signal can be achieved by picking up the vibration signal.

The traditional products of the same type meeting the requirements at present are divided into two types, one type is based on the piezoelectric piece to realize the conversion from vibration information to electric signals, and the products are limited by low structural transduction coefficients, so that the pickup performance is poor, the consistency is poor, the whole sound frequency section is difficult to cover, and the high-end sound collection requirements are difficult to adapt.

The other type of products is that a layer of vibration pickup structure is additionally arranged on the basis of the existing microphone product to achieve the purpose of picking up vibration signals, and the products are high in height and large in size due to the fact that the structure is additionally arranged on the basis of the microphone, and are not beneficial to the use of miniaturized application scenes such as a true wireless Bluetooth headset (TWS) and the like.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome the weak point of above-mentioned conventional art, provide a vibration signal that can pick up the skull when the people speaks, the sound of air conduction is passed through in the shielding that can very big degree, the miniature vibration sensor who is particularly suitable for extracting clear voice under noisy environment.

The purpose of the utility model is achieved through the following technical measures:

the utility model provides a miniature vibration sensor, includes the housing assembly, the housing assembly includes first casing and second casing, constitute vibration chamber between first casing and the second casing, its characterized in that: the utility model discloses a vibration cavity, including vibration chamber, MEMS chip, casing subassembly, vibration intracavity is equipped with the vibration subassembly, the vibration subassembly will vibrate the chamber region for first vibration chamber and the second vibration chamber that each other does not communicate, the second vibrates the intracavity and is equipped with the MEMS chip, MEMS chip electricity is connected with the ASIC chip, the MEMS chip has interior caving, the interior caving of MEMS chip and casing subassembly constitute the back sound chamber that does not communicate with the second vibration chamber.

The miniature vibration sensor can pick up the vibration signal of the skull when a person speaks, the information of the vibration signal is consistent with that of the sound signal when the person speaks in a certain frequency band, and the purpose of picking up the sound signal can be achieved by picking up the vibration signal. Meanwhile, the sensor can shield sound conducted through air to a great extent, so that the sensor is very suitable for extracting clear human voice in a noisy environment.

Preferably, the first vibration chamber has a first pressure release hole communicating with the outside, and the back sound chamber has a second pressure release hole communicating with the outside.

Preferably, the second vibration cavity is a closed cavity.

As a preferred scheme, the vibration assembly comprises a vibrating diaphragm and a mass block, the periphery of the vibrating diaphragm is fixedly connected with the shell assembly, and the mass block is arranged in the middle of the vibrating diaphragm.

Preferably, the housing assembly includes a backing ring, and the peripheral edge of the diaphragm is bonded to the backing ring.

Preferably, the housing assembly includes an annular support plate, one end surface of the support plate is fixedly connected to the backing ring, and the other end surface of the support plate is fixedly connected to the first housing or the second housing.

As a preferred scheme, the casing assembly is provided with a rear sound cavity recess, the rear sound cavity recess is communicated with the inner recess to form a rear sound cavity, and the second pressure relief hole is located in the rear sound cavity recess.

Preferably, the first shell and/or the second shell are made of electromagnetic shielding materials.

As a preferred scheme, the first shell is a metal shell, and the second shell is a PCB.

Preferably, the first pressure relief hole and/or the second pressure relief hole are one or more.

The components can be connected by glue, solder paste and the like.

Owing to adopted above-mentioned technical scheme, compare with prior art, the utility model has the advantages that:

the utility model discloses a miniature vibration sensor, which is provided with a vibration cavity for shielding noisy sound, wherein a vibration diaphragm component for picking up audio vibration signals in the vibration cavity is used for picking up sound, the information of the vibration signals is consistent with that of sound signals generated when a person speaks in a certain frequency band, and the sensor can shield sound conducted through air to a great extent, so that the sensor is very suitable for extracting clear voice in a noisy environment; the vibration pickup module is integrated into the traditional microphone module by adopting a fusion structure, the vibration pickup module and the traditional microphone module are fully fused, the height of a product is effectively reduced, and compared with the existing product, the volume can be reduced by more than 20%; all lines are arranged in an electromagnetic shielding mode, and the anti-interference capacity is high.

The present invention will be further described with reference to the accompanying drawings and the following detailed description.

Drawings

Fig. 1 is a schematic structural diagram of embodiment 1 of a micro vibration sensor according to the present invention.

Fig. 2 is a schematic structural diagram of embodiment 2 of a micro vibration sensor according to the present invention.

Fig. 3 is a schematic structural diagram of embodiment 3 of a micro vibration sensor according to the present invention.

Fig. 4 is a schematic structural diagram of embodiment 4 of a micro vibration sensor according to the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1: as shown in figure 1, the miniature vibration sensor comprises a shell assembly, wherein the shell assembly comprises a first shell 1, a second shell 4, a supporting plate 3 and a backing ring 2, the first shell 1 adopts a barrel-shaped metal shell, the second shell 4 adopts a PCB (printed Circuit Board), the supporting plate 3 is annular, the inner wall of the supporting plate 3 is fully metalized, two end faces of the supporting plate 3 are respectively connected with the first shell 1 and the second shell 4, a vibration cavity 13 is enclosed among the first shell 1, the second shell 4 and the support plate 3, the backing ring 2 is fixed at one end of the support plate 3 in the vibration cavity 13 by bonding or solder paste, a vibration component is connected on the backing ring 2, the vibration component comprises a vibration diaphragm 8 and a mass block 7, the mass block 7 is arranged in the middle of the diaphragm 8, and the periphery of the diaphragm 8 is connected with the backing ring 2 and divides the vibration cavity 13 into a first vibration cavity 11 and a second vibration cavity 12 which are not communicated with each other. A first vibration cavity 11 is formed between the diaphragm 8 and the first shell 1, a second vibration cavity 12 is formed between the diaphragm 8 and the second shell 4, and the second vibration cavity 12 is a closed cavity.

The mass block 7 is a non-magnetic block and can be made of metal or non-metal sheets, and the weight of the mass block is 10 times or more than the self weight of the diaphragm 8. The diaphragm 8 is made of an elastic material.

A first pressure relief hole 10 is formed in a first casing 1 of the first vibration cavity 11, and the first pressure relief hole 10 is communicated with the first vibration cavity 11 and the outside. The second shell 4 forming the second vibration cavity 12 is provided with an MEMS chip 6, the mass block 7 is located on one surface of the diaphragm 8 facing the MEMS chip 6, the MEMS chip 6 is electrically connected with an ASIC chip 9, and the MEMS chip 6 and the ASIC chip 9 are both located in the second vibration cavity 12. The MEMS chip 6 is provided with an inner recess 60, the inner recess 60 of the MEMS chip 6 and the second shell 4 form a back sound cavity, the back sound cavity is not communicated with the second vibration cavity 12, and a second pressure relief hole 40 communicated with the back sound cavity and the outside is arranged on the second shell 4.

The first pressure relief hole 10 and/or the second pressure relief hole 40 may be one or more. Only one first pressure relief vent 10 and one second pressure relief vent 40 are shown in the figures.

First pressure release hole 10 and second pressure release hole 40 are only for the inside and outside atmospheric pressure of intercommunication vibration chamber 13, improve the stability of product, especially, the stability of hot backward flow in-process, sound wave setting in the air conduction is not, so first pressure release hole 10 and the 40 diameters of second pressure release hole are little, and need pass through the cushion in using, measures such as tin ring are stopped up the pressure release hole, make the sensor only pick up the vibration audio signal who comes by casing subassembly conduction, it just also means that it only picks up the audio signal of skull when the use of miniaturized application scenes such as true wireless bluetooth headset (TWS), and have splendid shielding effect to external noisy noise, thereby improve the performance of this product filtration interference sound wave under noisy environment by a wide margin, can realize that the pickup effect is more close traditional microphone, can satisfy high-end sound collection demand. Moreover, the product has reasonable structure and good consistency of product performance.

The metal casing that first casing 1 adopted, the PCB board that second casing 4 adopted to and 3 inner walls full metallizations of backup pad, and all have electromagnetic shield effect, all circuits are all done in the metallic shield intracavity, can shield outside electromagnetic interference signal, and full electromagnetic shield design interference killing feature is strong, is showing the SNR that improves the sensor, improves tone quality.

Example 2: as shown in fig. 2, a micro vibration sensor includes a housing assembly, where the housing assembly includes a first housing 1, a second housing 4, a supporting plate 3, and a backing ring 2, the first housing 1 is a barrel-shaped metal housing, the second housing 4 is formed by a PCB, and a vibration cavity 13 is enclosed between the first housing 1 and the second housing 4. The supporting plate 3 is annular, and a second casing 4 is connected to 3 terminal surfaces of supporting plate, and backing ring 2 is connected to 3 other terminal surfaces of supporting plate, is connected with the vibration subassembly on the backing ring 2, and the vibration subassembly includes vibrating diaphragm 8 and quality piece 7, quality piece 7 settles in vibrating diaphragm 8 middle part, 8 peripheries of vibrating diaphragm are connected with backing ring 2 and separate vibration chamber 13 into first vibration chamber 11 and second vibration chamber 12 that do not communicate each other. The interval between the vibrating diaphragm 8, the first shell 1, the supporting plate 3, the backing ring 2 and the edge of the second shell 4 is a first vibrating cavity 11, the interval between the vibrating diaphragm 8, the backing ring 2, the supporting plate 3 and the second shell 4 is a second vibrating cavity 12, and the second vibrating cavity 12 is a closed cavity.

The rest of this example is the same as example 1.

Example 3: as shown in fig. 3, a miniature vibration sensor includes a housing assembly, where the housing assembly includes a first housing 1, a second housing 4, and a backing ring 2, the first housing 1 is a barrel-shaped metal housing, the second housing 4 is formed by a PCB, and a vibration cavity 13 is defined between the first housing 1 and the second housing 4. Be connected with the vibration subassembly on backing ring 2, the vibration subassembly includes vibrating diaphragm 8 and quality piece 7, quality piece 7 settles in vibrating diaphragm 8 middle part, and backing ring 2 is the annular, and 2 terminal surfaces of backing ring and first casing 1 keep away from the one end fixed connection of second casing 4, and another terminal surface and the vibrating diaphragm 8 periphery of backing ring 2 bond, vibrating diaphragm 8 and backing ring 2 divide vibration chamber 13 into first vibration chamber 11 and the second vibration chamber 12 that each other does not communicate. A first vibration cavity 11 is defined by the diaphragm 8, the first shell 1 and the backing ring 2, the mass block 7 is located in the first vibration cavity 11, a second vibration cavity 12 is formed among the diaphragm 8, the backing ring 2, the first shell 1 and the second shell 4, and the second vibration cavity 12 is a closed cavity.

The rest of this example is the same as example 1.

Example 4: as shown in fig. 4, in this embodiment of the micro vibration sensor, a back sound cavity recess 41 is disposed at a position of the second housing 4 facing the MEMS chip 6, the back sound cavity recess 41 and the inner recess 60 together form a back sound cavity, and the second pressure relief hole 40 is located in the back sound cavity recess 41. The volume of the back sound cavity in the embodiment is larger, and the sound pickup effect is improved.

The rest of this example is the same as example 1.

The product of the application has the following advantages:

1. this application adopts and fuses the structure, picks up the module with the vibration and fuses traditional microphone module, and both fully fuse the effectual height that has reduced the product, compare with current product, and the volume can reduce more than 20%, and this application product is small, highly low, and the product height of the same type is about 1.5mm, and the sensor height of this application is only about 1.2 mm.

2. The sensor of this application adopts full electromagnetic shielding design, and all circuits are all done in the metallic shield intracavity, and the interference killing feature is strong.

3. The sound wave is converted into the electronic signal by the MEMS chip and the ASIC chip in the traditional microphone, the product performance consistency is good, the pickup effect is close to that of the traditional microphone, and the high-end sound collection requirement can be met.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a miniature vibration sensor, includes the housing assembly, the housing assembly includes first casing and second casing, constitute vibration chamber between first casing and the second casing, its characterized in that: the utility model discloses a vibration cavity, including vibration chamber, MEMS chip, casing subassembly, vibration intracavity is equipped with the vibration subassembly, the vibration subassembly will vibrate the chamber region for first vibration chamber and the second vibration chamber that each other does not communicate, the second vibrates the intracavity and is equipped with the MEMS chip, MEMS chip electricity is connected with the ASIC chip, the MEMS chip has interior caving, the interior caving of MEMS chip and casing subassembly constitute the back sound chamber that does not communicate with the second vibration chamber.

2. A miniature vibration sensor as set forth in claim 1, wherein:

the first vibration cavity is provided with a first pressure relief hole communicated with the outside, and the back sound cavity is provided with a second pressure relief hole communicated with the outside.

3. A miniature vibration sensor as set forth in claim 1, wherein:

the second vibration cavity is a closed cavity.

4. A miniature vibration sensor as set forth in claim 1, wherein:

the vibration assembly comprises a vibrating diaphragm and a mass block, the periphery of the vibrating diaphragm is fixedly connected with the shell assembly, and the mass block is arranged in the middle of the vibrating diaphragm.

5. The miniature vibration sensor of claim 4, wherein:

the shell component comprises a backing ring, and the peripheral edge of the diaphragm is bonded with the backing ring.

6. The miniature vibration sensor of claim 5, wherein:

the shell assembly comprises an annular supporting plate, one end face of the supporting plate is fixedly connected with the backing ring, and the other end face of the supporting plate is fixedly connected with the first shell or the second shell.

7. A miniature vibration sensor as set forth in claim 2, wherein:

the shell component is provided with a back sound cavity which is sunken, the back sound cavity is sunken and communicated with the inner recess to form a back sound cavity, and the second pressure relief hole is positioned in the back sound cavity and is sunken.

8. A miniature vibration sensor as set forth in claim 1, wherein:

the first shell and/or the second shell are made of electromagnetic shielding materials.

9. A miniature vibration sensor as set forth in claim 1, wherein:

the first shell is a metal shell, and the second shell is a PCB.

10. A miniature vibration sensor as set forth in claim 2, wherein:

the number of the first pressure relief holes and/or the number of the second pressure relief holes are one or more.