CN208675538U - A kind of MEMS chip and the MEMS microphone including the chip - Google Patents
A kind of MEMS chip and the MEMS microphone including the chip Download PDFInfo
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- CN208675538U CN208675538U CN201821519904.5U CN201821519904U CN208675538U CN 208675538 U CN208675538 U CN 208675538U CN 201821519904 U CN201821519904 U CN 201821519904U CN 208675538 U CN208675538 U CN 208675538U
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- sidewall portion
- substrate
- mems chip
- mems
- extension
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- 239000000758 substrate Substances 0.000 claims abstract description 66
- 239000003292 glue Substances 0.000 claims abstract description 57
- 238000000034 method Methods 0.000 claims description 5
- 125000004122 cyclic group Chemical group 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 230000009194 climbing Effects 0.000 abstract description 5
- 230000010355 oscillation Effects 0.000 abstract description 4
- 230000006872 improvement Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Abstract
The utility model discloses a kind of MEMS chip and including the MEMS microphone of the chip, including the substrate with sidewall portion, it is provided with the plate condenser structure being made of vibrating diaphragm and backplane over the substrate；The sidewall portion includes the interior concave portion for being recessed inwardly and being formed by sidewall portion inner surface, which forms storage glue groove through the bottom surface of the sidewall portion.The utility model is by the improvement to MEMS chip structure, the problem of solving and occur climbing glue phenomenon when MEMS chip and substrate bonding are fixed in MEMS microphone, and then influence diaphragm oscillations, microphone property is caused to fail.
Description
Technical field
The utility model relates to field of micro electromechanical technology, more specifically, the utility model relates to a kind of MEMS chip and packets
Include the MEMS microphone of the chip.
Background technique
MEMS (Micro Electro Mechanical System) microphone is the microphone based on MEMS technology manufacture, and MEMS chip therein is
Important component in MEMS microphone.Traditional MEMS chip includes substrate and fixed vibrating diaphragm and backplane on substrate, vibration
There is certain gap, vibrating diaphragm, backplane constitute capacitor and integrate on silicon, pass through the vibration of vibrating diaphragm between film and backplane
It is dynamic, change the distance between vibrating diaphragm and backplane, so that voice signal is converted to electric signal.
But in the encapsulating structure of traditional MEMS microphone, MEMS chip multi-pass crosses glue and is pasted onto MEMS microphone
Substrate on, glue be easy climb along MEMS chip substrate sidewall portion inner surface to vibrating diaphragm, thus influence shake vibration of membrane, make
It fails at microphone property.
Utility model content
In view of the above problems, one of the utility model is designed to provide a kind of MEMS chip, by MEMS chip
The improvement of structure solves and occurs climbing glue phenomenon when MEMS chip and substrate bonding are fixed in MEMS microphone, and then influences vibration
The problem of film vibrates, and microphone property is caused to fail.
Another of the utility model is designed to provide a kind of MEMS microphone including above-mentioned MEMS chip.
In order to solve the first technical problem mentioned above, the utility model adopts the following technical solutions:
A kind of MEMS chip is provided with over the substrate including the substrate with sidewall portion by vibrating diaphragm and backplane structure
At plate condenser structure；
The sidewall portion includes the interior concave portion for being recessed inwardly and being formed by sidewall portion inner surface, which runs through the side
The bottom surface of wall portion forms storage glue groove.
Further, it is preferable to which scheme is, the storage glue groove is formed in the sidewall portion by etch process；And along the side
The circumferential direction of wall portion, the storage glue groove are in continuous cyclic structure.
Further, it is preferable to which scheme is, the storage glue groove is located at the bottom margin position of the sidewall portion inner surface.
Further, it is preferable to which scheme is, the storage glue groove further includes having the extension extended from interior concave portion to vibrating diaphragm direction.
Further, it is preferable to which scheme is, the extension is extended from the intersection of interior concave portion side wall and roof to vibrating diaphragm direction
Out.
Further, it is preferable to scheme is, the storage glue groove further includes having from one end of the close vibrating diaphragm of the extension to side
Wall portion interior direction and or the extension extended of lateral direction.
Further, it is preferable to which scheme is, on the sidewall portion extending direction, the length of the interior concave portion is 100 μm；Institute
It states on sidewall portion thickness direction, the length of the interior concave portion is 50 μm.
Further, it is preferable to which scheme is, on the sidewall portion extending direction, the length of the extension is 30 μm；It is described
The length of extension is 15 μm；On the sidewall portion thickness direction, the length of the extension is 15 μm, the extension
Length is 15 μm.
To solve above-mentioned second technical problem, the utility model is adopted the following technical solutions:
A kind of MEMS microphone, the microphone include:
By substrate and shell surround include cavity outer enclosure；
In cavity and setting asic chip on the substrate；And
MEMS chip as described above in cavity；
The underrun glue of the MEMS chip substrate sidewall portion is fixed in conjunction with the substrate.
Further, it is preferable to which scheme is, the acoustic aperture being correspondingly arranged with MEMS chip is provided on the substrate.
The beneficial effects of the utility model are as follows:
It can be seen from the above technical scheme that compared with prior art, MEMS chip provided by the utility model is in substrate
Sidewall portion bottom is provided with storage glue groove, and excessive glue carries out when on the one hand can be fixed using storage glue groove to substrate and substrate bonding
Storage, on the other hand can stop excessive glue using the storage glue groove structure, ensure that the reliability of vibrating diaphragm, it is therefore prevented that
Occur climbing glue phenomenon when MEMS chip and substrate bonding are fixed in MEMS microphone, and then influence diaphragm oscillations, causes microphone
The appearance of performance failure problem.
In addition, not only the setting of the storage glue groove without reducing the bond strength between substrate and substrate, utilizes described instead
Storage glue groove can increase substrate between substrate by fixed-area fixed in conjunction with glue, so that MEMS chip and MEMS Mike
Bond strength is higher between wind substrate, and stability is more preferable.In addition, the utility model additionally provides the variation knot of a variety of storage glue grooves
Structure can further improve bond strength between MEMS chip substrate and MEMS microphone substrate, and it is whole to improve MEMS microphone
The stability of performance, when avoiding MEMS microphone strenuous vibration occurs, MEMS chip is by the risks feelings such as isolating and falling off on substrate
The generation of condition.
Detailed description of the invention
Specific embodiment of the present utility model is described in further detail with reference to the accompanying drawing.
Fig. 1 shows the structural schematic diagram of existing MEMS chip.
Fig. 2 shows a kind of structural schematic diagrams of embodiment of the provided MEMS chip of the utility model.
Fig. 3 is the portion the A enlarged diagram in Fig. 2.
Fig. 4 shows a kind of structural schematic diagram of preferred embodiment of the provided MEMS chip of the utility model.
Fig. 5 is the portion the B enlarged diagram in Fig. 4.
Fig. 6 shows the structural schematic diagram of another preferred embodiment of the provided MEMS chip of the utility model.
Fig. 7 is the portion the C enlarged diagram in Fig. 6.
Fig. 8 shows a kind of structural schematic diagram of embodiment of the provided MEMS microphone of the utility model.
Specific embodiment
The various exemplary embodiments of the utility model are described in detail now with reference to attached drawing.It should also be noted that unless another
It illustrates outside, the component and the positioned opposite of step, numerical expression and numerical value otherwise illustrated in these embodiments is unlimited
The scope of the utility model processed.
Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as to this is practical
Novel and its application or any restrictions used.
Technology and equipment known to person of ordinary skill in the relevant may be not discussed in detail, but in appropriate situation
Under, the technology and equipment should be considered as part of specification.
It is shown here and discuss all examples in, any occurrence should be construed as merely illustratively, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, then in subsequent attached drawing does not need that it is further discussed.
One aspect according to the present utility model, in order to solve in existing MEMS microphone package structure, MEMS chip with
Substrate bonding easily occurs climbing glue phenomenon when fixed, the problem of influencing diaphragm oscillations, microphone property is caused to fail.The utility model
A kind of MEMS chip structure is provided, in conjunction with shown in Fig. 2, Fig. 3, Fig. 2 shows a kind of realities of the provided MEMS chip of the utility model
Apply the structural schematic diagram of mode.Fig. 3 is the portion the A enlarged diagram in Fig. 2.Specifically, the MEMS chip includes having side wall
The substrate 1 in portion 11 is provided with the plate condenser structure being made of vibrating diaphragm 2 and backplane 3 on the substrate 1.In order to guarantee
It may be constructed the plate condenser structure with certain interval between backplane 3 and vibrating diaphragm 2, between the backplane 3 and vibrating diaphragm 2 also
It is provided with the support portion 4 being used to support, the support portion 4 is while playing support backplane 3, it can also be ensured that backplane 3 and vibration
Insulation between film 2.In addition, in MEMS chip structure provided by the utility model, the support portion 4, backplane 3 can by according to
The mode of secondary deposition is formed on substrate 1, and the substrate 1 can use single crystal silicon material, and the backplane 3 can use monocrystalline silicon
Or polycrystalline silicon material, the selection of this material and the technique of deposition belong to the common knowledge of those skilled in the art, herein
No longer illustrate.
It is different from existing MEMS chip structure, in MEMS chip provided by the utility model, the side wall of the substrate 1
Portion 11 includes to be recessed inwardly the interior concave portion 51 formed by 11 inner surface of sidewall portion, and the interior concave portion 51 is through the sidewall portion 11
Bottom surface forms storage glue groove 5.In the present embodiment, the storage glue groove 5 is located at the bottom margin position of 11 inner surface of sidewall portion
It sets.And preferably on 11 extending direction of sidewall portion, the length of the interior concave portion 51 is 100 μm；In the sidewall portion 11
On thickness direction, the length of the interior concave portion 51 is 50 μm.It should be noted that the structure and structure ruler of above-mentioned storage glue groove 5
The very little optimal selection for for traditional MEMS chip structure, also should be used as distinguishing feature and is protected.
As shown in connection with fig. 1, Fig. 1 shows a kind of existing MEMS chip, by comparing it is found that existing MEMS chip structure
In, 1 ' sidewall portion of substrate, 11 ' inner surface 111 ' works as MEMS chip in MEMS microphone package in flat face in sectional view
When being pasted on the substrate of MEMS microphone by glue, the glue of spilling is easy along 1 ' sidewall portion 11 ' of MEMS chip substrate
Surface 111 ' is climb to vibrating diaphragm 2 ', to influence the vibration of vibrating diaphragm 2 ', microphone property is caused to fail.And the utility model institute
It, on the one hand can be using storage glue groove 5 to substrate 1 by the way that storage glue groove 5 is arranged in 1 sidewall portion 11 of substrate in the MEMS chip of offer
Glue excessive when fixed is stored with substrate bonding, on the other hand using 5 structure of storage glue groove can to excessive glue into
Row stops, and prevents the appearance for climbing glue phenomenon, ensure that the reliability of vibrating diaphragm 2.In addition, the setting by the storage glue groove 5 can also
Increase substrate 1 between substrate by the fixed-area of fixation glue ins conjunction with so that MEMS chip and MEMS microphone substrate it
Between bond strength it is higher, stability is more preferable.
Further, it is preferable to which scheme is, the storage glue groove 5 is formed in the sidewall portion 11 by etch process；And in order to
Guarantee that the glue overflowed can be in the sidewall portion 11 for being uniformly distributed in the substrate 1, it is further preferred that along the sidewall portion 11
Circumferential direction, the storage glue groove 5 be in continuous cyclic structure.
Shown in Fig. 2, Fig. 3 on the basis of MEMS chip structure, the utility model also provides a kind of preferred MEMS chip
Structure, in conjunction with shown in Fig. 4 and Fig. 5, in Fig. 4 and MEMS chip structure shown in fig. 5, the storage glue groove 5 further includes having by interior
The extension 52 that concave portion 51 is extended to 2 direction of vibrating diaphragm.Preferably scheme is, described on 11 extending direction of sidewall portion
The length of extension 52 is 30 μm；On 11 thickness direction of sidewall portion, the length of the extension 52 is 15 μm.This implementation
In mode, the interior concave portion 51 collectively forms storage glue groove 5 with extension 52, and extension 52 can further improve MEMS chip lining
Bond strength between bottom 1 and MEMS microphone substrate improves the stability of MEMS microphone overall performance, avoids MEMS Mike
When strenuous vibration occurs for wind, MEMS chip on substrate by isolating and falling off or MEMS chip is subjected to displacement on substrate extending direction
Etc. risk situations generation.
In order to reduce the difficulty of processing of MEMS chip, facilitate spilling glue can be smooth inflow extension 52 in, it is excellent
Selection of land, the extension 52 are extended from the intersection of interior 51 side wall 511 of concave portion and roof 512 to 2 direction of vibrating diaphragm.
In conjunction with shown in Fig. 6, Fig. 7, Fig. 6 shows another preferred embodiment of the provided MEMS chip of the utility model
Structural schematic diagram.Fig. 7 is the portion the C enlarged diagram in Fig. 6.Wherein the storage glue groove 5 further includes having by the extension 52
Close to one end of vibrating diaphragm 2 to 11 interior direction of sidewall portion and or the extension 53 extended of lateral direction.Preferably scheme is,
On 11 extending direction of sidewall portion, the length of the extension 53 is 15 μm；On 11 thickness direction of sidewall portion, institute
The length for stating extension 53 is 15 μm.In present embodiment, the interior concave portion 51 and the common structure of extension 52 and extension 53
At storage glue groove 5, extension 53 can provide stronger bond strength on diaphragm oscillations direction for MEMS chip and substrate, furthermore should
The storage glue groove 5 of frame mode also realizes the beneficial effect for avoiding MEMS chip from being subjected to displacement on substrate extending direction simultaneously.
It will be appreciated by persons skilled in the art that the extension can be as from one end of the close vibrating diaphragm of the extension to side
The independent structure that wall portion interior direction is extended can also be as from one end of the close vibrating diaphragm of the extension on the outside of sidewall portion
The independent structure that direction is extended, in attached drawing provided in present embodiment, the storage glue groove 5 includes by the extension
Two extensions 53 that one end of 52 close vibrating diaphragm 2 is extended to 11 interior direction of sidewall portion and lateral direction, should say
The fit system for stating extension 53 is not limitations of the embodiments of the present invention.
Other side according to the present utility model, the utility model also provide a kind of MEMS including above-mentioned MEMS chip
Microphone, specifically, as shown in connection with fig. 8, the microphone includes:
By substrate 6 and shell 7 surround include cavity outer enclosure；
In cavity and the asic chip 8 that is arranged on the substrate 6；And
MEMS chip as described above in cavity；
The underrun glue 10 of 1 sidewall portion 11 of MEMS chip substrate is combined fixation with the substrate 6；Preferably,
The glue 10 is silica gel.In the MEMS microphone structure provided by present embodiment, MEMS chip be can receive from outer
The sound on boundary, and the sound is converted into electric signal, asic chip 8 receives the electric signal issued from MEMS chip, and to this
Electric signal is handled, and is externally exported.Wherein asic chip 8 can be connected to by mode well-known to those skilled in the art
On substrate, such as it can be adhesively fixed by glue (silica gel), or be mounted on substrate by Heraeus.MEMS chip with it is described
It is electrically connected between asic chip 8 by gold thread 9, the signal that MEMS chip is exported is handled by asic chip 8；
It is electrically connected between the asic chip 8 and the substrate 6 by gold thread 9, so that the electricity exported through asic chip 8 to MEMS chip
Signal externally exports after being handled.It should be noted that the material of the substrate 6 can there are many selections, for example, FR4 plate
Material, BT plate or ceramic wafer, the utility model do not do further limitation to this.
In addition, the MEMS microphone further includes the acoustic aperture 61 for having connection extraneous, so as to the inflow of sound, acoustic aperture 61 can be with
It is arranged on shell 7, also can be set on substrate 6 and on the position of MEMS chip face.With reference to Fig. 8, in present embodiment,
The acoustic aperture 61 is arranged on substrate 6 on the position of MEMS chip back chamber face, and the extraneous sound allowed passes through this
Acoustic aperture 61 acts directly on the vibrating diaphragm 2 of MEMS chip.Preferably, it in the MEMS microphone structure of the utility model, can also incite somebody to action
Asic chip 8 cover it is encapsulated, it is encapsulated to can be COB glue well-known to those skilled in the art etc..By encapsulated by ASIC core
Piece 8 is covered on substrate, can be impacted to avoid extraneous noise to asic chip.It should be noted that Fig. 8 is only for upper
State a variety of MEMS chip structures provided by the utility model embodiment one of carry out attached drawing for example, in above description
On the basis of, MEMS microphone may include one or more MEMS chips such as other embodiments that the utility model provides
Structure, or other different forms of changes or modifications may be made based on the above description, details are not described herein again.But
For those of ordinary skill in the art, it is all belong to the technical solution of the utility model extend out it is apparent
Variation or change still in the protection scope of the utility model column.
In addition, the advantage of the MEMS microphone provided by present embodiment compared with the existing technology, with above-mentioned MEMS
The advantage of chip compared with the existing technology is substantially the same, and details are not described herein again.
Obviously, the above embodiments of the present invention is merely examples for clearly illustrating the present invention, and
It is not limitations of the embodiments of the present invention, for those of ordinary skill in the art, in above description
On the basis of can also make other variations or changes in different ways, all embodiments can not be exhaustive here,
It is all to belong to obvious changes or variations that the technical solution of the utility model is extended out still in the utility model
The column of protection scope.
Claims (10)
1. a kind of MEMS chip is provided with is made of vibrating diaphragm and backplane over the substrate including the substrate with sidewall portion
Plate condenser structure；It is characterized in that,
The sidewall portion includes the interior concave portion for being recessed inwardly and being formed by sidewall portion inner surface, which runs through the sidewall portion
Bottom surface formed storage glue groove.
2. MEMS chip according to claim 1, which is characterized in that the storage glue groove is formed in described by etch process
In sidewall portion；And along the circumferential direction of the sidewall portion, the storage glue groove is in continuous cyclic structure.
3. MEMS chip according to claim 1, which is characterized in that
The storage glue groove is located at the bottom margin position of the sidewall portion inner surface.
4. MEMS chip according to claim 1, which is characterized in that the storage glue groove further includes having from interior concave portion to vibrating diaphragm
The extension that direction is extended.
5. MEMS chip according to claim 4, which is characterized in that the extension by interior concave portion side wall and roof friendship
Extend at remittance to vibrating diaphragm direction.
6. MEMS chip according to claim 4, which is characterized in that the storage glue groove further includes having by the extension
Close to one end of vibrating diaphragm to sidewall portion interior direction and or the extension extended of lateral direction.
7. MEMS chip according to claim 1, which is characterized in that on the sidewall portion extending direction, the invagination
The length in portion is 100 μm；On the sidewall portion thickness direction, the length of the interior concave portion is 50 μm.
8. MEMS chip according to claim 6, which is characterized in that on the sidewall portion extending direction, the extension
The length in portion is 30 μm；The length of the extension is 15 μm；On the sidewall portion thickness direction, the length of the extension
It is 15 μm, the length of the extension is 15 μm.
9. a kind of MEMS microphone, which is characterized in that the microphone includes:
By substrate and shell surround include cavity outer enclosure；
In cavity and setting asic chip on the substrate；And
The MEMS chip as described in claim 1 to 8 any one claim in cavity；
The underrun glue of the MEMS chip substrate sidewall portion is fixed in conjunction with the substrate.
10. MEMS microphone according to claim 9, which is characterized in that be provided on the substrate and MEMS chip pair
The acoustic aperture that should be arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821519904.5U CN208675538U (en) | 2018-09-17 | 2018-09-17 | A kind of MEMS chip and the MEMS microphone including the chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821519904.5U CN208675538U (en) | 2018-09-17 | 2018-09-17 | A kind of MEMS chip and the MEMS microphone including the chip |
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| Publication Number | Publication Date |
|---|---|
| CN208675538U true CN208675538U (en) | 2019-03-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821519904.5U Active CN208675538U (en) | 2018-09-17 | 2018-09-17 | A kind of MEMS chip and the MEMS microphone including the chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110958549A (en) * | 2019-12-31 | 2020-04-03 | 歌尔股份有限公司 | A dustproof construction and MEMS microphone packaging structure for MEMS device |
-
2018
- 2018-09-17 CN CN201821519904.5U patent/CN208675538U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110958549A (en) * | 2019-12-31 | 2020-04-03 | 歌尔股份有限公司 | A dustproof construction and MEMS microphone packaging structure for MEMS device |
| WO2021135110A1 (en) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Dustproof structure and mems microphone packaging structure used for mems device |
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Effective date of registration: 20200612 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266100 Qingdao, Laoshan District, North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |