CN203590454U

CN203590454U - Piezoelectric electret microphone

Info

Publication number: CN203590454U
Application number: CN201320599860.2U
Authority: CN
Inventors: 梁海; 朱彪
Original assignee: Shenzhen Horn Audio Co Ltd
Current assignee: Shenzhen Horn Audio Co Ltd
Priority date: 2013-09-26
Filing date: 2013-09-26
Publication date: 2014-05-07
Anticipated expiration: 2023-09-26

Abstract

A piezoelectric electret microphone comprises a housing, a circuit board, an electronic element and a piezoelectric film. The housing is of an open cylindrical structure. The housing comprises a bottom wall and side walls, and the bottom wall is provided with a sound hole. The circuit board is arranged at an opening of the housing and seals the opening of the housing. The circuit board and the housing form an accommodation cavity. One side of the circuit board, back to the accommodation cavity, forms conductive bosses which are electrically connected to a client. The electronic element is arranged on the circuit board and is accommodated in the accommodation cavity. The piezoelectric film is accommodated in the accommodation cavity. The piezoelectric film comprises an input layer, a substrate layer and a ground layer. The substrate layer is positioned between the input layer and the ground layer. The input layer and the ground layer are electrically connected with the circuit board respectively. The orthographic projection of the sound hole on the circuit board falls in the piezoelectric film. One side of the circuit board, back to the accommodation cavity, is provided with the conductive bosses which are electrically connected with the client, so that the piezoelectric electret microphone can be directly mounted on the clients without additionally opening a through hole to install a pin, thereby reducing processing procedures, improving production efficiency and saving cost.

Description

Piezo-electric electret microphone

Technical field

The utility model relates to sound energy-conversion technique field, particularly relates to a kind of piezo-electric electret microphone.

Background technology

Microphone is a kind of energy conversion device that acoustic signals is converted to corresponding electric signal, and its operation principle is the vibrating membrane vibration being caused by acoustic pressure to be become to the variation of electrical quantity.Electret microphone, because of advantages such as volume are little, is widely used in each field, as mobile phone, notebook, panel computer, video camera, phone etc.

Usually, traditional electret microphone is electrically connected to cartridge conventionally with circuit board, by shell, is undertaken hermetically sealed.Yet, in order to make circuit board communicate and be connected with external client, need on circuit board, offer through hole, stitch is worn to through hole, circuit board communicates connection by stitch.At present, adopt that stitch connected mode cost is high and production efficiency is low.

Utility model content

Based on this, be necessary problem high for cost and that production efficiency is low, a kind of piezo-electric electret microphone is provided.

A piezo-electric electret microphone, comprising:

Housing, is opening tubular structure, and described housing comprises diapire and sidewall, and described diapire offers tone-entering hole;

Circuit board, is arranged at described shell nozzle place, and by described shell nozzle sealing, described circuit board and described housing form host cavity, and a described circuit board dorsad side of described host cavity is formed with the conducting boss that can be electrically connected to client;

Electronic component, is arranged at described circuit board, and is contained in described host cavity;

Piezoelectric film, be contained in described host cavity, described piezoelectric film comprises the input layer of being made by metal material, the substrate layer of being made by exotic material and the ground plane of being made by metal material, described substrate layer is between described input layer and described ground plane, described input layer and described ground plane be electrical connection corresponding to described circuit board respectively, and described tone-entering hole falls in described piezoelectric film in described circuit board orthographic projection direction.

In an embodiment, comprise becket therein, described becket one end is electrically connected to described piezoelectric film input layer, and the other end is electrically connected to described circuit board, and described piezoelectric film input layer is by the electrical connection corresponding to described circuit board of described becket.

In an embodiment, comprise the dead ring of being made by exotic material therein, described dead ring is contained in described host cavity, and is arranged between described becket and described housing sidewall.

Therein in an embodiment, described conducting boss be shaped as concentric circles or square shape, the described conducting boss of concentric circles comprises the inner ring boss that can form output cathode and the outer ring boss that can form output negative pole.

