CN208540162U

CN208540162U - MEMS microphone

Info

Publication number: CN208540162U
Application number: CN201820254200.3U
Authority: CN
Inventors: 王凯; 陈虎
Original assignee: AAC Technologies Pte Ltd
Current assignee: AAC Technologies Pte Ltd
Priority date: 2018-02-11
Filing date: 2018-02-11
Publication date: 2019-02-22
Anticipated expiration: 2028-02-11

Abstract

The utility model provides a kind of MEMS microphone, including the shell with accommodating chamber and the sound hole being opened on the shell, the MEMS chip, asic chip and the water proof and dust proof net for covering the sound hole of tool back chamber are equipped in the accommodating chamber, and the back chamber is oppositely arranged and is connected with the sound hole, the water proof and dust proof net includes PTFE film layer, is stacked at the PTFE film layer and support plate made of metal, the support plate is pressed on the PTFE film layer, and the support plate is equipped with multiple penetrable sound holes run through thereon and be spaced apart from each other setting.Compared with the relevant technologies, the MEMS microphone of the utility model, high production efficiency, water proof and dust proof performance is good and high reliablity.

Description

MEMS microphone

[technical field]

The utility model relates to electroacoustic conversion art more particularly to a kind of MEMS Mikes applied to mobile electronic device Wind.

[background technique]

Mobile communication technology has been rapidly developed in recent years, and consumer uses mobile communication equipment more and more, Such as portable phone, portable phone, personal digital assistant or the dedicated communications network that can surf the Internet communicated other set Standby, wherein microphone is then wherein one of the ost important components, especially MEMS microphone.

MEMS (Micro-Electro-Mechanical System, MEMS) microphone is a kind of using microcomputer The electric energy that tool processing technology is made changes sound device, has the characteristics that small in size, good frequency response, noise are low.With electronics Compact, the lightening development of equipment, MEMS microphone are applied to more and more widely in these equipment.

The MEMS microphone of the relevant technologies includes the shell with accommodating chamber, is contained in the MEMS chip of the container, The shell is equipped with sound hole, and one layer of water proof and dust proof net is equipped between the MEMS chip and the sound hole.The waterproof Air Filter has the function of water proof and dust proof.

However, the water proof and dust proof net uses single layer silicon chip for main material due to the limitation of process conditions or cost, lead to The position for being attached to the sound hole is crossed, achievees the effect that waterproof and dustproof.However due to the material of the water proof and dust proof net For silicon wafer, cause its toughness very poor, vibrating, fall or big gas shock in the case where easily ruptures, thus waterproof Dust-proof performance recruits destruction, thereby reduces the reliability of the MEMS microphone.

Therefore, it is necessary to provide the new MEMS microphone of one kind to solve drawbacks described above.

[utility model content]

The purpose of the utility model is to overcome above-mentioned technical problems, provide a kind of high production efficiency, and water proof and dust proof performance is good And the MEMS microphone of high reliablity.

To achieve the goals above, the utility model technology provides a kind of MEMS microphone comprising has accommodating chamber Shell and the sound hole that is opened on the shell, be equipped in the accommodating chamber MEMS chip of tool back chamber, asic chip and The water proof and dust proof net of the sound hole is covered, and the back chamber is oppositely arranged and is connected with the sound hole, the waterproof is anti- Dirt net includes PTFE film layer, is stacked at the PTFE film layer and support plate made of metal, and the support plate is pressed on The PTFE film layer, the support plate are equipped with multiple penetrable sound holes run through thereon and be spaced apart from each other setting.

Preferably, the shell includes that circuit board and lid connect on the circuit board and form the outer of the accommodating chamber therewith Shell, the sound hole are opened on the circuit board, and the asic chip and the water proof and dust proof net are fixed on the circuit board.

Preferably, the MEMS chip is fixedly connected with the circuit board, and the water proof and dust proof net is contained in the back chamber.

Preferably, the MEMS chip is fixedly connected with the water proof and dust proof net, and the water proof and dust proof network folder is set to institute It states between circuit board and the MEMS chip.

Preferably, the support plate includes two layers and is pressed on the opposite sides of the PTFE film layer respectively.

Preferably, the support plate with a thickness of 10~100 μm.

Preferably, the aperture of each penetrable sound hole is 5~10 μm, between the two neighboring penetrable sound hole between be divided into 1 ~3 μm.

Preferably, the penetrable sound hole passes through the metal etching process machine-shaping of microfabrication.

Preferably, the central axes of the back chamber and the central axes of the sound hole are located along the same line.

Preferably, the asic chip and the circuit board be by binding gold thread electrical connection, the MEMS chip and described Asic chip passes through binding gold thread electrical connection.

