CN202068568U - Electret capacitor microphone - Google Patents
Electret capacitor microphone Download PDFInfo
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- CN202068568U CN202068568U CN2011201637288U CN201120163728U CN202068568U CN 202068568 U CN202068568 U CN 202068568U CN 2011201637288 U CN2011201637288 U CN 2011201637288U CN 201120163728 U CN201120163728 U CN 201120163728U CN 202068568 U CN202068568 U CN 202068568U
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- capacitor microphone
- electret capacitor
- conductive layer
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Abstract
The utility model discloses an electret capacitor microphone. A substrate of the electret capacitor microphone comprises a groove-shaped substrate framework with one opening end, a circuit layer is arranged on the inner bottom surface and extends into the frame, and the opening end of the substrate frame is step-shaped. A first support face is arranged above the substrate framework on the outside, and a second support face is arranged under the substrate framework on the inside. A capacitor assembly is arranged above the second support face, and a metal casing is arranged above the first support face. A first conductive layer is arranged on the first support face, the substrate framework is provided with a first through hole respectively connected with the first conductive layer and the circuit layer, and a first electric connection piece is arranged in the first through hole. A second conductive layer is arranged on the second support face, the substrate framework is provided with a second through hole respectively connected with the second conductive layer and the circuit layer, and a second electric connection piece is arranged in the second through hole. The electret capacitor microphone reduces the number of parts of products, enables the structure of the products to be more better and simpler, reduces a plurality of processes in a whole assembly process, simplifies production process of the products and improves production efficiency.
Description
Technical field
The utility model relates to the electret capacitor microphone technical field.
Background technology
Existing electret capacitor microphone, its structure mainly comprise the external frame of being enclosed by groove shape shell and wiring board, externally are provided with capacitance component in the framework.Capacitance component mainly comprises vibrating diaphragm and the back pole plate that constitutes plane-parallel capacitor the two poles of the earth, between vibrating diaphragm and back pole plate, be provided with annular gasket and provide oscillation space for vibrating diaphragm, between vibrating diaphragm and shell, be provided with the conduction ring that shakes, vibrating diaphragm is by conduction being electrically connected of ring and shell realization and wiring board of shaking, and back pole plate is normally by being arranged on the conducting ring realization of groove shape shell inboard and being electrically connected of wiring board, and between conducting ring and shell, be provided with the insulation support ring, avoid product inner member in the pressing process to cause damage.Its operation principle is: the sound hole as sound process case surface enters electret capcitor microphone inside, at first act on the vibrating diaphragm, vibration by vibrating diaphragm, change the distance between plane-parallel capacitor the two poles of the earth that vibrating diaphragm and back pole plate form, produce the signal of telecommunication, and then realize the purpose of acoustic-electric conversion.
Structure of the prior art, component number is many, causes and is manufacturing middle complex process, is not easy to install, and production efficiency is low.And current, along with the development of technology, market to the demand of product towards miniaturization, even microminiaturized development, thereby, small product size is required more and more littler, it is littler that product component is done, component number is numerous, is unfavorable for more installing.In addition, in the prior art, the two poles of the earth of plane-parallel capacitor realize and being electrically connected of wiring board that by metal shell and conducting ring the relative area between metal shell and the conducting ring is bigger respectively, and both parasitic capacitances of generation are bigger, reduced properties of product.And in the prior art, normally with pressure metal shell is done crimping and wiring board and realize fixingly, the processing technology more complicated is difficult for realizing.
Summary of the invention
Technical problem to be solved in the utility model is: a kind of electret capacitor microphone is provided, reduced the quantity of product component, product structure is optimized succinctly more, a plurality of links in whole assembling process, have been reduced, simplified the production technology of product, improve production efficiency, increased production stability, and helped realizing automated production.
For solving the problems of the technologies described above, the technical solution of the utility model is: electret capacitor microphone comprises:
External frame by substrate and metal shell are enclosed is equipped with electronic devices and components on described substrate, be provided with sound hole on described metal shell;
Be installed on the capacitance component in the described external frame, to the metal shell side, described capacitance component comprises back pole plate, pad and the vibrating diaphragm assembly that sets gradually by substrate-side, is provided with the electret layer at a side surface of the close described vibrating diaphragm assembly of described back pole plate;
Described substrate comprises the substrate skeleton of the groove shape of an end opening, the inner bottom surface of described substrate skeleton is provided with circuit layer and extends to the inside of substrate skeleton, described electronic devices and components are installed on the described circuit layer, the openend of described substrate skeleton be step-like have be positioned at the outside and first supporting surface of top and be positioned at the inboard and second supporting surface of below, described back pole plate, pad and vibrating diaphragm assembly are placed on described second supporting surface top successively, and described metal shell is positioned over described first supporting surface top;
On described first supporting surface, be provided with first conductive layer, on described substrate skeleton, offer respectively first through hole that is connected with described circuit layer with described first conductive layer, in described first through hole, be provided with first electrical connector;
On described second supporting surface, be provided with second conductive layer, on described substrate skeleton, offer respectively second through hole that is connected with described circuit layer with described second conductive layer, in described second through hole, be provided with second electrical connector.
As a kind of optimized technical scheme, described substrate skeleton is the substrate skeleton that ceramic material forms.
As a kind of optimized technical scheme, described ceramic material is a glass ceramics.
As a kind of optimized technical scheme, described substrate skeleton comprises sintering upper strata skeleton, middle level skeleton and lower floor's skeleton together, described upper strata skeleton and described middle level skeleton constitute the edge of described groove shape substrate skeleton, described middle level skeleton is wider than described upper strata skeleton and both are in conjunction with being step-like, described lower floor skeleton constitutes the bottom of described groove shape substrate skeleton, and described lower floor skeleton is provided with described circuit layer towards a side of middle level skeleton.
As a kind of optimized technical scheme, described metal shell is a tabular.
As a kind of optimized technical scheme, described electret capacitor microphone is square.
After having adopted technique scheme, the beneficial effects of the utility model are:
1. the utility model uses the substrate of a novel structure, has replaced wiring board of the prior art, conducting ring and three parts of support ring, makes structure optimize more succinctly.Substrate comprises the substrate skeleton of the groove shape of an end opening, the bottom is provided with circuit layer and extends to skeleton inside within it, its port is step-like, on two supporting surfaces that form conductive layer is set respectively, back pole plate, pad and vibrating diaphragm assembly are successively set on second supporting surface of inboard and below, back pole plate is by second conductive layer on second supporting surface and be located at intraskeletal second electrical connector of substrate and realize being electrically connected with circuit layer, and vibrating diaphragm passes through metal shell, first conductive layer on first supporting surface of the substrate skeleton port outside and top and be located at intraskeletal first electrical connector of substrate and realize and being electrically connected of circuit layer.Because reduced amount of parts, and the reasonable in design of substrate, back pole plate, pad and vibrating diaphragm assembly are positioned over successively on second supporting surface of substrate skeleton inboard and get final product, easy to assembly quick, in whole assembling process, reduce a plurality of links, simplified the production technology of product, improved production efficiency, increase production stability, and helped realizing automated production.
2. the substrate skeleton of the utility model substrate adopts ceramic material to form, the preferential glass ceramic material that adopts, it has very high heat resistance, whole lifting the heat resistance of electret capacitor microphone, head and shoulders above the heatproof limitation of existing electret capacitor microphone, for electret capacitor microphone provides sound assurance in the suitability for industrialized production of subsequent applications product.
3. the utility model substrate comprises groove shape substrate skeleton, on the substrate skeleton, offer through hole, first electrical connector and second electrical connector are set in through hole, be respectively applied for and realize that vibrating diaphragm assembly, back pole plate are electrically connected with circuit layer, not only resistivity is low, and first relative area between electrical connector and second electrical connector little, the parasitic capacitance of generation is less, has improved the performance of product.
4. compared with prior art, substrate comprises groove shape substrate skeleton, metal shell is a tabular, the packaging technology of substrate and shell, do not need equipment to do the action of crimping,, tin cream is added to be put on the metal shell in the reflow soldering tin cream is melted as long as use advanced now production technology SMT, make metal shell and substrate strong bond together, simple machining process has more been arranged before.
5. the whole square structure that adopts of the utility model has been broken through the restriction of traditional electret capacitor microphone circle, and effectively having solved traditional circular electret capacitor microphone SMT can't pinpoint problem.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is the decomposition texture schematic diagram of the utility model embodiment;
Fig. 2 is the cutaway view of the utility model embodiment;
Among the figure: 1. metal shell, 11. sound holes, 2. vibrating diaphragm assembly, 21. vibrating diaphragms, the ring 22. shake, 3. pad, 4. back pole plate, 41. electret layers, 5. substrate, 51. substrate skeletons, 511. upper strata skeletons, 512. middle level skeletons, 513. lower floor's skeleton, 52. circuit layers, A. first supporting surface, 531. first conductive layer, 532. first electrical connectors, B. second supporting surface, 541. second conductive layer, 542. second electrical connector, 6. electronic devices and components.
Embodiment
In the following description, only the mode by explanation is described some one exemplary embodiment of the present utility model, undoubtedly, those of ordinary skill in the art can recognize, under the situation that does not depart from spirit and scope of the present utility model, can revise described embodiment with various mode.Therefore, accompanying drawing and be described in just illustratively in essence rather than is used to limit the protection range of claim.In addition, in this manual, identical Reference numeral indicates identical part.
As depicted in figs. 1 and 2, a kind of electret capacitor microphone.Its integral body is square, comprises the external frame of being enclosed by substrate 5 and metal shell 1, and is installed on the capacitance component in the external frame.
Be provided with the electronic devices and components 6 that signal is handled and carried out impedance conversion in the side of substrate 5 in external frame, in this implementation process, electronic devices and components 6 are by preposition amplification of built-in voice signal and digitized processing application-specific integrated circuit chip, make this electret capacitor microphone have low-voltage, low-power consumption, low noise, high performance characteristics.On metal shell 1, be provided with sound hole 11.Externally in the framework capacitance component is installed, by substrate 5 sides to metal shell 1 side, capacitance component comprises back pole plate 4, pad 3 and the vibrating diaphragm assembly 2 that sets gradually, and vibrating diaphragm assembly 2 comprises vibrating diaphragm 21 and the conduction ring 22 that shakes, and vibrating diaphragm 21 and back pole plate 4 constitutes two electrodes of plane-parallel capacitors.Side surface at back pole plate 4 close vibrating diaphragm assemblies 2 is provided with electret layer 41, can provide the quantity of electric charge for capacitance component; Pad 3 provides the space for ring-type for the vibration of vibrating diaphragm 21.
Wherein, substrate skeleton 51 comprises sintering upper strata skeleton 511, middle level skeleton 512 and lower floor's skeleton 513 together, upper strata skeleton 511 and middle level skeleton 512 constitute the edge of groove shape substrate skeleton, middle level skeleton 512 is wider than upper strata skeleton 511 and both are in conjunction with being step-like, lower floor's skeleton 513 constitutes the bottom of groove shape substrate skeleton, and circuit layer 52 is arranged at the side of lower floor's skeleton 513 towards middle level skeleton 512.
The step-like openend that substrate skeleton 51 is formed by upper strata skeleton 511 and middle level skeleton 512, have the first supporting surface A that is positioned at the outside and top and be positioned at the inboard and the second supporting surface B of below, back pole plate 4, pad 3 and vibrating diaphragm assembly 2 are placed on second supporting surface B top successively.On the second supporting surface B, be provided with second conductive layer 541, on substrate skeleton 51, offer respectively second through hole that is connected with circuit layer 52 with second conductive layer 541, be provided with second electrical connector 542 in second through hole, this second electrical connector 542 can be realized by fill metal powder in second through hole.Back pole plate 4 is realized being electrically connected with a polarity of circuit layer 52 by second conductive layer 541 and second electrical connector 542.
When the utility model carries out the assembling of product, because amount of parts reduces, and the reasonable in design of substrate 5, the second supporting surface B that back pole plate 4, pad 3 and vibrating diaphragm assembly 2 are positioned over substrate skeleton 51 port inboards successively upward gets final product, and is easy to assembly quick, reduced a plurality of links in whole assembling process, simplified the production technology of product, improve production efficiency, increased production stability, and helped realizing automated production.In addition, the packaging technology of substrate 51 and shell 1, do not need equipment to do the action of crimping, as long as with advanced now production technology SMT, tin cream is added to be put in the reflow soldering on the metal shell 1 tin cream is melted, make metal shell 1 and substrate 5 strong bond together, simple machining process has more been arranged before.
Under above-mentioned instruction of the present utility model; those skilled in the art can carry out various improvement and distortion on the basis of the foregoing description; and these improvement and distortion; all drop in the protection range of the present utility model; those skilled in the art should be understood that; above-mentioned specific descriptions are just better explained the purpose of this utility model, and protection range of the present utility model is limited by claim and equivalent thereof.
Claims (6)
1. electret capacitor microphone comprises:
External frame by substrate and metal shell are enclosed is equipped with electronic devices and components on described substrate, be provided with sound hole on described metal shell;
Be installed on the capacitance component in the described external frame, to the metal shell side, described capacitance component comprises back pole plate, pad and the vibrating diaphragm assembly that sets gradually by substrate-side, is provided with the electret layer at a side surface of the close described vibrating diaphragm assembly of described back pole plate;
It is characterized in that: described substrate comprises the substrate skeleton of the groove shape of an end opening, the inner bottom surface of described substrate skeleton is provided with circuit layer and extends to the inside of substrate skeleton, described electronic devices and components are installed on the described circuit layer, the openend of described substrate skeleton be step-like have be positioned at the outside and first supporting surface of top and be positioned at the inboard and second supporting surface of below, described back pole plate, pad and vibrating diaphragm assembly are placed on described second supporting surface top successively, and described metal shell is positioned over described first supporting surface top;
On described first supporting surface, be provided with first conductive layer, on described substrate skeleton, offer respectively first through hole that is connected with described circuit layer with described first conductive layer, in described first through hole, be provided with first electrical connector;
On described second supporting surface, be provided with second conductive layer, on described substrate skeleton, offer respectively second through hole that is connected with described circuit layer with described second conductive layer, in described second through hole, be provided with second electrical connector.
2. electret capacitor microphone as claimed in claim 1 is characterized in that: described substrate skeleton is the substrate skeleton that ceramic material forms.
3. electret capacitor microphone as claimed in claim 2 is characterized in that: described substrate skeleton is the substrate skeleton that glass ceramic material is made.
4. electret capacitor microphone as claimed in claim 3, it is characterized in that: described substrate skeleton comprises sintering upper strata skeleton, middle level skeleton and lower floor's skeleton together, described upper strata skeleton and described middle level skeleton constitute the edge of described groove shape substrate skeleton, described middle level skeleton is wider than described upper strata skeleton and both are in conjunction with being step-like, described lower floor skeleton constitutes the bottom of described groove shape substrate skeleton, and described lower floor skeleton is provided with described circuit layer towards a side of middle level skeleton.
5. as the described electret capacitor microphone of the arbitrary claim of claim 1 to 4, it is characterized in that: described metal shell is a tabular.
6. electret capacitor microphone as claimed in claim 5 is characterized in that: described electret capacitor microphone is square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201637288U CN202068568U (en) | 2011-05-21 | 2011-05-21 | Electret capacitor microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201637288U CN202068568U (en) | 2011-05-21 | 2011-05-21 | Electret capacitor microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202068568U true CN202068568U (en) | 2011-12-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201637288U Expired - Fee Related CN202068568U (en) | 2011-05-21 | 2011-05-21 | Electret capacitor microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202068568U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102158786A (en) * | 2011-05-21 | 2011-08-17 | 创达电子(潍坊)有限公司 | Electret condenser microphone |
-
2011
- 2011-05-21 CN CN2011201637288U patent/CN202068568U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102158786A (en) * | 2011-05-21 | 2011-08-17 | 创达电子(潍坊)有限公司 | Electret condenser microphone |
| WO2012159536A1 (en) * | 2011-05-21 | 2012-11-29 | 创达电子(潍坊)有限公司 | Electret condenser microphone |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111207 Termination date: 20140521 |