CN206318699U - Chip-packaging structure and MEMS environmental sensors - Google Patents

Abstract

This application discloses a kind of chip-packaging structure and MEMS environmental sensors, wherein, chip-packaging structure includes wiring board, MEMS chip and asic chip, the asic chip is welded on the wiring board by multiple conductive supporting weldments that there is gap each other, there is spacing, the MEMS chip is located in the encapsulating structure formed by the asic chip, the wiring board and the conductive supporting weldment and is connected on the asic chip between the asic chip and the wiring board.The MEMS environmental sensors are due to eliminating shell, directly it regard asic chip as a part for encapsulating structure in itself, MEMS chip is packaged in the spacing between asic chip and wiring board, so as to substantially reduce volume, can realize the small-sized package of chip level.

Description

Chip-packaging structure and MEMS environmental sensors

Technical field

The utility model is related to MEMS chip encapsulation technology field, more particularly to a kind of chip-packaging structure.Further relate to one Plant the MEMS environmental sensors using the chip-packaging structure.

Background technology

MEMS English full name is Micro-Electro-Mechanical System, and Chinese is MEMS, Refer to size in several millimeters of even more small high-tech devices, its internal structure is general in micron even nanometer scale, is one Independent intelligence system.MEMS technology is because having the advantages that miniaturization, intelligent, Highgrade integration and can be mass, extensively It is general to be applied to the fields such as electronics, medical science, industry, automobile and aerospace system.

Existing MEMS environmental sensors, such as MEMS microphone, MEMS barometers, MEMS Hygrothermographs, MEMS gases are passed Sensor etc., mainly including encapsulating structure, MEMS chip and asic chip, wherein, pcb board and metal shell are used encapsulating structure more Perforate on the packing forms of combination, metal shell, for being interacted with external environment variable, MEMS chip and asic chip are set Put in encapsulating structure, MEMS chip is overlayed on asic chip.This encapsulating structure volume is larger, it is difficult to realize environmentally sensitive The very small dimensions encapsulation of the chip level of device.

In summary, how to reduce the encapsulation volume of MEMS environmental sensors, become those skilled in the art and urgently solve Technical problem certainly.

Utility model content

In view of this, the purpose of this utility model is to provide a kind of chip-packaging structure, to reduce encapsulation volume.

Another purpose of the present utility model is to provide a kind of MEMS environmental sensors of the application chip-packaging structure, To reduce the volume of MEMS environmental sensors.

To reach above-mentioned purpose, the utility model provides following technical scheme：

A kind of chip-packaging structure, including wiring board, MEMS chip and asic chip, the asic chip by it is multiple that The conductive supporting weldment that there is gap between this is welded on the wiring board, is had between the asic chip and the wiring board There is spacing, the MEMS chip is located at the encapsulation formed by the asic chip, the wiring board and the conductive supporting weldment Structure is interior and is connected on the asic chip.

It is preferred that, in above-mentioned chip-packaging structure, the conductive supporting weldment is soldered ball or cylindrical metal solder joint, institute Soldered ball or the cylindrical metal solder joint are stated by the asic chip supporting welding on the wiring board.

It is preferred that, in above-mentioned chip-packaging structure, the soldered ball is tin ball or copper ball.

It is preferred that, in above-mentioned chip-packaging structure, the MEMS chip face-down bonding is conductively connected in the ASIC On chip.

It is preferred that, in above-mentioned chip-packaging structure, the MEMS chip formal dress is pasted on the asic chip, and The MEMS chip is conductively connected by wire with the asic chip.

It is preferred that, in above-mentioned chip-packaging structure, the wiring board is pcb board.

The utility model additionally provides a kind of MEMS environmental sensors, including encapsulating structure, the encapsulating structure for such as with Chip-packaging structure described in upper any one.

It is preferred that, in above-mentioned MEMS environmental sensors, the MEMS environmental sensors are MEMS microphone, MEMS gas Pressure meter, MEMS Hygrothermographs or MEMS gas sensors.

Compared with prior art, the beneficial effects of the utility model are：

In the chip-packaging structure that the utility model is provided, asic chip is directly welded by multiple conductive supporting weldments In on wiring board, there is spacing between asic chip and wiring board, asic chip, wiring board and conductive supporting weldment surround encapsulation Structure, MEMS chip is located in encapsulating structure, and is connected on asic chip, i.e., MEMS chip by asic chip, wiring board and Conductive supporting weldment is surrounded wherein, realizes encapsulation, external environment condition variable can be by between multiple conductive supporting weldments Gap enters in encapsulating structure, is interacted with MEMS chip.The MEMS environmental sensors directly will due to eliminating shell Asic chip is in itself as a part for encapsulating structure, and MEMS chip is packaged in the spacing between asic chip and wiring board, So as to substantially reduce volume, the small-sized package of chip level can be realized.

The MEMS environmental sensors that the utility model is provided are as a result of the chip-packaging structure in the application, therefore, Reduce the volume of MEMS environmental sensors.

Brief description of the drawings

, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art Or the accompanying drawing to be used needed for description of the prior art is briefly described, it should be apparent that, drawings in the following description are only It is embodiment of the present utility model, for those of ordinary skill in the art, on the premise of not paying creative work, also Other accompanying drawings can be obtained according to the accompanying drawing of offer.

A kind of structural representation for MEMS environmental sensors that Fig. 1 provides for the utility model embodiment.

Wherein, 1 it is asic chip, 2 be conductive supporting weldment, 3 be wiring board, 4 be MEMS chip, 5 is soldered ball.

Embodiment

Core of the present utility model there is provided a kind of chip-packaging structure, can reduce encapsulation volume.

The utility model additionally provides a kind of MEMS environmental sensors of the application chip-packaging structure, can reduce body Product, realizes the very small dimensions encapsulation of chip level.

Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made The every other embodiment obtained, belongs to the scope of the utility model protection.

Fig. 1 is refer to, the utility model embodiment provides a kind of chip-packaging structure, including wiring board 3, MEMS chip 4 and asic chip 1, asic chip 1 is welded on wiring board 3 by multiple conductive supporting weldments 2, and asic chip 1 is propped up by conduction Support weldment 2 is supported, and has spacing between asic chip 1 and wiring board 3, and multiple conductive supporting weldments 2 exist each other Gap, i.e. asic chip 1, wiring board 3 and the formation encapsulating structure of conductive supporting weldment 2, MEMS chip 4 are located at the encapsulating structure It is interior, and MEMS chip 4 is connected on asic chip 1.

The chip-packaging structure eliminates shell, directly using asic chip 1 as encapsulating structure a part, by MEMS cores Piece 4 is arranged between asic chip 1 and wiring board 3, substantially reduces the size of encapsulating structure, can realize the pole of chip level Small-sized package.

In the present embodiment, conductive supporting weldment 2 is soldered ball or cylindrical metal solder joint, and soldered ball or cylindrical metal solder joint will The supporting welding of asic chip 1 is on wiring board 3.Specifically, set according to the wiring on asic chip 1 in pad, assist side 3 The position of the pad of corresponding A SIC chips 1 equally sets pad, is welded between corresponding pad by the soldered ball of large-size Connect, or welded by cylindrical metal solder joint so that being retained between asic chip 1 and wiring board 3 has a spacing, soldered ball it Between or cylindrical metal solder joint between there is gap, for external environment condition variable enter.

Further, soldered ball is tin ball or copper ball, as long as being conductively connected between asic chip 1 and substrate 3 can be realized .

In order to further reduce the size of chip-packaging structure, as shown in figure 1, in the present embodiment, the upside-down mounting of MEMS chip 4 Welding is conductively connected on asic chip 1, i.e., MEMS chip 4 is directly conductively connected by less soldered ball 5 and asic chip 1, MEMS chip 4 is fixed on asic chip 1 by soldered ball 5 simultaneously.Need not it is extra by wire by MEMS chip 4 and ASIC Chip 1 is conductively connected, and further saves wiring space.MEMS chip 4 is located between asic chip 1 and wiring board 3.In this reality Apply in example, the upside-down mounting of MEMS chip 4 refers to the top vibrating diaphragm of MEMS chip 4 close to asic chip 1.

The mounting structure of another MEMS chip 4 is present embodiments provided, the formal dress of MEMS chip 4 is pasted on asic chip 1 On, and MEMS chip 4 is conductively connected by wire with asic chip 1, MEMS chip 4 is similarly positioned in asic chip 1 and wiring board 3 Between.The formal dress of MEMS chip 4 refers to the top vibrating diaphragm of MEMS chip 4 away from asic chip 1, and MEMS chip 4 is solid by bonding Being conductively connected for asic chip 1 and MEMS chip 4 is realized due on asic chip 1, then by wire.As long as MEMS can be realized Chip and asic chip being fixed and being conductively connected.

The utility model embodiment additionally provides a kind of MEMS environmental sensors, including encapsulating structure, wherein, encapsulating structure For the chip-packaging structure described by any of the above embodiment.The MEMS environmental sensors pass through between conductive supporting weldment 2 Gap inside encapsulating structure by external environment with being connected, and environmental variance can be entered by the gap between conductive supporting weldment 2 to be sealed In assembling structure, interacted with MEMS chip 4, complete the work of environmental sensor.Meanwhile, the encapsulation of the MEMS environmental sensors Structure eliminates shell, and asic chip 1 directly is arranged on into asic chip 1 by MEMS chip 4 as a part for encapsulating structure Between wiring board 3, the size of encapsulating structure is substantially reduced, the very small dimensions encapsulation of chip level can be realized.

In the present embodiment, wiring board 3 is preferably pcb board, can also be other wiring boards 3 certainly.

In the present embodiment, MEMS environmental sensors are MEMS microphone, MEMS barometers, MEMS Hygrothermographs or MEMS Gas sensor.As long as the sensor interacted with external environment condition, it can use the chip package in the application Structure.

The embodiment of each in this specification is described by the way of progressive, and what each embodiment was stressed is and other Between the difference of embodiment, each embodiment identical similar portion mutually referring to.

The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or new using this practicality Type.A variety of modifications to these embodiments will be apparent for those skilled in the art, determine herein The General Principle of justice can in other embodiments be realized in the case where not departing from spirit or scope of the present utility model.Cause This, the utility model is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein The most wide scope consistent with features of novelty.

Claims (8)

1. a kind of chip-packaging structure, it is characterised in that described including wiring board (3), MEMS chip (4) and asic chip (1) Asic chip (1) is welded on the wiring board (3) by multiple conductive supporting weldments (2) that there is gap each other, institute Stating has spacing between asic chip (1) and the wiring board (3), the MEMS chip (4) is located at by the asic chip (1), the encapsulating structure of the wiring board (3) and the conductive supporting weldment (2) formation is interior and is connected to the asic chip (1) On.

2. chip-packaging structure according to claim 1, it is characterised in that the conductive supporting weldment (2) be soldered ball or Cylindrical metal solder joint, the soldered ball or the cylindrical metal solder joint are by the asic chip (1) supporting welding in the wiring board (3) on.

3. chip-packaging structure according to claim 2, it is characterised in that the soldered ball is tin ball or copper ball.

4. chip-packaging structure according to claim 1, it is characterised in that MEMS chip (4) face-down bonding is conductive It is connected on the asic chip (1).

5. chip-packaging structure according to claim 1, it is characterised in that MEMS chip (4) formal dress is pasted on institute State on asic chip (1), and the MEMS chip (4) is conductively connected by wire with the asic chip (4).

6. chip-packaging structure according to claim 1, it is characterised in that the wiring board is pcb board.

7. a kind of MEMS environmental sensors, including encapsulating structure, it is characterised in that the encapsulating structure is such as claim 1-6 Chip-packaging structure described in any one.

8. MEMS environmental sensors according to claim 7, it is characterised in that the MEMS environmental sensors are MEMS wheats Gram wind, MEMS barometers, MEMS Hygrothermographs or MEMS gas sensors.