CN106531757B - MEMS environmental sensor - Google Patents
MEMS environmental sensor Download PDFInfo
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- CN106531757B CN106531757B CN201611239543.4A CN201611239543A CN106531757B CN 106531757 B CN106531757 B CN 106531757B CN 201611239543 A CN201611239543 A CN 201611239543A CN 106531757 B CN106531757 B CN 106531757B
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- substrate
- mems
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- asic chip
- cavity
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- 230000007613 environmental effect Effects 0.000 title claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 85
- 238000004806 packaging method and process Methods 0.000 claims abstract description 18
- 241000218202 Coptis Species 0.000 claims abstract description 14
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 14
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 238000005253 cladding Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 abstract description 12
- 239000002184 metal Substances 0.000 abstract description 12
- 238000004891 communication Methods 0.000 abstract description 3
- 239000005022 packaging material Substances 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000002633 protecting effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
This application discloses a kind of MEMS environmental sensors, including substrate, MEMS chip and asic chip；Asic chip is fixed on substrate, and asic chip is provided with cavity close to the side of substrate；MEMS chip is located in cavity, and MEMS chip is connected on substrate；The position that substrate corresponds to cavity offers through hole；Asic chip is connect by gold thread with substrate conducting；It further include the plastic packaging shell being coated on outside asic chip.It can be seen that; MEMS chip is located in the cavity of asic chip; it can only be in communication with the outside by the through hole on substrate; therefore; MEMS chip is protected, is surrounded asic chip by plastic packaging material in the outside of asic chip, equally protects asic chip and the strong conjunction structure of metal free from the influence of the external environment; and when carrying out plastic packaging, MEMS chip is protected by asic chip.Also, due to using plastic packaging shell, it can be coated on asic chip, reduce package dimension, and then reduce the volume of MEMS environmental sensor.
Description
Technical field
The present invention relates to MEMS chip encapsulation technology field, in particular to a kind of MEMS environmental sensor.
Background technique
The full name in English of MEMS is Micro-Electro-Mechanical System, and Chinese is MEMS,
Refer to size in several millimeters or even smaller high-tech device, internal structures are generally one in micron even nanometer scale
Independent intelligence system.MEMS technology is because having the advantages that micromation, intelligent, Highgrade integration and can be mass, extensively
It is general to be applied to the fields such as electronics, medicine, industry, automobile and aerospace system.
Existing MEMS environmental sensor, as MEMS microphone, MEMS barometer, MEMS Hygrothermograph, MEMS gas pass
Sensor etc. mainly includes encapsulating structure, MEMS chip and asic chip, wherein encapsulating structure mostly uses pcb board and metal shell
Combined packing forms, aperture on metal shell, for interacting with external environment variable, MEMS chip and asic chip are set
It sets in encapsulating structure, MEMS chip overlays on asic chip or MEMS chip and asic chip are disposed side by side on pcb board
On.Since chip often uses aluminium as welding block, copper wire is as bonding wire, both materials are in the environment existing for high temperature and humidity and halogen
Being easy to happen electrochemical reaction leads to weld failure.Existing this packing forms due to contacting chip with the external world, be unfavorable for into
The strong protection for closing structure of row copper/aluminium, it is possible to long-term reliability of the product under the environment such as high temperature and humidity is influenced, meanwhile, it is this
Encapsulating structure volume is larger, it is difficult to realize the very small dimensions encapsulation of the chip level of environmental sensor.
In conclusion how to protect the metal of chip is strong to close structure, reduce the volume of MEMS environmental sensor, becomes this
Field technical staff technical problem urgently to be resolved.
Summary of the invention
In view of this, the purpose of the present invention is to provide a kind of MEMS environmental sensor, to protect the metal of chip is strong to close
Structure reduces the volume of MEMS environmental sensor.
In order to achieve the above objectives, the present invention the following technical schemes are provided:
A kind of MEMS environmental sensor, including substrate, MEMS chip and asic chip；The asic chip is fixed on described
On substrate, the asic chip is provided with cavity close to the side of the substrate；The MEMS chip position in the cavity, and
The MEMS chip is connected on the substrate；The position that the substrate corresponds to the cavity offers through hole；The ASIC
Chip is connect by gold thread with the substrate conducting；It further include the plastic packaging shell being coated on outside the asic chip.
Preferably, in above-mentioned MEMS environmental sensor, the MEMS chip upside-down mounting is in the cavity, and described
MEMS chip is welded close to the side of the substrate and the substrate conducting.
Preferably, in above-mentioned MEMS environmental sensor, the MEMS chip formal dress is in the cavity, and described
Side of the MEMS chip far from the substrate is connect with the substrate conducting, the MEMS chip close to the substrate side with
The substrate is fixedly connected.
Preferably, in above-mentioned MEMS environmental sensor, the MEMS chip is provided with through silicon via, the MEMS chip
Side far from the substrate is welded to connect by the conductive column being located in the through silicon via and the substrate conducting.
Preferably, in above-mentioned MEMS environmental sensor, the MEMS chip passes through gold far from the side of the substrate
Line is connect with the substrate conducting, and the MEMS chip is fixed close to the side of the substrate with the substrate bonding.
Preferably, in above-mentioned MEMS environmental sensor, the asic chip is bonded and fixed to described by glue
On substrate.
Preferably, in above-mentioned MEMS environmental sensor, the cavity is the perforation asic chip perpendicular to institute
State the open spaces of two opposite flanks of substrate.
Preferably, in above-mentioned MEMS environmental sensor, the cavity is that setting is close described in the asic chip
The recess enclosure space of the side of substrate.
Compared with prior art, the beneficial effects of the present invention are:
In MEMS environmental sensor provided by the invention, asic chip is fixed on substrate, and asic chip is close to substrate
Side is provided with cavity, and MEMS chip is located in the cavity, and MEMS chip is connected on substrate, only corresponds to cavity in substrate
Position opens up through hole, and the outside of asic chip is coated with plastic packaging shell, by the gold thread of connection asic chip and substrate also plastic packaging
Cladding is got up.As it can be seen that MEMS chip is located in the cavity of asic chip, can only be in communication with the outside by the through hole on substrate,
Therefore, MEMS chip is protected, asic chip is surrounded by plastic packaging material in the outside of asic chip, equally protects ASIC core
Piece and the strong conjunction structure of metal are free from the influence of the external environment, and when carrying out plastic packaging, protect MEMS chip by asic chip.And
And due to using plastic packaging shell, packaging cost is reduced than previous metal shell, and can be coated on asic chip, is subtracted
Small package dimension, and then reduce the volume of MEMS environmental sensor.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is a kind of structural schematic diagram of MEMS environmental sensor provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of another kind MEMS environmental sensor provided in an embodiment of the present invention.
Wherein, 1 it is plastic packaging shell, 2 be asic chip, 201 be cavity, 3 be gold thread, 4 be substrate, 401 is through hole, 5
It is soldered ball for bonded adhesives, 6,7 be MEMS chip, 701 is through silicon via.
Specific embodiment
There is provided a kind of MEMS environmental sensors for core of the invention, while protecting the metal of chip is strong to close structure,
Reduce the volume of MEMS environmental sensor.
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1 and Fig. 2 are please referred to, the embodiment of the invention provides a kind of MEMS environmental sensors, including substrate 4, MEMS core
Piece 7, asic chip 2 and plastic packaging shell 1；Wherein, asic chip 2 is fixed on substrate 4, and asic chip 2 is close to the side of substrate 4
It is provided with cavity 201；MEMS chip 7 is located in cavity 201, and MEMS chip 7 is connected on substrate 4；Substrate 4 corresponds to cavity
201 position offers through hole 401, enters in cavity 201 for external environment variable, interacts with MEMS chip 7；
Asic chip 2 is conductively connected by gold thread 3 and substrate 4；Plastic packaging shell 1 is coated on outside asic chip 2 by plastic package process plastic packaging
Portion.
In above-mentioned MEMS environmental sensor, MEMS chip 7 is located in the cavity 201 of asic chip 2, can only pass through substrate 4
On through hole 401 be in communication with the outside, therefore, protect MEMS chip 7, the outside of asic chip 2 pass through plastic packaging material will
Asic chip 2 surrounds, and equally protects asic chip 2 and the strong conjunction structure of metal free from the influence of the external environment, and moulded
Feng Shi, protection of the MEMS chip 7 by asic chip 2 in cavity 201.Also, due to using plastic packaging shell 1, envelope
It is lower than previous metal shell to dress up this, and can be coated on asic chip 2, plastic packaging shell 1 do not need with asic chip 2 it
Between there are spacing, it therefore reduces package dimension, and then reduce the volume of MEMS environmental sensor.
In order to further decrease corrosion of the external environment to MEMS chip 7, protection metal is strong to close structure, and reduces body
Product, in the present embodiment, as shown in Fig. 2, 7 upside-down mounting of MEMS chip is in cavity 201, and MEMS chip 7 is close to the side of substrate 4
With 4 conductive solder of substrate.The gold thread for conductive connection is eliminated, but the electrical connection area of MEMS chip 7 is directly passed through into weldering
It connects and is conductively connected with substrate 4, welded by soldered ball 6, conductive connection is relatively reliable, corrosion-resistant.Simultaneously as gold thread is eliminated,
Therefore, the space that can save storage gold thread, reduces volume.Wherein, 7 upside-down mounting of MEMS chip refers to the base of MEMS chip 7
Seat is far from substrate 4.
Certainly, MEMS chip 7 can also be just loaded in cavity 201, and side of the MEMS chip 7 far from substrate 4 and substrate 4
It is conductively connected, MEMS chip 7 is fixedly connected close to the side of substrate 4 with substrate 4.Wherein, 7 formal dress of MEMS chip refers to MEMS
The pedestal of chip 7 is close to substrate 4.
In the case of MEMS chip 7 is just loaded in cavity 201, in order to further decrease external environment to MEMS chip 7
Corrosion, protection metal is strong to close structure, and reduces volume, in the present embodiment, as shown in Figure 1, MEMS chip 7 is provided with silicon
Through-hole 701, side of the MEMS chip 7 far from substrate 4 are connected by the conductive column and 4 conductive solder of substrate being located in through silicon via 701
It connects.Can equally save for conductive gold thread, the conductive column for being used for conductive is built in through silicon via 701, avoid its with
Extraneous contact, so that conductive column be protected not corroded.Conductive column and substrate 4 can be welded by soldered ball 6.
Certainly, another 7 formal dress mode of MEMS chip is that MEMS chip 7 passes through gold thread and substrate far from the side of substrate 4
4 are conductively connected, and MEMS chip 7 is adhesively fixed close to the side of substrate 4 with substrate 4.Only the conductive connection manner cannot save
Gold thread, gold thread protecting effect is good not as good as inverted structure or by the effect of conductive column conductive connection, can not further decrease
The volume of MEMS environmental sensor.
In the present embodiment, asic chip 2 is bonded and fixed on substrate 4 by glue 5, convenient and efficient.In addition to this,
Asic chip 2 can also be connected on substrate 4 by welding, threaded connector etc..
The present embodiment advanced optimizes the structure of cavity, and cavity 201 is perforation asic chip 2 perpendicular to substrate 4
Two opposite flanks open spaces.That is the generally concave-shaped structure of asic chip 2.The cutting perpendicular to substrate 4 of cavity 201
Face shape is arbitrary shape, such as trapezoidal, rectangle, semicircle, as long as MEMS chip 7 can be accommodated.
Another 201 structure of cavity is present embodiments provided, cavity 201 is that asic chip 2 is arranged in close to the one of substrate 4
The recess enclosure space of side.That is the opening of cavity 201 is positioned only at asic chip 2 close to the side of substrate 4.Such cavity knot
MEMS chip 7 is enclosed in cavity by structure, and when carrying out plastic package process, asic chip 2 can preferably be protected in cavity 201
MEMS chip 7.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (8)
1. a kind of MEMS environmental sensor, including substrate (4), MEMS chip (7) and asic chip (2)；It is characterized in that, described
Asic chip (2) is fixed on the substrate (4), and the asic chip (2) is provided with cavity close to the side of the substrate (4)
(201)；The MEMS chip (7) is located in the cavity (201), and the MEMS chip (7) is connected to the substrate (4)
On；The position of the corresponding cavity (201) of the substrate (4) offers through hole (401)；The asic chip (2) passes through gold
Line (3) and the substrate (4) are conductively connected；It further include being coated on the external plastic packaging shell (1) of the asic chip (2), it is described
Plastic packaging shell (1) gets up the gold thread (3) also plastic packaging cladding.
2. MEMS environmental sensor according to claim 1, which is characterized in that MEMS chip (7) upside-down mounting is in described
In cavity (201), and side and the substrate (4) conductive solder of the MEMS chip (7) close to the substrate (4).
3. MEMS environmental sensor according to claim 1, which is characterized in that the MEMS chip (7) is just loaded on described
In cavity (201), and side and the substrate (4) of the MEMS chip (7) far from the substrate (4) are conductively connected, described
MEMS chip (7) is fixedly connected close to the side of the substrate (4) with the substrate (4).
4. MEMS environmental sensor according to claim 3, which is characterized in that it is logical that the MEMS chip (7) is provided with silicon
Hole (701), side of the MEMS chip (7) far from the substrate (4) pass through the conductive column in the through silicon via (701)
It is connect with the substrate (4) conductive solder.
5. MEMS environmental sensor according to claim 3, which is characterized in that the MEMS chip (7) is far from the substrate
(4) side is conductively connected by gold thread and the substrate (4), the MEMS chip (7) close to the substrate (4) side with
The substrate (4) is adhesively fixed.
6. MEMS environmental sensor according to claim 1, which is characterized in that the asic chip (2) passes through glue
(5) it is bonded and fixed on the substrate (4).
7. MEMS environmental sensor according to claim 1-6, which is characterized in that the cavity (201) is to pass through
Lead to the open spaces of two opposite flanks perpendicular to the substrate (4) of the asic chip (2).
8. MEMS environmental sensor according to claim 1-6, which is characterized in that the cavity (201) is to set
Set the recess enclosure space in the asic chip (2) close to the side of the substrate (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611239543.4A CN106531757B (en) | 2016-12-28 | 2016-12-28 | MEMS environmental sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611239543.4A CN106531757B (en) | 2016-12-28 | 2016-12-28 | MEMS environmental sensor |
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| Publication Number | Publication Date |
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| CN106531757A CN106531757A (en) | 2017-03-22 |
| CN106531757B true CN106531757B (en) | 2019-06-11 |
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| CN201611239543.4A Active CN106531757B (en) | 2016-12-28 | 2016-12-28 | MEMS environmental sensor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110104606A (en) * | 2019-05-08 | 2019-08-09 | 苏州新沃微电子有限公司 | A kind of encapsulating structure of MEMS infrared sensor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203748007U (en) * | 2014-04-01 | 2014-07-30 | 山东共达电声股份有限公司 | MEMS microphone and electronic device |
| CN104484660A (en) * | 2014-12-31 | 2015-04-01 | 华天科技（西安）有限公司 | Chip-integrated fingerprint identification sensor and manufacturing method thereof |
| CN205619946U (en) * | 2016-02-25 | 2016-10-05 | 歌尔股份有限公司 | Environmental sensor chip package structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI431732B (en) * | 2011-09-22 | 2014-03-21 | 矽品精密工業股份有限公司 | Semiconductor package and manufacturing method thereof |
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- 2016-12-28 CN CN201611239543.4A patent/CN106531757B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203748007U (en) * | 2014-04-01 | 2014-07-30 | 山东共达电声股份有限公司 | MEMS microphone and electronic device |
| CN104484660A (en) * | 2014-12-31 | 2015-04-01 | 华天科技（西安）有限公司 | Chip-integrated fingerprint identification sensor and manufacturing method thereof |
| CN205619946U (en) * | 2016-02-25 | 2016-10-05 | 歌尔股份有限公司 | Environmental sensor chip package structure |
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Effective date of registration: 20200615 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
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