CN208924505U - The encapsulating structure and microphone of chip - Google Patents
The encapsulating structure and microphone of chip Download PDFInfo
- Publication number
- CN208924505U CN208924505U CN201822101283.5U CN201822101283U CN208924505U CN 208924505 U CN208924505 U CN 208924505U CN 201822101283 U CN201822101283 U CN 201822101283U CN 208924505 U CN208924505 U CN 208924505U
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- substrate
- chip
- encapsulating structure
- rough surface
- hole
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- 239000000758 substrate Substances 0.000 claims abstract description 85
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 239000006071 cream Substances 0.000 claims description 4
- 230000001788 irregular Effects 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000003292 glue Substances 0.000 abstract description 10
- 239000000084 colloidal system Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000009194 climbing Effects 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Landscapes
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model discloses the encapsulating structure and microphone of a kind of chip, wherein the encapsulating structure of the chip includes the cover, substrate and sensor chip, and the substrate and the cover are enclosed accommodating cavity；The sensor chip includes the substrate for being mounted on the medial surface of the substrate, and the through-hole of perforation is offered in the middle part of the substrate, and the inner wall of the through-hole is rough surface.Technical solutions of the utility model, which can be reduced, climbs glue phenomenon.
Description
Technical field
The utility model relates to chip encapsulation technology field, in particular to the encapsulating structure and microphone of a kind of chip.
Background technique
MEMS (Micro-Electro-Mechanical System) chip is the sensing based on microelectromechanical processes production
Device is widely used due to its good performance, minimum volume.Currently, when package of MEMS sensor,
Liquid glue material is coated on substrate first, then each MEMS chip is placed in liquid glue material, by hot setting etc.
Technique is secured firmly to MEMS chip on substrate.But due to the difference of packaging technology, the gluing of fixed MEMS chip bottom
The problem of spilling on the position for playing main electric conversion performance on other component or MEMS chip, that is, " climbing glue " occurs, this can lead
It causes to influence the characteristic that part of devices designs originally.
Utility model content
The main purpose of the utility model is to provide a kind of encapsulating structure of chip, it is intended to reduce and occur in encapsulation process
Climb glue problem.
To achieve the above object, the utility model proposes the encapsulating structure of chip include the cover；
Substrate, the substrate and the cover are enclosed accommodating cavity；And
Sensor chip, the sensor chip include the substrate for being mounted on the medial surface of the substrate, the substrate
Middle part offers the through-hole of perforation, and the inner wall of the through-hole is rough surface.
Optionally, the rough surface is in being projected as regularly arranged waveform or sawtooth projection on the substrate.
Optionally, the rough surface is in the polygon protrusion for being projected as irregular alignment on the substrate.
Optionally, along the substrate on the direction of the cover, the height phase one of the height of the rough surface and the substrate
It causes.
Optionally, the outside wall surface of the substrate is rough surface.
Optionally, the substrate offers the acoustic aperture being connected to the accommodating cavity, week of the substrate around the acoustic aperture
Edge setting, and the center of the through-hole is consistent with the center of the acoustic aperture.
Optionally, the sensor chip includes the vibrating diaphragm and backboard set on the substrate away from one end of the substrate,
The vibrating diaphragm is located between the sensor and the backboard, and the backboard offers the mistake for being connected to the through-hole and accommodating cavity
Hole.
Optionally, the cover is connected with the substrate by conducting resinl or tin cream.
Optionally, the encapsulating structure further includes the asic chip for being installed on the substrate, and the asic chip passes through gold
Belong to line to be electrically connected with the sensor chip and the substrate respectively.
The utility model also proposes a kind of microphone, the encapsulating structure including chip as described above.
Technical solutions of the utility model are the sensor chip of the substrate of rough surface by using inner wall, thus to biography
When sensor chip carries out colloid encapsulation, the base carried out with substrate it is be bonded, since the rough surface of substrate is with biggish frictional force,
Colloid can be effectively prevented and flowed from bottom to top along through-hole, so that the colloid between substrate and substrate is difficult to flow to other
The other positions of component or sensor chip avoid climbing glue phenomenon, to will not influence other component or sensor core
The electrical property of piece guarantees the functional stabilization of the encapsulating structure of chip.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, the structure that can also be shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structural schematic diagram of one embodiment of encapsulating structure of the utility model chip；
Fig. 2 is the enlarged drawing in Fig. 1 at A.
Drawing reference numeral explanation:
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, fall within the protection scope of the utility model.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute in the utility model embodiment
It is only used for explaining in relative positional relationship, the motion conditions etc. under a certain particular pose (as shown in the picture) between each component, such as
When the fruit particular pose changes, then directionality instruction also correspondingly changes correspondingly.
In the present invention unless specifically defined or limited otherwise, term " connection ", " fixation " etc. should do broad sense reason
Solution, for example, " fixation " may be a fixed connection, may be a detachable connection, or integral；It can be mechanical connection, it can also
To be electrical connection；It can be directly connected, the connection inside two elements can also be can be indirectly connected through an intermediary
Or the interaction relationship of two elements, unless otherwise restricted clearly.It for the ordinary skill in the art, can be with
The concrete meaning of above-mentioned term in the present invention is understood as the case may be.
In addition, the description for being such as related to " first ", " second " in the present invention is used for description purposes only, and cannot manage
Solution is its relative importance of indication or suggestion or the quantity for implicitly indicating indicated technical characteristic.Define as a result, " the
One ", the feature of " second " can explicitly or implicitly include at least one of the features.In addition, the skill between each embodiment
Art scheme can be combined with each other, but must be based on can be realized by those of ordinary skill in the art, when technical solution
It will be understood that the combination of this technical solution is not present in conjunction with there is conflicting or cannot achieve when, also not in the utility model
It is required that protection scope within.
The utility model proposes a kind of encapsulating structures of chip.
Referring to Fig.1 and 2, the encapsulating structure of the chip includes the cover 10 in the utility model embodiment；
Substrate 30, the substrate 30 are enclosed accommodating cavity 10a with the cover 10；And
Sensor chip 50, the sensor chip 50 include the substrate 51 for being mounted on the medial surface of the substrate 30, institute
The middle part for stating substrate 51 offers the through-hole 511 of perforation, and the inner wall 513 of the through-hole 511 is rough surface.
In the present embodiment, the metal shell that the cover 10 can be integrally formed, substrate 30 can be circuit board, 10 He of the cover
Substrate 30 surrounds closed space, and sensor chip 50 is set in the space.The shape in the space that the cover 10 and substrate 30 surround
It can be cube or sphere, be not limited thereto.Sensor chip 50 can be MEMS chip, but be not restricted to that MEMS Mike
Wind chip, MEMS pressure sensor chip, MEMS gyroscope chip and mems accelerometer chip etc., are also possible to MEMS humidity
Sensor chip or MEMS gas sensor chip etc..MEMS microphone 100, MEMS can be respectively obtained using said chip
Pressure sensor, MEMS gyroscope, mems accelerometer, MEMS humidity sensor, MEMS gas sensor etc. and they
Integrated products.For the convenience of description, existing illustrated in detail with the encapsulating structure of 100 structure of MEMS microphone, at this point, passing
Sensor chip 50 is MEMS microphone chip.Certainly, when the sensor is pressure sensor or gyroscope, MEMS chip then has
There is corresponding structure feature.
It is to be appreciated that the cover 10 can be connected with the substrate 30 by conducting resinl or tin cream.
Specifically, substrate 30 is pcb board, which can successively include top solder mask, copper foil layer, half from top to bottom
Cured layer and buried capacitor layer, certainly, the pcb board of different size has the different numbers of plies, can be selected according to actual needs.
The outer surface of substrate 30 is provided with pad, the encapsulating structure of chip can be fixed, and be electrically connected to external circuit.The cover 10 is
Metal material or nonmetallic materials coated with metal material, are connect by conducting resinl or tin cream with substrate 30, be may be implemented
The cover 10 is electrically connected with substrate 30, to realize the shielding cavity of a conducting, can prevent external electromagnetic wave interference, is guaranteed
The conversion performance of sensor chip 50.Certainly, it can also be connected to by other conductive materials between the cover 10 and substrate 30.
It quiets down to realize, the substrate 30 offers the acoustic aperture 31 being connected to the accommodating cavity 10a, 51 ring of substrate
Periphery around the acoustic aperture 31 is arranged, and the center of the through-hole 511 is consistent with the center of the acoustic aperture 31.
Also, the sensor chip 50 further includes the vibrating diaphragm 53 set on the substrate 51 away from one end of the substrate 30
With backboard 55, the vibrating diaphragm 53 is located between the sensor and the backboard 55, and the backboard 55 offers described in connection
The via hole 551 of through-hole 511 and cavity.
In the present embodiment, acoustic aperture 31 is offered on substrate 30, which is connected to extraneous and accommodating cavity 10a, thus convenient
The inflow of voice signal.Certainly, acoustic aperture 31 can also be opened in the cover 10, and sensor chip 50 is also correspondingly arranged.Accordingly,
Sensor chip 50 is substantially in cube, and substrate 51 offers circular through-hole 511, and acoustic aperture 31 is corresponding to be also set as round, the through-hole
511 are connected to acoustic aperture 31, and consistent with the center of acoustic aperture 31, and the two cooperatively forms the operatic tunes cavity of MEMS microphone 100, can protect
The incoming smoothness of sound is demonstrate,proved, and sound can be made incoming in continuously curve along the peripheral wall of acoustic aperture 31 and through-hole 511, improves sound
Sound quality.Substrate 51 is connected with vibrating diaphragm 53 and backboard 55 away from one end of substrate 30, and backboard 55 offers connection through-hole 511 and holds
The via hole 551 of chamber 10a is set, said minuscule hole also is provided on vibrating diaphragm 53, and backboard 55 pads between vibrating diaphragm 53 and is equipped with partition, to make
It obtains and remains with gap between vibrating diaphragm 53 and backboard 55, gap is remained between vibrating diaphragm 53 and backboard 55 to form a parallel-plate
Capacitor, vibrating diaphragm 53 generates vibration after receiving the voice signal being passed to by acoustic aperture 31, to change gap between the two, changes
Capacitor.Certainly, in actual application, backboard 55 can also be set between vibrating diaphragm 53 and substrate 51, does not influence this reality
It is embodied with novel advantage.
Voltage is provided to sensor chip 50 in order to realize, the encapsulating structure further includes being installed on the substrate 30
ASIC (Application Specific Integrated Circuit, integrated circuit) chip, the asic chip 70 pass through
Metal wire 60 is electrically connected with the sensor chip 50 and the substrate 30 respectively.
In the present embodiment, asic chip 70 can be mounted on substrate 30 by Heraeus, can also pass through the side of plant tin ball
Formula is directly welded on substrate 30.Asic chip 70 also needs to cover by shielding glue, which can be COB glue (Chip
On Board).ASIC is connected to sensor chip 50 by metal wire 60, and asic chip 70 can provide perseverance for sensor chip 50
Fixed voltage, the material of MEMS sensor chip 50 are generally the materials such as monocrystalline silicon, polysilicon or silicon nitride, can believe sound
Number being converted to electric signal is transmitted, and the signal that sensor chip 50 exports can amplify processing simultaneously by asic chip 70
Output.
Since sensor chip 50 is mounted by colloid and substrate 30, when substrate 51 abuts substrate away from one end of vibrating diaphragm 53
When 30 surface, colloid can be adhered to the end face of substrate 51, since colloid can all have certain mobility, so, setting
The inner wall 513 of the through-hole 511 of substrate 51 is rough surface, wherein the rough surface is on the substrate 30 in an embodiment
It is projected as regularly arranged waveform or sawtooth projection.
In the present embodiment, which can be integrally formed by mold, easy to process, and the surface of the rough surface is equipped with more
A protrusion, multiple protrusions are joined together to form several rows of waveform or zigzag, and the rough surface of the structure is more regular, is convenient for
Processing can unify production mold, improve processing efficiency and reduce production cost.And the depressed section between multiple protrusions can also be with
So that colloidal deposition is not easy to be flowed up by the bottom of substrate 51, to colloid will not be made to flow on vibrating diaphragm 53, i.e., not
" climbing glue " phenomenon can occur, guarantee the elasticity of vibrating diaphragm 53, to improve the stability of the 50 electricity conversion of sensor chip, effectively mention
High yield.
Certainly, in another embodiment, the rough surface is in being projected as the polygon of irregular alignment on the substrate 30
Shape protrusion.
In the present embodiment, rough surface is convexly equipped with the protrusion of multiple irregular alignments, the shape of the protrusion can it is identical not yet
It is identical, raised shape can be frustum, ball, cylinder or other etc., it is not limited here.The protrusion of the structure can be with
It is disposed proximate to, setting can also be spaced, simplify structure, can both guarantee not climbing glue phenomenon, it is also possible that sensor core
The processing of piece 50 is more convenient.Certainly, which is also possible to be connected to through-hole 511 by way of pasting or brushing
Inner wall 513 further increases processing convenience.
Colloidality energy is climbed in order to improve the obstruction of rough surface, along the substrate 30 on the direction of the cover 10, the rough surface
Height it is consistent with the height of the substrate 51.
In the present embodiment, the height that rough surface is arranged is consistent with the height of substrate 51, i.e., by the inner wall of through-hole 511
513 entirety are disposed as rough surface, which does not increase additional process, integrated molding, and the structure in processing yet
The obstruction to colloid can be enhanced, guarantee that colloid will not be flow on vibrating diaphragm 53 enough.
Optionally, the outside wall surface of the sensor chip 50 is rough surface.
Certainly, it in order to further prevent colloid that can flow to other component, can also be set as in the outside wall surface of substrate 51
Rough surface, the structure of the rough surface can refer to the rough surface setting of inner wall 513, to can effectively ensure that the encapsulating structure of chip
Yield.
The utility model also proposes a kind of microphone 100, which includes the encapsulating structure of chip, the chip
The specific structure of encapsulating structure is referring to above-described embodiment, since this microphone 100 uses whole skills of above-mentioned all embodiments
Art scheme, therefore at least all beneficial effects brought by the technical solution with above-described embodiment, this is no longer going to repeat them.
The above is only the preferred embodiment of the present invention, and therefore it does not limit the scope of the patent of the utility model,
It is all under the inventive concept of the utility model, equivalent structure made based on the specification and figures of the utility model becomes
It changes, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (10)
1. a kind of encapsulating structure of chip characterized by comprising
The cover；
Substrate, the substrate and the cover are enclosed accommodating cavity；And
Sensor chip, the sensor chip include the substrate for being mounted on the medial surface of the substrate, the middle part of the substrate
The through-hole of perforation is offered, the inner wall of the through-hole is rough surface.
2. the encapsulating structure of chip as described in claim 1, which is characterized in that the rough surface is in the projection on the substrate
For regularly arranged waveform or sawtooth projection.
3. the encapsulating structure of chip as claimed in claim 2, which is characterized in that the rough surface is in the projection on the substrate
For the polygon protrusion of irregular alignment.
4. the encapsulating structure of the chip as described in any one of claims 1 to 3, which is characterized in that along the substrate to cover
On the direction of lid, the height of the rough surface is consistent with the height of the substrate.
5. the encapsulating structure of chip as claimed in claim 4, which is characterized in that the outside wall surface of the substrate is rough surface.
6. the encapsulating structure of chip as claimed in claim 4, which is characterized in that the substrate is offered to be connected with the accommodating cavity
Logical acoustic aperture, the substrate is arranged around the periphery of the acoustic aperture, and the center of the through-hole is consistent with the center of the acoustic aperture.
7. the encapsulating structure of chip as claimed in claim 6, which is characterized in that the sensor chip includes being set to the base
Bottom deviates from the vibrating diaphragm and backboard of one end of the substrate, and the vibrating diaphragm is located between the substrate and the backboard, the back
Plate offers the via hole for being connected to the through-hole and accommodating cavity.
8. the encapsulating structure of chip as described in claim 1, which is characterized in that the cover and the substrate pass through conducting resinl
Or tin cream connection.
9. the encapsulating structure of chip as described in claim 1, which is characterized in that the encapsulating structure further include be installed on it is described
The asic chip of substrate, the asic chip are electrically connected with the sensor chip and the substrate respectively by metal wire.
10. a kind of microphone, which is characterized in that the encapsulating structure including the chip as described in any in claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822101283.5U CN208924505U (en) | 2018-12-13 | 2018-12-13 | The encapsulating structure and microphone of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822101283.5U CN208924505U (en) | 2018-12-13 | 2018-12-13 | The encapsulating structure and microphone of chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208924505U true CN208924505U (en) | 2019-05-31 |
Family
ID=66712854
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822101283.5U Active CN208924505U (en) | 2018-12-13 | 2018-12-13 | The encapsulating structure and microphone of chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208924505U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112995866A (en) * | 2021-02-23 | 2021-06-18 | 歌尔微电子股份有限公司 | Sensor packaging structure and electronic equipment |
| WO2021135110A1 (en) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Dustproof structure and mems microphone packaging structure used for mems device |
| WO2021168902A1 (en) * | 2020-02-25 | 2021-09-02 | 瑞声声学科技(深圳)有限公司 | Mems chip assembly |
-
2018
- 2018-12-13 CN CN201822101283.5U patent/CN208924505U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021135110A1 (en) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Dustproof structure and mems microphone packaging structure used for mems device |
| WO2021168902A1 (en) * | 2020-02-25 | 2021-09-02 | 瑞声声学科技(深圳)有限公司 | Mems chip assembly |
| CN112995866A (en) * | 2021-02-23 | 2021-06-18 | 歌尔微电子股份有限公司 | Sensor packaging structure and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200617 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266104 Laoshan Qingdao District North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |