CN208570348U - Encapsulating structure, pcb board and the electronic equipment of compatible a variety of electronic components - Google Patents
Encapsulating structure, pcb board and the electronic equipment of compatible a variety of electronic components Download PDFInfo
- Publication number
- CN208570348U CN208570348U CN201821451993.4U CN201821451993U CN208570348U CN 208570348 U CN208570348 U CN 208570348U CN 201821451993 U CN201821451993 U CN 201821451993U CN 208570348 U CN208570348 U CN 208570348U
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- China
- Prior art keywords
- variety
- electronic components
- encapsulating structure
- compatible
- pad
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The utility model discloses a kind of encapsulating structure for being compatible with a variety of electronic components, pcb board and electronic equipment, the encapsulating structure of compatible a variety of capacitors includes encapsulating shell and two pads being set in the encapsulating shell, the encapsulating structure of a variety of capacitors of compatibility includes encapsulating shell and two pads being set in the encapsulating shell, various sizes of electronic component can be matched on two pads, the pad includes rectangular portion and is connected with the rectangular portion and shape is trapezoidal lug boss.The utility model structure is simple, easy to operate, while improving compatibility of the electronic component when being welded on pad.
Description
Technical field
The utility model relates to electronic package field more particularly to a kind of encapsulation knots for being compatible with a variety of electronic components
Structure, pcb board and electronic equipment.
Background technique
Existing electronic component has the characteristics of small in size, specific volume is big, the service life is long and high reliablity, is adapted for mount to PCB
On plate (printed circuit board), and it is widely applied in the high portable product of integrated level.
And generally require that multiple electronic components are installed on existing pcb board, therefore need to design energy before being installed
The pcb board of multiple and different scale electronic elements is enough placed, and this undoubtedly will increase the difficulty in design, also result in pcb board
Area increases, and then leads to increased costs.If not making the pcb board that can be compatible with multiple electronic components, pass through
The mode of electronic component or modification pcb board is changed to solve, this undoubtedly will cause existing pcb board and is not available, and make again
The pcb board for making meet demand is also required to the time, to cause cost, temporal loss.
Therefore, it is necessary to provide encapsulating structure, pcb board and the electronic equipment of a kind of new a variety of electronic components of compatibility to solve
Certainly above-mentioned technical problem.
Utility model content
The main purpose of the utility model is to provide a kind of encapsulating structure for being compatible with a variety of electronic components, pcb board and electronics
Equipment, it is intended to solve the problems, such as that pcb board can not be compatible with multiple electronic components in the prior art.
To achieve the above object, the utility model proposes a kind of encapsulating structure for being compatible with a variety of electronic components include encapsulation
Shell and two pads being set in the encapsulating shell, two pads can match various sizes of electronic component, institute
State pad include rectangular portion and be connected with the rectangular portion and shape be trapezoidal lug boss.
Preferably, the lug boss includes first side and the bevel edge that is connected with the end of the first side, institute
Stating rectangular portion includes equal be connected with the bevel edge and equal with bevel edge vertical edge at an angle and with the vertical edge
Connected second side, the length of the first side are less than the length of the second side.
Preferably, the length of the first side is more than or equal to 0.4mm, and the length of the second side is 0.6~
1.8mm and the distance between the first side and the second side are 0.6~1.8mm.
Preferably, the first side of two pads is close to each other and arranged in parallel, described in one of them
The distance between the first side of pad and the first side of another pad are less than or equal to 0.8mm.
Preferably, the length of the vertical edge is more than or equal to 0.8mm.
Preferably, two pads being set in the encapsulating shell are symmetrically set.
Preferably, the electronic component includes 0805 patch capacitor and 0603 patch capacitor.
In addition, the utility model also provides a kind of pcb board, it is as described above simultaneous that at least one is provided on the pcb board
Hold the encapsulating structure of a variety of electronic components.
In addition, the utility model also provides a kind of electronic equipment, PCB as described above is provided in the electronic equipment
Plate.
In the technical solution of the utility model, the pad of such shape can either reduce cost when pad production, thus
On the basis of keeping original performance and quality, the compatibility when placement electronic component of two pads is increased, and then subtract
Area of the small encapsulating structure on pcb board occupies, and since such pad can be compatible with the placement of a variety of electronic components, thus
Flexibility when improving production and using.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, the structure that can also be shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structural schematic diagram of the encapsulating structure of a variety of electronic components of compatibility of the utility model embodiment.
Drawing reference numeral explanation:
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, fall within the protection scope of the utility model.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute in the utility model embodiment
It is only used for explaining in relative positional relationship, the motion conditions etc. under a certain particular pose (as shown in the picture) between each component, such as
When the fruit particular pose changes, then directionality instruction also correspondingly changes correspondingly.
In addition, the description for being such as related to " first ", " second " in the present invention is used for description purposes only, and cannot manage
Solution is its relative importance of indication or suggestion or the quantity for implicitly indicating indicated technical characteristic.Define as a result, " the
One ", the feature of " second " can explicitly or implicitly include at least one of the features.It is " more in the description of the present invention,
It is a " it is meant that at least two, such as two, three etc., unless otherwise specifically defined.
Also, the technical solution between each embodiment of the utility model can be combined with each other, but must be with ability
Based on domain those of ordinary skill can be realized, it will be understood that when the combination of technical solution appearance is conflicting or cannot achieve
The combination of this technical solution is not present, also not within the protection scope of the requires of the utility model.
The utility model provides a kind of encapsulating structure for being compatible with a variety of electronic components, pcb board and electronic equipment, it is intended to solve
Pcb board can not be compatible with the problem of multiple electronic components in the prior art.
As shown in Figure 1, the encapsulating structure of a variety of electronic components of the compatibility of the utility model embodiment include encapsulating shell 10 with
And two pads 20 in encapsulating shell 10 are set to, two pads 20 can match various sizes of electronic component, and pad
20 include rectangular portion 22 and be connected with rectangular portion 22 and shape be trapezoidal lug boss 21.
It is trapezoidal lug boss 21 and rectangular portion 22 due to taking shape, when this reality in the utility model embodiment
When adapting to the installation of various sizes of electronic component with the encapsulating structure matching of new embodiment, the first of large scale electronic component is drawn
Foot and second pin are mounted on rectangular portion 22, and the first pin of small size electronic component is installed in lug boss 21, and second draws
Foot is then butted on the second side 222 of rectangular portion 22, alternatively, the first pin of small size electronic component is installed on 21 He of lug boss
Between rectangular portion 22, second pin is also installed between lug boss 21 and rectangular portion 22.Hence for various sizes of electronics
Element, two pads in the encapsulating structure of the present embodiment can adapt to installation requirement.
For welding 0805 patch capacitor and 0603 patch capacitor, it can be incited somebody to action when needing to install 0805 patch capacitor
0805 patch capacitor is installed in rectangular portion 22, and lug boss 21 can be used for observing welding of 0805 patch capacitor on pad 20
Situation has effectively ensured the stability of 0805 patch capacitor.
And can be installed on one end of 0603 patch capacitor in lug boss 21 when needing to install 0603 patch capacitor, separately
One end is butted on the second side 222 of rectangular portion 22, and the remaining part of pad 20 is also used for 0603 patch capacitor of observation and is welding
Welding situation on disk 20.Alternatively, one end of 0603 patch capacitor is installed between lug boss 21 and rectangular portion 22, the other end
It is installed between lug boss 21 and rectangular portion 22.To which the pad 20 of this shape has been compatible with 0805 and 0603 patch capacitor
Welding on pad, the weldering for intuitively observing patch capacitor can be understood when welding each patch capacitor by turn ensuring
Situation is connect, ensure that the welding between patch capacitor and pad 20, prevents patch capacitor from falling from pad 20 and falls off.It solves
Pad in the prior art can not be compatible with the technical issues of a variety of electronic components.
When needing soldering surface mounted capacitor, it is only necessary to be welded in the pin of patch capacitor on pad 20 i.e. on pad 20
The encapsulation of achievable capacitor.Also, in this embodiment, the size of two pads 20 can be compatible with 0805 and 0603 patch
The welding of capacitor increases to improve the compatibility of the soldering surface mounted capacitor of pad 20, and when selecting patch capacitor
Flexibility when patch capacitor selection is added.Meanwhile using the encapsulating structure of a variety of capacitors of this compatibility, reduce in parallel multiple
The patch capacitor of different type encapsulation, reduces and accounts for plate space, so as to vacate more fabric swatch spaces, and then help to subtract
The area of small pcb board enables finished product to reduce area so that finished product can be more portable.
Further, lug boss 21 includes first side 211 and the bevel edge being connected with the end of first side 211
212, and rectangular portion 22 includes being connected with bevel edge 212 and vertical edge 221 and and vertical edge with bevel edge 212 at an angle
221 connected second sides 222, and the length of first side 211 is less than the length of second side 222.It is understood that
The lug boss 21 and rectangular portion 22 of this shape are to be compatible with 0805 patch capacitor and 0603 patch capacitor on pad
Welding, to achieve the purpose that the encapsulation of compatible a variety of capacitors.Certainly, in other examples, lug boss 21 can also be with
For other shapes such as triangle, arcs, for example, 0402 patch capacitor can be compatible with when the shape of lug boss 21 is triangle
And 0603 welding of the patch capacitor on pad 20.
Wherein, the length of first side 211 be more than or equal to 0.4mm, and the length 222 of second side be 0.6~
The distance between the first side 211 of 1.8mm and the same pad 20 and second side 222 are 0.6~1.8mm.Meanwhile
The length of vertical edge 221 is more than or equal to 0.8mm.In this embodiment, preferred embodiment is that the length of first side 211 is
0.4mm, the length 222 of second side are 1.2mm, between the first side 211 and second side 222 of the same pad 20 away from
It is 0.8mm from the length for 1.2mm, vertical edge 221.In the above-described embodiments, the pad 20 of preferably this this scheme
The reason is that can either guarantee the encapsulation of compatible 0805 patch capacitor and 0603 patch capacitor, and pad can be reduced as far as possible
20 material to save cost, while additionally providing reliable welding performance.
In addition, the first side 211 of two pads 20 is close to each other and arranged in parallel, and one of pad 20
The distance between first side 211 and the first side 211 of another pad 20 are less than or equal to 0.8mm.Preferably
In embodiment, the distance between the first side 211 of one of pad 20 and the first side 211 of another pad 20 are
0.8mm.And the distance between two first sides 211 are to be able to guarantee in soldering surface mounted capacitor on pad 20, operation
Person clearly can observe whether patch capacitor is accurately installed on pad 20 by the distance between two first sides 211
On.Also, in other examples, the first side of the first side 211 of one of pad 20 and another pad 20
The distance between side 211 can be greater than 0mm and selected less than or equal to the numerical value between 0.8mm.
Preferably, two pads 20 in encapsulating shell 10 are symmetrically set.Due to two pads 20 in encapsulating shell 10
Symmetrically, and if two pads 20 in encapsulating shell 10 not symmetrically, i.e., the perpendicular bisector of two pads 20 is not conllinear.And two
If the perpendicular bisector of a pad 20 is not conllinear, it will cause the perimeters of the encapsulating shell 10 around two pads 20 will increase, in turn
Occupied area is caused to increase.So the mutual axisymmetrical of two pads 2 in encapsulating shell 10 can reduce encapsulating shell 10
Area, and then reduce the area of pcb board.Meanwhile two symmetrical pads 20 are also able to ascend the aesthetic measure of product.
Meanwhile in above-mentioned preferred embodiment, referring again to Fig. 1, when electronic component is installed, if hair
The patch capacitor i.e. under-reserve of 0603 patch capacitor required for existing can then not use 0603 in next encapsulating structure
Patch capacitor, and (0805 patch capacitor is in addition to different from 0603 patch capacitor size dimension instead of using 0805 patch capacitor
Outside, other electric properties are consistent) so that the encapsulating structure has compatibility to various sizes of electronic component, in pcb board
On electronic component alternative it is more.
Also, being also possible to the patch capacitor on two pads 20 is 0805 patch capacitor or 0603 patch capacitor,
It, can be with flexible choice patch capacitor to be welded to further improve the alternative of the patch capacitor on pad 20
It connects.
Further, the utility model also provides a kind of pcb board, and it is a variety of that at least one compatibility is provided on the pcb board
The encapsulating structure of electronic component.Due to needing to place at least one patch capacitor on pcb board, and be provided on the pcb board to
The encapsulating structure of few a variety of capacitors of compatibility subtracts to reduce in parallel and the multiple and different type packages of series connection capacitors
Lack and accounted for plate space, so as to vacate the area of more pcb boards to carry out the layout of other component.
Further, the utility model also provides a kind of electronic equipment, and is provided with pcb board in the electronic equipment.Due to
The electronic equipment uses whole technical solutions of above-mentioned all embodiments, therefore at least with the technical solution of above-described embodiment
Brought all beneficial effects, this is no longer going to repeat them.
The above is only the preferred embodiment of the present invention, and therefore it does not limit the scope of the patent of the utility model,
Under all utility models in the utility model are conceived, equivalent structure made based on the specification and figures of the utility model
Transformation, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (9)
1. a kind of encapsulating structure for being compatible with a variety of electronic components, which is characterized in that the encapsulation knot of a variety of electronic components of compatibility
Structure includes encapsulating shell and two pads being set in the encapsulating shell, and two pads can match various sizes of electricity
Subcomponent, the pad include rectangular portion and be connected with the rectangular portion and shape be trapezoidal lug boss.
2. being compatible with the encapsulating structure of a variety of electronic components as described in claim 1, which is characterized in that the lug boss includes the
A side and the bevel edge being connected with the end of the first side, the rectangular portion include be connected with the bevel edge and with
Bevel edge vertical edge at an angle and the second side being connected with the vertical edge, the length of the first side
Less than the length of the second side.
3. being compatible with the encapsulating structure of a variety of electronic components as claimed in claim 2, which is characterized in that the length of the first side
Degree is more than or equal to 0.4mm, the length of the second side be 0.6~1.8mm and the same pad described the
The distance between a side and the second side are 0.6~1.8mm.
4. being compatible with the encapsulating structure of a variety of electronic components as claimed in claim 2, which is characterized in that the of two pads
A side is close to each other and arranged in parallel, and the of the first side of one of them pad and another pad
The distance between a side is less than or equal to 0.8mm.
5. being compatible with the encapsulating structure of a variety of electronic components as described in claim 1, which is characterized in that the length of the vertical edge
More than or equal to 0.8mm.
6. the encapsulating structure of a variety of electronic components of compatibility according to any one of claims 1 to 5, which is characterized in that the envelope
Two pads in dress shell are symmetrically set.
7. the encapsulating structure of a variety of electronic components of compatibility according to any one of claims 1 to 5, which is characterized in that the electricity
Subcomponent includes 0805 patch capacitor and 0603 patch capacitor.
8. a kind of pcb board, which is characterized in that be provided at least one on the pcb board as described in any one of claim 1-7
The a variety of electronic components of compatibility encapsulating structure.
9. a kind of electronic equipment, which is characterized in that be provided with pcb board as claimed in claim 8 in the electronic equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821451993.4U CN208570348U (en) | 2018-09-05 | 2018-09-05 | Encapsulating structure, pcb board and the electronic equipment of compatible a variety of electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821451993.4U CN208570348U (en) | 2018-09-05 | 2018-09-05 | Encapsulating structure, pcb board and the electronic equipment of compatible a variety of electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208570348U true CN208570348U (en) | 2019-03-01 |
Family
ID=65451667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821451993.4U Expired - Fee Related CN208570348U (en) | 2018-09-05 | 2018-09-05 | Encapsulating structure, pcb board and the electronic equipment of compatible a variety of electronic components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208570348U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113709970A (en) * | 2021-07-16 | 2021-11-26 | 北京金百泽科技有限公司 | Electronic equipment, PCB and chip packaging structure thereof |
| CN114449752A (en) * | 2021-12-31 | 2022-05-06 | 四川天邑康和通信股份有限公司 | Common pad of SMT |
-
2018
- 2018-09-05 CN CN201821451993.4U patent/CN208570348U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113709970A (en) * | 2021-07-16 | 2021-11-26 | 北京金百泽科技有限公司 | Electronic equipment, PCB and chip packaging structure thereof |
| CN113709970B (en) * | 2021-07-16 | 2022-03-04 | 北京金百泽科技有限公司 | Electronic equipment, PCB and chip packaging structure thereof |
| CN114449752A (en) * | 2021-12-31 | 2022-05-06 | 四川天邑康和通信股份有限公司 | Common pad of SMT |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190301 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |