WO2020134449A1

WO2020134449A1 - Microphone

Info

Publication number: WO2020134449A1
Application number: PCT/CN2019/113282
Authority: WO
Inventors: 曾鹏; 王天娇
Original assignee: 瑞声声学科技(深圳)有限公司
Priority date: 2018-12-28
Filing date: 2019-10-25
Publication date: 2020-07-02
Also published as: CN209375863U

Abstract

A microphone. The microphone comprises a housing having an accommodating cavity, and a microelectromechanical system chip and a control circuit chip accommodated in the accommodating cavity; the housing is provided with a sound producing hole penetrating through the housing in a thickness direction and communicated with the accommodating cavity; the microphone also comprises an electric dust-proof device at least fully covering the sound producing hole; the electric dust-proof device is electrically connected to the control circuit chip. The electric dust-proof device is capable of opening the sound producing hole when receiving a power-on signal of the control circuit chip and closing the sound producing hole when not receiving the power-on signal of the control circuit chip, thereby effectively solving the pollution problem of the microphone in the process of transport, assembly, SMT or not being used, during which dust most easily enters, while not affecting acoustic performance.

Description

i

Microphone Technology

[0001] The utility model relates to the technical field of acoustic equipment, in particular to a microphone.

Background technique

[0002] Traditionally, in order to make the microphone dustproof, it is often necessary to attach a fixed dustproof film to the sound hole position of the microphone, but the fixed dustproof film needs to be opened with a dustproof hole, therefore, there are always smaller than the dustproof hole There is a certain probability that foreign objects will enter the dust hole. In addition, the biggest disadvantage is that the sound hole is added with a dust net, the damping becomes larger, and the microphone's acoustic performance will become worse.

[0003] It is therefore necessary to study a microphone with a new structure.

Summary of the invention

technical problem

[0004] The utility model aims to solve one of the technical problems existing in the prior art, and provides a new microphone problem solution

Technical solution

[0005] In order to achieve the above object, the present invention provides a microphone, the microphone includes a housing with a receiving cavity, and a micro-electromechanical system chip and a control circuit chip received in the receiving cavity, the housing An acoustic hole is provided through the thickness and communicates with the accommodating cavity, the microphone further includes an electric dustproof device that at least completely covers the acoustic hole, the electric dustproof device is electrically connected to the control circuit chip, the The electric dustproof device can open the sound hole when receiving the power-on signal of the control circuit chip and close the sound hole when not receiving the power-on signal of the control circuit chip.

[0006] Optionally, the housing includes a housing and a circuit board connected to the housing to form the accommodating cavity, and the micro-electromechanical chip and the control circuit chip are both electrically connected to the circuit board. The sound hole is provided on the circuit board.

[0007] Optionally, the sound hole corresponds to the position of the MEMS chip, and the electric dustproof device is interposed between the circuit board and the MEMS chip. [0008] Optionally, the housing includes a housing and a circuit board connected to the housing to form the accommodating cavity, and both the micro-electromechanical chip and the control circuit chip are electrically connected to the circuit board. The sound hole is provided on the housing.

[0009] Optionally, the sound hole corresponds to the position of the control circuit chip, and the electric dustproof device is located between the bottom wall of the housing and the control circuit chip.

[0010] Optionally, the electric dustproof device includes a fixed dustproof part and a movable dustproof part detachably connected to the fixed dustproof part, the movable dustproof part is electrically connected to the control circuit chip Connection, the movable dustproof part opens the sound hole when receiving the power-on signal and closes the sound hole when the power-on signal is not received.

[0011] Optionally, the electric dustproof device is a semiconductor material electric dustproof device.

[0012] Optionally, the electric dustproof device is one of semiconductor material/polytetrafluoroethylene hybrid material or polytetrafluoroethylene material.

[0013] Optionally, the electric dustproof device is a silicon electric dustproof device.

Beneficial effects of invention

Beneficial effect

[0014] The beneficial effects of the present invention are: the microphone of the present invention, the microphone includes a housing with a receiving cavity, and a micro-electromechanical system chip and a control circuit chip received in the receiving cavity, the housing An acoustic hole is provided through the thickness and communicates with the accommodating cavity, the microphone further includes an electric dustproof device that at least completely covers the acoustic hole, the electric dustproof device is electrically connected to the control circuit chip, the The electric dustproof device can open the sound hole when receiving the power-on signal of the control circuit chip and close the sound hole when the power-on signal of the control circuit chip is not received, which can effectively improve the microphone during transportation , Assembly, SMT or when not in use, the pollution problem in the process of the most easy to enter the dust will not affect the acoustic performance.

Brief description of the drawings

BRIEF DESCRIPTION

[0015] FIG. 1 is a cross-sectional view of the first embodiment of the present invention when the microphone is not powered on;

[0016] FIG. 2 is a cross-sectional view of the first embodiment of the present invention when the microphone is powered on;

[0017] FIG. 3 is a cross-sectional view of the second embodiment of the present invention when the microphone is not powered on; [0018] FIG. 4 is a cross-sectional view of the second embodiment of the present invention when the microphone is powered on.

Invention Example

detailed description

[0019] The utility model will be described in detail below with reference to FIGS. 1 to 4.

[0020] Embodiment 1:

[0021] As shown in FIGS. 1 and 2, this embodiment relates to a microphone 100, and the microphone 100 includes a housing 110.

, A circuit board 120 forming an accommodating cavity S, and a micro-electro-mechanical system chip 130 and a control circuit chip 140 accommodated in the accommodating cavity S, the micro-electro-mechanical chip 130 and the control circuit chip U0 Both are electrically connected to the circuit board 120. The circuit board 120 is provided with a sound hole K penetrating through the thickness thereof and communicating with the accommodating cavity S. The microphone 100 further includes an electric dustproof device 150 that at least completely covers the soundhole K. The electric dustproof device 150 is electrically connected to the control circuit chip 140, and the electric dustproof device 150 can open the sound hole K when the power-on signal of the control circuit chip 140 is received and when the control circuit chip 140 is not received The sound hole K is closed when the power-on signal is turned on.

[0022] As shown in FIGS. 1 and 2, the sound hole K may correspond to the position of the microelectromechanical system chip 130, and the electric dustproof device 150 is interposed between the circuit board 120 and the micro Between the electromechanical system chips 130. Of course, besides this, the sound hole K may also correspond to the position of the control circuit chip 140. In this case, the electric dustproof device 150 is interposed between the circuit board 120 and the control circuit chip 140.

[0023] Specifically, as shown in FIG. 1, at this time, the control circuit chip 140 does not emit a power-up signal, at this time, the electric dustproof device 150 completely covers the sound hole K, so that the microphone dustproof function can be achieved . On the contrary, as shown in FIG. 2, when the control circuit chip 140 sends out a power-up signal, the electric dustproof device 150 can open the sound hole K under the action of the power-up signal, so that the sound hole K can communicate with the outside and the accommodating cavity S, and then realize functions such as microphone pickup.

[0024] The microphone 100 in this embodiment includes, in addition to the general structure of the microphone 100, an electric dustproof device 150 covering at least the sound hole K, the electric dustproof device 150 and the control circuit The chip 140 is electrically connected, and the electric dustproof device 150 can open the sound hole K when receiving the power-on signal of the control circuit chip 140 and close when the power-on signal of the control circuit chip 140 is not received The sound hole K. Therefore, the microphone 100 in this embodiment can effectively improve the pollution problem of the microphone 100 during the most dust-laden process during transportation, assembly, SMT, or when not in use, without affecting the acoustics Performance.

[0025] It should be noted that the specific structure of the electric dustproof device 100 is not limited, as long as it can meet the power-on signal (for example, a high-level signal) can be opened sound hole K, not received The power-on signal (for example, a low-level signal) can close the sound hole K.

[0026] As shown in FIGS. 1 and 2, the electric dustproof device 150 may include a fixed dustproof part 151 and a movable dustproof part 152 detachably connected to the fixed dustproof part 151, the fixed dustproof The dust part 151 is interposed between the MEMS chip 130 and the circuit board 120, the movable dustproof part 152 is electrically connected to the control circuit chip 140, and the movable dustproof part 152 The sound hole K is opened when the power-on signal is received and the sound hole K is closed when the power-on signal is not received. That is to say, in this embodiment, when the electric dustproof device 150 receives the power-on signal, not the entire electric dustproof device 150 responds to the power-on signal, only the electric dustproof device corresponding to the K portion of the sound hole It suffices that 150 responds to the power-on signal, that is, the movable dustproof part 152 responds to the power-on signal to open or close the sound hole K, so that the structure of the electric dustproof device 150 can be simplified.

[0027] In this embodiment, the electric dustproof device 150 may be a semiconductor material electric dustproof device, for example, preferably, the electric dustproof device 150 is a silicon material electric dustproof device; in addition, The electric dustproof device 150 may also be one of semiconductor material/polytetrafluoroethylene hybrid material or polytetrafluoroethylene material. You can also choose other semiconductor materials or other polymer materials, which can be determined according to actual needs.

[0028] Embodiment 2:

[0029] Unlike Embodiment 1, as shown in FIGS. 3 and 4, the sound hole K is provided on the housing 110, and the electric dustproof device 150 is located between the bottom wall of the housing 110 and the control circuit chip 140. As shown in FIG. 3, the control circuit chip 140 does not emit a power-up signal. At this time, the electric dustproof device 150 completely covers the sound hole K, so that the dustproof function of the microphone can be achieved. Conversely, as shown in FIG. 4, when the control circuit chip 140 sends out a power-up signal, the electric dustproof device 150 can open the sound hole K under the action of the power-up signal, so that the sound hole K can communicate with the outside world and the accommodating cavity S, and then realize functions such as microphone pickup.

[0030] For the rest of the structure in this embodiment, reference may be made to the relevant content described in Embodiment 1, which is not repeated here.

[0031] The above is only an embodiment of the present invention, it should be pointed out here that, for ordinary skills in the art For technical personnel, improvements can be made without departing from the creative concept of the utility model, but these all fall within the protection scope of the utility model.

Claims

[Claim 1] A microphone, the microphone includes a housing with a receiving cavity, and a micro-electro-mechanical system chip and a control circuit chip received in the receiving cavity, the housing is provided with a thickness that communicates with the The sound hole of the accommodating cavity is characterized in that the microphone further includes an electric dustproof device that at least completely covers the soundhole, the electric dustproof device is electrically connected to the control circuit chip, and the electric dustproof device The sound hole can be opened when the power-up signal of the control circuit chip is received and closed when the power-up signal of the control circuit chip is not received.

[Claim 2] The microphone according to claim 1, wherein the housing includes a housing and a circuit board connected to the housing to form the accommodating cavity, the microelectromechanical chip and the control circuit The chips are all electrically connected to the circuit board, and the sound hole is provided on the circuit board.

[Claim 3] The microphone according to claim 2, wherein the sound hole corresponds to the position of the MEMS chip, and the electric dustproof device is interposed between the circuit board and the Between MEMS chips.

[Claim 4] The microphone according to claim 1, wherein the housing includes a housing and a circuit board connected to the housing to form the accommodating cavity, the microelectromechanical chip and the control circuit The chips are all electrically connected to the circuit board, and the sound hole is provided on the housing.

[Claim 5] The microphone according to claim 4, wherein the sound hole corresponds to the position of the control circuit chip, and the electric dustproof device is located on the bottom wall of the housing and the control Between circuit chips.

[Claim 6] The microphone according to any one of claims 2 to 5, wherein the electric dust-proof device includes a fixed dust-proof part and a movable dust-proof part detachably connected to the fixed dust-proof part A dust part, the movable dust-proof part is electrically connected to the control circuit chip, the movable dust-proof part opens the sound hole when the power-up signal is received and the power-up signal is not received When closing the sound hole.

[Claim 7] The microphone according to any one of claims 1 to 5, wherein the electric dustproof device is made of semiconductor material.

[Claim 8] The microphone according to any one of claims 1 to 5, characterized in that the electric The dustproof device is one of semiconductor material/polytetrafluoroethylene mixed material or polytetrafluoroethylene material.

[Claim 9] The microphone according to claim 7, wherein the electric dustproof device is a silicon electric dustproof device.