Therein in an embodiment, described housing comprises the first housing and the second housing, described circuit board comprises first circuit board and second circuit board, and described conducting boss comprises can mate with described second circuit board the first conducting boss being electrically connected to and second conducting boss that can be electrically connected to client;

Described first circuit board is arranged at described the first shell nozzle place, and by described the first shell nozzle sealing, described first circuit board and described the first housing form the first host cavity, described piezoelectric film is contained in described the first host cavity, described piezoelectric film input layer is attached at described first circuit board, the earth terminal that described piezoelectric film ground plane is corresponding with described first circuit board is electrically connected to, described tone-entering hole is opened in described the first shell bottom wall, described tone-entering hole falls in described piezoelectric film in described first circuit board orthographic projection direction, described the first conducting boss is formed at a described first circuit board side of described the first host cavity dorsad, described first circuit board mates electrical connection by described the first conducting boss with described second circuit board,

Described second circuit board is arranged at described the second shell nozzle place, and by described the second shell nozzle sealing, described second circuit board and described the second housing form the second host cavity, described electronic component is arranged at described second circuit board, and being contained in described the second host cavity, described the second conducting boss is formed at a described second circuit board side of described host cavity dorsad.

In an embodiment, comprise conductive tape therein, described piezoelectric film ground plane is electrically connected to by the described conductive tape earth terminal corresponding with described first circuit board, and described the first housing adheres to described first circuit board.

Therein in an embodiment, comprise conductive tape, described piezoelectric film ground plane is electrically connected to by the described conductive tape earth terminal corresponding with described first circuit board, described the first housing is put along the edge ring winding of described first circuit board, between described first circuit board and described the first shell bottom wall, is provided with the first support ring.

In an embodiment, described the first housing is pressed on described first circuit board therein, described ground plane and described the first shell bottom wall laminating, and described ground plane is electrically connected to by described the first housing earth terminal corresponding with described first circuit board.

In an embodiment, described second circuit board comprises the reserved portion for being connected with described first circuit board coupling therein, and the side that described first circuit board is formed with the first conducting boss is arranged at described reserved portion.

In an embodiment, described the second housing is put along the edge ring winding of described second circuit board therein, between described second circuit board and described the second shell bottom wall, is provided with the second support ring.

Above-mentioned piezo-electric electret microphone, by circuit board dorsad a side of host cavity form the conducting boss can being electrically connected to client, can be directly and client mount, without offering separately through hole, stitch is installed, save manufacturing procedure, enhance productivity, and cost-saving.

Accompanying drawing explanation

Fig. 1 is the structural representation of an execution mode piezo-electric electret microphone;

Fig. 2 is the structural representation of the conducting boss of an execution mode piezo-electric electret microphone;

Fig. 3 is the structural representation of the conducting boss of another execution mode piezo-electric electret microphone;

Fig. 4 is the structural representation of another execution mode piezo-electric electret microphone;

Fig. 5 is a first circuit board for execution mode piezo-electric electret microphone and the structural representation of the first housing shown in Fig. 4;

Fig. 6 is the first circuit board of another execution mode piezo-electric electret microphone shown in Fig. 4 and the structural representation of the first housing;

Fig. 7 is a second circuit board for execution mode piezo-electric electret microphone and the structural representation of the second housing shown in Fig. 4.

Embodiment

For the ease of understanding the utility model, below with reference to relevant drawings, the utility model is described more fully.In accompanying drawing, provided preferred embodiment of the present utility model.But the utility model can be realized in many different forms, be not limited to embodiment described herein.On the contrary, providing the object of these embodiment is to make to the understanding of disclosure of the present utility model more thoroughly comprehensively.

It should be noted that, when element is called as " being fixed on " another element, can directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may have centering elements simultaneously.

Unless otherwise defined, all technology of using are herein identical with the implication that belongs to the common understanding of those skilled in the art of the present utility model with scientific terminology.The term using in specification of the present utility model herein, just in order to describe the object of specific embodiment, is not intended to be restriction the utility model.Term as used herein " and/or " comprise one or more relevant Listed Items arbitrarily with all combinations.

As shown in Figure 1, a kind of piezo-electric electret microphone, comprises housing 110, circuit board 120, electronic component 130 and piezoelectric film 140.

Housing 110 is for being opening tubular structure, and housing 110 comprises diapire 112 and sidewall 114, and diapire 112 offers tone-entering hole 116.

Circuit board 120 is arranged at housing 110 opening parts, and by housing 110 opening sealings, circuit board 120 forms host cavity 122 with housing 110, and a circuit board 120 dorsad side of host cavity 122 is formed with the conducting boss 124 that can be electrically connected to client.Housing 110 can the mode by crimping be connected with circuit board 120, or passes through that conducting resinl is direct and circuit board 120 is bonding.

