CN111031461A - A dustproof construction and MEMS microphone packaging structure for MEMS device - Google Patents
A dustproof construction and MEMS microphone packaging structure for MEMS device Download PDFInfo
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- CN111031461A CN111031461A CN201911415114.1A CN201911415114A CN111031461A CN 111031461 A CN111031461 A CN 111031461A CN 201911415114 A CN201911415114 A CN 201911415114A CN 111031461 A CN111031461 A CN 111031461A
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- 238000004806 packaging method and process Methods 0.000 title abstract description 8
- 238000010276 construction Methods 0.000 title description 3
- 239000012528 membrane Substances 0.000 claims abstract description 54
- 238000002955 isolation Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 6
- 239000000969 carrier Substances 0.000 claims description 5
- 239000005871 repellent Substances 0.000 claims 3
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 8
- 238000001259 photo etching Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004744 fabric Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 210000002478 hand joint Anatomy 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
- H04R2231/001—Moulding aspects of diaphragm or surround
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
Abstract
The invention discloses a dustproof structure for an MEMS device and an MEMS microphone packaging structure, wherein the dustproof structure comprises a grid film, a first carrier and a second carrier, wherein the first carrier is provided with a through first opening, and the second carrier is provided with a through second opening; the first carrier and the second carrier are respectively arranged on two sides of the grid film, and the grid film is spaced between the first opening and the second opening; the first carrier and/or the second carrier are configured for being fixed on a MEMS device. The arrangement of the first carrier and the second carrier plays a good role in supporting and protecting the grid membrane, and can avoid direct contact damage of the grid membrane, and the first opening and the second opening are arranged opposite to the through holes in the grid membrane, so that a smooth channel is provided for air, and sound transmission is facilitated.
Description
Technical Field
The invention belongs to the technical field of sound-electricity conversion, and particularly relates to a dustproof structure for an MEMS device and an MEMS microphone packaging structure.
Background
With the rapid development of electroacoustic technology, various electroacoustic products are developed. A microphone, as a transducer for converting sound into an electrical signal, is one of the very important devices in electro-acoustic products. Nowadays, microphones have been widely used in various types of electronic products, such as mobile phones, tablet computers, notebook computers, VR devices, AR devices, smartwatches, and smart wearing. In recent years, for a microphone packaging structure, the design of the structure thereof has become an important point and a focus of research by those skilled in the art.
The existing microphone package structure is generally: the chip package comprises a shell with a containing cavity, and components such as a chip assembly (for example, a MEMS chip and an ASIC chip) are contained and fixed in the containing cavity; and a sound pickup hole is also arranged on the shell. However, in long-term application, it is found that external particles and foreign matters such as dust and impurities are easily introduced into the accommodating cavity of the microphone through the sound pickup hole, and the external particles and foreign matters cause certain damage to components such as a chip assembly in the accommodating cavity, and finally affect the acoustic performance and the service life of the microphone.
In view of the above problems, the prior art generally adopts a solution that a corresponding isolation component is disposed on a sound pickup hole of a microphone package structure to block the entry of external particles, foreign matters, and the like. The existing isolation assembly comprises a supporting part and isolation mesh cloth. When the isolation component is used, the isolation component is installed on the sound pickup hole. However, in the existing isolation assembly, the isolation mesh cloth is directly exposed, and in addition, the isolation mesh cloth has low strength, so that the isolation mesh cloth is easy to damage, and the sound production quality of the microphone is influenced.
Disclosure of Invention
An object of the present invention is to provide a dust-proof structure for a MEMS device and a MEMS microphone packaging structure.
According to a first aspect of the present invention, there is provided a dust-proof structure for a MEMS device, comprising:
a mesh membrane configured to transmit sound;
a first carrier having a first opening therethrough and a second carrier having a second opening therethrough;
the first carrier and the second carrier are respectively arranged on two sides of the grid film, and the grid film is spaced between the first opening and the second opening;
the first carrier and/or the second carrier are configured for being fixed on a MEMS device.
Optionally, the grid membrane includes an isolation net and a fixing portion, the fixing portion is connected around the isolation net, the fixing portion is fixedly connected with the first carrier and the second carrier, and the isolation net is spaced between the first opening and the second opening.
Optionally, the mesh membrane has a thickness in a range of 0.3 microns to 0.7 microns.
Optionally, the first carrier and/or the second carrier has a thickness in the range of 25 microns to 55 microns.
Optionally, the first and second carriers are of the same structural size.
Optionally, the material of the first and second carriers is the same.
Optionally, the grid membrane is a multilayer structure, the grid membrane at least includes an upper grid membrane and a lower grid membrane, the first carrier is fixedly connected to the upper grid membrane, and the second carrier is fixedly connected to the lower grid membrane.
Optionally, the upper grid film and the lower grid film are bonded to form a fixed connection.
Optionally, the first carrier and the second carrier are made of a photolithographic material, the photolithographic material for forming the first carrier and the second carrier is formed on two sides of the grid film in advance, and the first carrier and the second carrier are formed through a photolithographic process.
According to a second aspect of the present invention, there is provided a MEMS microphone packaging structure, comprising:
the sound hole is arranged on the shell and used for communicating the inside and the outside of the shell;
a microphone device fixedly disposed within the housing;
the dustproof structure, at least the first carrier of the dustproof structure is fixedly connected with the shell;
the grid film closes the sound hole; and/or the mesh membrane is spaced between the sound holes and the microphone devices.
Compared with the prior art, the invention has the technical effects that:
the invention discloses a dustproof structure for an MEMS device, which comprises a grid film, a first carrier and a second carrier, wherein the first carrier is provided with a first through opening, and the second carrier is provided with a second through opening; the first carrier and the second carrier are respectively arranged on two sides of the grid membrane, and the first carrier and the second carrier are arranged to play a good role in supporting and protecting the grid membrane.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a schematic structural diagram of a dustproof structure for a MEMS device according to the present invention;
FIG. 2 is a schematic diagram of a structure of a mesh film of a dust-proof structure for a MEMS device according to the present invention;
FIG. 3 is a schematic cross-sectional view of a dustproof structure for a MEMS device according to the present invention;
FIG. 4 is a schematic diagram of a photolithography stage of a dustproof structure for a MEMS device according to the present invention;
FIG. 5 is a schematic diagram of a photolithography stage of a dustproof structure for a MEMS device according to the present invention;
FIG. 6 is a schematic diagram of a photolithography stage of a dustproof structure for a MEMS device according to the present invention;
FIG. 7 is a schematic structural diagram of another dustproof structure for a MEMS device according to the present invention;
FIG. 8 is a schematic structural diagram of a MEMS microphone package structure according to the present invention;
fig. 9 is a schematic structural diagram of another MEMS microphone package structure according to the present invention.
Wherein: 100-a dustproof structure; 1-a grid film; 101-an isolation net; 102-a stationary part; 103-upper grid film; 104-lower grid film; 2-a first carrier; 3-a second carrier; 4-a first opening; 5-a second opening; 6-a housing; 7-a sound hole; 8-a microphone device; 9-a first support part; 10-a second support; 11-a protective layer; 12-a first tie layer; 13-substrate.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
Referring to fig. 1 and 3, the present invention discloses a dust-proof structure 100 for a MEMS device, including:
a mesh membrane 1, a first carrier 2 and a second carrier 3, the mesh membrane 1 being configured to be transparent to sound; the first carrier 2 has a first opening 4 therethrough, and the second carrier 3 has a second opening 5 therethrough; the first carrier 2 and the second carrier 3 are respectively arranged on two sides of the grid film 1, and the grid film 1 is spaced between the first opening 4 and the second opening 5;
the first carrier 2 and/or the second carrier 3 are configured for being fixed on a MEMS device.
Have a plurality of through-holes that can let the air pass through on the net membrane 1, the transmission of the sound of being convenient for, and first carrier 2 and second carrier 3 set up respectively the both sides of net membrane 1 can be right net membrane 1 plays fine support and guard action, can avoid net membrane 1's direct contact damages, and first opening 4 and second opening 5 with through-hole on the net membrane 1 sets up relatively, provides smooth and easy passageway for the air, the transmission of the sound of being convenient for.
Optionally, referring to fig. 1 and 2, the mesh membrane 1 includes an isolation mesh 101 and a fixing portion 102, the fixing portion 102 is connected around the isolation mesh 101, the fixing portion 102 is fixedly connected to the first carrier 2 and the second carrier 3, and the isolation mesh 101 is spaced between the first opening 4 and the second opening 5.
The isolation net 101 of the grid membrane 1 is provided with a plurality of through holes, so that the isolation net 101 has low strength, the fixing parts 102 which are closely arranged around the isolation net 101 can increase the structural strength of the grid membrane 1, and the fixing parts 102 are fixedly connected with the first carrier 2 and the second carrier 3, so that the structural stability of the dustproof structure 100 is ensured.
Optionally, the thickness of the mesh membrane 1 ranges from 0.3 microns to 0.7 microns. Since the mesh membrane 1 is used in the MEMS device, there is a high demand for the size thereof, and the thickness of the mesh membrane 1 should be in a low range to achieve a good dustproof effect. However, if the mesh membrane 1 is too thin, the strength is too low, and breakage is easily caused, but if the mesh membrane 1 is too thick, the size and weight of the dustproof structure 100 are increased on the one hand, and air is not easily passed through the other hand, making sound transmission difficult.
Optionally, the thickness of the first carrier 2 and/or the second carrier 3 ranges from 25 micrometers to 55 micrometers. In order to provide a good supporting protection for the grid membrane 1, the first carrier 2 and the second carrier 3 need to have a certain thickness, but the thickness is not too high, and if the thickness of the first carrier 2 and the second carrier 3 is too large, the size and the weight of the dustproof structure 100 are increased, which is not suitable for the application in the MEMS device.
Optionally, the first carrier 2 and the second carrier 3 are of the same structural size. The first carrier 2 and the second carrier 3 have the same structure size, so that the rapid manufacturing and assembling are facilitated, the manufacturing and assembling efficiency is improved, the applicability of the dustproof structure 100 is improved, and the dustproof structure can be flexibly used in the forward and reverse directions.
Optionally, the material of the first carrier 2 and the second carrier 3 is the same. The first carrier 2 and the second carrier 3 are made of the same material, so that rapid manufacturing and assembling are facilitated, manufacturing and assembling efficiency is improved, and applicability of the dust-proof structure 100 is improved.
Optionally, referring to fig. 7, the mesh membrane 1 is a multilayer structure, the mesh membrane 1 at least includes an upper mesh membrane 103 and a lower mesh membrane 104, the first carrier 2 is fixedly connected to the upper mesh membrane 103, and the second carrier 3 is fixedly connected to the lower mesh membrane 104. Of course, the multi-layer structure of the grid film 1 may also be a combination of three, four or more layers, as long as the dimensional quality and the dustproof effect can be considered.
On one hand, as the grid film 1 is provided with a plurality of through holes, the structural strength of the grid film 1 is weaker, and the structural strength and the service life of the grid film 1 can be improved by adopting a mode of compounding the upper grid film 103 and the lower grid film 104; on the other hand, the material and the through-hole size of upper grid membrane 103 and lower floor's grid membrane 104 can be the same, also can be different, works as when the material and the through-hole size of upper grid membrane 103 and lower floor's grid membrane 104 are inequality, just can reach the filtering action to impurity such as the dust of different grade type and size, have improved dustproof construction 100's suitability.
Optionally, the upper grid film 103 and the lower grid film 104 are bonded to form a fixed connection. Specifically, upper strata net membrane 103 with lower floor's net membrane 104 passes through first tie coat 12 bonds and forms, the bonding can be the bonding that adopts the double faced adhesive tape, also can adopt glue to bond, and the connected mode of bonding is flexible operation convenience on the one hand, and on the other hand joint strength is high, effectual.
Optionally, the first carrier 2 and the second carrier 3 are made of a photolithographic material, the photolithographic material for forming the first carrier 2 and the second carrier 3 is formed on both sides of the grid film 1 in advance, and the first carrier 2 and the second carrier 3 are formed through a photolithographic process.
Specifically, referring to fig. 4, 5 and 6, the photolithography process includes the steps of:
providing a support on the second carrier 3;
arranging the first carrier 2 opposite the lithographic apparatus;
arranging a mask on one side of the first carrier 2 close to the photoetching equipment, wherein a through hole is arranged on the mask at a position opposite to the first opening 4;
the photoetching equipment is used for carrying out photoetching on the first carrier 2 to obtain the first carrier 2 with the first opening 4;
removing the mask and arranging a protective layer 11 on one side of the first carrier 2 close to the photoetching equipment;
arranging the second carrier 3 opposite the lithographic apparatus;
arranging a mask on one side of the second carrier 3 close to the lithographic equipment, wherein a through hole is arranged on the mask at a position opposite to the second opening 5;
the photoetching equipment performs photoetching on the second carrier 3 to obtain the second carrier 3 with the second opening 5;
the mask and the protective layer 11 are removed, and the dustproof structure 100 is obtained.
The support may include a first support 9 and a second support 10, and specifically, the first support 9 may be an organic layer directly connected to the second carrier 3, and the second support 10 may be a silicon layer connected to the first support 9.
The MEMS device may be a MEMS microphone, MEMS sensor, MEMS chip, MEMS switch, or the like.
Referring to fig. 8 and 9, the present invention also discloses a MEMS microphone packaging structure, including:
the sound box comprises a shell 6 provided with a containing cavity, wherein a sound hole 7 is formed in the shell 6, and the sound hole 7 is used for communicating the inside and the outside of the shell 6;
a microphone device 8, said microphone device 8 being fixedly arranged within said housing 6;
the dustproof structure 100, at least the first carrier 2 of the dustproof structure 100 is fixedly connected with the shell 6;
the mesh membrane 1 closes the sound hole 7; and/or the mesh membrane 1 is spaced between the sound holes 7 and the microphone devices 8.
The first carrier 2 of the dustproof structure 100 may be fixedly connected to the housing 6, and in order to improve the connection stability of the dustproof structure 100, both the first carrier 2 and the second carrier 3 may be fixedly connected to the housing 6; the dust-proof structure 100 may be provided outside the housing 6 facing the sound hole 7, inside the housing 6 facing the sound hole 7, or may be further provided directly around the microphone device 8 in the housing 6, may be provided directly around a plurality of microphone devices 8, or may be provided only around an important microphone device 8 such as a chip. It is also possible to use the dust-proof structure 100 around the microphone device 8 and the dust-proof structure 100 at the sound hole 7 for dual protection.
Specifically, the housing 6 includes a substrate 13, the sound hole 7 is disposed on the substrate 13, the dust-proof structure 100 seals the sound hole 7, the microphone device 8 includes a MEMS chip, the dust-proof structure 100 is spaced between the sound hole 7 and the MEMS chip, and the dust-proof structure 100 and the MEMS chip may be directly connected or not connected to form a spacing support structure as shown in fig. 8.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (10)
1. A dust-proof structure for a MEMS device, comprising:
a mesh membrane configured to transmit sound;
a first carrier having a first opening therethrough and a second carrier having a second opening therethrough;
the first carrier and the second carrier are respectively arranged on two sides of the grid film, and the grid film is spaced between the first opening and the second opening;
the first carrier and/or the second carrier are configured for being fixed on a MEMS device.
2. The dustproof structure according to claim 1, wherein the mesh membrane includes an isolation mesh and a fixing portion, the fixing portion is connected around the isolation mesh, the fixing portion is fixedly connected to the first carrier and the second carrier, and the isolation mesh is spaced between the first opening and the second opening.
3. The dust-repellent structure according to claim 1, wherein said mesh film has a thickness in the range of 0.3 to 0.7 μm.
4. The dust-repellent structure according to claim 1, wherein said first carrier and/or said second carrier has a thickness in the range of 25 micrometers to 55 micrometers.
5. The dust-proof structure of claim 1, wherein the first carrier and the second carrier are the same size.
6. The dust-proof structure according to claim 1, wherein the first carrier and the second carrier are made of the same material.
7. The dustproof structure according to any one of claims 1 to 6, wherein the mesh membrane is a multilayer structure, the mesh membrane comprises at least an upper mesh membrane and a lower mesh membrane, the first carrier is fixedly connected to the upper mesh membrane, and the second carrier is fixedly connected to the lower mesh membrane.
8. The dustproof structure according to claim 7, wherein the upper mesh film and the lower mesh film are bonded to form a fixed connection.
9. The dustproof structure according to any one of claims 1 to 6, wherein the material of the first and second carriers is a photolithographic material, the photolithographic material for constituting the first and second carriers is formed on both sides of the mesh film in advance, and the first and second carriers are formed through a photolithographic process.
10. A MEMS microphone package structure, comprising:
the sound hole is arranged on the shell and used for communicating the inside and the outside of the shell;
a microphone device fixedly disposed within the housing;
the dust-repellent structure of any of claims 1-9, wherein at least said first carrier is fixedly attached to said housing;
the grid film closes the sound hole; and/or the mesh membrane is spaced between the sound holes and the microphone devices.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911415114.1A CN111031461A (en) | 2019-12-31 | 2019-12-31 | A dustproof construction and MEMS microphone packaging structure for MEMS device |
| PCT/CN2020/099280 WO2021135119A1 (en) | 2019-12-31 | 2020-06-30 | Dustproof structure for mems device and mems microphone packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911415114.1A CN111031461A (en) | 2019-12-31 | 2019-12-31 | A dustproof construction and MEMS microphone packaging structure for MEMS device |
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| CN111031461A true CN111031461A (en) | 2020-04-17 |
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| CN201911415114.1A Pending CN111031461A (en) | 2019-12-31 | 2019-12-31 | A dustproof construction and MEMS microphone packaging structure for MEMS device |
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| CN (1) | CN111031461A (en) |
| WO (1) | WO2021135119A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111654796A (en) * | 2020-06-30 | 2020-09-11 | 歌尔微电子有限公司 | Miniature microphone dust keeper and MEMS microphone |
| WO2021135119A1 (en) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Dustproof structure for mems device and mems microphone packaging structure |
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| 刘清惓; 高翔; 陈传寅; 谢钟镭: "基于MEMS传感器的水汽测量系统", 《传感技术学报》, 15 June 2014 (2014-06-15), pages 852 - 856 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021135119A1 (en) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Dustproof structure for mems device and mems microphone packaging structure |
| CN111654796A (en) * | 2020-06-30 | 2020-09-11 | 歌尔微电子有限公司 | Miniature microphone dust keeper and MEMS microphone |
| CN111654796B (en) * | 2020-06-30 | 2021-12-28 | 歌尔微电子有限公司 | Miniature microphone dust keeper and MEMS microphone |
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| Publication number | Publication date |
|---|---|
| WO2021135119A1 (en) | 2021-07-08 |
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