CN209017316U - Microphone packaging scheme - Google Patents
Microphone packaging scheme Download PDFInfo
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- CN209017316U CN209017316U CN201821951044.2U CN201821951044U CN209017316U CN 209017316 U CN209017316 U CN 209017316U CN 201821951044 U CN201821951044 U CN 201821951044U CN 209017316 U CN209017316 U CN 209017316U
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- substrate
- packaging scheme
- microphone packaging
- chip
- mems chip
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 239000002775 capsule Substances 0.000 claims 2
- 230000005611 electricity Effects 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- Micromachines (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model discloses a kind of microphone packaging scheme, including substrate, shell on the substrate is set, MEMS chip and asic chip, the shell and the substrate surround cavity, the MEMS chip and asic chip are located in the cavity, the substrate has acoustic aperture corresponding with the MEMS chip position, wherein, the microphone packaging scheme further includes that the opaque capsul on the substrate and being located in the cavity is arranged, the opaque capsul covers the asic chip in the side of the MEMS chip, the microphone packaging scheme is able to solve existing microphone packaging scheme and is easy to produce the problem of light is made an uproar.
Description
Technical field
The utility model relates to acoustic-electric technical field more particularly to a kind of microphone packaging schemes.
Background technique
With the extensive use of portable electronic product, the utilization rate of the products such as earphone, loudspeaker, microphone is higher and higher,
Wherein, MEMS (Micro Electro Mechanical System) microphone is based on the microphone of MEMS technology manufacture, it mainly includes vibrating diaphragm, back pole plate
Equal important components, vibrating diaphragm, back pole plate constitute capacitor and it is integrated on silicon, by vibration of membrane of shaking, change vibrating diaphragm with
The distance between back pole plate, so that voice signal is converted to electric signal.
However, the thinner thickness of the vibrating diaphragm of such microphone in the prior art, extraneous light from acoustic aperture come in after can
To penetrate diaphragm easily, the region of asic chip is reached after reflection, is made an uproar so as to cause light.
Utility model content
The main purpose of the utility model is to provide a kind of microphone packaging scheme, it is intended to solve existing microphone package knot
Structure is easy to produce the problem of light is made an uproar.
To achieve the above object, the utility model proposes a kind of microphone packaging scheme, including substrate, be arranged described
Shell, MEMS chip and asic chip on substrate, the shell and the substrate surround cavity, the MEMS chip and ASIC
Chip is located in the cavity, and the substrate has acoustic aperture corresponding with the MEMS chip position, which is characterized in that institute
State microphone packaging scheme further include setting on the substrate and be located at the cavity in opaque capsul, it is described not
Light transmission capsul covers the asic chip in the side of the MEMS chip.
Preferably, the microphone packaging scheme includes the conducting wire for connecting the MEMS chip Yu the asic chip, institute
State the position that substrate corresponds between the MEMS chip and the asic chip and be provided with electric connecting part, the MEMS chip and
The asic chip passes through conducting wire respectively and is electrically coupled with the electric connecting part.
Preferably, the shell includes the first roof and the first side wall for being connected to first roof, and described first
Side wall is connected to the substrate, and the opaque capsul includes the second roof and the second side for being connected to second roof
Wall, the second sidewall are connected to the substrate.
Preferably, first roof is interval in second roof.
Preferably, the first side wall is interval in the second sidewall.
Preferably, the height of the second sidewall is higher than the height of the MEMS chip.
Preferably, the shell is metal-back.
Preferably, the opaque capsul is plastic housing.
Preferably, the outside wall surface of the opaque capsul is provided with reflective layer.
Preferably, the substrate corresponds to that electric connecting part setting is fluted, and the electric connecting part is set to described
In groove, the MEMS chip side is arranged not higher than the substrate in height of the electric connecting part far from the substrate side
Height；The opaque capsul is in conjunction with the base plate seals.
In technical solutions of the utility model, since microphone packaging scheme further includes being disposed on the substrate and being located at cavity
In opaque capsul, opaque capsul covers asic chip in the side of MEMS chip, it is possible to by opaque
Capsul to form optical path isolation between MEMS chip and asic chip, i.e. extraneous light comes in penetrate MEMS again from acoustic aperture
After the vibrating diaphragm of chip, asic chip can not be reached, is made an uproar and anti-interference ability to increase the anti-light of asic chip, and then increase whole
The anti-light of a microphone packaging scheme is made an uproar and anti-interference ability.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, the structure that can also be shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structural schematic diagram of microphone packaging scheme in the utility model embodiment.
Drawing reference numeral explanation:
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, fall within the protection scope of the utility model.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute in the utility model embodiment
It is only used for explaining in relative positional relationship, the motion conditions etc. under a certain particular pose (as shown in the picture) between each component, such as
When the fruit particular pose changes, then directionality instruction also correspondingly changes correspondingly.
In addition, the description for being such as related to " first ", " second " in the present invention is used for description purposes only, and cannot manage
Solution is its relative importance of indication or suggestion or the quantity for implicitly indicating indicated technical characteristic.Define as a result, " the
One ", the feature of " second " can explicitly or implicitly include at least one of the features.It is " more in the description of the present invention,
It is a " it is meant that at least two, such as two, three etc., unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " connection ", " fixation " etc. should do broad sense reason
Solution, for example, " fixation " may be a fixed connection, may be a detachable connection, or integral；It can be mechanical connection, it can also
To be electrical connection；It can be directly connected, the connection inside two elements can also be can be indirectly connected through an intermediary
Or the interaction relationship of two elements, unless otherwise restricted clearly.It for the ordinary skill in the art, can be with
The concrete meaning of above-mentioned term in the present invention is understood as the case may be.
It in addition, the technical solution between each embodiment of the utility model can be combined with each other, but must be with ability
Based on domain those of ordinary skill can be realized, it will be understood that when the combination of technical solution appearance is conflicting or cannot achieve
The combination of this technical solution is not present, also not within the protection scope of the requires of the utility model.
Referring to Fig. 1, the utility model provides a kind of microphone packaging scheme, which includes substrate 1, sets
Shell 2, MEMS chip 3 and asic chip 4 on substrate 1 is set, shell 2 and substrate 1 surround cavity, MEMS chip 3 and ASIC
Chip 4 is located in cavity, and substrate 1 has acoustic aperture 5 corresponding with 3 position of MEMS chip, and microphone packaging scheme further includes
The opaque capsul 6 on substrate 1 and being located in cavity is set, and opaque capsul 6 is covered in the side of MEMS chip 3
Asic chip 4.Certainly, MEMS chip 3 has the vibrating diaphragm of alignment acoustic aperture 5.About MEMS chip 3 and asic chip 4, detailed art
Language is explained are as follows: ASIC (Application Specific Integrated Circuit) is specific integrated circuit, MEMS
(Micro-Electro-Mechanical System) is MEMS.
In technical solutions of the utility model, since microphone packaging scheme further includes setting on substrate 1 and is located at chamber
Opaque capsul 6 in body, opaque capsul 6 cover asic chip 4 in the side of MEMS chip 3, it is possible to pass through
Opaque capsul 6 to form optical path isolation between MEMS chip 3 and asic chip 4, i.e. extraneous light is come in from acoustic aperture 5
After the vibrating diaphragm for penetrating MEMS chip 3 again, asic chip 4 can not be reached, is made an uproar and anti-interference energy to increase the anti-light of asic chip 4
Power.And then increases the anti-light of entire microphone packaging scheme and make an uproar and anti-interference ability.
Certainly, in order to further increase the anti-transmittancy of opaque capsul 6, the outside wall surface of opaque capsul 6 can
To be provided with reflective layer, such as the outside wall surface coating reflectorized material in opaque capsul 6.
Specific embodiment according to the present utility model, microphone packaging scheme can also include connection MEMS chip 3 with
The conducting wire 7 of asic chip 4, conducting wire 7 are arranged between opaque capsul 6 and substrate 1, as shown in Figure 1, the utility model
The wire laying mode of the microphone packaging scheme of offer has carried out specialization design: due to the addition of opaque capsul 6, MEMS core
The conducting wire 7 that piece 3 is drawn is first to downward cabling and the position between substrate 1, the corresponding MEMS chip 3 of the substrate 1 and asic chip 4
It installs and is equipped with electric connecting part, MEMS chip 3 and asic chip 4 are electrically coupled by conducting wire 7 with electric connecting part respectively.By this
The electric connecting part of design, MEMS chip, the electrical connection design between asic chip, can reduce the encapsulation process difficulty of MIC,
Product yield is improved, guarantees product reliability.Preferably, 1 plate of base correspond to electric connecting part setting it is fluted, electrical connection
Component is arranged in the groove, and electric connecting part is not higher than on substrate 1 far from the height of 1 side of substrate and is provided with MEMS at this time
The height of the plane of chip 3 and asic chip 4, to guarantee that opaque capsul 6 and substrate 1 seal the leakproofness combined and secured
Property.
Preferred embodiment according to the present utility model, shell 2 may include the first roof 21 and be connected to the first top
The first side wall 22 of wall 21, the first side wall 22 are connected to substrate 1, and opaque capsul 6 includes the second roof 61 and is connected to
The second sidewall 62 of second roof 61, second sidewall 62 are connected to substrate 1.
Specific embodiment according to the present utility model, the first roof 21 can be interval in the second roof 61.The first side wall
22 can be interval in second sidewall 62.The height of second sidewall 62 is higher than the height of MEMS chip 3.Certainly, as needed, these
The spatial position set-up mode and dimensional height set-up mode of specific structure also change to being adapted to property.
About the material selection of microphone packaging scheme, above-mentioned shell 2 can be metal-back, opaque capsul
6 can be the materials such as plastic housing.
The above is only the preferred embodiment of the present invention, and therefore it does not limit the scope of the patent of the utility model,
Under all utility models in the utility model are conceived, equivalent structure made based on the specification and figures of the utility model
Transformation, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (10)
1. a kind of microphone packaging scheme, including substrate, shell, MEMS chip and the asic chip of setting on the substrate,
The shell and the substrate surround cavity, and the MEMS chip and asic chip are located in the cavity, the substrate
With acoustic aperture corresponding with the MEMS chip position, which is characterized in that the microphone packaging scheme further includes being arranged in institute
The opaque capsul on substrate and being located in the cavity is stated, the opaque capsul is in the side of the MEMS chip
Cover the asic chip.
2. microphone packaging scheme according to claim 1, which is characterized in that the microphone packaging scheme includes connection
The conducting wire of the MEMS chip and the asic chip, the substrate correspond between the MEMS chip and the asic chip
Position is provided with electric connecting part, and the MEMS chip and the asic chip pass through conducting wire and electric connecting part electricity respectively
In conjunction with.
3. microphone packaging scheme according to claim 1, which is characterized in that the shell includes the first roof and company
It is connected to the first side wall of first roof, the first side wall is connected to the substrate, and the opaque capsul includes the
Two roofs and the second sidewall for being connected to second roof, the second sidewall are connected to the substrate.
4. microphone packaging scheme according to claim 3, which is characterized in that first roof is interval in described second
Roof.
5. microphone packaging scheme according to claim 3, which is characterized in that the first side wall is interval in described second
Side wall.
6. microphone packaging scheme according to claim 3, which is characterized in that the height of the second sidewall is higher than described
The height of MEMS chip.
7. microphone packaging scheme as claimed in any of claims 1 to 6, which is characterized in that the shell is gold
Belong to shell.
8. microphone packaging scheme as claimed in any of claims 1 to 6, which is characterized in that described opaque close
Capsule is plastic housing.
9. microphone packaging scheme as claimed in any of claims 1 to 6, which is characterized in that described opaque close
The outside wall surface of capsule is provided with reflective layer.
10. microphone packaging scheme according to claim 2, which is characterized in that the substrate corresponds to the electrical connection section
Part setting is fluted, and the electric connecting part is arranged in the groove, and the electric connecting part is far from the substrate side
The height of the MEMS chip side is arranged not higher than the substrate for height；The opaque capsul and the base plate seals knot
It closes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821951044.2U CN209017316U (en) | 2018-11-23 | 2018-11-23 | Microphone packaging scheme |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821951044.2U CN209017316U (en) | 2018-11-23 | 2018-11-23 | Microphone packaging scheme |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209017316U true CN209017316U (en) | 2019-06-21 |
Family
ID=66843011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821951044.2U Active CN209017316U (en) | 2018-11-23 | 2018-11-23 | Microphone packaging scheme |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209017316U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114339560A (en) * | 2021-12-23 | 2022-04-12 | 歌尔微电子股份有限公司 | Miniature microphone and electronic equipment |
-
2018
- 2018-11-23 CN CN201821951044.2U patent/CN209017316U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114339560A (en) * | 2021-12-23 | 2022-04-12 | 歌尔微电子股份有限公司 | Miniature microphone and electronic equipment |
| CN114339560B (en) * | 2021-12-23 | 2024-03-19 | 歌尔微电子股份有限公司 | Miniature microphone and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200612 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266104 Laoshan Qingdao District North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |