CN104051370A - Packaging system with thermocouple structure - Google Patents
Packaging system with thermocouple structure Download PDFInfo
- Publication number
- CN104051370A CN104051370A CN201310081704.1A CN201310081704A CN104051370A CN 104051370 A CN104051370 A CN 104051370A CN 201310081704 A CN201310081704 A CN 201310081704A CN 104051370 A CN104051370 A CN 104051370A
- Authority
- CN
- China
- Prior art keywords
- chip
- temperature
- keyset
- packaging
- thermocouple
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Abstract
The invention discloses a packaging system. A thermocouple structure is arranged at a switching board, thereby obtaining a precise temperature at a chip inside a packaging body. On the basis of the thermocouple working principle, different metals are manufactured at the surface of the switching board and contact is also realized. With vertical through holes filled with metals in the switching board, the metals at the contact portions are led out; and then a leading-out terminal is connected to a printed circuit board by a packaging substrate, thereby carrying out temperature measurement.
Description
Technical field
The present invention relates to system in package technology, the fields such as 2.5DIC, sensor technology.
Background technology
Along with the continuous lifting of semiconductor core piece performance and the continuous enhancing of function, integrated increasing transistor on one chip, the thing followed is exactly the increase of chip power-consumption and the rising of working temperature.Although constantly dwindling of semiconductor chip processing procedure slowed down this trend, nowadays, such as the power consumption of high-end CPU, GPU chip, be easy to reach tens watts and even break through hectowatt.The design of chip cooling mechanism and the on-line monitoring of chip temperature and regulation and control have been become to a large difficult point that guarantees chip reliability.
Traditional chip temperature is measured conventionally outside encapsulation (on as PCB version or on radiator structure) and is carried out.But chip temperature measured under environment like that has had relatively large deviation compared with actual chips internal temperature, let alone on-line monitoring.
Thermocouple is temperature element conventional in temperature survey, and it directly measures temperature, and temperature signal is converted to thermo-electromotive force signal, converts the temperature of measured medium by electric meter (secondary meter) to.Traditional thermocouple occurs usually used as independent measuring component, has bulky shortcoming, should not turn as envelope the temperature survey of yardstick.
The present invention is exactly in order to solve the temperature survey of package dimensions, makes thermocouple structure on keyset, for the temperature of chip is carried out to on-line monitoring.Because keyset is close to chip lower surface, the thermocouple structure being located thereon can obtain the temperature close to chip internal.
Summary of the invention
Main purpose of the present invention is to propose a kind of thermocouple structure being integrated on keyset, and for comparatively accurately measuring chip internal temperature, main implementation is as follows:
The hot junction of thermocouple is positioned at the upper surface of keyset, close with the lower surface of chip, and cold junction is positioned on the bump that keyset is connected with substrate.By measuring this thermocouple structure, the temperature difference between chip lower surface and upper surface of base plate can be obtained, more just the temperature of chip can be obtained accurately by measuring the temperature of upper surface of base plate.Can also increase online test circuit in PCB version level, reach the object of Real-Time Monitoring chip temperature simultaneously.
Accompanying drawing explanation
Figure mono-is structural representation of the present invention.
Figure bis-is vertical views of structure of the present invention.
1 is integrated circuit (IC) chip, 2 is keyset, 3 is base plate for packaging, 4,5 for forming two kinds of different metals or the alloy of thermocouple structure, 6 soldered balls that are electrically connected to keyset for chip, 7 for having filled the vertical through hole of metal, and 8 is the soldered ball that keyset is electrically connected to envelope transglutaminase substrate, 9 is the metal line on base plate for packaging, 10 soldered balls that are electrically connected to printed circuit board (PCB) for base plate for packaging.
Embodiment
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with specific embodiment, and the present invention is described in more detail with reference to accompanying drawing.
Package system with thermocouple structure, comprising: a base plate for packaging 3 (can be organic material, can be also other materials); Keyset 2 (can be silicon materials, also can other materials); Integrated circuit (IC) chip 1 is positioned on described keyset 2, the vertical through hole 7 of metal that has been connected with keyset 2 via the filling on it by soldered ball 6, and be finally connected on the soldered ball 10 of base plate for packaging 3 belows by 1 metal line 9 on base plate for packaging.
On keyset 2, have to be formed to contact by two kinds of different metals or alloy 4,5 and form thermocouple structure, described thermocouple structure by the filling on keyset 2 vertical through hole 7 of metal through soldered ball 8, be connected on envelope transglutaminase substrate 3, finally the soldered ball 10 by base plate for packaging 3 belows is connected to the temperature survey end on printed circuit board (PCB).By measuring this thermocouple structure, the temperature difference between chip lower surface and upper surface of base plate can be obtained, more just the temperature of chip can be obtained accurately by measuring the temperature of upper surface of base plate.Can also increase online test circuit in PCB version level, reach the object of Real-Time Monitoring chip temperature simultaneously.
Claims (1)
1. the package system with thermocouple structure, comprise keyset (2) and base plate for packaging (3), it is characterized in that: the upper surface at keyset (2) has two kinds of different metal or alloy (4), (5) to form contact, this Metal Contact by the filling on keyset (2) vertical through hole of metal (7) draw, metal connecting line (9) and soldered ball (10) on soldered ball (8), base plate for packaging (3) are finally connected on the measuring junction on printed circuit board (PCB).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310081704.1A CN104051370A (en) | 2013-03-15 | 2013-03-15 | Packaging system with thermocouple structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310081704.1A CN104051370A (en) | 2013-03-15 | 2013-03-15 | Packaging system with thermocouple structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104051370A true CN104051370A (en) | 2014-09-17 |
Family
ID=51504034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310081704.1A Pending CN104051370A (en) | 2013-03-15 | 2013-03-15 | Packaging system with thermocouple structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104051370A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104990565A (en) * | 2015-07-21 | 2015-10-21 | 歌尔声学股份有限公司 | An environment sensor |
| CN105067013A (en) * | 2015-07-21 | 2015-11-18 | 歌尔声学股份有限公司 | Environmental sensor |
| CN105489568A (en) * | 2015-11-25 | 2016-04-13 | 中国科学院微电子研究所 | Flip chip package structure of flip chip and flip chip |
| JP2016118554A (en) * | 2014-12-19 | 2016-06-30 | コミサリア ア レネルジー アトミック エ オ ゼネルジー アルテルナティブＣｏｍｍｉｓｓａｒｉａｔ Ａ Ｌ’Ｅｎｅｒｇｉｅ Ａｔｏｍｉｑｕｅ Ｅｔ Ａｕｘ Ｅｎｅｒｇｉｅｓ Ａｌｔｅｒｎａｔｉｖｅｓ | Differential temperature sensor |
| JP2016128805A (en) * | 2014-12-19 | 2016-07-14 | コミサリア ア レネルジー アトミック エ オ ゼネルジー アルテルナティブＣｏｍｍｉｓｓａｒｉａｔ Ａ Ｌ’Ｅｎｅｒｇｉｅ Ａｔｏｍｉｑｕｅ Ｅｔ Ａｕｘ Ｅｎｅｒｇｉｅｓ Ａｌｔｅｒｎａｔｉｖｅｓ | Differential temperature sensor |
| CN106298732A (en) * | 2016-09-29 | 2017-01-04 | 中国电子科技集团公司第四十三研究所 | A kind of adapter plate structure for system in package |
| CN106898838A (en) * | 2017-03-21 | 2017-06-27 | 联想(北京)有限公司 | The detection method of electronic equipment and battery surface temperature |
| CN107250748A (en) * | 2015-03-12 | 2017-10-13 | 欧姆龙株式会社 | Internal temperature determines device and sensor encapsulation |
-
2013
- 2013-03-15 CN CN201310081704.1A patent/CN104051370A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016118554A (en) * | 2014-12-19 | 2016-06-30 | コミサリア ア レネルジー アトミック エ オ ゼネルジー アルテルナティブＣｏｍｍｉｓｓａｒｉａｔ Ａ Ｌ’Ｅｎｅｒｇｉｅ Ａｔｏｍｉｑｕｅ Ｅｔ Ａｕｘ Ｅｎｅｒｇｉｅｓ Ａｌｔｅｒｎａｔｉｖｅｓ | Differential temperature sensor |
| JP2016128805A (en) * | 2014-12-19 | 2016-07-14 | コミサリア ア レネルジー アトミック エ オ ゼネルジー アルテルナティブＣｏｍｍｉｓｓａｒｉａｔ Ａ Ｌ’Ｅｎｅｒｇｉｅ Ａｔｏｍｉｑｕｅ Ｅｔ Ａｕｘ Ｅｎｅｒｇｉｅｓ Ａｌｔｅｒｎａｔｉｖｅｓ | Differential temperature sensor |
| CN107250748A (en) * | 2015-03-12 | 2017-10-13 | 欧姆龙株式会社 | Internal temperature determines device and sensor encapsulation |
| CN107250748B (en) * | 2015-03-12 | 2019-10-25 | 欧姆龙株式会社 | Internal temperature measurement device and sensor encapsulation |
| US10551252B2 (en) | 2015-03-12 | 2020-02-04 | Omron Corporation | Internal temperature measuring apparatus and sensor package |
| CN104990565A (en) * | 2015-07-21 | 2015-10-21 | 歌尔声学股份有限公司 | An environment sensor |
| CN105067013A (en) * | 2015-07-21 | 2015-11-18 | 歌尔声学股份有限公司 | Environmental sensor |
| CN105489568A (en) * | 2015-11-25 | 2016-04-13 | 中国科学院微电子研究所 | Flip chip package structure of flip chip and flip chip |
| WO2017088286A1 (en) * | 2015-11-25 | 2017-06-01 | 中国科学院微电子研究所 | Flip chip package structure of flip chip, and flip chip |
| CN105489568B (en) * | 2015-11-25 | 2019-01-22 | 中国科学院微电子研究所 | A kind of the flip-chip packaged structure and flip-chip of flip-chip |
| CN106298732A (en) * | 2016-09-29 | 2017-01-04 | 中国电子科技集团公司第四十三研究所 | A kind of adapter plate structure for system in package |
| CN106898838A (en) * | 2017-03-21 | 2017-06-27 | 联想(北京)有限公司 | The detection method of electronic equipment and battery surface temperature |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140917 |