CN209419845U - MEMS chip and MEMS microphone - Google Patents
MEMS chip and MEMS microphone Download PDFInfo
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- CN209419845U CN209419845U CN201822123932.1U CN201822123932U CN209419845U CN 209419845 U CN209419845 U CN 209419845U CN 201822123932 U CN201822123932 U CN 201822123932U CN 209419845 U CN209419845 U CN 209419845U
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- mems chip
- substrate
- mems
- glue
- parallel plate
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- 239000003292 glue Substances 0.000 claims abstract description 74
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 239000003990 capacitor Substances 0.000 claims abstract description 25
- 238000009434 installation Methods 0.000 claims description 4
- 230000009194 climbing Effects 0.000 abstract description 12
- 230000000630 rising effect Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010200 validation analysis Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Micromachines (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model discloses a kind of MEMS chip and MEMS microphone, wherein MEMS chip includes substrate and the parallel plate capacitor that is made of vibrating diaphragm and backplane, and substrate and parallel plate capacitor are enclosed the operatic tunes of an opening, and the lateral wall of substrate is equipped with gear glue portion.The utility model MEMS chip on the lateral wall of substrate by being arranged gear glue portion, then in the case where not influencing the overall structure of MEMS chip, increase climb path and the difficulty of climbing of glue, so as to slow down the surface for even preventing glue from rising to MEMS chip, guarantee the normal work of MEMS chip, and in substrate setting gear glue portion be able to use softer MEMS bonding die glue or increase it is thicker to weaken a part of external force, to reduce influence of the external force to MEMS chip.
Description
Technical field
The utility model relates to microphone techniques field, in particular to a kind of MEMS chip and MEMS microphone.
Background technique
MEMS (Micro Electro Mechanical System, Micro Electro Mechanical System) microphone is based on MEMS skill
The microphone of art manufacture, due to the size with Bao Er little, high reliability, high temperature resistant etc. compared with the microphone of traditional technology
Excellent characteristic and be widely used.
MEMS chip is the core component in MEMS microphone, and MEMS chip includes the back pole plate and Bao Eryou of rigid perforated
The vibrating diaphragm of elasticity, back pole plate and vibrating diaphragm collectively constitute a parallel plate capacitor, and MEMS chip is the pressure difference by vibrating diaphragm two sides
Change and is converted to what capacitor's capacity variation worked, thus it is more sensitive to external force, in order to reduce MEMS chip to external force
Sensitivity is increasingly tended to select soft MEMS bonding die glue or increases glue thickness to weaken a part of external force, so that external force
The power for being transmitted to MEMS chip reduces.But softer MEMS bonding die glue and increase glue it is thick after meeting so that glue be easy to climb to
The surface of MEMS chip, while there are small-molecule substances easily to spread in ingredient, so will lead to the sensitizing range MEMS vibration etc.
Exception is to cause sensitivity abnormal.
Utility model content
The main purpose of the utility model is to propose a kind of MEMS chip and MEMS microphone, it is intended to solve glue and be easy to climb
The technical issues of rising to the surface of MEMS chip.
To achieve the above object, the utility model proposes MEMS chip, comprising:
Parallel plate capacitor is made of vibrating diaphragm and backplane；
Substrate, the substrate and the parallel plate capacitor are enclosed the operatic tunes of an opening, on the lateral wall of the substrate
Equipped with gear glue portion.
Optionally, the gear glue portion is the annular groove being provided on the lateral wall of the substrate.
Optionally, the wall surface of the annular groove at a distance from the operatic tunes, from one side of the opening to described parallel
Plate capacitor side is in increase setting.
Optionally, decorative pattern or several salient points are provided on the inner wall of the annular groove.
Optionally, the depth of the annular groove is less than or equal to the half of the base side wall thickness.
Optionally, the gear glue portion is the annular flange being arranged on the lateral wall of the substrate.
Optionally, the annular flange be equipped with it is multiple, multiple annular flanges from an opening side to it is described in parallel
Plate capacitor side is set in distance.
Optionally, the spacing of adjacent two annular flanges is in the direction far from the opening in increase setting.
Optionally, the gear glue portion is also equipped on the inner sidewall of the substrate.
The utility model also proposes a kind of MEMS microphone, including wiring board, shell and MEMS chip, the shell with
The wiring board is enclosed installation space, and the MEMS chip is set on the wiring board in the installation space, wherein described
MEMS chip be include:
Parallel plate capacitor is made of vibrating diaphragm and backplane；
Substrate, the substrate and the parallel plate capacitor are enclosed the operatic tunes of an opening, on the lateral wall of the substrate
Equipped with gear glue portion.
The utility model MEMS chip is not then influencing MEMS chip by the way that gear glue portion is arranged on the lateral wall of substrate
In the case where overall structure, increase climb path and the difficulty of climbing of glue, even glue is prevented to rise to so as to slow down
The surface of MEMS chip guarantees the normal work of MEMS chip, and setting gear glue portion is able to use softer MEMS in substrate
Bonding die glue or increase are thicker to weaken a part of external force, to reduce influence of the external force to MEMS chip.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, the structure that can also be shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structural schematic diagram of one embodiment of the utility model MEMS chip；
Fig. 2 is the structural schematic diagram of another embodiment of the utility model MEMS chip；
Fig. 3 is the structural schematic diagram of the another embodiment of the utility model MEMS chip；
Fig. 4 is the structural schematic diagram of the utility model MEMS chip another embodiment；
Fig. 5 is the structural schematic diagram of the utility model MEMS chip a further embodiment；
Fig. 6 is the structural schematic diagram of another embodiment of the utility model MEMS chip；
Fig. 7 is the structural schematic diagram of the another embodiment of the utility model MEMS chip；
Fig. 8 is the structural schematic diagram of one embodiment of the utility model MEMS microphone.
Drawing reference numeral explanation:
| Label | Title | Label | Title |
| 100 | MEMS chip | 31 | Keep off glue portion |
| 1 | Parallel plate capacitor | 311 | Annular groove |
| 11 | Vibrating diaphragm | 312 | Annular flange |
| 12 | Backplane | 200 | Wiring board |
| 2 | Substrate | 300 | Shell |
| 3 | The operatic tunes |
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, fall within the protection scope of the utility model.
It is to be appreciated that if related in the utility model embodiment directionality instruction (such as upper and lower, left and right, it is preceding,
Afterwards ...), then directionality instruction is only used for explaining opposite between each component under a certain particular pose (as shown in the picture)
Positional relationship, motion conditions etc., if the particular pose changes, directionality instruction is also correspondingly changed correspondingly.
In addition, if relating to the description of " first ", " second " etc. in the utility model embodiment, " first ", " the
Two " etc. description is used for description purposes only, and is not understood to indicate or imply its relative importance or is implicitly indicated meaning
The quantity of the technical characteristic shown." first " is defined as a result, the feature of " second " can explicitly or implicitly include at least one
A this feature.In addition, the meaning of the "and/or" occurred in full text is, and including three schemes arranged side by side, by taking " A and/or B " as an example,
The scheme met simultaneously including A scheme or B scheme or A and B.In addition, the technical solution between each embodiment can be mutual
In conjunction with, but must be based on can be realized by those of ordinary skill in the art, when mutual lance occurs in the combination of technical solution
Shield or cannot achieve when, will be understood that the combination of this technical solution is not present, also not in the protection scope of the requires of the utility model
Within.
The utility model proposes a kind of MEMS chips, are suitable for MEMS microphone.
In the utility model embodiment, as shown in Figure 1 to Figure 3, the MEMS chip 100, comprising: substrate 2 and by vibrating diaphragm
11 and the parallel plate capacitor 1 that constitutes of backplane 12, substrate 2 and parallel plate capacitor 1 are enclosed the operatic tunes 3 of an opening, substrate 2 it is outer
Side wall is equipped with gear glue portion 31.
In the present embodiment, MEMS can be using single backplane 12 or 12 structure of double backplanes, when MEMS is using single backplane 12
When structure, can using backplane 12 upper, vibrating diaphragm 11 lower or backplane 12 under, vibrating diaphragm 11 by the way of upper, when MEMS is adopted
, can be using vibrating diaphragm 11 in centre when with double 12 structures of backplane, two backplanes 12, can be according to reality in the mode of 11 two sides of vibrating diaphragm
Depending on design requirement, it is not specifically limited herein.The structure of substrate 2 is generally cylindrical, and the lid of parallel plate capacitor 1 is closed in substrate 2
Side, with substrate 2 be enclosed one opening the operatic tunes 3.Keep off glue portion 31 can for groove, protrusion, curved structure etc.,
This is not specifically limited, and only needs it that can slow down the surface for even preventing glue from rising to MEMS.In one embodiment, base
Outer 1 side of a lateral edge parallel plate capacitor that is open without leave at bottom 2 is gradually increased.In this way, substrate 2 can form gear by the structure of its own
Glue portion 31.When climbing upwards when glue to the outside wall surface along substrate 2, since the center of gravity of glue is not fallen in substrate 2, in this way, making
Obtaining glue is more difficult to climb upwards.In other embodiments, it is also possible that the interior lateral edge parallel plate capacitor that is open without leave of substrate 2
1 side is gradually increased.In this way, the glue on the inner wall of substrate 2 climbs, difficulty is also increased, so that the effect of gear glue is more preferable.
The utility model MEMS chip 100 is not then influencing MEMS by the way that gear glue portion 31 is arranged on the lateral wall of substrate 2
In the case where the overall structure of chip 100, increase climb path and the difficulty of climbing of glue, even prevents glue so as to slow down
Water rises to the surface of MEMS chip 100, guarantees the normal work of MEMS chip 100, and setting gear 31 energy of glue portion in substrate 2
It is enough thicker to weaken a part of external force using softer MEMS bonding die glue or increase, to reduce external force to MEMS chip 100
It influences.Gear glue portion 31 is arranged in the present embodiment on 2 lateral wall of substrate of MEMS chip 100, is arranged on the inner sidewall of substrate 2
Gear glue portion 31 compares, and since gear glue portion 31 is not located in the operatic tunes 3, then the influence to the acoustical behavior of MEMS microphone is more
It is small, just so, keep off glue portion 31 structure and setting position can more diversified and validation, to realize blocking as far as possible
Glue climbs.
Further, gear glue portion 31 is the annular groove 311 being provided on the lateral wall of substrate 2.
In the present embodiment, the cross-sectional shape of annular groove 311 can be the shape of rule, such as semicircle, trapezoidal, square
Shape is also possible to irregular shape, such as indentation, polygon etc., is not specifically limited herein.The quantity of annular groove 311
Can be one or more, when the quantity of annular groove 311 be it is multiple when, glue climb path and difficulty of climbing it is also corresponding
Increase.In order to further strengthen the difficulty of climbing of glue, annular groove 311 at least has two different width.In other realities
It applies in example, it is also possible that difference is arranged in the spacing between adjacent annular groove 311, the depth of annular groove 311 is set as not
Together, it can equally play and increase glue and climb the effect of difficulty.
Further, as shown in Fig. 2, the wall surface of annular groove 311 at a distance from the operatic tunes 3, from one side of opening to parallel
1 side of plate capacitor is in increase setting.In this way, the wall surface of annular groove 311 rises to annular in glue in setting is inclined outwardly
When in groove 311, center of gravity is not fallen in substrate 2, then can further increase the difficulty of climbing of glue.
Further, decorative pattern or several salient points are provided on the inner wall of annular groove 311.
In the present embodiment, by the way that decorative pattern or several salient points are arranged on the inner wall of annular groove 311, then can increase
Add the roughness of the inner wall of annular groove 311, so that the difficulty of climbing of glue is further increased, so that gear glue effect is more preferable.
Above-mentioned decorative pattern or several salient points can be obtained by etch process.
Depth by increasing annular groove 311 can further increase the difficulty of climbing of glue, but if annular groove
311 depth is too deep, will affect the intensity of substrate 2.Therefore, in order to not influence the intensity of substrate 2, optionally, annular groove 311
Depth be less than or equal to 2 sidewall thickness of substrate half.
Further, referring to figure 4. and Fig. 5, gear glue portion 31 is the annular flange 312 being arranged on the lateral wall of substrate 2.
By the way that annular flange 312, the energy in the case where will not influence the intensity of substrate 2 are arranged on the lateral wall of substrate 2
Enough effects for realizing gear glue.And be arranged on the lateral wall of substrate 2 due to annular flange 312, hardly influence MEMS Mike
The acoustical behavior of wind, therefore the setting position of annular flange 312 can be set according to actual needs.In one embodiment,
The side on 2 lateral wall of substrate close to parallel plate capacitor 1 is arranged in annular flange 312.In this way, preventing annular flange 312
Glue creep be diffused into the surface of MEMS chip 100 effect it is more preferable.The shape of the cross section of annular flange 312 can use more
Kind shape, such as triangle, semicircle, rectangular, trapezoidal, polygon, are not specifically limited herein.In order to further increase glue
Difficulty of creeping, decorative pattern or salient point can be set to increase the coarse of 312 surface of annular flange on the surface of annular flange 312
Degree, naturally it is also possible to so that the outer diameter of annular flange 312 is in that increase is arranged from one side of opening to 1 direction of parallel plate capacitor.
Further, annular flange 312 is equipped with multiple, and multiple annular flanges 312 are from one side of opening to parallel plate capacitor 1 one
Side is set in distance.By the way that multiple annular flanges 312 are arranged, it can more increase creep path and the difficulty of creeping of glue
Degree, significantly more efficient protection MEMS chip 100.
Further, as shown in figure 5, the spacing of adjacent two annular flange 312 is arranged in the direction far from opening in increase.
In this way, being gradually increased the path of creeping of glue along the direction far from opening, then glue is more not easy expansion of climbing
It is scattered to the surface of MEMS chip 100, to will not influence the acoustical behavior of MEMS chip 100.
Further, Fig. 7 is please referred to, gear glue portion 31 is also equipped on the inner sidewall of substrate 2.
In the present embodiment, by be respectively provided on the outboard sidewalls of substrate 2 gear glue portion 31, can complete barrier glue climb
It goes to the path on the surface of MEMS chip 100, so as to be played under the premise of not changing the overall structure of MEMS chip 100
The effect for thoroughly glue being prevented to climb guarantees the normal work of MEMS chip 100, microphone is avoided to fail；And can so it increase
Add it is thicker and using softer bonding die glue to reduce influence of the external force to MEMS chip 100, use the MEMS core to be promoted
The overall performance of the microphone of piece 100.
In a preferred embodiment, as shown in fig. 6, the gear glue portion 31 on 2 lateral wall of substrate is band saw dentalation.It is logical
Cross using this structure, can either increase considerably climb path and difficulty of climbing, and will not structure to substrate 2 and intensity make
Cheng Tai great influences, and the influence to the acoustical behavior of MEMS chip 100 is also very little.Band saw dentalation can be along substrate 2
Opening to 1 direction of parallel plate capacitor extend, be also possible to along substrate 2 circumferentially extending constitute annular or spiral shape.
In other embodiments, gear glue portion 31 can be using the structure of spiral groove or helical flange, no matter gear
Which kind of shape glue portion 31 is set as, and only needs it that can play and blocks glue, increases path of climbing, and improves glue and climbs difficulty i.e.
Can, it is not specifically limited herein.
The utility model also proposes a kind of MEMS microphone, as shown in figure 8, the MEMS microphone include wiring board 200, it is outer
Shell 300 and MEMS chip 100, the specific structure of the MEMS chip 100 is referring to above-described embodiment, since this MEMS microphone uses
Whole technical solutions of above-mentioned all embodiments, therefore at least all brought by the technical solution with above-described embodiment have
Beneficial effect, this is no longer going to repeat them.
Wherein, MEMS can allow for by using above-mentioned MEMS chip 100 by using the utility model MEMS microphone
Connection between chip 100 and wiring board 200 using softer bonding die glue and further increases glue thickness, then can further subtract
Influence of the small external force to MEMS chip 100, to promote the overall performance of MEMS microphone.
The above is only the preferred embodiment of the present invention, and therefore it does not limit the scope of the patent of the utility model,
It is all under the inventive concept of the utility model, equivalent structure made based on the specification and figures of the utility model becomes
It changes, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (10)
1. a kind of MEMS chip characterized by comprising
Parallel plate capacitor is made of vibrating diaphragm and backplane；
Substrate, the substrate and the parallel plate capacitor are enclosed the operatic tunes of an opening, and the lateral wall of the substrate is equipped with
Keep off glue portion.
2. MEMS chip as described in claim 1, which is characterized in that the gear glue portion is the lateral wall for being provided with the substrate
On annular groove.
3. MEMS chip as claimed in claim 2, which is characterized in that the wall surface of the annular groove and the operatic tunes away from
From, from one side of the opening to the parallel plate capacitor side in increase setting.
4. MEMS chip as claimed in claim 3, which is characterized in that be provided on the inner wall of the annular groove decorative pattern or
Several salient points of person.
5. the MEMS chip as described in any one of claim 2 to 4, which is characterized in that the depth of the annular groove is small
In or equal to the base side wall thickness half.
6. MEMS chip as described in claim 1, which is characterized in that the gear glue portion is the lateral wall that the substrate is arranged in
On annular flange.
7. MEMS chip as claimed in claim 6, which is characterized in that the annular flange is equipped with multiple, multiple annulars
Flange is set in distance from one side of the opening to the parallel plate capacitor side.
8. MEMS chip as claimed in claim 7, which is characterized in that the spacing of adjacent two annular flange is far from described
The direction of opening is in increase setting.
9. the MEMS chip as described in any one of Claims 1-4, which is characterized in that on the inner sidewall of the substrate
It is provided with the gear glue portion.
10. a kind of MEMS microphone, which is characterized in that including wiring board, shell and such as any one of claim 1-9 institute
The MEMS chip stated, the shell and the wiring board are enclosed installation space, and it is empty that the MEMS chip is set to the installation
On interior wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822123932.1U CN209419845U (en) | 2018-12-18 | 2018-12-18 | MEMS chip and MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822123932.1U CN209419845U (en) | 2018-12-18 | 2018-12-18 | MEMS chip and MEMS microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209419845U true CN209419845U (en) | 2019-09-20 |
Family
ID=67938667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822123932.1U Active CN209419845U (en) | 2018-12-18 | 2018-12-18 | MEMS chip and MEMS microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209419845U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110958549A (en) * | 2019-12-31 | 2020-04-03 | 歌尔股份有限公司 | A dustproof construction and MEMS microphone packaging structure for MEMS device |
| CN111031461A (en) * | 2019-12-31 | 2020-04-17 | 歌尔股份有限公司 | A dustproof construction and MEMS microphone packaging structure for MEMS device |
| WO2021168902A1 (en) * | 2020-02-25 | 2021-09-02 | 瑞声声学科技(深圳)有限公司 | Mems chip assembly |
-
2018
- 2018-12-18 CN CN201822123932.1U patent/CN209419845U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110958549A (en) * | 2019-12-31 | 2020-04-03 | 歌尔股份有限公司 | A dustproof construction and MEMS microphone packaging structure for MEMS device |
| CN111031461A (en) * | 2019-12-31 | 2020-04-17 | 歌尔股份有限公司 | A dustproof construction and MEMS microphone packaging structure for MEMS device |
| WO2021168902A1 (en) * | 2020-02-25 | 2021-09-02 | 瑞声声学科技(深圳)有限公司 | Mems chip assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200615 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266104 Laoshan Qingdao District North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |