CN218450447U - Microphone and loudspeaker combination module, earphone and electronic equipment - Google Patents

Abstract

Embodiments of the present application provide a combination module of a microphone and a loudspeaker, earphones, and electronic equipment. The combined microphone and speaker module includes at least a microphone and a speaker. The speaker is a MEMS speaker, and the microphone is a MEMS microphone. The speaker has a speaker front cavity, a speaker rear cavity and a sound outlet. The loudspeaker front cavity communicates with the external space of the combined module of the microphone and the loudspeaker through the sound outlet. The microphone has a microphone cavity and a sound pickup hole. The microphone cavity is located below the speaker rear cavity along the first direction, and the cavity wall of the microphone cavity facing the speaker rear cavity along the first direction is opposite to at least part of the cavity wall of the speaker rear cavity facing the microphone cavity along the first direction. The microphone cavity communicates with the external space of the combined module of the microphone and the speaker through the sound pickup hole. The combination module of the microphone and the loudspeaker can improve the high-frequency sound quality of the earphone or the electronic equipment, and helps to improve the experience of the user.

Description

Microphone and speaker combo modules, headphones and electronic equipment

technical field

The embodiment of the present application relates to the technical field of wireless earphones, and in particular to a combination module of a microphone and a loudspeaker, earphones and electronic equipment.

Background technique

With the development of true wireless stereo (True Wireless Stereo, TWS) wireless bluetooth earphone technology, the true wireless stereo earphone includes many sensors, so the integration of earphone components is getting higher and higher, and the internal space of the earphone is becoming more and more tight.

In order to make the headset have a good uplink communication effect and the feedback signal pickup requirement of Active Noise Cancellation (ANC), a microphone can be arranged between the speaker of the headset and the ear canal to achieve noise reduction. In the related art, the loudspeaker and the microphone are connected on the same substrate, and the loudspeaker and the microphone are independent and staggered along the sound output direction perpendicular to the earphone. When the earphone is working, the microphone is used to pick up the surrounding noise signal, and the noise signal is reversed through the circuit and then transmitted to the speaker. The reverse noise signal output by the speaker is offset by the noise signal directly entering the ear, so as to achieve the purpose of reducing noise. .

However, the high-frequency sound quality of the earphones in the related art is insufficient, which will affect the user experience.

Utility model content

The embodiment of the present application provides a combination module of microphone and speaker, earphone and electronic equipment, which can reduce the distance between the combination module of microphone and speaker and the tympanic membrane of the user's ear, and help to improve the high-frequency sound quality of the earphone. Improve user experience.

The first aspect of the embodiments of the present application provides a combined microphone and speaker module, which at least includes: a microphone and a speaker. The speaker is a MEMS speaker, and the microphone is a MEMS microphone. The speaker has a speaker front cavity, a speaker rear cavity and a sound outlet. The front cavity of the speaker communicates with the external space of the combined module of the microphone and the speaker through the sound outlet. The microphone has a microphone cavity and a sound pickup hole. The microphone cavity is located below the speaker rear cavity along the first direction, the cavity wall of the microphone cavity facing the speaker rear cavity along the first direction and the speaker rear cavity facing the microphone cavity along the first direction At least portions of the chamber walls are opposed. The microphone cavity communicates with the external space of the combined microphone and speaker module through the sound pickup hole.

The microphone and speaker combination module provided by the embodiment of the present application can reduce the thickness of the speaker and the thickness of the microphone by using the MEMS speaker and the MEMS microphone. In addition, the rear cavity of the speaker is located above the microphone cavity along the first direction , and the cavity wall of the speaker rear cavity facing the microphone cavity is at least partially opposite to the cavity wall of the microphone cavity facing the speaker rear cavity in the first direction, so that the microphone cavity and the speaker rear cavity can be stacked in the first direction, and then the microphone and The speakers are stacked in the first direction, so that the length of the combined module of the microphone and the speaker in the second direction can be reduced, wherein the second direction is perpendicular to the first direction, therefore, by using the MEMS microphone and the micro The electromechanical system speaker and the stacking arrangement of the microphone and the speaker along the first direction help to reduce the thickness of the microphone and the speaker combination module in the first direction and the length in the second direction, so that the microphone and the speaker combination module The required installation space is reduced, which in turn can reduce the distance between the human eardrum of the user of the microphone and speaker combination module, and can improve the high-frequency sound quality of the earphone.

In a possible implementation manner, the combined microphone and speaker module includes a substrate assembly, a first casing, a first transducer assembly, a second casing, and a second transducer assembly. The first transducing assembly includes a first MEMS transducer, and the second transducing assembly includes a second MEMS transducer. The substrate assembly, the first housing, and the first transducer assembly jointly define the speaker, and the first enclosure and the first transducer assembly are mounted on the first surface of the substrate assembly , the first transducing component is used to convert electrical energy into acoustic energy, the first transducing component is arranged in the first housing and defines the rear chamber of the speaker together with the substrate component, the first transducing component A housing, the first transducing component and the substrate component jointly define the loudspeaker front chamber. The substrate assembly, the second housing, and the second transducer assembly jointly define the microphone, and both the second housing and the second transducer assembly are mounted on a second surface of the substrate assembly , the second shell and the substrate assembly jointly define the microphone cavity, the second transducing component is located in the microphone cavity and is used for converting sound energy into electrical energy. Wherein, the first surface and the second surface are oppositely arranged along the first direction. Such arrangement can reduce the installation space required by the microphone and speaker combination module, making the distance between the microphone and speaker combination module and the user's eardrum closer, and helping to improve the high-frequency sound quality of the earphone.

In a possible implementation manner, the microphone cavity includes a microphone front cavity and a microphone rear cavity. The second transducer component and the substrate component together define the microphone rear cavity. The second housing, the second transducer assembly and the substrate assembly jointly define the microphone front cavity. The sound pickup hole is arranged on the substrate assembly or the second housing, so that the microphone can collect noise signals near the combined module of the microphone and the speaker, so as to realize active noise reduction.

In a possible implementation manner, the substrate component includes a first substrate, and the first transducing component and the second transducing component are respectively arranged on opposite sides of the first substrate along the first direction. On the other hand, such an arrangement helps to further reduce the thickness of the microphone and speaker combination module in the first direction, and can reduce the volume of the microphone and speaker combination module to meet the needs of the microphone and speaker combination module. installation space.

In a possible implementation manner, the substrate assembly includes a first substrate and a second substrate stacked along the first direction. Both the first housing and the first transducing component are disposed on the surface of the first substrate, and the second housing and the second transducing component are disposed on the surface of the second substrate. With such an arrangement, on the one hand, it can reduce the installation space required by the combined microphone and loudspeaker module, and on the other hand, it can improve the production efficiency of the combined microphone and loudspeaker module.

In a possible implementation manner, the sound pickup hole includes a first sound hole segment and a second sound hole segment that are arranged in communication. The first sound hole section is disposed through the second substrate and communicates with the microphone rear cavity. The second sound hole section is disposed between the first substrate and the second substrate, and the second sound hole section is used to communicate with the external space of the combined microphone and speaker module. With such arrangement, the sound pickup hole can be arranged on the substrate assembly, and the sensitivity of the microphone can be improved, which helps to improve the application range of the combined module of the microphone and the speaker.

In a possible implementation manner, the substrate assembly further includes: a third substrate. The first substrate is connected to the second substrate through the third substrate. A communication structure for communicating the sound pickup hole with the external space of the combined microphone and loudspeaker module is provided on the third substrate. The third substrate helps to reduce the layout difficulty of arranging the sound pickup hole on the substrate assembly, and reduces the processing difficulty of the substrate assembly, thereby improving the application range of the microphone and loudspeaker combination module.

In a possible implementation manner, a sound hole is provided on the substrate assembly, and the speaker rear cavity communicates with the external space of the combined microphone and speaker module through the sound hole. Through the sound hole, the rear cavity of the speaker can communicate with the external space of the combined module of the microphone and the speaker, which helps to ensure that the pressure in the rear cavity of the speaker is balanced with that of the front cavity of the speaker.

In a possible implementation manner, when the sound pickup hole is arranged on the substrate assembly, the sound hole communicates with the sound pickup hole, so that both the speaker rear cavity and the microphone cavity are connected to the The microphone and the loudspeaker combined module communicate with the external space. Such an arrangement helps to reduce the number of openings on the substrate assembly, and can improve the rigidity of the substrate assembly.

In a possible implementation manner, the combined microphone and speaker module includes a fourth substrate, a first housing, a first transducer assembly, a second enclosure, and a second transducer assembly. The first transducing assembly includes a first MEMS transducer, and the second transducing assembly includes a second MEMS transducer. The fourth substrate, the first housing and the first transducing component jointly define the speaker, and the fourth substrate, the second housing and the second transducing component jointly define the speaker. microphone. The first shell, the second shell and the second transducing component are all installed on the same surface of the fourth substrate, the first transducing component, the second shell and the second transducing component The transducer components are located in the first housing, and the second transducer components are located in the second housing. The first transducer assembly is mounted on the outer surface of the second housing and together with the outer surface of the second housing defines the rear cavity of the speaker, the first transducer assembly, the first housing , the outer surface of the second housing and the fourth substrate jointly define the loudspeaker front cavity. The inner surface of the second housing and the fourth substrate jointly define the microphone cavity, and the sound pickup hole is disposed on the fourth substrate. By sharing the same substrate with the microphone and the speaker, on the one hand, the thickness of the combined module of the microphone and the speaker in the first direction can be reduced to reduce the size of the combined module of the microphone and the speaker; The production difficulty of the combination module helps to improve the production efficiency of the microphone and loudspeaker combination module.

In a possible implementation manner, the microphone cavity includes a microphone front cavity and a microphone rear cavity. The second transducer assembly and the fourth substrate jointly define the microphone rear chamber, and the second transducer assembly, the fourth substrate and the second housing jointly define the microphone front chamber. One end of the sound pickup hole communicates with the microphone front cavity or the microphone rear cavity, and the other end of the sound pickup hole communicates with the external space of the combined microphone and loudspeaker module.

In a possible implementation manner, the second housing is an electromagnetic shielding housing. Alternatively, the second housing includes an electromagnetic shielding layer and a resin layer stacked along the first direction. The resin layer is used for fastening connection with the second transducer assembly and jointly defining a speaker rear cavity with the second transducer assembly. With such setting, the electromagnetic shielding effect of the microphone is more remarkable, and the electromagnetic interference capability of the microphone can be improved.

In a possible implementation manner, the fourth substrate is provided with an accommodating groove for accommodating the second transducer assembly, which helps to further reduce the impact of the combined microphone and loudspeaker module in the first direction. thickness.

In a possible implementation manner, the sound outlet hole is arranged on the side wall or the top wall of the first housing, so that the speaker can emit sound from the front or side.

The second aspect of the embodiment of the present application provides an earphone, which at least includes: a first casing, a second casing, and the combination module of a microphone and a speaker according to any one of the first aspect. The first housing is fastened to the second housing and jointly define a receiving cavity, and an inner wall of the second housing is provided with a sound outlet communicating with the receiving cavity. The microphone and speaker combination module is located in the accommodation cavity and is set close to the sound outlet, or the microphone and speaker combination module is located in the sound outlet.

In the earphone provided by the embodiment of the present application, since the microphone and speaker combination module adopts the microelectromechanical system microphone and the microelectromechanical system speaker stacked along the first direction, the thickness of the microphone and speaker combination module in one direction is reduced, so that the microphone The volume of the combination module with the speaker becomes smaller, and the installation space required for the combination module of the microphone and the speaker becomes smaller. The distance between the eardrum and the human eardrum to enhance the high-frequency sound effect of the earphones.

In a possible implementation manner, it further includes: a speaker unit. The speaker unit is located in the accommodating cavity and between the combined module of the microphone and the speaker and the first casing. Such a setting helps to improve the sound effect of the earphone.

In a possible implementation manner, the speaker unit is a moving coil unit or a moving iron unit.

The third aspect of the embodiment of the present application provides an electronic device, which at least includes: a body and the microphone and speaker combination module according to any one of the first aspect, the microphone and speaker combination module is installed on the body superior.

The electronic device provided by the embodiment of the present application can improve the high-frequency sound effect when the electronic device makes a sound by setting the combined microphone and speaker module as described in the first aspect, thereby improving the user experience.

Description of drawings

FIG. 1 is a schematic structural diagram of an earphone provided by an embodiment of the present application;

Fig. 2 is a sectional view of the earphone of the embodiment shown in Fig. 2;

FIG. 3 is a schematic structural diagram of another earphone provided by an embodiment of the present application;

Fig. 4 is a sectional view of the earphone of the embodiment shown in Fig. 3;

Fig. 5 is a cross-sectional view of a microphone and loudspeaker combination module provided by an embodiment of the present application;

Fig. 6 is a cross-sectional view of the first transducer assembly provided by the embodiment of the present application;

7 is a partial perspective view of another microphone and speaker combination module provided by the embodiment of the present application;

Fig. 8 is a cross-sectional view of the second transducer assembly provided by the embodiment of the present application;

Fig. 9 is a cross-sectional view of another microphone and speaker combination module provided by the embodiment of the present application;

Fig. 10 is a cross-sectional view of a sound hole provided by an embodiment of the present application;

FIG. 11 is a schematic structural diagram of another microphone and speaker combination module provided by the embodiment of the present application;

Fig. 12 is a schematic structural diagram of the combined microphone and loudspeaker module of the embodiment shown in Fig. 11;

Figure 13 is a schematic diagram of the communication between a sound hole and a sound pickup hole provided by the embodiment of the present application;

Fig. 14 is a schematic structural diagram of another microphone and loudspeaker combination module provided by the embodiment of the present application;

Fig. 15 is a cross-sectional view of the microphone and loudspeaker combination module of the embodiment shown in Fig. 14;

Fig. 16 is a cross-sectional view of another microphone and speaker combination module provided by the embodiment of the present application;

Fig. 17 is a cross-sectional view of another microphone and speaker combination module provided by the embodiment of the present application;

Fig. 18 is a cross-sectional view of another microphone and speaker combination module provided by the embodiment of the present application;

Fig. 19 is a schematic diagram of the first step of making the combined microphone and loudspeaker module of the embodiment shown in Fig. 17;

Fig. 20 is a schematic diagram of the second step of making the combined microphone and loudspeaker module of the embodiment shown in Fig. 17;

Fig. 21 is a schematic diagram of the third step of making the microphone and loudspeaker combination module of the embodiment shown in Fig. 17;

FIG. 22 is a schematic diagram of the fourth step of manufacturing the combined microphone and speaker module of the embodiment shown in FIG. 17 .

Explanation of reference signs:

10. Microphone chamber; 11. Microphone front chamber; 12. Microphone rear chamber;

20. Pickup hole; 21. The first sound hole segment; 22. The second sound hole segment;

31. Speaker front chamber; 32. Speaker rear chamber; 33. Sound hole; 34 sound hole; 341. Fourth groove; 342. First through hole;

100. Microphone and loudspeaker combination module;

110. Microphone;

111, the second shell; 1111, the electromagnetic shielding layer; 1112, the resin layer;

112. The second transducer component; 1121. The diaphragm; 1122. The second base; 113. The processing element;

120. Loudspeaker;

121. The first shell;

122. The first transducing component;

1221, vibration element; 12211, substrate layer; 12212, first electrode layer; 12213, piezoelectric layer; 12214, second electrode layer;

1222, first substrate; 1223, gap structure;

130. Substrate assembly; 131. First substrate; 132. Second substrate; 133. Third substrate; 1331. Connecting structure; 134. Fourth substrate; 1341. Accommodating groove;

140, wire; 150, pad;

200. Earphone; 210. First shell; 220. Second shell; 230. Sound outlet; 240. Speaker unit; 250. Bracket;

X, the first direction;

Y, the second direction.

Detailed ways

The embodiment of the present application provides a headset 200, which can be used as an accessory of an electronic device in a call scene, where the electronic device includes but not limited to a handheld device, a vehicle device, a wearable device, a computing device or other processing devices connected to a wireless modem. Electronic devices may include cellular phones, smartphones, personal digital assistant (PDA) computers, tablet computers, laptop computers, vehicle computers, smart watches , smart wristband, pedometer and other electronic devices with call function. In this embodiment of the present application, an electronic device may also be referred to as a terminal. Call scenarios include but are not limited to indoor call scenarios, outdoor call scenarios, and vehicle call scenarios. Call scenes can include quiet call scenes, noisy call scenes (such as streets, shopping malls, airports, stations, construction sites, in the rain, watching games, concerts, etc.), cycling call scenes, outdoor windy call scenes, and single-ear call scenes , binaural call scenarios, and other scenarios where calls can be made. Earphone 200 (earphone, also known as headphone, head-set, earpiece) can be a pair of conversion units, used to receive the electrical signal sent by the media player or receiver, and use the speaker 120 close to the ear to convert it into an audible sound waves.

The headset 200 can generally be divided into a wired headset 200 (wired headset or wired headset) and a wireless headset 200 (wireless headset). The wired earphone 200 has two earphones 200 and a connection line, wherein the left and right earphones 200 are connected by a connection line. The wired earphone 200 may be inconvenient to wear and needs to be connected to the electronic device through the jack of the earphone 200 , and the power of the electronic device needs to be consumed during the working process. The wireless earphone 200 can use wireless communication technology (such as bluetooth technology, infrared radio frequency technology, 2.4G wireless technology, ultrasonic wave, etc.) , It is more convenient to use, so it has been developed rapidly. Wherein, the left earphone 200 of the wireless earphone 200 can be connected to the right earphone 200 through Bluetooth.

The true wireless Bluetooth earphone 200 is also called a true wireless stereo (TWS) earphone 200. The TWS earphone 200 completely abandons the way of wire connection, and includes two earphones 200 (such as the master earphone 200 and the slave earphone 200). For example, when in use, an electronic device (which can also be called a transmitting device, such as a mobile phone, a tablet, a music player with Bluetooth output, etc.) The real Bluetooth left and right channels are used wirelessly. The left and right earphones 200 of the TWS earphone 200 can form a stereo system through Bluetooth, and the performance of listening to songs, talking, and wearing are all improved. In addition, any one of the two earphones 200 can also work independently. For example, when the master earphone 200 is not connected to the slave earphone 200, the master earphone 200 can return to monophonic sound quality. Due to the fact that the left and right earphones 200 of the TWS earphone 200 have no physical connection, almost all TWS earphones 200 are equipped with a charging box with both charging and storage functions.

TWS headset 200 has limited internal space due to the limitation of its shape, and compared with wired headset 200, TWS headset 200 needs to be equipped with other components such as batteries and circuit boards in addition to acoustic devices. For example, in some In the technology, the acoustic device includes a loudspeaker and a microphone. The loudspeaker and the microphone are arranged on the same circuit board and are located on the same surface of the circuit board. The loudspeaker and the microphone are independent and staggered along the sound direction perpendicular to the earphone. Improve the space utilization of the microphone and speaker, but this will lead to an excessively large plane size of the circuit board, which will lead to a larger installation space required for the circuit board, thereby limiting the position of the circuit board in the earphone, and causing the speaker to be separated from the user. The distance from the eardrum of the human ear increases and the high-frequency sound quality of the earphone is insufficient.

Fig. 1 is a schematic structural diagram of an earphone provided by an embodiment of the present application, Fig. 2 is a cross-sectional view of the earphone of the embodiment shown in Fig. 2, Fig. 3 is a schematic structural diagram of another earphone provided by an embodiment of the present application, and Fig. 4 is The sectional view of the earphone of the embodiment shown in FIG. 3 .

As shown in FIGS. 1-3 , the embodiment of the application provides an earphone 200 , the earphone 200 at least includes: a first housing 210 , a second housing 220 and a combination module 100 of a microphone and a speaker. The first housing 210 is fastened to the second housing 220 and jointly define an accommodating cavity, which can be used to accommodate components such as batteries, microphone and speaker combination module 100 . The inner wall of the second housing 220 is provided with a sound outlet 230 communicating with the receiving cavity, and the sound outlet 230 can be used for the sound emitted by the earphone 200 to be transmitted to the outer space of the earphone 200 .

In the embodiment of the present application, the combined microphone and speaker module 100 includes a stacked MEMS speaker 120 and a MEMS microphone 110. Since the thickness of the MEMS speaker 120 and the MEMS microphone 110 are both small, the microphone The thickness of the speaker combination module 100 is small, and in addition, since the microelectromechanical system speaker 120 and the microelectromechanical system microphone 110 are stacked along the thickness direction (such as the X direction in FIG. 5 ) of the microphone and speaker combination module 100, the microphone and the speaker The length of the combination module 100 in the direction perpendicular to its thickness direction becomes smaller, so that the volume of the microphone and speaker combination module 100 becomes smaller, thereby reducing the required installation space of the microphone and speaker combination module 100, so , the layout range of the installation position of the microphone and speaker combination module 100 in the earphone 200 can be increased, and the microphone and speaker combination module 100 can be installed to reduce the distance between the microphone and speaker combination module 100 and the user's eardrum. to improve the high-frequency sound quality of the earphone 200. In addition, since the high-frequency sound quality of the MEMS speaker 120 is good, the high-frequency sound quality of the earphone 200 can be further improved.

In the embodiment of the present application, since the installation space required by the microphone 110 and the speaker 120 is small, as shown in Fig. 1 and Fig. The combination module 100 covers the end of the sound outlet 230 and communicates with the receiving cavity. Such setting can reduce the distance between the microphone and speaker combination module 100 and the tympanic membrane of the human ear, which helps to improve the high-frequency sound quality of the earphone 200 . Certainly, besides being located at the sound outlet 230, the combined microphone and speaker module 100 can also be embedded in the sound outlet 230 as shown in FIG. 3 and FIG. The small distance between the combined microphone and speaker module 100 and the user's eardrum helps to further improve the high-frequency sound quality of the earphone 200 .

In order to further improve the sound producing effect of the earphone 200, as shown in FIG. , it can be understood that since the combined microphone and speaker module 100 has a MEMS speaker 120, the earphone 200 has two sounding units, namely the speaker unit 240 and the MEMS speaker 120, which can meet the different sounding requirements of the earphone 200 .

In the embodiment of the present application, the speaker unit 240 can be a moving coil unit or a moving iron unit. It can be understood that a moving coil unit refers to a moving coil speaker, and a moving iron unit refers to a moving iron speaker. Of course, the speaker The unit 240 can also be other types of speakers 120, which is not specifically limited here.

In the embodiment of the present application, as shown in FIGS. 2-4 , the earphone 200 also includes a bracket 250 through which the combined microphone and speaker module 100 can be securely connected to the second housing 220 . In addition, through the bracket 250 , The combined microphone and speaker module 100 can cover one end of the sound outlet 230 or be located in the sound outlet 230 .

The implementation of the combined microphone and loudspeaker module 100 provided by the embodiment of the present application will be described below.

FIG. 5 is a cross-sectional view of a microphone and speaker combination module provided by an embodiment of the present application. Referring to FIG. . Wherein, the speaker 120 is a micro-electro-mechanical system (Micro-Electro-Mechanical System, MEMS) speaker 120 , which helps to reduce the thickness of the speaker 120 and can improve the high-frequency sound quality of the speaker 120 . The speaker 120 has a speaker front cavity 31 , a speaker rear cavity 32 and a sound outlet 33 . The speaker front cavity 31 communicates with the external space of the microphone and speaker combination module 100 through the sound outlet 33 , so that the sound from the speaker 120 can be transmitted to the external space of the microphone and speaker combination module 100 . The microphone 110 is a MEMS microphone 110 which helps to reduce the thickness of the microphone 110 . The microphone 110 has a microphone cavity 10 and a sound pickup hole 20 . The microphone cavity 10 is located below the speaker rear cavity 32 along the first direction (for example, the X direction in FIG. 5 ), the microphone cavity 10 faces the wall of the speaker rear cavity 32 along the first direction, and the speaker rear cavity 32 faces the microphone cavity along the first direction. At least part of the cavity wall of 10 is arranged oppositely, so that the size of the combined microphone and speaker module 100 in the direction perpendicular to the first direction (such as the Y direction in FIG. 5 ) can be reduced, which helps to reduce the combination of the microphone and the speaker. The size of the module 100. The microphone cavity 10 communicates with the external space of the microphone and speaker combination module 100 through the sound pickup hole 20 , so that the microphone 110 can pick up the sound in the external space of the microphone and speaker combination module 100 .

It should be noted that the location of the microphone cavity 10 below the speaker rear cavity 32 is based on the position of the microphone and speaker combination module 100 in FIG. 10 as a reference. When the position of the microphone and speaker combination module 100 changes , the microphone cavity 10 is always arranged with the speaker rear cavity 32 along the first direction.

Since both the microphone 110 and the loudspeaker 120 are made by a micro-electro-mechanical system (Micro-Electro-Mechanical System, MEMS) process, the micro-electro-mechanical system speaker 120 and the micro-electro-mechanical system microphone 110 made by the MEMS process have small size, light weight, and low power consumption. The advantages of low cost, high reliability, small thickness, high sensitivity and easy integration help to reduce the thickness of the combined microphone and speaker module 100 .

Because the speaker front cavity 31 is located above the speaker rear cavity 32 along the first direction, in other words, along the first direction, the speaker front cavity 31 wraps the speaker rear cavity 32 towards the cavity wall of the speaker rear cavity 32, therefore, the part of the speaker front cavity 31 Located above the speaker rear cavity 32 along the first direction, so that the speaker front cavity 31, the speaker rear cavity 32 and the microphone cavity 10 are arranged from top to bottom along the first direction, and then the microphone 110 and the speaker 120 are arranged along the first direction Cascading settings.

The cavity wall of the microphone cavity 10 facing the speaker rear cavity 32 along the first direction is opposite to at least part of the cavity wall of the speaker rear cavity 32 facing the microphone cavity 10 along the first direction, which prevents the microphone 110 and the speaker 120 from moving in the second direction (such as The staggered setting in the Y direction in FIG. 10 helps to reduce the length of the microphone and speaker combined module 100 in the second direction. Wherein, the second direction is perpendicular to the first direction. In addition, the first direction refers to the thickness direction of the combined microphone and speaker module 100 . Of course, the first direction is also the thickness direction of the speaker 120 and the thickness direction of the microphone 110 .

Therefore, in the combined microphone and speaker module 100 of the embodiment of the present application, by stacking the MEMS microphone 110 and the MEMS speaker 120 along the first direction, the small thickness of the MEMS microphone 110 and the MEMS The advantage of the thickness of the speaker 120 can reduce the length of the microphone and speaker combination module 100 in the second direction, in other words, the cross-sectional area of the microphone and speaker combination module 100 can help reduce the microphone and speaker combination module. The installation space required by the earphone 100 can further reduce the distance between the microphone and loudspeaker combination module 100 and the eardrum of the human ear, which helps to improve the high-frequency sound quality of the earphone 200. Wherein, the cross section of the combined microphone and speaker module 100 is parallel to the second direction and perpendicular to the first direction.

The process of implementing active noise reduction for the combined microphone and speaker module 100 provided in the embodiment of the present application is as follows: external noise can enter the microphone cavity 10 through the sound pickup hole 20 and then be picked up by the microphone 110, and the microphone 110 converts the picked up sound signal into The electrical signal is transmitted to the processing unit for processing, and the processing unit can perform reverse processing according to the obtained electrical signal, and convert the reversely processed electrical signal into a sound signal and send it to the speaker 120, and the speaker 120 The signal emits anti-phase sound waves through the sound hole 33 to offset external noise and realize active noise reduction. It should be noted that the processing unit may be a processing chip of the combined microphone and speaker module 100 or a processing module separately provided in the earphone 200 , which is not specifically limited here.

In the embodiment of the present application, the microphone cavity 10 includes a microphone front cavity 11 and a microphone rear cavity 12, and the sound pickup hole 20 can communicate with the microphone front cavity 11 or the microphone rear cavity 12, so that the external space of the microphone and speaker combination module 100 Noise can be picked up by the microphone 110 through the microphone rear cavity 12 or the microphone front cavity 11 .

As shown in FIG. 5, the microphone cavity 10, the speaker front cavity 31 and the speaker rear cavity 32 may be located on different sides of the substrate part (such as the substrate assembly in FIG. 10) of the microphone and speaker combination module 100 along the first direction, and the bottom The detailed description will be made facing the fact that the microphone cavity 10 is located on different sides of the substrate portion from the speaker front cavity 31 and the speaker rear cavity 32 .

In some possible implementations, as shown in FIG. 5 , the combined microphone and speaker module 100 includes a substrate assembly 130 , a first housing 121 , a first transducer assembly 122 , a second enclosure 111 and a second transducer assembly 112 . Wherein, the first transducer component 122 includes a first micro-electro-mechanical system transducer, and the first micro-electro-mechanical system transducer enables the first transduction component 122 to realize the mutual conversion of electric energy and acoustic energy. The second transducing component 112 includes a second micro-electro-mechanical system transducer, and the second micro-electro-mechanical system transducer enables the second transducing component 112 to realize the mutual conversion of electric energy and acoustic energy.

Wherein, as shown in FIG. 5 , the substrate assembly 130, the first housing 121 and the first transducing assembly 122 jointly define the speaker 120, and due to the setting of the first microelectromechanical system transducer, the first transducing assembly 122 can The signal is converted into a sound signal to realize the sounding function of the speaker 120 . Both the first housing 121 and the first transducer assembly 122 are mounted on the first surface of the substrate assembly 130, the first transducer assembly 122 is disposed in the first enclosure 121 and together with the substrate assembly 130 defines the speaker rear cavity 32, the second A housing 121 , the first transducing component 122 and the substrate component 130 jointly define the speaker front cavity 31 .

Wherein, as shown in FIG. 5 , the substrate assembly 130, the second housing 111 and the second transducer assembly 112 jointly define the microphone 110. Due to the setting of the second MEMS transducer, the first transducer assembly 122 can transmit the sound The signal is converted into an electrical signal to realize the sound pickup function of the microphone 110 . Both the second housing 111 and the second transducer assembly 112 are installed on the second surface of the substrate assembly 130, and the second housing 111 and the substrate assembly 130 jointly define the microphone cavity 10; wherein, the first surface and the second surface are along the first Direction is set relative to. Such setting can reduce the installation space required by the combined microphone and speaker module 100 , making the distance between the combined microphone and speaker module 100 and the user's eardrum closer, and helping to improve the high-frequency sound quality of the earphone 200 .

The sound hole 33 can be provided on the side wall (such as shown in FIG. 5 ) or the top wall (such as shown in FIG. 13 or FIG. 14 ) of the first housing 121 , so that the speaker 120 can realize front or side sound output.

It can be understood that the first housing 121 is used to protect the first transducer assembly 122, and can be firmly connected with the second housing 220 of the earphone 200 through the first housing 121, so that the combined microphone and speaker module 100 can be installed on In the accommodation cavity or the sound outlet 230 . In addition, the material of the first shell 121 can be metal (the material of metal can be stainless steel material, aluminum material, aluminum alloy material, copper material, copper alloy material, iron material, iron alloy material), plastic (plastic material can be selected hard High-quality plastics, such as ABS, POM, PS, PMMA, PC, PET, PBT, PPO, etc.), ceramics and other materials. Similarly, the second housing 111 is also used to protect the second transducer assembly 112, and can be firmly connected with the second shell 220 of the earphone 200 through the second housing 111, so that the combined microphone and loudspeaker module 100 can be installed in a housing cavity or sound outlet 230. In addition, the material of the second housing 111 can be metal (the material of metal can be stainless steel material, aluminum material, aluminum alloy material, copper material, copper alloy material, iron material, iron alloy material), plastic (plastic material can be selected hard High-quality plastics, such as ABS, POM, PS, PMMA, PC, PET, PBT, PPO, etc.), ceramics and other materials.

It can be understood that both the first MEMS transducer and the second MEMS transducer are transducers made of semiconductor materials using MEMS technology, therefore, the first MEMS transducer and the second MEMS transducer Any one of the two MEMS transducers can be any one of the following transducers: piezoelectric MEMS transducers, electric MEMS transducers, electrostatic MEMS transducers, Thermoacoustic MEMS transducer. In addition, the types of the first MEMS transducer and the second MEMS transducer may be the same or different.

The structure of the first transducing component 122 and the second transducing component 112 will be described below by taking the example that both the first transducing component 122 and the second transducing component 112 use piezoelectric MEMS transducers.

Fig. 6 is a cross-sectional view of the first transducer assembly provided by the embodiment of the present application, and Fig. 7 is a partial perspective view of another combination module of microphone and speaker provided by the embodiment of the present application.

As shown in FIG. 6 , the first transducer component 122 may include a vibrating element 1221 and a first base 1222 for supporting the vibrating element 1221 . The first base 1222 is firmly connected to the substrate assembly 130 , so that the vibrating element 1221 is firmly installed on the substrate assembly 130 . In addition, the vibrating element 1221 , the first base 1222 and the substrate assembly 130 jointly define the speaker rear cavity 32 . The vibrating element 1221 is made of piezoelectric material, and under the action of an electric field, the vibrating element 1221 can be deformed to push the air to produce sound.

The vibrating element 1221 is the first micro-electromechanical system transducer made by MEMS technology. The vibrating element 1221 can be a piezoelectric single cantilever beam, a combination of multiple cantilever beams (such as shown in FIG. 7 ), a piezoelectric cantilever beam plus a dome combination structure Equal cantilever beam structure. For example, as shown in FIG. 11 , the vibration element 1221 includes a substrate layer 12211 , a first electrode layer 12212 , a piezoelectric layer 12213 and a second electrode layer 12214 stacked along the first direction. The polarities of the first electrode layer 12212 and the second electrode layer 12214 are opposite, and the piezoelectric layer 12213 is made of a piezoelectric material, and the piezoelectric material generates reverse polarity under the electric field defined by the first electrode layer 12212 and the second electrode layer 12214. The piezoelectric effect drives the vibrating element 1221 to deform, thereby pushing the air to produce sound. It should be noted that the number of piezoelectric layers 12213 between the first electrode layer 12212 and the second electrode layer 12214 can be multiple layers, and the piezoelectric layers 12213 of two adjacent layers can be connected through a connecting layer.

Piezoelectric materials refer to materials with piezoelectric effect, such as lead zirconate titanate, aluminum nitride, scandium-doped aluminum nitride, zinc oxide and other materials.

As shown in FIG. 7 , the cantilever beam structure means that the connecting end of the vibrating element 1221 is firmly connected with the first base 1222 , and the free end of the vibrating element 1221 can vibrate up and down along the first direction under the action of an electric field.

As shown in FIG. 7 , the first MEMS transducer may include a plurality of vibrating elements 1221, and there is a gap structure 1223 between two adjacent vibrating elements 1221, and the gap structure 1223 makes the free end of the cantilever structure mechanically free, with Help the vibrating element 1221 to vibrate.

Fig. 8 is a cross-sectional view of the second transducer assembly provided by the embodiment of the present application.

As shown in FIG. 8 , the second transducer assembly 112 may include a diaphragm 1121 and a second base 1122 for supporting the diaphragm 1121, the second base 1122 is fastened on the substrate assembly 130, the diaphragm 1121, the second base 1122 and the substrate assembly 130 jointly define the microphone rear chamber 12 , and the diaphragm 1121 , the second base 1122 , the substrate assembly 130 and the second housing 111 jointly define the microphone front chamber 11 . Wherein, the vibrating membrane 1121 is the first MEMS transducer made by MEMS technology, the vibrating membrane 1121 can be integrally etched from single crystal or polycrystalline silicon material, and the piezoelectric material is sprayed on the etched vibrating membrane 1121 (such as ceramic material), or a layer of piezoelectric ceramic sheet is covered on the etched diaphragm 1121 to form a piezoelectric MEMS transducer. When the diaphragm 1121 bends, the diaphragm 1121 generates an electrical signal, and the processing element 113 electrically connected to the diaphragm 1121 processes the electrical signal.

In the embodiment of the application, the substrate assembly 130 can be composed of a printed circuit board (PCB), so that the electrical signals generated by the vibration element 1221 and the diaphragm 1121 can be transmitted to the processing unit and the processing element 113 through the circuit board. , the electrode layer of the vibrating element 1221 may be electrically connected to the circuit board through wires.

The processing element 113 may include, but is not limited to, an application specific integrated circuit (Application Specific Integrated Circuit, ASIC) chip, a digital signal processing unit (Digital Signal Processor, DSP) chip, and the like. In addition, as shown in FIG. 13 , the processing element 113 may be mounted on a circuit board and electrically connected to the diaphragm 1121 and the circuit board through wires 140 .

FIG. 9 is a cross-sectional view of another microphone and speaker combination module provided by an embodiment of the present application, and FIG. 10 is a cross-sectional view of a sound hole provided by an embodiment of the present application.

As shown in FIG. 9, in a possible implementation manner, the substrate assembly 130 may include a first substrate 131, and the first transducer assembly 122 and the second transducer assembly 112 are respectively arranged on the first substrate 131 along the first direction. On the opposite sides, such an arrangement helps to further reduce the thickness of the microphone and speaker combination module 100 in the first direction, and can reduce the volume size of the microphone and speaker combination module 100 to reduce the size of the microphone and speaker. The installation space required by the combination module 100.

The first substrate 131 and the second transducer assembly 112 jointly define the microphone rear chamber 12 , and the first substrate 131 , the second transducer assembly 112 and the second housing 111 jointly define the microphone front chamber 11 . In order to pick up noise in the external space of the combined microphone and speaker module 100 , the sound pickup hole 20 may be disposed on the first substrate 131 , so that the microphone rear chamber 12 communicates with the external space of the combined microphone and speaker module 100 . Alternatively, the sound pickup hole 20 may be disposed on the second housing 111 , so that the microphone front cavity 11 communicates with the external space of the microphone and speaker combination module 100 .

When the sound pickup hole 20 is disposed on the first substrate 131 , it helps to further improve the sensitivity of the microphone 110 and can increase the application range of the microphone and speaker combined module 100 . For example, as shown in FIG. 10 , the sound pickup hole 20 includes a first sound hole section 21 and a second sound hole section 22 arranged in communication. The first sound hole section 21 is located on the surface where the first substrate 131 is connected to the second transducer assembly 112 and is located in the microphone rear cavity 12 , and the second sound hole section 22 is disposed on the side wall of the first substrate 131 .

In order to balance the pressure between the speaker rear cavity 32 defined by the first substrate 131 and the first transducer assembly 122 and the external space of the microphone and speaker combination module 100, in other words, the speaker rear cavity 32 and the speaker front cavity 31 To balance the pressure between them, an acoustic hole 34 may be provided on the first substrate 131 , through which the speaker rear cavity 32 communicates with the external space of the combined microphone and speaker module 100 .

In order to reduce the number of openings on the first substrate 131 and increase the rigidity of the first substrate 131 , the sound hole 34 may communicate with the sound pickup hole 20 on the first substrate 131 .

It can be understood that the first substrate 131 may be a first circuit board, and the first transducing component 122 and the second transducing component 112 are fastened on the first circuit board and electrically connected to the first circuit board respectively. In addition, for electrical connection with external circuits, pads 150 are provided on the first circuit board.

FIG. 11 is a schematic structural diagram of yet another microphone and speaker combination module provided by an embodiment of the present application, and FIG. 12 is a structural schematic diagram of the microphone and speaker combination module of the embodiment shown in FIG. 11 .

As shown in FIG. 11 , in another possible implementation manner, the substrate assembly 130 may include a first substrate 131 and a second substrate 132 stacked along a first direction. Both the first housing 121 and the first transducing component 122 are disposed on the surface of the first substrate 131 , and both the second housing 111 and the second transducing component 112 are disposed on the surface of the second substrate 132 . Such setting, on the one hand, can reduce the installation space required by the combined microphone and speaker module 100 , and on the other hand, can improve the production efficiency of the combined microphone and speaker module 100 .

It should be noted that the first substrate 131 may be a first circuit board, and the first transducer assembly 122 is mounted on the first circuit board and electrically connected to the first circuit board. The second substrate 132 may be a second circuit board, on which the second transducer component 112 is mounted and electrically connected to the second circuit board. In addition, the first circuit board has an electrical connection circuit, and the electrical connection circuit is electrically connected to the pads 150 (such as shown in FIG. 11 ) on the second circuit board and the first circuit board respectively, so that the first circuit board and the second circuit board The boards may share pads 150 and be electrically connected to external circuits. In addition, the first circuit board and the second circuit board can be firmly connected by welding.

It can be understood that, the first transducer assembly 122 and the first substrate 131 jointly define the speaker rear chamber 32 , and the first substrate 131 , the first housing 121 and the first transducer assembly 122 jointly define the speaker front chamber 31 . The second transducer assembly 112 and the second substrate 132 jointly define the microphone rear chamber 12 , and the second substrate 132 , the second housing 111 and the second transducer assembly 112 jointly define the microphone front chamber 11 .

The sound outlet hole 33 may be disposed on the top wall or the side wall of the first housing 121 , which is not specifically limited here.

In order to make the microphone 110 pick up external noise, the sound pickup hole 20 can be arranged on the second housing 111 (such as shown in FIG. 11 or FIG. 12 ), or the sound pickup hole 20 can be arranged on the first substrate 131 and the second substrate 132 On the defined substrate assembly 130 , for example, in some examples, the sound pickup hole 20 includes a first sound hole section 21 and a second sound hole section 22 arranged in communication. The first sound hole section 21 is disposed through the second substrate 132 and communicates with the microphone rear cavity 12 . The second sound hole section 22 is disposed between the first substrate 131 and the second substrate 132 , and the second sound hole section 22 is used to communicate with the external space of the combined microphone and speaker module 100 . Such arrangement enables the sound pickup hole 20 to be disposed on the substrate assembly 130 , and can improve the sensitivity of the microphone 110 , which helps to improve the application range of the microphone and speaker combination module 100 .

The second sound hole section 22 may include but not limited to the following formation methods: a first groove is arranged on the surface of the second substrate 132 in contact with the first substrate 131, and the first groove cooperates with the first substrate 131 to define a first groove. Two tone hole sections 22. Alternatively, a second groove is provided on the contacting surface of the first substrate 131 and the second substrate 132 , and the second groove cooperates with the second substrate 132 to define the second sound hole section 22 . Alternatively, the surface of the first substrate 131 in contact with the second substrate 132 is provided with a first groove, the surface of the second substrate 132 in contact with the first substrate 131 is provided with a second groove, and the first groove and the second groove The grooves cooperate to define a second sound hole section 22 .

In order to balance the pressure between the speaker rear cavity 32 and the speaker front cavity 31, as shown in FIG. 11 or FIG. The speaker rear chamber 32 communicates with the external space of the combined microphone and speaker module 100 . In addition, the number of the sound holes 34 may include but not limited to 1, 2, 3, 4 and other numbers.

Figure 13 is a schematic diagram of the connection between a sound hole and a sound pickup hole provided by the embodiment of the present application, Figure 14 is a schematic structural diagram of another microphone and speaker combination module provided by the embodiment of the present application, and Figure 15 is shown in Figure 12 A cross-sectional view of the microphone and speaker combined module of the embodiment.

As shown in Figure 13, the sound hole 34 can also communicate with the sound hole 20, in other words, the sound hole 34 can communicate with the external environment through the sound hole 20, or the sound hole 20 can communicate with the external environment through the sound hole 34, for example Taking the sound hole 34 passing through the sound pickup hole 20 as an example, one end of the sound hole 34 communicates with the speaker rear cavity 32, and the other end of the sound hole 34 communicates with the sound pickup hole 20, so that the sound pickup hole 20 can transmit external noise on the one hand To the microphone 110, on the other hand, the pressure between the speaker rear cavity 32 and the external environment can be kept balanced.

As shown in FIGS. 14 and 15 , the acoustic hole 34 may include a fourth groove 341 disposed on the surface where the first substrate 131 is connected to the first transducer assembly 122 and penetrate through the first substrate 141 and communicate with the fourth groove. The first through hole 342, the fourth groove 341 is used to communicate with the speaker rear cavity 32 and the external environment, the first through hole 342 communicates the fourth groove 341 with the sound pickup hole 20, so that the sound pickup hole 20 passes through the sound hole 34 communicates with the external environment, and then the microphone rear chamber 12 communicates with the external environment.

Fig. 16 is a cross-sectional view of yet another combination module of a microphone and a loudspeaker provided by an embodiment of the present application.

In some examples, as shown in FIG. 16 , the substrate assembly 130 may further include: a third substrate 133 . The first substrate 131 is connected to the second substrate 132 through the third substrate 133 . The third substrate 133 is provided with a communication structure 1331 for communicating the sound pickup hole 20 with the external space of the combined microphone and speaker module 100 . Through the third substrate 133, it helps to reduce the layout difficulty of setting the sound pickup hole 20 on the substrate assembly 130, and can reduce the processing difficulty of the substrate assembly 130, thereby improving the application range of the microphone and speaker combination module 100 .

The communication structure 1331 may be a notch penetrating the third substrate 133, a groove provided on the side wall of the third substrate 133, a groove provided on the surface of the third substrate 133 in contact with the second substrate 132, etc., which are not described here. Specific restrictions. For example, in the embodiment of the present application, the communication structure 1331 is a gap penetrating through the third substrate 133 .

Because the sound hole 34 can communicate with the sound hole 20, thereby the external environment communicates with the speaker rear cavity 32 and the microphone rear cavity 12 respectively, therefore, the communication structure 1331 can also communicate with the sound hole 34, so that the sound hole 34 and the sound pickup hole 20 Both communicate with the external environment through the communication structure 1331 .

The third substrate 133 can also be a third circuit board, so that the first circuit board and the second circuit board can be electrically connected, and then the first circuit board and the second circuit board can be connected to the external circuit through the pad 150 on the first circuit board. electrical connection.

The above content has explained that the microphone cavity 10, the speaker front cavity 31 and the speaker rear cavity 32 are located on opposite sides of the substrate assembly 130 along the first direction. Of course, the microphone cavity 10, the speaker front cavity 31 and the speaker rear cavity 32 may be located on the substrate assembly 130 on the same side as the following.

Fig. 17 is a cross-sectional view of yet another combination module of a microphone and a loudspeaker provided by an embodiment of the present application.

As shown in FIG. 17 , in some possible implementations, the substrate assembly 130 may include a fourth substrate 134 . Wherein, the first shell 121, the second shell 111 and the second transducing component 112 are all installed on the same surface of the fourth substrate 134, and the first transducing component 122, the second shell 111 and the second transducing component 112 are all located on Inside the first housing 121 , the second transducer assembly 112 is located in the second housing 111 . The first transducer assembly 122 is mounted on the outer surface of the second housing 111 and together with the outer surface of the second housing 111 defines the speaker rear cavity 32, the first transducer assembly 122, the first housing 121, and the second housing 111 The outer surface and the fourth substrate 134 jointly define the speaker front chamber 31 . The inner surface of the second shell 111 and the fourth substrate 134 jointly define the microphone cavity 10 , and the sound pickup hole 20 is disposed on the fourth substrate 134 , ensuring that the microphone 110 can pick up external noise. The microphone 110 and the speaker 120 share the same substrate, on the one hand, the thickness of the microphone and speaker combination module 100 in the first direction can be reduced to reduce the volume of the microphone and speaker combination module 100; The production difficulty of the small microphone and speaker combination module 100 helps to improve the production efficiency of the microphone and speaker combination module 100 .

Since the microphone 110 and the speaker 120 share the fourth substrate 134, and can be stacked in the first direction, the thickness of the microphone and speaker combination module 100 in the first direction is reduced, thereby reducing the size of the microphone and speaker combination module. Installation space required for group 100. In addition, since the microphone 110 and the speaker 120 are manufactured using the same surface of the fourth substrate 134, and the first transducer assembly 122 is located on the outer surface of the second housing 111, during the process of manufacturing the microphone and speaker combination module 100, The position of the fourth substrate 134 does not need to be moved or flipped, which helps to reduce the manufacturing steps of the microphone and speaker combination module 100, can reduce the production difficulty of the microphone and speaker combination module 100, and helps to improve the combination of microphone and speaker. The production efficiency of the module 100.

It can be understood that the fourth substrate 134 may be a fourth circuit board, and the fourth circuit board may be electrically connected to the first transducing component 122 and the second transducing component 112 through wires 140 to realize transmission of electrical signals.

It can be understood that the second transducer assembly 112 and the fourth substrate 134 jointly define the microphone rear chamber 12 , and the second housing 111 , the second transducer assembly 112 and the fourth substrate 134 jointly define the microphone front chamber 11 . In addition, one end of the sound pickup hole 20 communicates with the microphone front cavity 11 or the microphone rear cavity 12 , and the other end of the sound pickup hole 20 communicates with the external space of the combined microphone and speaker module 100 . When the sound pickup hole 20 communicates with the microphone rear chamber 12 , it helps to improve the sound pickup effect of the microphone 110 .

In order to improve the anti-interference capability of the microphone 110, the second housing 111 may be an electromagnetic shielding housing made of an electromagnetic shielding material, for example, the second housing 111 is made of a metal material.

In order to improve the anti-interference capability of the microphone 110 and improve the connection effect between the first transducer assembly 122 and the second housing 111 , the second housing 111 includes an electromagnetic shielding layer 1111 and a resin layer 1112 stacked along the first direction. The resin layer 1112 is used to securely connect with the second transducer assembly 112 and jointly define the speaker rear chamber 32 with the second transducer assembly 112 .

Fig. 18 is a cross-sectional view of yet another combination module of a microphone and a loudspeaker provided by an embodiment of the present application.

In order to further reduce the thickness of the combined microphone and loudspeaker module 100 in the first direction, as shown in FIG. The thickness of the second transducer assembly 112 in the first direction is less than or equal to the depth of the receiving groove 1341 in the first direction.

It can be understood that the second housing 111 may be partially located in the receiving groove 1341 or the second housing 111 is located above the receiving groove 1341 . For example, the second shell 111 is a flat structure, and the second shell 111 is arranged to cover the receiving groove 1341 .

It should be noted that, since the first transducer assembly 122 can adopt a plurality of vibrating elements 1221 with a cantilever beam structure, the first transducer assembly 122 has a gap structure 1223, which can make the loudspeaker rear chamber 32 and the loudspeaker The communication of the front cavity 31 can also balance the pressure between the speaker rear cavity 32 and the speaker front cavity 31 , and then balance the pressure between the speaker rear cavity 32 and the external space of the combined microphone and speaker module 100 .

Fig. 19 is a schematic diagram of the first step of making the microphone and loudspeaker combination module of the embodiment shown in Fig. 17, Fig. 20 is a schematic diagram of the second step of making the microphone and loudspeaker combination module of the embodiment shown in Fig. 17, and Fig. 21 is a schematic diagram of making FIG. 17 is a schematic diagram of the third step of making the microphone and speaker combination module of the embodiment shown in FIG. 17 , and FIG. 22 is a schematic diagram of the fourth step of making the microphone and speaker combination module of the embodiment shown in FIG. 17 .

The packaging process flow of the microphone and speaker combination module 100 formed by sharing the fourth substrate 134 with the microphone 110 and the speaker 120 is described below:

S101 , forming the microphone 110 on the fourth substrate 134 .

Specifically, referring to FIG. 19 and FIG. 20 , the second transducer assembly 112 and the ASIC chip can be mounted on the fourth substrate 134 by bonding, and the second transducer assembly 112 can be bonded on the fourth substrate 134 first. Alternatively, the ASIC chip is bonded on the fourth substrate 134 first, or the second transducer component 112 and the ASIC chip are bonded on the fourth substrate 134 at the same time. After the bonding of the second transducer assembly 112 and the ASIC chip is completed, and then after the second transducer assembly 112 is electrically connected to the ASIC chip and the fourth substrate 134 through the wire 140 respectively, the electromagnetic shielding layer 1111 of the second housing 111 It is fixed on the fourth substrate 134 and the second transducer component 112 and the ASIC chip are located in the electromagnetic shielding layer 1111 , and finally the surface of the electromagnetic shielding layer 1111 away from the second transducer component 112 is covered with high-temperature resin to form a resin layer 1112 .

S102 , installing the first transducer assembly 122 on the outer surface of the second housing 111 and electrically connecting the first transducer assembly 122 to the fourth substrate 134 .

Specifically, referring to FIG. 21 , the first substrate 1222 of the first transducer component 122 is bonded to the surface of the resin layer 1112 of the second housing 111 , and the electrode layer of the first transducer component 122 can be connected to the fourth substrate 134 through wires 140 electrical connection.

S103 , installing the first housing 121 on the fourth substrate 134 to form the speaker 120 .

Specifically, referring to FIG. 22 , the first housing 121 may be pasted on the fourth substrate 134 by means of adhesion.

In the description of the embodiments of this application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a An indirect connection through an intermediary may be an internal communication between two elements or an interaction relationship between two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in the embodiments of the present application according to specific situations.

The devices or components mentioned in the embodiments of the present application must have specific orientations, be constructed and operated in specific orientations, and therefore should not be construed as limiting the embodiments of the present application. In the description of the embodiments of the present application, "plurality" means two or more, unless otherwise specifically specified.

The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of the present application and the above drawings are used to distinguish similar objects, while It is not necessarily used to describe a particular order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the application described herein, for example, can be practiced in sequences other than those illustrated or described herein. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive inclusion, for example, a process, method, system, product or device comprising a sequence of steps or elements is not necessarily limited to the expressly listed instead, may include other steps or elements not explicitly listed or inherent to the process, method, product or apparatus.

The term "plurality" herein means two or more. The term "and/or" in this article is just an association relationship describing associated objects, which means that there can be three relationships, for example, A and/or B can mean: A exists alone, A and B exist simultaneously, and there exists alone B these three situations. In addition, the character "/" in this paper generally indicates that the contextual objects are an "or" relationship; in the formula, the character "/" indicates that the contextual objects are a "division" relationship.

It can be understood that the various numbers involved in the embodiments of the present application are only for convenience of description, and are not used to limit the scope of the embodiments of the present application.

It can be understood that, in the embodiments of the present application, the sequence numbers of the above-mentioned processes do not mean the order of execution, and the order of execution of the processes should be determined by their functions and internal logic, and should not be used in the implementation of this application. The implementation of the examples constitutes no limitation.

Claims (18)

1. A combination module of a microphone and a loudspeaker, characterized in that it at least comprises: a microphone and a loudspeaker; The speaker is a MEMS speaker, and the microphone is a MEMS microphone; The speaker has a speaker front cavity, a speaker rear cavity and a sound outlet; The speaker front cavity communicates with the external space of the microphone and speaker combination module through the sound outlet; The microphone has a microphone cavity and a sound pickup hole; The microphone cavity is located below the speaker rear cavity along the first direction, the cavity wall of the microphone cavity facing the speaker rear cavity along the first direction and the speaker rear cavity facing the microphone cavity along the first direction at least portions of the cavity walls are oppositely disposed; The microphone cavity communicates with the external space of the combined microphone and speaker module through the sound pickup hole. 2. The combined microphone and loudspeaker module according to claim 1, wherein the combined microphone and loudspeaker module comprises a substrate assembly, a first housing, a first transducer assembly, a second casing, and a second transducer components; The first transducing assembly includes a first MEMS transducer, and the second transducing assembly includes a second MEMS transducer; The substrate assembly, the first housing, and the first transducer assembly jointly define the speaker, and the first enclosure and the first transducer assembly are mounted on the first surface of the substrate assembly , the first transducing component is used to convert electrical energy into acoustic energy, the first transducing component is arranged in the first housing and defines the rear chamber of the speaker together with the substrate component, the first transducing component A housing, the first transducer assembly and the substrate assembly jointly define the loudspeaker front cavity; The substrate assembly, the second housing, and the second transducer assembly jointly define the microphone, and both the second housing and the second transducer assembly are mounted on a second surface of the substrate assembly , the second shell and the substrate assembly jointly define the microphone cavity, the second transducer component is located in the microphone cavity and is used to convert sound energy into electrical energy; Wherein, the first surface and the second surface are oppositely arranged along the first direction. 3. The microphone and loudspeaker combination module according to claim 2, wherein the microphone cavity comprises a microphone front cavity and a microphone rear cavity; The second transducer component and the substrate component jointly define the microphone rear cavity; The second housing, the second transducer assembly and the substrate assembly jointly define the microphone front cavity; The sound pickup hole is disposed on the substrate assembly or the second shell. 4. The combined microphone and speaker module according to claim 3, wherein the substrate assembly comprises a first substrate, and the first transducer assembly and the second transducer assembly are aligned along the first direction respectively disposed on opposite sides of the first substrate. 5. The combined microphone and loudspeaker module according to claim 3, wherein the substrate assembly comprises a first substrate and a second substrate stacked along the first direction; the first shell and the Both the first transducing components are disposed on the surface of the first substrate, and the second housing and the second transducing components are disposed on the surface of the second substrate. 6. The microphone and loudspeaker combination module according to claim 5, wherein the sound pickup hole comprises a first sound hole section and a second sound hole section connected in communication; The first sound hole section is arranged through the second substrate and communicates with the microphone rear cavity; The second sound hole section is disposed between the first substrate and the second substrate, and the second sound hole section is used to communicate with the external space of the combined microphone and speaker module. 7. The combined microphone and speaker module according to claim 6, wherein the substrate assembly further comprises: a third substrate; the first substrate is connected to the second substrate through the third substrate; A communication structure for communicating the sound pickup hole with the external space of the combined microphone and loudspeaker module is provided on the third substrate. 8. The microphone and loudspeaker combination module according to any one of claims 2-7, wherein a sound hole is arranged on the substrate assembly, and the rear chamber of the loudspeaker communicates with the microphone and the loudspeaker through the sound hole. The external spaces of the combined modules are connected. 9. The combination module of microphone and speaker according to claim 8, characterized in that, when the sound pickup hole is arranged on the substrate assembly, the sound hole communicates with the sound pickup hole, so that the sound pickup hole Both the rear cavity of the speaker and the microphone cavity communicate with the external space of the combination module of the microphone and the speaker. 10. The combined microphone and loudspeaker module according to claim 1, characterized in that, the combined microphone and loudspeaker module comprises a fourth substrate, a first casing, a first transducer assembly, a second casing, and a second transducer energy components; The first transducing assembly includes a first MEMS transducer, and the second transducing assembly includes a second MEMS transducer; The fourth substrate, the first housing and the first transducing component jointly define the speaker, and the fourth substrate, the second housing and the second transducing component jointly define the speaker. microphone; The first shell, the second shell and the second transducing component are all installed on the same surface of the fourth substrate, the first transducing component, the second shell and the second transducing component The transducing components are all located in the first housing, and the second transducing components are located in the second housing; The first transducer assembly is mounted on the outer surface of the second housing and together with the outer surface of the second housing defines the rear cavity of the speaker, the first transducer assembly, the first housing , the outer surface of the second housing and the fourth substrate jointly define the loudspeaker front cavity; The inner surface of the second housing and the fourth substrate jointly define the microphone cavity, and the sound pickup hole is disposed on the fourth substrate. 11. The microphone and speaker combination module according to claim 10, wherein the microphone cavity comprises a microphone front cavity and a microphone rear cavity; The second transducer assembly and the fourth substrate jointly define the microphone rear chamber, and the second transducer assembly, the fourth substrate and the second housing jointly define the microphone front chamber; One end of the sound pickup hole communicates with the microphone front cavity or the microphone rear cavity, and the other end of the sound pickup hole communicates with the external space of the combined microphone and loudspeaker module. 12. The combined microphone and loudspeaker module according to claim 10 or 11, wherein the second housing is an electromagnetic shielding housing; or, The second housing includes an electromagnetic shielding layer and a resin layer stacked along the first direction; the resin layer is used for fastening connection with the second transducer assembly and is jointly defined with the second transducer assembly out of the rear of the speaker. 13. The combined microphone and loudspeaker module according to claim 10 or 11, characterized in that, the fourth substrate is provided with an accommodating groove for accommodating the second transducer assembly. 14. The combination module of microphone and speaker according to claim 2 or 10, characterized in that, the sound outlet is arranged on the side wall or the top wall of the first casing. 15. An earphone, characterized in that it comprises a first casing, a second casing, and the combination module of a microphone and a speaker according to any one of claims 1-14; The first housing is fastened to the second housing and jointly define a receiving cavity, and an inner wall of the second housing is provided with a sound outlet communicating with the receiving cavity; The microphone and speaker combination module is located in the accommodation cavity and is set close to the sound outlet, or the microphone and speaker combination module is located in the sound outlet. 16. The earphone according to claim 15, further comprising: a speaker unit; the speaker unit is located in the accommodating cavity and is located in the combined module of the microphone and the speaker and the first housing between. 17. The earphone according to claim 16, wherein the speaker unit is a moving coil unit or a moving iron unit. 18. An electronic device, characterized by comprising a body and the microphone and speaker combination module according to any one of claims 1 to 14, the microphone and speaker combination module being installed on the body.

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