CN201114763Y

CN201114763Y - A silicon speaker

Info

Publication number: CN201114763Y
Application number: CNU2007200580411U
Authority: CN
Inventors: 温增丰; 郑虎鸣; 贺志坚
Original assignee: Transound Electronics Co Ltd
Current assignee: Transound Electronics Co Ltd
Priority date: 2007-10-09
Filing date: 2007-10-09
Publication date: 2008-09-10
Anticipated expiration: 2017-10-09

Abstract

The utility model relates to a silicon microphone which comprises an outer casing, a first circuit board and a second circuit board. The outer casing is matched with the first circuit board to compose a first cavity. A silicon film unit is arranged on the first circuit board. A through hole is opened on the first circuit board and corresponding to the lower part of the position where the silicon film unit is arranged. The second circuit board is overlapped on the first circuit board and a second cavity is formed between the second circuit board and the first circuit board. A sound hole is arranged on the second circuit board. The second cavity is communicated with the external air through the sound hole. A sound channel used for the silicon film unit to be communicated with the external air is composed of the sound hole, the second cavity and the through hole in a way of connecting. And the large enclosed first cavity structure which is composed of the outer casing and the first circuit board can satisfy the back cavity condition of the silicon microphone well and is provided with good frequency response and sensitivity performances. In addition, the second cavity structure of the utility model for the sound entering is composed of two circuit boards which are in a way of overlapped assembly and has the advantages of simple structure and convenient processing. And the requirement for zero height installation of the sound entering hole of a patch microphone can be realized.

Description

A kind of silicon microphone

Technical field

The utility model relates to the microphone art, refer in particular to a kind of simple in structure, easy to process, the silicon microphone that antijamming capability is stronger.

Background technology

Along with developing rapidly of current science and technology, also obtained significant progress in the microphone art, everybody uses maximum electret capacitor microphone (ECM) to be replaced by a kind of new silicon microphone before, utilization MEMS (micro electro mechanical system) (Microelectromechanicalsystems; MEMS) the made silicon microphone of technology is compared with the electret microphone (ECM) of tradition, and its main advantage is: efficiency production in a large number; Microcircuit easy and other effect is integrated; Realize digitlization easily; Thermal endurance is strong, can bear 260 ℃ high temperature reflux welding; Uniform quality and stability are high, and is all very stable in the performance of different temperatures, can not be subjected to the influence of temperature, vibration, humidity and time; Volume is little, is suitable for use in the short and small frivolous Application Design or the like.

The structure of existing silicon microphone mainly is made up of parts such as shell and wiring boards, is welded with electric elements such as electric capacity, silicon fiml and chip on the wiring board, and the sound hole is arranged on the shell or on the wiring board.The structure that present sound on the market hole is arranged on the wiring board has two kinds, a kind of is the structure (with reference to Fig. 1) of direct perforate 1 below the sound chamber of silicon fiml, the anti-interference in air flow ability of this kind structure is relatively poor, and the back drop that is easy to appearance " puff, puff " in the use causes the distorted signals phenomenon serious; Another kind of long sound channel sound pore structure (with reference to Fig. 2) on a wiring board, making Z-shaped passage 2, though the antijamming capability of this kind structure increases, desirable not enough, do not reach the needs of signal requirements at the higher level, and its fabrication and processing complexity, unfavorable market competition.

The utility model content

The utility model is at the defective of prior art existence, and main purpose provides a kind of simple in structure, easy to process, the silicon microphone that antijamming capability is stronger.

For achieving the above object, the utility model adopts following technical scheme:

A kind of silicon microphone, comprise shell, first wiring board and second wiring board, this shell matches with first wiring board and forms first cavity, first wiring board is provided with the silicon fiml unit, and on first wiring board to offering a through hole below the residing position, silicon fiml unit, above-mentioned silicon fiml unit is positioned at first cavity; Second wiring board is folded on first wiring board, and and first wiring board between form second cavity, this second cavity is connected with aforementioned through-hole; Second wiring board is provided with the hole, and aforementioned second cavity is in communication with the outside by this hole.

Through hole one segment distance is departed from described sound hole.

Above-mentioned first wiring board is provided with the recess that one and second wiring board forms above-mentioned second cavity.

Above-mentioned second wiring board is provided with the recess that one and first wiring board forms above-mentioned second cavity.

Respectively be provided with a recess that can complement each other to form above-mentioned second cavity on above-mentioned first circuit and second wiring board.

The utility model compared with prior art, its beneficial effect is to be connected to form a sound channel that supplies the silicon fiml unit to communicate with outside air by sound hole, second cavity and through hole, outer signals is transferred on the silicon fiml unit by this sound channel, because will be in its transmission course through second cavity structure than large space, thereby make silicon microphone have superpower anti-airflow noise interference performance, can effectively avoid the generation of distorted signals phenomenon.And the big first airtight cavity structure that the shell and first wiring board form can finely satisfy silicon wheat back cavity condition, makes it have frequency response preferably and sensitivity behaviour.In addition, second cavity structure that the utility model advances sound is formed by two stacked assembly of wiring board, and is simple in structure, easy to process, and can realize the requirement that paster microphone sound hole zero elevation is installed.

Description of drawings

Fig. 1 is the silicon microphone concrete structure of a prior art;

Fig. 2 is the silicon microphone concrete structure of another prior art;

Fig. 3 is the perspective exploded view of the utility model;

Fig. 4 is the assembly schematic perspective view of the utility model;

Fig. 5 is the schematic cross-section of the utility model.

The accompanying drawing identifier declaration:

1, perforate 2, Z-shaped passage

10, shell

20, first wiring board 21, recess

22, through hole 23, silicon fiml unit

30, second wiring board 31, sound hole

40, first cavity 50, second cavity

Embodiment

The utility model is described in further detail below in conjunction with accompanying drawing and specific embodiment:

Show the concrete structure of this practical embodiment with reference to Fig. 3 to Fig. 5, comprise shell 10, first wiring board 20 and second wiring board 30 of a square indent.

Wherein, shell 10 is fixed in the lower surface of first wiring board 20, and form first cavity 40 with first wiring board 20, can adopt affixed modes such as conducting resinl, scolder welding or reflow soldering between the shell 10 and first wiring board 20, to realize the circuit connection and to be tightly connected, reach the effect of anti-High-frequency Interference and sealing, shell 10 is other materials that metal material or surface are coated with metal.Because this first cavity 40 is bigger closed cavity structure, can finely satisfy silicon wheat back cavity condition, makes it have frequency response preferably and sensitivity behaviour.

Be installed with silicon fiml unit 23 electric elements such as grade on first wiring board, 20 lower surfaces, the place, below, sound chamber corresponding to silicon fiml unit 23 on first wiring board 20 is provided with through hole 22, and this through hole 22 is communicated with aforementioned first cavity 40.

Second wiring board 30 is laminated in the upper surface of first wiring board 20, and first wiring board, 20 upper surfaces are provided with a square recess 21, and this recess 21 and second wiring board 30 are combined to form second cavity 50.

Also be provided with hole 31 on second wiring board 30, through hole 22 1 segment distances are departed from this hole 31, and aforementioned second cavity 50 is in communication with the outside by this hole 31.

By this, be connected to form a sound channel that supplies silicon fiml unit 23 to communicate by sound hole 21, second cavity 50 and through hole 22 with outside air, outer signals is transferred on the silicon fiml unit 23 by this sound channel, because will be in its transmission course through second cavity structure than large space, thereby make silicon microphone have superpower anti-interference in air flow ability, can effectively avoid the generation of distorted signals phenomenon.In addition, second cavity structure of the utility model is formed by two stacked assembly of wiring board, and is simple in structure, easy to process.

The above, it only is a kind of preferred embodiment of the utility model with silicon microphone of preferable audio, be not that technical scope of the present utility model is imposed any restrictions, for example the formation of second cavity 50 also can be by being located at recess 21 mode of the lower surface of second wiring board 30, or the compound mode of recess 21 all is set on first wiring board 20 and second wiring board 30.So every foundation technical spirit of the present utility model all still belongs in the scope of technical solutions of the utility model any trickle modification, equivalent variations and modification that above embodiment did.

Claims

1, a kind of silicon microphone, it is characterized in that: comprise shell, first wiring board and second wiring board, this shell matches with first wiring board and forms first cavity, first wiring board is provided with the silicon fiml unit, and on first wiring board to offering a through hole below the residing position, silicon fiml unit, above-mentioned silicon fiml unit is positioned at first cavity; Second wiring board is folded on first wiring board, and and first wiring board between form second cavity, this second cavity is connected with aforementioned through-hole; Second wiring board is provided with the hole, and aforementioned second cavity is in communication with the outside by this hole.

2, a kind of silicon microphone according to claim 1 is characterized in that: through hole one segment distance is departed from described sound hole.

3, a kind of silicon microphone according to claim 1 is characterized in that: above-mentioned first wiring board is provided with the recess that one and second wiring board forms above-mentioned second cavity.

4, a kind of silicon microphone according to claim 1 is characterized in that: above-mentioned second wiring board is provided with the recess that one and first wiring board forms above-mentioned second cavity.

5, a kind of silicon microphone according to claim 1 is characterized in that: respectively be provided with a recess that can complement each other to form above-mentioned second cavity on above-mentioned first circuit and second wiring board.