Particularly, the shape of conducting boss 124 can be concentric circles or square shape.Wherein, what Fig. 2 represented is that conducting boss 124 is concentric circles, and this conducting boss 124 comprises inner ring boss and outer ring boss, and inner ring boss can form output cathode, outer ring boss can form output negative pole, is greater than the area of output cathode to realize the area of output negative pole.What Fig. 3 represented is that conducting boss 124 is square, and this conducting boss 124 is 2 and symmetrical, is respectively output cathode and output negative pole.Adopt concentric circles or square shape, simple in structure, be convenient to produce.Be appreciated that the shape of conducting boss 124 can also polygon etc. be other shape, as long as conducting boss 124 can make circuit board 120 be electrically connected to client.

Electronic component 130 is arranged at circuit board 120, and is contained in host cavity 122.Electronic component 130 generally includes IC and filter element etc.

Piezoelectric film 140 is contained in host cavity 122, piezoelectric film 140 comprises input layer 142, substrate layer 144 and ground plane 146, substrate layer 144 is between input layer 142 and ground plane 146, input layer 142 and ground plane 146 be electrical connection corresponding to circuit board 120 respectively, and tone-entering hole 116 falls in piezoelectric film 140 in circuit board 120 orthographic projection directions.Wherein, input layer 142 and ground plane 146 are oppositely arranged, input layer 142 and ground plane 146 all can be formed at respectively by the mode of plated electrode substrate layer 144 surfaces, and for integral type designs, good pressure-resistant performance, so that when microphone and client are assembled, suction nozzle can directly adsorb the piezoelectric film 140 at corresponding tone-entering hole 116 places, without set up separately miaow cover before absorption, also having avoided the absorption position because of piezoelectric film 140 fragile suction nozzles can only be housing 110 diapires 112 other positions except tone-entering hole 116, simplify assembling flow path, raise the efficiency.And tone-entering hole 116 is positioned at housing 110 diapire 112 centers conventionally, be conducive to microphone stress balance in transport process of absorption, can run-off the straight.Input layer 142 is made by metal material, and for the input electrode as piezoelectric film 140, ground plane 146 is also to be made by metal material, for the earth terminal as piezoelectric film 140.Substrate layer 144 is made by exotic material, and the temperature of bearing is at least 260 degree, so that microphone and groups of clients are put into when row Reflow Soldering is welded, does not deform, and has expanded the range of application of this microphone.This substrate layer 144 can be by polytetrafluoroethylene (polytetrafluoroethylene, PTFE) material is made, also can be by polytetrafluoroethylene and fluorinated ethylene propylene copolymer (Fluorinated ethylene propylene, FEP) the stacked formation of the two material, adopts this stepped construction to be conducive to improve heat resistance.Other parts of being made by nonmetallic materials of this piezo-electric electret microphone all can be made by exotic material, and the temperature of bearing is at least 260 degree.

Above-mentioned piezo-electric electret microphone, by circuit board 120 dorsad a side of host cavity 122 form the conducting boss 124 can being electrically connected to client, can be directly and client mount, without offering separately through hole, stitch is installed, save manufacturing procedure, enhance productivity, and cost-saving.

Refer to Fig. 1, in an embodiment, piezo-electric electret microphone comprises becket 150 therein, and becket 150 one end are electrically connected to piezoelectric film 140 input layers 142, the other end is electrically connected to circuit board 120, and piezoelectric film 140 input layers 142 are by becket 150 electrical connection corresponding to circuit board 120.So, by becket 150 is set, realize the object that the input electrode of piezoelectric film 140 input layers 142 is electrically connected to circuit board 120 corresponding circuits, simple in structure, easy to connect.Becket 150 can be copper ring, good conductivity.

Refer to Fig. 1, in an embodiment, piezo-electric electret microphone comprises dead ring 160 therein, and dead ring 160 is contained in host cavity 122, and is arranged between becket 150 and housing 110 sidewalls 114.Conventionally housing 110 is made by metal material, and the ground plane 146 of piezoelectric film 140 and housing 110 diapire 112 laminatings, make piezoelectric film 140 by housing 110 ground connection.By between becket 150 and housing 110 sidewalls 114, dead ring 160 being set, so that becket 150 arranges with housing 110 insulation.Dead ring 160 is made by resistant to elevated temperatures material, and the temperature of bearing is to be also at least 260 degree, to carry out when Reflow Soldering is welded, does not deform.The material of this dead ring 160 can be PTFE or polyether-ether-ketone (Polyether Ether Ketone, PEEK) etc.Even if it is pointed out that dead ring 160 is not set, as by piezoelectric film 140 edges to a lateral buckling etc., also can realize the object that becket 150 and housing 110 insulation arrange.

Refer to Fig. 4, therein in an embodiment, housing 110 comprises the first housing 111 and the second housing 113, circuit board 120 comprises first circuit board 121 and second circuit board 123, and conducting boss 124 comprises can mate with second circuit board 123 the first conducting boss 126 being electrically connected to and second conducting boss 128 that can be electrically connected to client.

First circuit board 121 is arranged at the first housing 111 opening parts, and by the first housing 111 opening sealings, first circuit board 121 and the first housing 111 form the first host cavity 125, and piezoelectric film 140 is contained in the first host cavity 125.Piezoelectric film 140 input layers 142 are attached at first circuit board 121, piezoelectric film 140 can be attached at first circuit board 121 by conducting resinl and be electrically connected to the input corresponding with first circuit board 121, and the earth terminal that piezoelectric film 140 ground planes 146 are corresponding with first circuit board 121 is electrically connected to.Tone-entering hole 116 is opened in the first housing 111 diapires, tone-entering hole 116 falls in piezoelectric film 140 in first circuit board 121 orthographic projection directions, the first conducting boss 126 is formed at first circuit board 121 side of the first host cavity 125 dorsad, and first circuit board 121 can mate electrical connection with second circuit board 123 by the first conducting boss 126.Wherein, first circuit board 121 can, for comprising the circuit board 120 of the complicated cabling of single-layer double-side, can be also the circuit board 120 of the complicated cabling of multilayer.

Second circuit board 123 is arranged at the second housing 113 opening parts, and by the second housing 113 opening sealings, second circuit board 123 and the second housing 113 form the second host cavity 127, electronic component 130 is arranged at second circuit board 123, and be contained in the second host cavity 127, the second conducting boss 128 and be formed at second circuit board 123 side of host cavity 122 dorsad.Second circuit board 123 is formed with by the second conducting boss 128 connecting electrode matching with client.Wherein, second circuit board 123 can, for comprising the circuit board 120 of the complicated cabling of single-layer double-side, can be also the circuit board 120 of the complicated cabling of multilayer.

So, first circuit board 121 is electrically connected to second circuit board 123 by the first conducting boss 126, and second circuit board 123 is electrically connected to client by the second conducting boss 128, adopts the form of boss to mount, and saves manufacturing procedure, enhances productivity.Meanwhile, by the first housing 111 and the second housing 113 are set, first circuit board 121 and second circuit board 123 are set, the first housing 111 forms the first host cavity 125 with first circuit board 121, the second housing 113 forms the second host cavity 127 with second circuit board 123, piezoelectric film 140 is arranged to the first host cavity 125, electronic component 130 is arranged at the second host cavity 127, be about to piezoelectric film 140 is arranged with electronic component for 130 minutes, when piezoelectric film 140 is damaged or need changes piezoelectric film 140, only piezoelectric film 140 parts need be replaced with other qualified new piezoelectric film, without changing whole microphone, cost-saving, and it is convenient to change.

Refer to Fig. 4, therein in an embodiment, piezo-electric electret microphone comprises conductive tape 170, and piezoelectric film 140 ground planes 146 are electrically connected to by conductive tape 170 earth terminal corresponding with first circuit board 121, and the first housing 111 adheres to first circuit board 121.So, can pass through at first circuit board 121 the local coated with conductive glue for being connected with the first housing 111, then place the first housing 111 in first circuit board 121, treat that curing first housing 111 that can make of conducting resinl is bonding with first circuit board 121, workable, connect easy.

Refer to Fig. 5, therein in an embodiment, piezo-electric electret microphone comprises conductive tape 170, piezoelectric film 140 ground planes 146 are electrically connected to by conductive tape 170 earth terminal corresponding with first circuit board 121, the first housing 111 is put along the edge ring winding of first circuit board 121, between first circuit board 121 and the first housing 111 diapires, is provided with the first support ring 180.So, 180 supporting roles of stepping down of the first support ring.By the first housing 111, along the edge ring winding of first circuit board 121, put, be conducive to dwindle the volume of first circuit board 121, be convenient to miniaturization.

Refer to Fig. 6, in an embodiment, the first housing 111 is pressed on first circuit board 121 therein, ground plane 146 and the first housing 111 diapire laminatings, and ground plane 146 is electrically connected to by the first housing 111 earth terminal corresponding with first circuit board 121.So, the first housing 111 is directly pressed on first circuit board 121, the edge of first circuit board 121 and the first housing 111 sidewalls offset, be convenient to miniaturization, the input layer 142 of piezoelectric film 140 and first circuit board 121 laminatings, ground plane 146 and the first housing 111 diapire laminatings, ground plane 146 is electrically connected to by the first housing 111 earth terminal corresponding with first circuit board 121, piezoelectric film 140 also plays a supportive role, cost-saving.

Refer to Fig. 4, in an embodiment, second circuit board 123 comprises the reserved portion for being connected with first circuit board 121 couplings therein, and the side that first circuit board 121 is formed with the first conducting boss 126 is arranged at reserved portion.So, by reserved portion is set, first by suction nozzle, draw second circuit board 123 and be mounted on client correspondence position, by the second conducting boss 128, be electrically connected to client, at first circuit board 121, reserved portion applies tin cream, first circuit board 121 is mounted on to the reserved portion of second circuit board 123, finally carries out reflow soldering and assembled.The second housing 113 can adhere to second circuit board 123 by conducting resinl.It is to be noted, even if reserved portion is not set, as the connecting circuit of reserved and the first conducting boss 126 and the second conducting boss 128 respectively in client, respectively first circuit board 121 is provided with to a side of the first conducting boss 126 and a side that second circuit board 123 is provided with the second conducting boss 128 and is directly mounted on client, also can realize first circuit board 121 and be electrically connected to second circuit board 123, and the object being finally electrically connected to client.

Refer to Fig. 7, in an embodiment, when first circuit board 121 is not provided with reserved portion, the second housing 113 can be put along the edge ring winding of second circuit board 123, between second circuit board 123 and the second housing 113 ground walls, is provided with the second support ring 190 therein.So, 190 supporting roles of stepping down of the second support ring.By the second housing 113, along the edge ring winding of second circuit board 123, put, be conducive to dwindle the volume of second circuit board 123, be convenient to miniaturization.

The above embodiment has only expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.

Claims

1. a piezo-electric electret microphone, is characterized in that, comprising:

2. piezo-electric electret microphone according to claim 1, it is characterized in that, comprise becket, described becket one end is electrically connected to described piezoelectric film input layer, the other end is electrically connected to described circuit board, and described piezoelectric film input layer is by the electrical connection corresponding to described circuit board of described becket.

3. piezo-electric electret microphone according to claim 2, is characterized in that, comprises the dead ring of being made by exotic material, and described dead ring is contained in described host cavity, and is arranged between described becket and described housing sidewall.

4. piezo-electric electret microphone according to claim 1, it is characterized in that, described conducting boss be shaped as concentric circles or square shape, the described conducting boss of concentric circles comprises the inner ring boss that can form output cathode and the outer ring boss that can form output negative pole.

5. piezo-electric electret microphone according to claim 1, it is characterized in that, described housing comprises the first housing and the second housing, described circuit board comprises first circuit board and second circuit board, and described conducting boss comprises can mate with described second circuit board the first conducting boss being electrically connected to and second conducting boss that can be electrically connected to client;

6. piezo-electric electret microphone according to claim 5, it is characterized in that, comprise conductive tape, described piezoelectric film ground plane is electrically connected to by the described conductive tape earth terminal corresponding with described first circuit board, and described the first housing adheres to described first circuit board.

7. piezo-electric electret microphone according to claim 5, it is characterized in that, comprise conductive tape, described piezoelectric film ground plane is electrically connected to by the described conductive tape earth terminal corresponding with described first circuit board, described the first housing is put along the edge ring winding of described first circuit board, between described first circuit board and described the first shell bottom wall, is provided with the first support ring.

8. piezo-electric electret microphone according to claim 5, it is characterized in that, described the first housing is pressed on described first circuit board, described ground plane and described the first shell bottom wall laminating, and described ground plane is electrically connected to by described the first housing earth terminal corresponding with described first circuit board.

9. piezo-electric electret microphone according to claim 5, it is characterized in that, described second circuit board comprises the reserved portion for being connected with described first circuit board coupling, and the side that described first circuit board is formed with the first conducting boss is arranged at described reserved portion.

10. piezo-electric electret microphone according to claim 5, is characterized in that, described the second housing is put along the edge ring winding of described second circuit board, between described second circuit board and described the second shell bottom wall, is provided with the second support ring.