Compared with the relevant technologies, MEMS microphone provided by the utility model cooperates by using built-in PTFE film layer to be supported Plate is as water proof and dust proof net, while reaching water-proof function, and with anti-vibration, fall or the ability of big gas shock； Micron level is accomplished into the aperture of support plate aperture and pore wall thickness, it is ensured that water proof and dust proof net has extremely low acoustic resistance premise Under, and have the function that dust-proof；Semiconductor packages instrument is crossed by water proof and dust proof Netcom with dustproof and waterproof to draw and mount Inside MEMS microphone, finally under the premise of guaranteeing not changing product acoustical behavior, so that MEMS microphone is anti-with waterproof Dirt, anti-vibration, anti-drop and anti-big gas shock ability.

[Detailed description of the invention]

It, below will be to required in embodiment description in order to illustrate more clearly of the technical scheme in the embodiment of the utility model Attached drawing to be used is briefly described, it should be apparent that, the accompanying drawings in the following description is only some realities of the utility model Example is applied, it for those of ordinary skill in the art, without creative efforts, can also be according to these attached drawings Obtain other attached drawings, in which:

Fig. 1 is the structural schematic diagram of the embodiment one of MEMS microphone provided by the utility model；

Fig. 2 is the structural schematic diagram of the water proof and dust proof net of MEMS microphone shown in FIG. 1；

Fig. 3 is the structural schematic diagram of the embodiment two of MEMS microphone provided by the utility model；

Fig. 4 is the structural schematic diagram of the water proof and dust proof net of MEMS microphone shown in Fig. 3；

Fig. 5 is the structural schematic diagram of the embodiment three of MEMS microphone provided by the utility model；

Fig. 6 is the structural schematic diagram of the example IV of MEMS microphone provided by the utility model.

[specific embodiment]

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work All other embodiment obtained, fall within the protection scope of the utility model.

Embodiment one:

Fig. 1 and Fig. 2 are please referred to, the MEMS microphone 100 includes having the shell 11 of accommodating chamber 115 and being opened in Sound hole 117 on the shell 11, the interior tool that is equipped with of the accommodating chamber 115 carry on the back the MEMS chip 13 of chamber 131, are the MEMS core The water proof and dust proof net 17 of asic chip 15 and the covering sound hole 117 that piece 13 is powered.

The shell 11 includes that circuit board 111 and lid connect on the circuit board 111 and form the accommodating chamber 115 therewith Shell 113, the sound hole 117 is opened in the circuit board 111.Specifically, the circuit board 111 is pcb board, it is described outer Shell 113 is metal shell.

Transformation of the MEMS chip 13 for realizing voice signal to electric signal.Specifically, the MEMS chip 13 has There is back chamber 131, and the back chamber 131 is oppositely arranged and is connected with the sound hole 117.More preferably, in the back chamber 131 The central axes of axis and the sound hole 117 are located along the same line, that is to say, that sound hole described in 131 face of back chamber 117 settings.

The asic chip 15 is contained in the accommodating chamber 115 and is fixed on the circuit board 111.The asic chip 15 It is electrically connected respectively by gold thread with the circuit board 111 and the MEMS chip 13.

17 two sides of water proof and dust proof net are connect with the MEMS chip 13 and the circuit board 111 respectively, and cover institute State sound hole 117, that is to say, that the water proof and dust proof net 17 is located between the circuit board 111 and the MEMS chip 13, The erosion MEMS microphone 100 for stopping moisture, salinity and other corrosive liquids with this, while the biography of sound is not hindered It passs.Specifically, the water proof and dust proof 17 is to be packaged in the circuit board 111 in advance by semiconductor packaging process.

The water proof and dust proof net 17 includes PTFE film layer 171 and the support plate 173 for being pressed on the PTFE film layer 171. Support plate 173 described in the present embodiment is one layer, and the PTFE film layer 171 and the asic chip 15 connect, the support Plate 173 and the circuit board 111 connect.

The PTFE film layer 171 uses special process by polytetrafluoroethylene material, through the side such as calendering, extrusion, biaxial tension Method is made, and the PTFE film layer 171 has waterproof and dustproof, corrosion-resistant, high temperature resistant and good translucent performance.

The support plate 173 is pressed on the PTFE film layer 171 by hot pressing combination process, and the support plate 173 can be with The PTFE film layer 171 is supported, prevents the PTFE film layer 171 to be recessed and deform, to improve the water proof and dust proof net 17 Reliability, and then improve water proof and dust proof, anti-vibration, anti-drop and anti-big air-flow punching that the MEMS microphone 100 works The ability hit improves the reliability of the MEMS microphone 100.

The support plate 173 is made of iron, aluminium, copper, nickel and stainless steel and other metal materials, and is not limited solely to this.

The support plate 173 etches intensive penetrable sound hole 1731, the penetrable sound hole by the etch process of microfabrication 1731 run through the support plate 173.

1731 aperture of penetrable sound hole is 5~10 μm, such as 5 μm, 7 μm, 8 μm and 10 μm etc..Adjacent is described translucent It is spaced 1~3 μm, such as 1 μm, 2 μm and 3 μm etc. between hole 1731, not only ensure that the support strength of the support plate 173, but also So that the acoustic resistance of the support plate 173 is minimum, meet the use demand of acoustic product.

Embodiment two:

Fig. 3 and Fig. 4 are please referred to, what the structure and embodiment one of MEMS microphone 200 provided in this embodiment provided MEMS microphone 100 is essentially identical, the difference is that the water proof and dust proof net 27 include two layers of support plate 273, two layers The support plate 273 is pressed on the opposite sides of the PTFE film layer 271 respectively, and the support plate 273 respectively with the electricity Road plate 211 and the MEMS chip 23 connect, and rest part is identical as described in embodiment one in the present embodiment.

Embodiment three:

Referring to Fig. 5, the MEMS microphone that the structure of MEMS microphone 300 provided in this embodiment and embodiment one provide 100 is essentially identical, the difference is that the MEMS chip 33 is directly fixedly connected with the circuit board 311, the waterproof is anti- Dirt net 37 is contained in the back chamber 331.

Example IV:

Referring to Fig. 6, the MEMS microphone that the structure of MEMS microphone 400 provided in this embodiment and embodiment two provide 200 is essentially identical, the difference is that the MEMS chip 43 is directly fixedly connected with the circuit board 411, the waterproof is anti- Dirt net 47 is contained in the back chamber 431.

Compared with the relevant technologies, MEMS microphone 100 provided by the utility model is matched by using built-in PTFE film layer 171 It closes support plate 173 and is used as water proof and dust proof net 17, while reaching water-proof function, and there is anti-vibration, fall or big air-flow The ability of impact；Micron level is accomplished into the aperture of 173 aperture of support plate and pore wall thickness, it is ensured that water proof and dust proof net 17 has Under the premise of having extremely low acoustic resistance, and have the function that dust-proof；Water proof and dust proof net 17 with dustproof and waterproof is passed through into semiconductor package Dress instrument is drawn and is mounted inside MEMS microphone 100, finally under the premise of guaranteeing not changing product acoustical behavior, so that MEMS microphone 100 has the ability of water proof and dust proof, anti-vibration, anti-drop and anti-big gas shock.

Above-described is only the embodiments of the present invention, it should be noted here that for the ordinary skill of this field For personnel, without departing from the concept of the present invention, improvement can also be made, but these belong to it is practical Novel protection scope.

Claims

1. a kind of MEMS microphone comprising the sound hole that there is the shell of accommodating chamber and be opened on the shell, feature It is, MEMS chip, asic chip and the water proof and dust proof net for covering the sound hole with back chamber is equipped in the accommodating chamber, And the back chamber is oppositely arranged and is connected with the sound hole, the water proof and dust proof net include PTFE film layer, be stacked at it is described PTFE film layer and support plate made of metal, the support plate are pressed on the PTFE film layer, and the support plate is equipped with Multiple penetrable sound holes run through thereon and be spaced apart from each other setting.

2. MEMS microphone according to claim 1, which is characterized in that the shell includes that circuit board and lid connect described The shell of the accommodating chamber is formed on circuit board and therewith, and the sound hole is opened on the circuit board, the asic chip The circuit board is fixed on the water proof and dust proof net.

3. MEMS microphone according to claim 2, which is characterized in that the MEMS chip and the fixed company of the circuit board It connects, the water proof and dust proof net is contained in the back chamber.

4. MEMS microphone according to claim 2, which is characterized in that the MEMS chip and the water proof and dust proof net are solid Fixed connection, and the water proof and dust proof network folder is set between the circuit board and the MEMS chip.

5. MEMS microphone according to claim 1, which is characterized in that the support plate includes two layers and is pressed on respectively The opposite sides of the PTFE film layer.

6. MEMS microphone according to claim 1, which is characterized in that the support plate with a thickness of 10~100 μm.

7. MEMS microphone according to claim 6, which is characterized in that the aperture of each penetrable sound hole is 5~10 μm, 1~3 μm is divided between the two neighboring penetrable sound hole.

8. MEMS microphone according to claim 1, which is characterized in that the penetrable sound hole is lost by the metal of microfabrication Carving technology machine-shaping.

9. MEMS microphone according to claim 1-8, which is characterized in that the back central axes of chamber and described The central axes of sound hole are located along the same line.

10. MEMS microphone according to claim 2, which is characterized in that the asic chip and the circuit board pass through It binds gold thread electrical connection, the MEMS chip and the asic chip and passes through binding gold thread electrical connection.