CN204031449U - Silica-based MEMS microphone - Google Patents
Silica-based MEMS microphone Download PDFInfo
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- CN204031449U CN204031449U CN201420430434.0U CN201420430434U CN204031449U CN 204031449 U CN204031449 U CN 204031449U CN 201420430434 U CN201420430434 U CN 201420430434U CN 204031449 U CN204031449 U CN 204031449U
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- vibrating diaphragm
- dorsal pore
- mems microphone
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- silicon base
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Abstract
The utility model embodiment discloses a kind of silica-based MEMS microphone, this microphone comprises: silicon base, be fixed on the vibrating diaphragm above described silicon base, be fixed on the perforation backboard that described vibrating diaphragm deviates from described vibrating diaphragm side, at least one is fixed on the limiting platform on described dorsal pore sidewall, between described limiting platform and described vibrating diaphragm, there is prepared separation, and described limiting platform is less than the distance of described dorsal pore sidewall to described dorsal pore center along described dorsal pore sidewall to the length on dorsal pore center position, thus when described MEMS silica-based microphone is when falling or receive very strong acoustic signals, reduce the probability that described vibrating diaphragm is damaged because Oscillation Amplitude is excessive, improve the signal to noise ratio of described MEMS microphone.
Description
Technical field
The utility model relates to microphone manufacturing technology field, particularly relates to a kind of silica-based MEMS microphone.
Background technology
MEMS microphone, particularly silica-based MEMS microphone, has has researched and developed for many years.Silica-based MEMS microphone due to its potential advantages in miniaturization, performance, reliability, environmental durability, cost and mass production capabilities, and is widely used in many application such as such as mobile phone, panel computer, camera, hearing aids, intelligent toy and monitoring arrangement.
As shown in Figure 1, silica-based MEMS microphone of the prior art comprises: silicon base, is formed with dorsal pore in described silicon base; Be positioned at the vibrating diaphragm above described silicon base and perforation backboard, wherein, have multiple perforation in described perforation backboard, described vibrating diaphragm is between described perforation backboard and described silicon base, and between described vibrating diaphragm and the described perforation back side, there is cavity clearance, thus form variable air gap capacitor.When acoustic signals is acted on described vibrating diaphragm and described perforation backboard by described dorsal pore, when described vibrating diaphragm vibrates under sound wave effect, and there is in described perforation backboard multiple perforation, therefore can not vibrate, thus the electric capacity of the variable air gap capacitor making described vibrating diaphragm and described perforation backboard form is with the described vibration of membrane and changing of shaking, acoustic signals is converted into the signal of telecommunication, to realize the detection to acoustic signals.
But above-mentioned silica-based MEMS microphone, when falling or when having very strong acoustic signals by dorsal pore, is easy to cause vibrating diaphragm to be damaged because Oscillation Amplitude is excessive.
Utility model content
For solving the problems of the technologies described above, the utility model embodiment provides a kind of silica-based MEMS microphone, to reduce silica-based MEMS microphone when falling or when having very strong acoustic signals by dorsal pore, the probability that vibrating diaphragm is damaged because Oscillation Amplitude is excessive.
For solving the problem, the utility model embodiment provides following technical scheme:
A kind of silica-based MEMS microphone, comprising:
Silicon base, has the dorsal pore running through described silicon base in described silicon base;
Be fixed on the vibrating diaphragm above described silicon base, described vibrating diaphragm covers described dorsal pore completely;
Be fixed on the perforation backboard that described vibrating diaphragm deviates from described vibrating diaphragm side, described perforation backboard has multiple perforation, and and between described vibrating diaphragm, there is air gap;
At least one is fixed on the limiting platform on described dorsal pore sidewall, between described limiting platform and described vibrating diaphragm, there is prepared separation, and described limiting platform is less than the distance of described dorsal pore sidewall to described dorsal pore center along described dorsal pore sidewall to the length on dorsal pore center position.
Preferably, described silica-based MEMS microphone comprises multiple limiting platform.
Preferably, described multiple limiting platform is uniformly distributed on the sidewall of described dorsal pore.
Preferably, described silica-based MEMS microphone comprises four limiting platforms.
Preferably, have insulating barrier between described vibrating diaphragm and described silicon base, described insulating barrier is positioned at described silicon substrate surface.
Preferably, also comprise: the dielectric layer between described insulating barrier and described vibrating diaphragm, described dielectric layer is identical along the thickness on described vibrating diaphragm extremely described silicon base direction with described prepared separation along the thickness on described vibrating diaphragm extremely described silicon base direction.
Compared with prior art, technique scheme has the following advantages:
The technical scheme that the utility model embodiment provides, except comprising: except silicon base, vibrating diaphragm, perforation backboard, also comprise at least one and be fixed on limiting platform on described dorsal pore sidewall, between described limiting platform and described vibrating diaphragm, there is prepared separation, thus when described MEMS silica-based microphone is when falling or receive very strong acoustic signals, the Oscillation Amplitude of described limiting platform to described vibrating diaphragm can be utilized to limit, the Oscillation Amplitude of described vibrating diaphragm is limited in described prepared separation, reduces the probability that described vibrating diaphragm is damaged because Oscillation Amplitude is excessive.
And, described limiting platform is less than the distance of described dorsal pore sidewall to described dorsal pore center along described dorsal pore sidewall to the length on dorsal pore center position, make described limiting platform be parallel to described vibrating diaphragm area planar less, namely when acoustic signals reaches in the process of described vibrating diaphragm by described dorsal pore, the obstruction of described limiting platform to described acoustic signals is less, thus make background noise less, improve the sensitivity of described MEMS microphone, namely on the basis reducing the probability that described vibrating diaphragm is damaged because Oscillation Amplitude is excessive, improve the signal to noise ratio of described MEMS microphone.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The structural representation of the silica-based MEMS microphone that Fig. 1 provides for the utility model embodiment;
In the silica-based MEMS microphone that Fig. 2 provides for the utility model embodiment, the vertical view of limiting platform.
Embodiment
Just as described in the background section, silica-based MEMS microphone of the prior art, when falling or when having very strong acoustic signals by dorsal pore, is easy to cause vibrating diaphragm to be damaged because Oscillation Amplitude is excessive.
In view of this, the utility model embodiment provides a kind of silica-based MEMS microphone, comprising:
Silicon base, has the dorsal pore running through described silicon base in described silicon base;
Be fixed on the vibrating diaphragm above described silicon base, described vibrating diaphragm covers described dorsal pore completely;
Be fixed on the perforation backboard that described vibrating diaphragm deviates from described vibrating diaphragm side, described perforation backboard has multiple perforation, and and between described vibrating diaphragm, there is air gap;
At least one is fixed on the limiting platform on described dorsal pore sidewall, between described limiting platform and described vibrating diaphragm, there is prepared separation, and described limiting platform is less than the distance of described dorsal pore sidewall to described dorsal pore center along described dorsal pore sidewall to the length on dorsal pore center position.
In the MEMS microphone that the utility model embodiment provides, described MEMS microphone is except comprising: silicon base, vibrating diaphragm, outside perforation backboard, also comprise at least one and be fixed on limiting platform on described dorsal pore sidewall, between described limiting platform and described vibrating diaphragm, there is prepared separation, thus when described MEMS silica-based microphone is when falling or receive very strong acoustic signals, the Oscillation Amplitude of described limiting platform to described vibrating diaphragm can be utilized to limit, the Oscillation Amplitude of described vibrating diaphragm is limited in described prepared separation, reduce the probability that described vibrating diaphragm is damaged because Oscillation Amplitude is excessive.
And, described limiting platform is less than the distance of described dorsal pore sidewall to described dorsal pore center along described dorsal pore sidewall to the length on dorsal pore center position, make described limiting platform be parallel to described vibrating diaphragm area planar less, namely when acoustic signals reaches in the process of described vibrating diaphragm by described dorsal pore, the obstruction of described limiting platform to described acoustic signals is less, thus make background noise in described MEMS microphone less, improve the sensitivity of described MEMS microphone, namely on the basis reducing the probability that described vibrating diaphragm is damaged because Oscillation Amplitude is excessive, improve the signal to noise ratio of described MEMS microphone.
For enabling above-mentioned purpose of the present utility model, feature and advantage more become apparent, and are described in detail embodiment of the present utility model below in conjunction with accompanying drawing.
Set forth detail in the following description so that fully understand the utility model.But the utility model can be different from alternate manner described here to implement with multiple, those skilled in the art can when doing similar popularization without prejudice to when the utility model intension.Therefore the utility model is not by the restriction of following public concrete enforcement.
As shown in Figure 1, the utility model embodiment provides a kind of silica-based MEMS microphone, comprising:
Silicon base 1, has the dorsal pore 10 running through described silicon base 1 in described silicon base 1;
Be fixed on the vibrating diaphragm 2 above described silicon base 1, described vibrating diaphragm 2 covers described dorsal pore 10 completely;
Be fixed on the perforation backboard 3 that described vibrating diaphragm 2 deviates from described vibrating diaphragm 2 side, described perforation backboard 3 has multiple perforation 30, and and between described vibrating diaphragm 2, there is air gap;
At least one is fixed on the limiting platform 4 on described dorsal pore 10 sidewall, between described limiting platform 4 and described vibrating diaphragm 2, there is prepared separation, and described limiting platform 4 is less than the distance of described dorsal pore 10 sidewall to described dorsal pore 10 center along described dorsal pore 10 sidewall to the length on dorsal pore 10 center position.
It should be noted that, the utility model embodiment does not limit to the length on dorsal pore 10 center position along described dorsal pore 10 sidewall described limiting platform 4, in an embodiment of the present utility model, can in order to reduce silica-based MEMS microphone further when falling or when having very strong acoustic signals by dorsal pore 10, the probability that vibrating diaphragm 2 is damaged because Oscillation Amplitude is excessive, extend the length that described limiting platform 4 is long along described dorsal pore 10 sidewall to dorsal pore 10 center position, in another embodiment of the present utility model, also can in order to improve the signal to noise ratio of described MEMS microphone, shorten the length that described limiting platform 4 is long along described dorsal pore 10 sidewall to dorsal pore 10 center position, as long as ensure that described limiting platform 4 is less than the distance of described dorsal pore 10 sidewall to described dorsal pore 10 center along described dorsal pore 10 sidewall to the length on dorsal pore 10 center position.
Also it should be noted that, the height of the utility model to described prepared separation does not also limit, as long as described prepared separation is less than described vibrating diaphragm 2 apart from the distance bottom described silicon base 1, silica-based MEMS microphone can be reduced to a certain extent when falling or when having very strong acoustic signals by dorsal pore 10, the probability that vibrating diaphragm 2 is damaged because Oscillation Amplitude is excessive, specifically depending on maximum vibration amplitude that described vibrating diaphragm 2 can bear.
In an embodiment of the present utility model, in order to improve the signal to noise ratio of described MEMS microphone, described silica-based MEMS microphone comprises a limiting platform 4, in another embodiment of the present utility model, in order to reduce silica-based MEMS microphone further when falling or when having very strong acoustic signals by dorsal pore 10, the probability that vibrating diaphragm 2 is damaged because Oscillation Amplitude is excessive, described silica-based MEMS microphone comprises multiple limiting platform 4, the utility model does not limit this, specifically depends on the circumstances.
It should be noted that, when the MEMS microphone that the utility model embodiment provides comprises multiple limiting platform 4, described multiple limiting platform 4 is preferably uniformly distributed, but the utility model does not limit this, in other embodiments of the present utility model, described multiple limiting platform 4 also can uneven distribution.
In a specific embodiment of the present utility model, as shown in Figure 2, described MEMS microphone preferably includes four limiting platforms 4, described four limiting platforms 4 are uniformly distributed on the sidewall of described dorsal pore 10, to reduce silica-based MEMS microphone when falling or when having very strong acoustic signals by dorsal pore 10, on the Probability Basis that vibrating diaphragm 2 is damaged because Oscillation Amplitude is excessive, ensure the signal to noise ratio of described MEMS microphone.
On the basis of above-mentioned any embodiment, in an embodiment of the present utility model, between described vibrating diaphragm 2 and described perforation backboard 3, there is separator 5, described separator 5 has the first through hole 50, and described first through hole 50 covers described dorsal pore 10 at described perforation backboard 3 to the projection on described vibrating diaphragm 2 direction in described perforation backboard 3 to the projection on described vibrating diaphragm 2 direction.Preferably, described first through hole 50 overlaps to the projection on described vibrating diaphragm 2 direction at described perforation backboard 3 with described dorsal pore 10 to the projection on described vibrating diaphragm 2 direction at described perforation backboard 3, but the utility model does not limit this, specifically depends on the circumstances.
On the basis of above-mentioned any embodiment, in an embodiment of the present utility model, between described vibrating diaphragm 2 and described silicon base 1, there is insulating barrier 6, described insulating barrier 6 is positioned at described silicon base 1 surface, namely there is in described insulating barrier 6 the second through hole 60 running through described insulating barrier 6, described second through hole 60 overlaps to the projection on described vibrating diaphragm 2 direction at described perforation backboard 3 with described dorsal pore 10 to the projection on described vibrating diaphragm 2 direction at described perforation backboard 3, to ensure that acoustic signals is when described dorsal pore 10 reaches vibrating diaphragm 2, the stop of described insulating barrier 6 can not be subject to, improve the sensitivity of signal.
Preferably, on the basis of above-mentioned any embodiment, in an embodiment of the present utility model, described MEMS silica-based microphone also comprises: the dielectric layer 7 between described insulating barrier 6 and described vibrating diaphragm 2, described dielectric layer 7 is identical to the thickness on described silicon base 1 direction along described vibrating diaphragm 2 with described prepared separation to the thickness on described silicon base 1 direction along described vibrating diaphragm 2, so that determine that described prepared separation is along described vibrating diaphragm 2 to the thickness on described silicon base 1 direction.
Known from the above mentioned, the MEMS microphone that the utility model embodiment provides is except comprising: silicon base 1, vibrating diaphragm 2, outside perforation backboard 3, also comprise at least one and be fixed on limiting platform 4 on described dorsal pore 10 sidewall, between described limiting platform 4 and described vibrating diaphragm 2, there is prepared separation, thus when described MEMS silica-based microphone is when falling or receive very strong acoustic signals, the Oscillation Amplitude of described limiting platform 4 to described vibrating diaphragm 2 can be utilized to limit, the Oscillation Amplitude of described vibrating diaphragm 2 is limited in described prepared separation, reduce the probability that described vibrating diaphragm 2 is damaged because Oscillation Amplitude is excessive.
And, described limiting platform 4 is less than the distance of described dorsal pore 10 sidewall to described dorsal pore 10 center along described dorsal pore 10 sidewall to the length on dorsal pore 10 center position, make described limiting platform 4 be parallel to described vibrating diaphragm 2 area planar less, namely when acoustic signals reaches in the process of described vibrating diaphragm 2 by described dorsal pore 10, the obstruction of described limiting platform 4 to described acoustic signals is less, thus make background noise in described MEMS microphone less, improve the sensitivity of described MEMS microphone, namely on the basis reducing the probability that described vibrating diaphragm 2 is damaged because Oscillation Amplitude is excessive, improve the signal to noise ratio of described MEMS microphone.
Accordingly, the utility model embodiment still provides a kind of manufacture method of silica-based MEMS microphone, is applied to the MEMS microphone that above-mentioned any embodiment provides, comprises:
Form vibrating diaphragm on a silicon substrate, described vibrating diaphragm covers described silicon base completely;
Deviate from described silicon base side at described vibrating diaphragm and form perforation backboard, between described perforation backboard and described vibrating diaphragm, there is air gap;
Described silicon base is etched, dorsal pore and limiting platform is formed in described silicon base, described limiting platform is positioned on the sidewall of described dorsal pore, and between described vibrating diaphragm, there is prepared separation, and described limiting platform is less than the distance of described dorsal pore sidewall to described dorsal pore center along described dorsal pore sidewall to the length on dorsal pore center position.
It should be noted that, the utility model embodiment does not limit to the length on dorsal pore center position along described dorsal pore sidewall described limiting platform, in an embodiment of the present utility model, can in order to reduce silica-based MEMS microphone further when falling or when having very strong acoustic signals by dorsal pore, the probability that vibrating diaphragm is damaged because Oscillation Amplitude is excessive, extend the length that described limiting platform is long along described dorsal pore sidewall to dorsal pore center position, in another embodiment of the present utility model, also can in order to improve the signal to noise ratio of described MEMS microphone, shorten the length that described limiting platform is long along described dorsal pore sidewall to dorsal pore center position, as long as ensure that described limiting platform is less than the distance of described dorsal pore sidewall to described dorsal pore center along described dorsal pore sidewall to the length on dorsal pore center position.
Also it should be noted that, the height of the utility model to described prepared separation does not also limit, as long as described prepared separation is less than described vibrating diaphragm apart from the distance bottom described silicon base, silica-based MEMS microphone can be reduced to a certain extent when falling or when having very strong acoustic signals by dorsal pore, the probability that vibrating diaphragm is damaged because Oscillation Amplitude is excessive, specifically depending on maximum vibration amplitude that described vibrating diaphragm can bear.
In an embodiment of the present utility model, comprise before forming vibrating diaphragm on a silicon substrate: in described silicon base, form insulating barrier, to ensure described silicon base and described vibrating diaphragm mutually insulated.Accordingly, in this embodiment, comprise after described silicon base is etched: described insulating barrier is etched, the second through hole is formed in described insulating barrier, the projection of described second through hole on described perforation backboard to described vibrating diaphragm direction overlaps with the projection of described dorsal pore on described perforation backboard to described vibrating diaphragm direction, to ensure that acoustic signals is when described dorsal pore reaches vibrating diaphragm, can not be subject to the stop of described insulating barrier, improve the sensitivity of signal.
On the basis of above-mentioned any embodiment, in another embodiment of the present utility model, described vibrating diaphragm is formed perforation backboard, between described perforation backboard and described vibrating diaphragm, there is air gap and comprise: form separator at described diaphragm surface; Etch described separator, form the first through hole, the projection of described first through hole on described vibrating diaphragm to described silicon base direction covers the projection of described dorsal pore on described vibrating diaphragm to described silicon base direction; Backsheet layer is formed in described insulation surface; Described backsheet layer is etched, in described backsheet layer, forms multiple perforation running through described backsheet layer, form perforation backboard, between described perforation backboard and described vibrating diaphragm, there is air gap; Wherein, described interstitial gap is that described separator is along the thickness on described perforation backboard extremely described vibrating diaphragm direction along the height on described perforation backboard extremely described vibrating diaphragm direction.Preferably, the projection of described first through hole on described perforation backboard to described vibrating diaphragm direction overlaps with the projection of described dorsal pore on described perforation backboard to described vibrating diaphragm direction, but the utility model does not limit this, specifically depends on the circumstances.
On the basis of above-mentioned any embodiment, have in an embodiment of the present utility model, the method also comprises: between described insulating barrier and described vibrating diaphragm, form dielectric layer, described dielectric layer is identical along the thickness on described vibrating diaphragm extremely described silicon base direction with described prepared separation along the thickness on described vibrating diaphragm extremely described silicon base direction, so that determine that described prepared separation is along the thickness on described vibrating diaphragm extremely described silicon base direction.
In sum, in MEMS microphone that the utility model embodiment provides and preparation method thereof, described MEMS microphone is except comprising: silicon base, vibrating diaphragm, outside perforation backboard, also comprise at least one and be fixed on limiting platform on described dorsal pore sidewall, between described limiting platform and described vibrating diaphragm, there is prepared separation, thus when described MEMS silica-based microphone is when falling or receive very strong acoustic signals, the Oscillation Amplitude of described limiting platform to described vibrating diaphragm can be utilized to limit, the Oscillation Amplitude of described vibrating diaphragm is limited in described prepared separation, reduce the probability that described vibrating diaphragm is damaged because Oscillation Amplitude is excessive.
And, described limiting platform is less than the distance of described dorsal pore sidewall to described dorsal pore center along described dorsal pore sidewall to the length on dorsal pore center position, make described limiting platform be parallel to described vibrating diaphragm area planar less, namely when acoustic signals reaches in the process of described vibrating diaphragm by described dorsal pore, the obstruction of described limiting platform to described acoustic signals is less, thus make background noise in described MEMS microphone less, improve the sensitivity of described MEMS microphone, namely on the basis reducing the probability that described vibrating diaphragm is damaged because Oscillation Amplitude is excessive, improve the signal to noise ratio of described MEMS microphone.
In this specification, various piece adopts the mode of going forward one by one to describe, and what each some importance illustrated is the difference with other parts, between various piece identical similar portion mutually see.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the utility model.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein when not departing from spirit or scope of the present utility model, can realize in other embodiments.Therefore, the utility model can not be restricted to embodiment illustrated herein, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (6)
1. a silica-based MEMS microphone, is characterized in that, comprising:
Silicon base, has the dorsal pore running through described silicon base in described silicon base;
Be fixed on the vibrating diaphragm above described silicon base, described vibrating diaphragm covers described dorsal pore completely;
Be fixed on the perforation backboard that described vibrating diaphragm deviates from described vibrating diaphragm side, described perforation backboard has multiple perforation, and and between described vibrating diaphragm, there is air gap;
At least one is fixed on the limiting platform on described dorsal pore sidewall, between described limiting platform and described vibrating diaphragm, there is prepared separation, and described limiting platform is less than the distance of described dorsal pore sidewall to described dorsal pore center along described dorsal pore sidewall to the length on dorsal pore center position.
2. silica-based MEMS microphone according to claim 1, is characterized in that, described silica-based MEMS microphone comprises multiple limiting platform.
3. silica-based MEMS microphone according to claim 2, is characterized in that, described multiple limiting platform is uniformly distributed on the sidewall of described dorsal pore.
4. silica-based MEMS microphone according to claim 3, is characterized in that, described silica-based MEMS microphone comprises four limiting platforms.
5. silica-based MEMS microphone according to claim 1, is characterized in that, has insulating barrier between described vibrating diaphragm and described silicon base, and described insulating barrier is positioned at described silicon substrate surface.
6. silica-based MEMS microphone according to claim 5, it is characterized in that, also comprise: the dielectric layer between described insulating barrier and described vibrating diaphragm, described dielectric layer is identical along the thickness on described vibrating diaphragm extremely described silicon base direction with described prepared separation along the thickness on described vibrating diaphragm extremely described silicon base direction.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420430434.0U CN204031449U (en) | 2014-07-31 | 2014-07-31 | Silica-based MEMS microphone |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201420430434.0U CN204031449U (en) | 2014-07-31 | 2014-07-31 | Silica-based MEMS microphone |
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| CN204031449U true CN204031449U (en) | 2014-12-17 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104105041A (en) * | 2014-07-31 | 2014-10-15 | 歌尔声学股份有限公司 | Silicon-based MEMS (Micro Electro Mechanical System) microphone and manufacturing method thereof |
| CN106162476A (en) * | 2015-04-20 | 2016-11-23 | 钰太芯微电子科技（上海）有限公司 | The mike monomer of anti-low frequency noise |
| CN107770707A (en) * | 2016-08-22 | 2018-03-06 | 上海微联传感科技有限公司 | A kind of MEMS microphone |
| CN111924794A (en) * | 2019-05-13 | 2020-11-13 | 无锡华润上华科技有限公司 | Micro-electro-mechanical system device |
-
2014
- 2014-07-31 CN CN201420430434.0U patent/CN204031449U/en not_active Withdrawn - After Issue
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104105041A (en) * | 2014-07-31 | 2014-10-15 | 歌尔声学股份有限公司 | Silicon-based MEMS (Micro Electro Mechanical System) microphone and manufacturing method thereof |
| CN104105041B (en) * | 2014-07-31 | 2019-01-04 | 歌尔股份有限公司 | Silicon substrate MEMS microphone and preparation method thereof |
| CN106162476A (en) * | 2015-04-20 | 2016-11-23 | 钰太芯微电子科技（上海）有限公司 | The mike monomer of anti-low frequency noise |
| CN106162476B (en) * | 2015-04-20 | 2023-10-27 | 钰太芯微电子科技（上海）有限公司 | Microphone unit for resisting low-frequency noise |
| CN107770707A (en) * | 2016-08-22 | 2018-03-06 | 上海微联传感科技有限公司 | A kind of MEMS microphone |
| CN111924794A (en) * | 2019-05-13 | 2020-11-13 | 无锡华润上华科技有限公司 | Micro-electro-mechanical system device |
| WO2020228543A1 (en) * | 2019-05-13 | 2020-11-19 | 无锡华润上华科技有限公司 | Micro-electro-mechanical system device |
| US11671765B2 (en) | 2019-05-13 | 2023-06-06 | Csmc Technologies Fab2 Co., Ltd. | Micro-Electro-Mechanical System device |
| CN111924794B (en) * | 2019-05-13 | 2024-06-04 | 无锡华润上华科技有限公司 | Micro-electromechanical system device |
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| C14 | Grant of patent or utility model | ||
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Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
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| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20141217 Effective date of abandoning: 20190104 |