CN202218394U - Electret capacitor microphone - Google Patents
Electret capacitor microphone Download PDFInfo
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- CN202218394U CN202218394U CN201120284267XU CN201120284267U CN202218394U CN 202218394 U CN202218394 U CN 202218394U CN 201120284267X U CN201120284267X U CN 201120284267XU CN 201120284267 U CN201120284267 U CN 201120284267U CN 202218394 U CN202218394 U CN 202218394U
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Abstract
The utility model discloses an electret capacitor microphone. A base plate of the electret capacitor microphone comprises a slotted base plate framework, one end of the slotted base plate framework is opened; a circuit layer, a first support surface and a second support surface are arranged on an inner bottom surface of the slotted base plate framework, the opened end of the first support surface is in shape of a stage, the first support surface is arranged at the outer side and the upper part of the slotted base plate framework, the second support surface is arranged at the inner side and the lower part of the slotted base plate framework, and conductive layers are respectively arranged on the first support surface and the second support surface. A metal shell is arranged on the first support surface, and a capacitor assembly comprises a back pole plate and a vibrating diaphragm which are sequentially arranged on the second support surface. The back pole plate comprises a central part and two end parts which are integrally arranged, and an electret material layer is arranged at one side of the back pole plate close to the vibrating diaphragm; the two end parts are supported on the second support surface, and a vibration space is formed between an inner groove of the central part facing to the slotted base plate framework and the vibrating diaphragm; and edge parts of the two end parts and edge parts of the central part form a gap concave inwards, and spaces of the two sides of the central part are communicated through the gap. The electret capacitor microphone has the advantages of reducing the number of components and parts, simplifying production process, improving assembly efficiency and the hole-opening way of the back pole plate and increasing the sensitivity of products.
Description
Technical field
The utility model relates to the electret capacitor microphone technical field.
Background technology
Existing electret capacitor microphone, its structure mainly comprises the external frame of being enclosed by groove shape shell and wiring board, externally is provided with capacitance component in the framework.Capacitance component mainly comprises vibrating diaphragm and the back pole plate that constitutes plane-parallel capacitor the two poles of the earth; Between vibrating diaphragm and back pole plate, being provided with annular gasket is that diaphragm provides oscillation space; Vibrating diaphragm is realized and being electrically connected of wiring board through metal shell; And back pole plate is normally through being arranged on that the inboard conducting ring of groove shape shell is realized and being electrically connected of wiring board, and between conducting ring and shell, is provided with the insulation support ring, avoids product inner member in the pressing process to cause damage.
Structure of the prior art, component number is many, causes and is manufacturing middle complex process, is not easy to install, and production efficiency is low.The two poles of the earth of plane-parallel capacitor realize and being electrically connected of wiring board that through metal shell and conducting ring the relative area between metal shell and the conducting ring is bigger respectively, and both parasitic capacitances of generation are bigger, reduced properties of product.
The back pole plate that uses in the existing electret capacitor microphone all is the certain orientation boring of portion within it, mainly is to guarantee diaphragm when vibration, and the ante-chamber that electret capacitor microphone is inner and the air pressure of back cavity are balanced.But in view of the vibration of diaphragm more near central point, its susceptibility is strong more, and back pole plate is near the mode of center perforate; In the time of can making the diaphragm vibration; The back pole plate position of opening does not form capacitance body, has reduced the susceptibility of vibration, and electret capacitor microphone sensitivity is low.
Vibrating diaphragm in the existing electret capacitor microphone, the structure that it is shaped as side foreign side in comprises that outward flange is the square rigidity ring that shakes, rigidity is shaken the endoporus of ring also for square, is close to the diaphragm that is fixed with the covering square inner bore shaking to encircle.The vibrating diaphragm of said structure has very big restriction to the vibration of diaphragm, because vibration is expanded from putting face; That is to say that energy all is therefrom mind-set outdiffusion, because endoporus is square, has four right angles; So when radius vector runs into limit and four right angles of endoporus in communication process, have a kind of uneven opposite energy reflection, under the influence of reaction force; Can propagate uniform radius vector and produce bad interference, make the harmonic distortion of diaphragm big, thereby reduce the vibration performance of diaphragm.Influence the sensitivity and the reliability of condenser microphone.
Summary of the invention
The utility model technical problem to be solved is: a kind of electret capacitor microphone is provided, has reduced the quantity of product component, product structure is optimized succinctly more, simplified the production technology of product, reduced the assembling link, improved production efficiency; Improved the perforate mode of back pole plate and the structure of vibrating diaphragm, the sensitivity that has improved electret capacitor microphone has improved product quality.
For solving the problems of the technologies described above; The technical scheme of the utility model is: electret capacitor microphone; Comprise the external frame of enclosing by substrate and metal shell; On said substrate, electronic devices and components are installed, on said metal shell, are provided with sound hole, in said external frame, capacitance component is installed;
Said substrate comprises the substrate skeleton of the groove shape of an end opening; The inner bottom surface of said substrate skeleton is provided with circuit layer and extends to the inside of substrate skeleton; Said electronic devices and components are installed on the said circuit layer, the openend of said substrate skeleton be step-like have be positioned at the outside and first supporting surface of top and be positioned at the inboard and second supporting surface of below;
On first supporting surface of said substrate skeleton, be provided with first conductive layer, on said substrate skeleton, offer respectively first through hole that is connected with said circuit layer with said first conductive layer, in said first through hole, be provided with first electrical connector;
On second supporting surface of said substrate skeleton, be provided with second conductive layer, on said substrate skeleton, offer respectively second through hole that is connected with said circuit layer with said second conductive layer, in said second through hole, be provided with second electrical connector;
Said capacitance component comprises back pole plate and the vibrating diaphragm on second supporting surface that is positioned over said substrate skeleton successively;
Said back pole plate comprise the central part that is positioned at the centre position and be positioned at two ends and with two ends of said central part one, said central part and said two ends are provided with the electret layer near the surface of said vibrating diaphragm one side; Said two ends at grade and be supported on second supporting surface of said substrate skeleton, said central part forms oscillation space between the inner recess of said substrate skeleton and said vibrating diaphragm; The limit portion of said two ends and the limit portion of said central part constitute the breach that concaves, the space of the said central part of said breach conducting both sides;
Said metal shell is positioned on first supporting surface of said substrate skeleton.
As a kind of optimized technical scheme, said substrate skeleton is the substrate skeleton that glass ceramic material is made.
As a kind of optimized technical scheme, said vibrating diaphragm comprises: outward flange is the square rigidity ring that shakes, and the shake endoporus of ring of said rigidity is a slotted hole; Be fixed in the said rigidity ring that shakes and go up cover the diaphragm of said endoporus.
As a kind of optimized technical scheme, said metal shell is a tabular.
As a kind of optimized technical scheme, said electret capacitor microphone is square.The central part of said back pole plate and two ends are square, and said central part and said two ends constitute " worker " font.
After having adopted technique scheme, the beneficial effect of the utility model is:
1. the utility model uses the substrate of a novel structure, has replaced wiring board of the prior art, conducting ring and three parts of support ring, makes structure optimization succinct, and is simple for assembly process.In the assembling process; Back pole plate in the capacitance component and vibrating diaphragm are positioned over successively on second supporting surface of substrate skeleton and get final product; Back pole plate through second conductive layer on second supporting surface be located at intraskeletal second electrical connector of substrate and realize being electrically connected with circuit layer, vibrating diaphragm is through first conductive layer on metal shell, first supporting surface and be located at being electrically connected of intraskeletal first electrical connector realization of substrate and circuit layer.Because reduced amount of parts, simplified the production technology of product, and the reasonable in design of substrate; Capacitance component is installed on the second inboard supporting surface of substrate skeleton, and is easy to assembly quick, reduced the assembling link; Improve production efficiency, increased production stability.
2. the substrate skeleton of the utility model substrate adopts glass ceramic material to be made; It has very high heat resistance; Whole lifting the heat resistance of electret capacitor microphone; Head and shoulders above the heatproof limitation of existing electret capacitor microphone, for electret capacitor microphone provides sound assurance in the suitability for industrialized production of subsequent applications product.
3. the back pole plate of the utility model comprises central part and two ends that are wholely set, and is provided with the electret layer near the surface of vibrating diaphragm one side, has the effect of insulation and stored charge.Two ends at grade; One side contacts with vibrating diaphragm through the electret layer on surface; Opposite side is supported on second supporting surface of substrate skeleton; Central part forms oscillation space between the inner recess of substrate skeleton and vibrating diaphragm, played the effect of traditional electret capcitor microphone Intermediate gasket.Therefore, parts of the back pole plate of the utility model replace back pole plate of the prior art and two parts of pad, structurally reduce by parts, and convenient assembling processing has improved production efficiency.
The back pole plate of the utility model, compared with prior art, its not perforate of center, the limit portion of two ends and the limit portion of central part constitute the breach that concaves, and the space of these breach conducting central part both sides is as the via of balanced air pressure.In the electret capacitor microphone, the vibration of diaphragm is more near central point, and its susceptibility is strong more; The back pole plate of the utility model, the central part corresponding with diaphragm are integrated entity, have increased effective usable floor area of back pole plate; During the diaphragm vibration; Whole central part forms capacitance body, makes the susceptibility of vibration improve, and the high sensitivity that helps electret capacitor microphone is more made.
3. the vibrating diaphragm of the utility model, its rigidity petticoat that shakes is square, and endoporus is a slotted hole, and diaphragm is fixed in the rigidity ring that shakes and goes up and cover endoporus.The design of endoporus has made full use of the outer square length of shaking and encircling, and has increased the area of the diaphragm that is used to vibrate, the sensitivity that has improved microphone.Adopt slotted hole, the two ends arc-shaped transition of endoporus, whole interior bore edges does not have flex point; Make that the tension force of diaphragm is seamlessly transitted; So energy is outwards to propagate by radius vector equably, also be even passback even run into the reaction force of the edge generation of endoporus, can not cause vibration originally and disturb and harmful effect; Make the harmonic distortion of diaphragm little on the whole, can fully reach good vibration performance.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the utility model is further specified.
Fig. 1 is the decomposition texture sketch map of the utility model embodiment.
Fig. 2 is the cutaway view of the utility model embodiment.
Fig. 3 is the structural representation of back pole plate among the utility model embodiment.
Fig. 4 is the profile of Fig. 3.
Fig. 5 is the installation diagram of back pole plate and substrate among the utility model embodiment.
Fig. 6 is the installation diagram of back pole plate and vibrating diaphragm among the utility model embodiment.
Fig. 7 is the structural representation of vibrating diaphragm among the utility model embodiment.
Among the figure: 1. metal shell, 11. sound holes, 2. vibrating diaphragm, 21. rings that shake, 22. endoporus, 23. diaphragms; 3. back pole plate, 31. central parts, 32. ends, 33. breach, 34. electret layer, 4. substrates; 41. the substrate skeleton, 411. upper strata skeletons, 412. middle level skeletons, 413. lower floor's skeletons, 42. circuit layers, A. first supporting surface; 431. first conductive layer, 432. first electrical connectors, B. second supporting surface, 441. second conductive layers, 442. second electrical connector, 5. electronic devices and components.
Embodiment
In the following description; Only some example embodiment of the utility model is described through the mode of explanation; Undoubtedly; Those of ordinary skill in the art can recognize, under the situation of spirit that does not depart from the utility model and scope, can revise described embodiment with various mode.Therefore, accompanying drawing be described in just illustratively in essence, rather than be used to limit the protection range of claim.In addition, in this manual, identical Reference numeral indicates identical part.
As depicted in figs. 1 and 2, a kind of electret capacitor microphone, it comprises the external frame of being enclosed by substrate 4 and metal shell 1, and is installed on the capacitance component in the external frame.Integral body is square structure, has broken through the circular restriction of traditional electret capacitor microphone, and effectively having solved traditional circular electret capacitor microphone SMT can't pinpoint problem.
Be provided with the electronic devices and components 5 that signal is handled and carried out impedance conversion in the side of substrate 4 in external frame; In this implementation process; Electronic devices and components 5 make this electret capacitor microphone have low-voltage, low-power consumption through preposition amplification of built-in voice signal and digitized processing application-specific integrated circuit chip; Low noise, high performance characteristics.On metal shell 1, be provided with sound hole 11.
Wherein, Substrate skeleton 41 comprises sintering upper strata skeleton 411, middle level skeleton 412 and lower floor's skeleton 413 together; The edge of upper strata skeleton 411 and middle level skeleton 412 formation groove shape substrate skeletons; Middle level skeleton 412 is wider than upper strata skeleton 411 and both combinations are step-like, and lower floor's skeleton 413 constitutes the bottom of groove shape substrate skeleton, and circuit layer 42 is arranged at a side of lower floor's skeleton 413 skeleton 412 towards the middle level.
Substrate skeleton 41 is had the first supporting surface A that is positioned at the outside and top and is positioned at the inboard and the second supporting surface B of below by the step-like openend that upper strata skeleton 411 and middle level skeleton 412 form,
On the first supporting surface A, be provided with first conductive layer 431; On substrate skeleton 41, offer respectively first through hole that is connected with circuit layer 42 with first conductive layer 431; In first through hole, be provided with first electrical connector 432, this first electrical connector 432 can be realized through in first through hole, filling metal powder.
On the second supporting surface B, be provided with second conductive layer 441; On substrate skeleton 41, offer respectively second through hole that is connected with circuit layer 42 with second conductive layer 441; In second through hole, be provided with second electrical connector 442, this second electrical connector 442 can be realized through in second through hole, filling metal powder.
Capacitance component comprises the back pole plate 3 and vibrating diaphragm 2 on the second supporting surface B that is positioned over substrate skeleton 4 successively.
Wherein, Extremely shown in Figure 6 like Fig. 3; Back pole plate 3 comprise the central part 31 that is positioned at the centre position and be positioned at two ends and with two ends 32 of central part 31 one; Central part 31 and two ends 32 are provided with electret layer 34 near the surface of vibrating diaphragm 2 one sides, and electret layer 34 plays the effect of insulation and stored charge.Two ends 32 at grade; One side contacts with vibrating diaphragm 2 through the electret layer 34 on surface; Opposite side is supported on the second supporting surface B of substrate skeleton 4; Central part 31 forms oscillation space between the inner recess of substrate skeleton 4 and vibrating diaphragm 2, played the effect of traditional electret capcitor microphone Intermediate gasket.Therefore, the utility model replaces back pole plate of the prior art and two parts of pad with parts of back pole plate, structurally reduces by parts, and convenient assembling processing has improved production efficiency.
In the present embodiment; Central part 31 and two ends 32 are square, and central part 31 and two ends 32 constitute " worker " fonts, the breach 33 that the limit portion of two ends 32 and the limit portion of central part 31 formation concave; The space of breach 33 conducting central parts 31 both sides is as the via of balanced air pressure.Adopt said structure; Back pole plate 3 is an integrated entity with vibrating diaphragm 2 corresponding central parts 1; Increased effective usable floor area of back pole plate 3, during vibrating diaphragm 2 vibrations, whole central part 1 forms capacitance body; Make the susceptibility of vibration improve, the high sensitivity that helps electret capacitor microphone is more made.
The processing technology of above-mentioned back pole plate: the side at the conductive metal sheet that is used to process back pole plate covers one deck electret layer; Reduce through machinery then and leave breach in the both sides of conductive metal sheet; Then central part is carried out punch forming and get final product, press depth can be regulated as required.
As shown in Figure 7, vibrating diaphragm 2 comprises that outward flange is the square rigidity ring 21 that shakes, and this rigidity ring 21 that shakes is made by electric conducting material, and the shake endoporus 22 of ring 21 of this rigidity is slotted hole, comprises that also being fixed in rigidity shakes and cover the diaphragm 23 of endoporus 22 on the ring 21.Diaphragm 23 comprises plastic film layers, and the metallic diaphragm that is coated with at a side surface of plastic film layers, the structure of diaphragm 23 and the specification that material can adopt other existing diaphragm certainly.Adopt above-mentioned design, endoporus 22 is a slotted hole, has made full use of the length of the outer square ring that shakes, and has increased the area of the diaphragm 23 that is used to vibrate, the sensitivity that has improved microphone.The two ends arc-shaped transition of endoporus 22; Whole endoporus 22 edges do not have flex point, make that the tension force of diaphragm 23 is seamlessly transitted, so energy is outwards to propagate by radius vector equably; Even running into the reaction force of the edge generation of endoporus 22 also is even passback; Can not cause interference and harmful effect to vibration originally, make the harmonic distortion of diaphragm 23 little on the whole, can fully reach good vibration performance.
Above-mentioned back pole plate 3 is realized being electrically connected with a polarity of circuit layer 42 through second conductive layer 441 and second electrical connector 442.Metal shell 1 is a tabular, is positioned on the first supporting surface A of substrate skeleton, and 21 contacts with the rigidity ring that shakes.Vibrating diaphragm 2 is realized being electrically connected with a polarity of circuit layer 42 through metal shell 1, first conductive layer 431 and first electrical connector 432.Not only resistivity is low to be used to realize first electrical connector 432 that two electrodes of plane-parallel capacitor are electrically connected with substrate and second electrical connector 442, and relative area between the two is little, and the parasitic capacitance of generation is less, has improved performance of products.
The packaging technology of substrate 4 and shell 1; Do not need equipment to do the action of crimping; As long as with advanced now production technology SMT; Tin cream is added to be put on the metal shell 1 in the reflow soldering tin cream is melted, make metal shell 1 and substrate 4 strong bond together, simple machining process has more been arranged before.
Under the above-mentioned instruction of the utility model; Those skilled in the art can carry out various improvement and distortion on the basis of the foregoing description; And these improvement and distortion all drop in the protection range of the utility model, and those skilled in the art should be understood that; Above-mentioned specific descriptions are just better explained the purpose of the utility model, and the protection range of the utility model is limited claim and equivalent thereof.
Claims (6)
1. electret capacitor microphone comprises the external frame of being enclosed by substrate and metal shell, on said substrate, electronic devices and components is installed, and on said metal shell, is provided with sound hole, in said external frame, capacitance component is installed; It is characterized in that:
Said substrate comprises the substrate skeleton of the groove shape of an end opening; The inner bottom surface of said substrate skeleton is provided with circuit layer and extends to the inside of substrate skeleton; Said electronic devices and components are installed on the said circuit layer, the openend of said substrate skeleton be step-like have be positioned at the outside and first supporting surface of top and be positioned at the inboard and second supporting surface of below;
On first supporting surface of said substrate skeleton, be provided with first conductive layer, on said substrate skeleton, offer respectively first through hole that is connected with said circuit layer with said first conductive layer, in said first through hole, be provided with first electrical connector;
On second supporting surface of said substrate skeleton, be provided with second conductive layer, on said substrate skeleton, offer respectively second through hole that is connected with said circuit layer with said second conductive layer, in said second through hole, be provided with second electrical connector;
Said capacitance component comprises back pole plate and the vibrating diaphragm on second supporting surface that is positioned over said substrate skeleton successively;
Said back pole plate comprise the central part that is positioned at the centre position and be positioned at two ends and with two ends of said central part one, said central part and said two ends are provided with the electret layer near the surface of said vibrating diaphragm one side; Said two ends at grade and be supported on second supporting surface of said substrate skeleton, said central part forms oscillation space between the inner recess of said substrate skeleton and said vibrating diaphragm; The limit portion of said two ends and the limit portion of said central part constitute the breach that concaves, the space of the said central part of said breach conducting both sides;
Said metal shell is positioned on first supporting surface of said substrate skeleton.
2. electret capacitor microphone as claimed in claim 1 is characterized in that: said substrate skeleton is the substrate skeleton that glass ceramic material is made.
3. electret capacitor microphone as claimed in claim 1 is characterized in that, said vibrating diaphragm comprises:
Outward flange is the square rigidity ring that shakes, and the shake endoporus of ring of said rigidity is a slotted hole;
Be fixed in the said rigidity ring that shakes and go up cover the diaphragm of said endoporus.
4. like the described electret capacitor microphone of the arbitrary claim of claim 1 to 3, it is characterized in that: said metal shell is a tabular.
5. electret capacitor microphone as claimed in claim 4 is characterized in that: said electret capacitor microphone is square.
6. electret capacitor microphone as claimed in claim 5 is characterized in that: the central part of said back pole plate and two ends are square, and said central part and said two ends constitute " worker " font.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120284267XU CN202218394U (en) | 2011-08-05 | 2011-08-05 | Electret capacitor microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120284267XU CN202218394U (en) | 2011-08-05 | 2011-08-05 | Electret capacitor microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202218394U true CN202218394U (en) | 2012-05-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120284267XU Expired - Fee Related CN202218394U (en) | 2011-08-05 | 2011-08-05 | Electret capacitor microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202218394U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115767401A (en) * | 2022-10-17 | 2023-03-07 | 苏州清听声学科技有限公司 | Foldable directional sounding device, display device and preparation process |
-
2011
- 2011-08-05 CN CN201120284267XU patent/CN202218394U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115767401A (en) * | 2022-10-17 | 2023-03-07 | 苏州清听声学科技有限公司 | Foldable directional sounding device, display device and preparation process |
| CN115767401B (en) * | 2022-10-17 | 2023-12-08 | 苏州清听声学科技有限公司 | Foldable directional sounding device, display device and preparation process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120509 Termination date: 20130805 |