CN202310097U - Silicon microphone - Google Patents
Silicon microphone Download PDFInfo
- Publication number
- CN202310097U CN202310097U CN201120425007XU CN201120425007U CN202310097U CN 202310097 U CN202310097 U CN 202310097U CN 201120425007X U CN201120425007X U CN 201120425007XU CN 201120425007 U CN201120425007 U CN 201120425007U CN 202310097 U CN202310097 U CN 202310097U
- Authority
- CN
- China
- Prior art keywords
- upper plate
- waterproof membrane
- cavity
- microphone
- silicon micro
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 34
- 239000010703 silicon Substances 0.000 title claims abstract description 34
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 239000012528 membrane Substances 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 6
- 238000010276 construction Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 7
- 230000035945 sensitivity Effects 0.000 abstract description 5
- 238000004806 packaging method and process Methods 0.000 abstract 3
- 239000000428 dust Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Abstract
The utility model discloses a silicon microphone which comprises an external packaging structure, wherein the external packaging structure is formed by an upper plate, a hollow cavity and a circuit board baseplate which are combined from top to bottom; the baseplate is provided with a silicon acoustic chip and an electrical signal processing chip; the upper plate is provided with at least two sound inlet holes; the upper plate and the cavity are provided with a shielding layer electrically connected with the grounding terminal of a circuit board; the interior of the packaging structure is fixedly provided with a waterproof membrane adhered to the sound inlet holes; and the waterproof membrane is electrically connected with the shielding layer of the upper plate and/or the cavity. By the design, better waterproof and dustproof effects can be realized, and the product sensitivity loss can be reduced; and the waterproof membrane is connected to the shielding layer of a product, so that the electromagnetic shielding effect of the product is ensured.
Description
Technical field
The utility model relates to the acoustical-electrical transducer field, is specifically related to a kind of silicon micro-microphone.
Background technology
The development of terminal consumption electronic product, miniature acoustic-electric transition period such as MEMS microphone (Micro-Electro-Mechanical-Systems-Microphone) in batches is applied to the consumer electronics product field gradually.In the practical application of silicon micro-microphone, when satisfying low-cost and high performance requirements, generally also require it to have the dust and water protection function, this becomes a difficult problem of silicon micro-microphone design.
Traditional silicon micro-microphone dustproof and waterproof design can be carried out miniaturization Design with sound hole.Though the actual minimizing assembling procedure that has is being produced in this design; But when the sound hole was arranged on the metal shell of silicon micro-microphone, because the product design requirement, the thickness of metal shell was generally below 0.1 millimeter; Micropore is difficult to realize dustproof and waterproof effect preferably generally more than 100 microns.
In the improvement to above-mentioned traditional structure; Generally through on sound hole, covering waterproof membrane, as shown in Figure 3 in the prior art, silicon micro-microphone comprises the metal cap 1 that is formed by the metal upper plate 11 of one, cavity 12; And the outer enclosure structure of wiring board base plate 2 formation; Upper plate 11 is provided with sound hole 13, and silicon acoustics chip and signal of telecommunication process chip 4 are installed on base plate 2, on sound hole 13, is coated with waterproof membrane 5 '.This design can realize water proof and dust proof effect preferably, but requires waterproof membrane 5 comparatively fine and close in the design, but the design of fine and close waterproof membrane has formed certain acoustic resistance to silicon micro-microphone, causes the loss of sensitivity of silicon micro-microphone integral product.
Simultaneously, above-mentioned design when silicon micro-microphone adopts Shielding Design, can reduce the shielding properties of product equally.
So, be necessary the silicon micro-microphone of said structure is further improved, to avoid above-mentioned defective.
Summary of the invention
The utility model technical problem to be solved is: to the silicon micro-microphone of traditional structure in the actual product structural design with the water proof and dust proof and the electromagnetic shielding defective that exist in to the properties of product influence; The utility model provides a kind of can realize better water proof and dust proof effect; And can reduce influence, reduce the loss of product sensitivity properties of product.
For solving the problems of the technologies described above; The technical scheme of the utility model is: a kind of silicon micro-microphone; Comprise the upper plate, the cavity of hollow and the outer enclosure structure that the wiring board base plate forms that combine by from top to bottom, silicon acoustics chip and signal of telecommunication process chip are installed on the said base plate, said upper plate is provided with sound hole; Said upper plate and said cavity are provided with the screen that is connected electrically in said wiring board earth terminal; And: said sound hole is for being at least two, and the internal fixation of said encapsulating structure has the waterproof membrane that pastes on said sound hole, and said waterproof membrane is electrically connected the screen of said upper plate and/or said cavity.
As a kind of optimized technical scheme, the cavity of said upper plate and said hollow is the metal cap construction of one.
As a kind of optimized technical scheme, said waterproof membrane comprises an intermediate layer and is positioned at the said intermediate layer conductive layer on two surfaces up and down.
As a kind of optimized technical scheme, said conductive layer is the coat of metal.
As a kind of optimized technical scheme, the inner cavity wall of said encapsulating structure is provided with installation portion, and said waterproof membrane is installed on the said installation portion.
After having adopted technique scheme, the beneficial effect of the utility model is: the silicon micro-microphone of the utility model can be realized water proof and dust proof effect preferably, has reduced the loss of product sensitivity; And adopt waterproof membrane to be connected on the screen of product, guaranteed the effectiveness of product.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the utility model is further specified.
Fig. 1 is the cutaway view of the utility model embodiment silicon micro-microphone;
Fig. 2 is the cutaway view of the utility model embodiment silicon micro-microphone waterproof membrane;
Fig. 3 is the cutaway view of the silicon micro-microphone of prior art;
Among the figure: the 1-metal cap; The 11-upper plate; The 12-lower plate; The 13-sound hole; 2-wiring board base plate; 3-silicon acoustics chip; 4-signal of telecommunication process chip; 5,5 '-waterproof membrane.
Embodiment
In the following description; Only some example embodiment of the utility model is described through the mode of explanation; Mother is mediocre to doubt; Those of ordinary skill in the art can recognize, under the situation of spirit that does not depart from the utility model and scope, can revise described embodiment with various mode.Therefore, accompanying drawing be described in just illustratively in essence, rather than be used to limit the protection range of claim.In addition, in this manual, identical Reference numeral indicates identical part.
Embodiment:
Fig. 1 is the cutaway view of the utility model embodiment silicon micro-microphone; Fig. 2 is the cutaway view of the utility model embodiment silicon micro-microphone waterproof membrane; As depicted in figs. 1 and 2, silicon micro-microphone comprises the upper plate 11 that combines, the cavity 12 of hollow from top to bottom; And wiring board base plate 2 formed outer enclosure structures; Upper plate 11 is provided with first sound hole 13, and the encapsulating structure set inside has the silicon acoustics chip 4 and signal of telecommunication process chip 3 that is installed on the wiring board base plate 2, and wherein upper plate 11 has Shielding Design with cavity 12; Be electrically connected on the earth terminal 21 on the wiring board base plate 2; And: sound hole 13 be at least two each and every one, be provided with the waterproof membrane 5 that is attached on the sound hole 13 in the inside of encapsulating structure, waterproof membrane 5 is electrically connected on the Shielding Design of upper plates 11 and/or cavity 12.
This design, owing to the waterproof membrane 5 that pastes on sound hole 13 is arranged in the internal fixation of encapsulating structure, and on the Shielding Design of waterproof membrane 5 electrical connection upper plates 11 and/or cavity 12, can realize waterproof and dustproof effect preferably; Because sound hole 13 is at least two, the driving area of a plurality of sound hole 13 designs increase sound holes 13 makes waterproof membrane 5 that sound wave is delivered on the silicon acoustics chip 4 preferably, thereby has reduced the loss of product sensitivity simultaneously; And waterproof membrane 5 is electrically connected to the Shielding Design of upper plate 11 and/or cavity 12, has guaranteed the anti-capability of electromagnetic shielding of product.
In this implementation process, upper plate 11 is the metal cap construction of one with cavity 12, and cavity 12 is electrically connected on the earth terminal 21.This design can better meet the miniaturization demand of product design.Upper plate 11 also can be materials such as wiring board with cavity 12 in this implementation process, realizes design of Electromagnetic Shielding through carry out electroplated conductive layer on the surface.
In addition, in this implementation process, preferred, waterproof membrane comprises an intermediate layer 52 and the conductive layer 51 that is positioned at two surfaces about in the of 52, intermediate layer, and this design can realize water proof and dust proof and effectiveness preferably; Intermediate layer 52 can be resin or soft plastics, conductive layer 51 coat of metal preferably in this implementation process, and the 52 enterprising electroplatings designs in the intermediate layer, technology is more simple in the production reality; In addition, preferred for ease of the assembling of waterproof membrane 5, inner cavity 12 sidewalls of encapsulating structure are provided with installation portion 6, and waterproof membrane 5 is installed on the installation portion 6.
More than show and described basic principle of the utility model and the advantage of principal character and the utility model.The technical staff of the industry should understand; The utility model is not restricted to the described embodiments; Under the prerequisite that does not break away from the utility model spirit and scope, the utility model also has various changes and modifications, and these variations and improvement all fall in the utility model scope that requires protection.The utility model requires protection range to be defined by appending claims and equivalent thereof.
Claims (5)
1. silicon micro-microphone; Comprise the upper plate, the cavity of hollow and the outer enclosure structure that the wiring board base plate forms that combine by from top to bottom; Silicon acoustics chip and signal of telecommunication process chip are installed on the said base plate; Said upper plate is provided with sound hole, and said upper plate and said cavity are provided with the screen that is connected electrically in said wiring board earth terminal, it is characterized in that: said sound hole is for being at least two; The internal fixation of said encapsulating structure has the waterproof membrane that pastes on said sound hole, and said waterproof membrane is electrically connected the screen of said upper plate and/or said cavity.
2. a kind of silicon micro-microphone according to claim 1 is characterized in that,
The cavity of said upper plate and said hollow is the metal cap construction of one.
3. a kind of silicon micro-microphone according to claim 1 and 2 is characterized in that,
Said waterproof membrane comprises an intermediate layer and is positioned at the said intermediate layer conductive layer on two surfaces up and down.
4. a kind of silicon micro-microphone according to claim 3 is characterized in that,
Said conductive layer is the coat of metal.
5. a kind of silicon micro-microphone according to claim 1 is characterized in that,
The inner cavity wall of said encapsulating structure is provided with installation portion, and said waterproof membrane is installed on the said installation portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120425007XU CN202310097U (en) | 2011-10-31 | 2011-10-31 | Silicon microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120425007XU CN202310097U (en) | 2011-10-31 | 2011-10-31 | Silicon microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202310097U true CN202310097U (en) | 2012-07-04 |
Family
ID=46378904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120425007XU Expired - Lifetime CN202310097U (en) | 2011-10-31 | 2011-10-31 | Silicon microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202310097U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104113818A (en) * | 2014-07-18 | 2014-10-22 | 瑞声声学科技(深圳)有限公司 | Silicon substrate microphone encapsulation method |
| CN104185099A (en) * | 2013-05-28 | 2014-12-03 | 上海耐普微电子有限公司 | Micromechanical microphone and electronic device containing same |
-
2011
- 2011-10-31 CN CN201120425007XU patent/CN202310097U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104185099A (en) * | 2013-05-28 | 2014-12-03 | 上海耐普微电子有限公司 | Micromechanical microphone and electronic device containing same |
| CN104113818A (en) * | 2014-07-18 | 2014-10-22 | 瑞声声学科技(深圳)有限公司 | Silicon substrate microphone encapsulation method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20200615 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120704 |
|
| CX01 | Expiry of patent term |