CN1961624A - Electronic component - Google Patents

Electronic component Download PDF

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Publication number
CN1961624A
CN1961624A CN 200580017881 CN200580017881A CN1961624A CN 1961624 A CN1961624 A CN 1961624A CN 200580017881 CN200580017881 CN 200580017881 CN 200580017881 A CN200580017881 A CN 200580017881A CN 1961624 A CN1961624 A CN 1961624A
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CN
China
Prior art keywords
terminal
electronic component
outer covering
covering material
lead terminal
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Pending
Application number
CN 200580017881
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Chinese (zh)
Inventor
日高晃男
池边庄一
村野雄一
梶谷广澄
池田美香
沟口督生
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Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
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Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN1961624A publication Critical patent/CN1961624A/en
Pending legal-status Critical Current

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Abstract

The present invention aims to supply an electronic component which is manufactured in a manufacturing process at low cost, and realize improvement of shock resistance, endurance, flexure resistance, mounting reliability etc. at the same time, without requiring fine adjustment etc. The invention is an electronic component 1 which has an element 2, a pair of terminal portions 4 which were disposed on the element 2, and an external covering material 5 which covers the a part of the terminal portions 4 and the element 2, and configured in such a manner that inclined portions 10 are disposed on corner portions of a bottom surface 9 and side surfaces of the external covering material 5, and the terminal portions 4 are protruded from corner portions where the inclined portions 10 and the bottom surface 9 of the external covering material intersect.

Description

Electronic component
Technical field
The present invention relates to electronic component, it is applicable to for example electronic installation of power supply, DC-DC transducer and the power line communication apparatus of modulator-demodulator, power circuit, liquid crystal.
Background technology
In the electronic installation of for example modulator-demodulator and power circuit, many electronic components have been installed.For example, all use capacitor to remove in many cases and make an uproar, cut off DC component etc.
Now, require electronic device miniaturization, low cost, and be accordingly therewith, also require electronic component miniaturization, low cost.In addition, need surface mounted electronic elements to reduce by the installation cost due to the automatic installation and to reduce erection space in many cases.On the other hand, many situations appear, and consistent with miniaturization, wherein require such as realizing high-performance, minimizing characteristics fluctuation and more being the conflict specification of improving durability.
In addition, the increase along with the figure place of the realization of a plurality of pins that are used for large scale integrated circuit (LSI) etc. and holding wire the needs to high-density installation occurred, to be used for that a plurality of electronic components are installed in the very little place of distance between centers of tracks.
Especially, have many situations, being used for two lines that data inputs and data export is paired at modulator-demodulator etc., and two electronic components need be installed on line reliably.
In order to satisfy these requirements, various feasible electronic components (for example, open referring to JP-A-2001-110691, JP-A-2002-43170 is open) have been proposed.
Especially, as described in above-mentioned patent document,, realize improving puncture voltage, and improve durability, thermal endurance and moisture-proof etc. in the electronic component by outer covering material cladding element with for example resin in response to high-breakdown-voltage.
Yet, in the case, need form outer covering material by using metal die wait, and have the situation of the following configuration of many employings, promptly engage two established outer covering materials, and lead terminal stretches out from its laminating surface, or the like.Yet, in this type of configuration, there are many situations, the number in man-hour that wherein is used to produce becomes big, and cost becomes expensive.In addition, portion of terminal and lead terminal will stretch out from the middle part of the side of outer covering material, therefore have following situation, and promptly it is carried out meticulous adjustment and need expend cost, or the like.
For corresponding to this, a kind of electronic component has been proposed, it is made by the following method, promptly puts into mould bases (frame) under portion of terminal or lead terminal are connected to the situation of element, resin etc. is cast in this mould bases, and encapsulates with outer covering material.
Figure 41 and 42 is the end view of the electronic component in the correlation technique, and it has owing to the shape that adopts manufacture method as mentioned above to form, and the advantage made from low cost is arranged.
1100 expression electronic components, 1101 expressions comprise for example element of the various electronic devices of capacitor (single plate capacitor, multi-layer capacitor etc.), resistor, coil, filter and other electronic device.1102 is electrode in the expression under the situation of multi-layer capacitor at described element, 1103 expression external electrodes, and 1104 expression lead terminals, 1105 represent outer covering materials.Simultaneously, the lead terminal 1104 that is connected to element 1101 and stretches out from outside coating member 1105 is called as portion of terminal under it is directly connected to the situation of described element, and the terminal that further is connected to the direct-connected portion of terminal of described element is called lead terminal, but do not have strict difference here, but they are similar.
Clearly visible from Figure 41, by with resin-cast in mould bases with as above-mentioned realization low-cost and in by the outside electronic component 1100 that covers, its lead terminal 1104 becomes and has following shape, and promptly lead terminal 1104 reaches the outside from the bottom surface of outer covering material 1105 and the corner part of side.
Yet, in as Figure 41 in the electronic component of represented correlation technique, portion of terminal and lead terminal 1104 stretch out from the bottom surface of outer covering material 1105 and the corner part of side, therefore and externally there is not tolerance (tolerance limit) between cladding material 1105 and the lead terminal 1104 etc., and exists opposing comes from the outside after installation the vibration and the more weak problem of stiffness of impact.
In addition, certainly, also just do not have the ability of impacting etc. of handling, therefore, described impact concentrates on outer covering material 1105, install on the solder portion etc., and exists more weak problem such as durability, situation about damaging such as crackle etc. for example occurs.
In addition, as shown in Figure 42, on the lead terminal 1104 that stretches out laterally, become and be easy to generate warpage and bending, and the substrate problem of difficulty and installation reliability step-down that becomes occurred being installed to.
In addition, in order to make with low cost, lead terminal 1104 is connected to element 1101 puts into metal die etc. together, and molten resin etc. is cast in this metal die, therefore make it mold formed, but in this type of manufacture method, need be under the state that the lead terminal 1104 that stretches out is upwards mentioned with it, promptly putting into metal die under its state that is reversed, and resin etc. is cast in the metal die.Therefore, be difficult to make lead terminal 1104 to stretch out from the side.Perhaps, for lead terminal 1104 is stretched out from the side, and further make between the lead terminal 1104 that stretched out and the outer covering material 1105 and keep tolerance (tolerance limit), need in advance lead terminal 1104 intricatelys to be bent, therefore also exist and the complicated problems that becomes and the low cost that is unrealized such as adjust.
As above, for the electronic component in the correlation technique, with resin-cast in being placed on mould bases element 1101 and lead terminal 1104 to realize in the outside method that covers, reduce work hours number, to make the meticulous adjustment in back etc. be unnecessary, therefore just might realize low cost, but exist following problem, promptly handle the ability variation of lead terminal deflection, and durability and resistance to impact step-down, and the shape retention in installation reliability and when transportation can step-down, or the like.Therefore, exist the problem of electronic component deficiency aspect practical application.
In addition, in as Figure 41 in the electronic component of represented correlation technique, when the cast molten resin very high temperature appears, therefore exist multi-layer capacitor 1106 1102 fusions of interior electrode, problem such as be damaged.Equally, under the situation by automatic installation electronic components 1100 such as refluxing, occur high temperature similarly, therefore, the fusion and the damage of interior electrode 1102 become problem.Therefore, require to use the interior electrode 1102 of applicable high temperature countermeasure.
In addition, in Figure 41 in the electronic component of represented correlation technique, transfer modling methods such as (transfer mold) is different with the situation that outer covering material encapsulates with using, lead terminal 1104 does not stretch out laterally from the side of outer covering material 1105 and the extension of side, therefore, exist the resistance to impact of lead terminal 1104 and durability, the more weak problem of stiffness.
Therefore, exist manufacturing, transportation and when installing and the more weak problem of reliability after installing, and exist the problem of electronic component deficiency aspect practical application.
Summary of the invention
The invention of claim 1 is an electronic component, and it comprises: element; Pair of terminal portion, it places on the described element and turns back to allow mounted on surface; With outside coating member, it covers the part of described portion of terminal, and wherein said pair of terminal portion stretches out from the bottom surface of outer covering material respectively.
The present invention can be by realizing having improvement with the outer covering material potted element puncture voltage, resistance to impact, durability, the electronic component of moisture-proof.
In addition, portion of terminal and lead terminal stretch out from the bottom surface of outer covering material, therefore tolerance (tolerance limit) occurs between described outer covering material and described portion of terminal (lead terminal), and might improve stiffness after installation.
In the invention described in the claim 24 of the present invention is the manufacture method of electronic component, it is characterized in that, has the step of placing element; Element is connected to the step of pair of terminal portion; The element that will be connected with portion of terminal is put into the step of metal die; With the outer covering material of fusion be cast in the described metal die, until the step that reaches the degree that described portion of terminal stretches out from the bottom surface of described outer covering material; With the step of solidifying the outer covering material of being poured into a mould, and the electronic component that might easily have strong stiffness with low cost manufacturing.
Description of drawings
Fig. 1 is the end view of the electronic component in the embodiments of the present invention.
Fig. 2 is the end view of the electronic component in the embodiments of the present invention.
Fig. 3 is the end view of the electronic component in the embodiments of the present invention.
Fig. 4 is the end view of the electronic component in the embodiments of the present invention.
Fig. 5 is the end view of the electronic component in the embodiments of the present invention.
Fig. 6 is the end view of the electronic component in the embodiments of the present invention.
Fig. 7 is the end view of the electronic component in the embodiments of the present invention.
Fig. 8 is the end view of the electronic component in the embodiments of the present invention.
Fig. 9 is the end view of the electronic component in the embodiments of the present invention.
Figure 10 is the end view of the electronic component in the embodiments of the present invention.
Figure 11 is the end view of the electronic component in the embodiments of the present invention.
Figure 12 is the end view of the electronic component in the embodiments of the present invention.
Figure 13 is the end view of the electronic component in the embodiments of the present invention.
Figure 14 is the vertical view of the electronic component in the embodiments of the present invention.
Figure 15 is the vertical view of the electronic component in the embodiments of the present invention.
Figure 16 is the vertical view of the electronic component in the embodiments of the present invention.
Figure 17 is the vertical view of the electronic component in the embodiments of the present invention.
Figure 18 is the end view of the electronic component in the embodiments of the present invention.
Figure 19 is the end view of the electronic component in the embodiments of the present invention.
Figure 20 is the end view of the electronic component in the embodiments of the present invention.
Figure 21 is the end view of the electronic component in the embodiments of the present invention.
Figure 22 is the end view of the electronic component in the embodiments of the present invention.
Figure 23 is the end view of the electronic component in the embodiments of the present invention.
Figure 24 is the end view of the electronic component in the embodiments of the present invention.
Figure 25 is the end view of the electronic component in the embodiments of the present invention.
Figure 26 is the end view of the electronic component in the embodiments of the present invention.
Figure 27 is the end view of the electronic component in the embodiments of the present invention.
Figure 28 is the end view of the electronic component in the embodiments of the present invention.
Figure 29 is the end view of the electronic component in the embodiments of the present invention.
Figure 30 is the end view of the electronic component in the embodiments of the present invention.
Figure 31 is the end view of the electronic component in the embodiments of the present invention.
Figure 32 is the end view of the electronic component in the embodiments of the present invention.
Figure 33 is the end view of the electronic component in the embodiments of the present invention.
Figure 34 is the vertical view of the electronic component in the embodiments of the present invention.
Figure 35 is the vertical view of the electronic component in the embodiments of the present invention.
Figure 36 is the vertical view of the electronic component in the embodiments of the present invention.
Figure 37 is the vertical view of the electronic component in the embodiments of the present invention.
Figure 38 is the end view of the electronic component in the embodiments of the present invention.
Figure 39 is the end view of the electronic component in the embodiments of the present invention.
Figure 40 is the end view of the electronic component in the embodiments of the present invention.
Figure 41 is the end view of the electronic component in the correlation technique.
Figure 42 is the end view of the electronic component in the correlation technique.
Figure 43 is the end view of the electronic component in the embodiments of the present invention.
Figure 44 is the end view of the electronic component in the embodiments of the present invention.
Figure 45 is the end view of the electronic component in the embodiments of the present invention.
Figure 46 is the end view of the electronic component in the embodiments of the present invention.
Figure 47 is the end view of the electronic component in the embodiments of the present invention.
Figure 48 is the end view of the electronic component in the embodiments of the present invention.
Figure 49 is the end view of the electronic component in the embodiments of the present invention.
Figure 50 is the end view of the electronic component in the embodiments of the present invention.
Figure 51 is the end view of the electronic component in the embodiments of the present invention.
Figure 52 is the end view of the electronic component in the embodiments of the present invention.
Figure 53 is the end view of the electronic component in the embodiments of the present invention.
Figure 54 is the end view of the electronic component in the embodiments of the present invention.
Figure 55 is the end view of the electronic component in the embodiments of the present invention.
Figure 56 is the vertical view of the electronic component in the embodiments of the present invention.
Figure 57 is the vertical view of the electronic component in the embodiments of the present invention.
Figure 58 is the vertical view of the electronic component in the embodiments of the present invention.
Figure 59 is the vertical view of the electronic component in the embodiments of the present invention.
Figure 60 is the process drawing of the electronic component in the embodiments of the present invention.
Figure 61 is the process drawing of the electronic component in the embodiments of the present invention.
Figure 62 is the end view of the electronic component in the embodiments of the present invention.
Figure 63 is the end view of the electronic component in the embodiments of the present invention.
Figure 64 is the end view of the electronic component in the embodiments of the present invention.
Figure 65 is the end view of the electronic component in the embodiments of the present invention.
Figure 66 is the end view of the electronic component in the embodiments of the present invention.
Figure 67 is the end view of the electronic component in the embodiments of the present invention.
Figure 68 is the end view of the electronic component in the embodiments of the present invention.
Figure 69 is the end view of the electronic component in the embodiments of the present invention.
Figure 70 is the end view of the electronic component in the embodiments of the present invention.
Figure 71 is the end view of the electronic component in the embodiments of the present invention.
Figure 72 is the end view of the electronic component in the embodiments of the present invention.
Figure 73 is the end view of the electronic component in the embodiments of the present invention.
Figure 74 is the end view of the electronic component in the embodiments of the present invention.
Figure 75 is the vertical view of the electronic component in the embodiments of the present invention.
Figure 76 is the vertical view of the electronic component in the embodiments of the present invention.
Figure 77 is the vertical view of the electronic component in the embodiments of the present invention.
Figure 78 is the vertical view of the electronic component in the embodiments of the present invention.
Figure 79 is the process drawing of the electronic component in the embodiments of the present invention.
Figure 80 is the process drawing of the electronic component in the embodiments of the present invention.
Figure 81 is the end view of the electronic component in the embodiments of the present invention.
Figure 82 is the end view of the electronic component in the embodiments of the present invention.
Figure 83 is the end view of the electronic component in the embodiments of the present invention.
Figure 84 is the end view of the electronic component in the embodiments of the present invention.
Figure 85 is the end view of the electronic component in the embodiments of the present invention.
Figure 86 is the end view of the electronic component in the embodiments of the present invention.
Figure 87 is the end view of the electronic component in the embodiments of the present invention.
Figure 88 is the end view of the electronic component in the embodiments of the present invention.
Figure 89 is the end view of the electronic component in the embodiments of the present invention.
Figure 90 is the end view of the electronic component in the embodiments of the present invention.
Figure 91 is the end view of the electronic component in the embodiments of the present invention.
Figure 92 is the end view of the electronic component in the embodiments of the present invention.
Figure 93 is the end view of the electronic component in the embodiments of the present invention.
Figure 94 is the end view of the electronic component in the embodiments of the present invention.
Figure 95 is the vertical view of the electronic component in the embodiments of the present invention.
Figure 96 is the vertical view of the electronic component in the embodiments of the present invention.
Figure 97 is the vertical view of the electronic component in the embodiments of the present invention.
Figure 98 is the end view of the electronic component in the embodiments of the present invention.
Figure 99 is the end view of the electronic component in the embodiments of the present invention.
Figure 100 is the end view of the electronic component in the embodiments of the present invention.
Figure 101 is the end view of the electronic component in the embodiments of the present invention.
Figure 102 is the end view of the electronic component in the embodiments of the present invention.
Figure 103 is the end view of the electronic component in the embodiments of the present invention.
Figure 104 is the end view of the electronic component in the embodiments of the present invention.
Figure 105 is the end view of the electronic component in the embodiments of the present invention.
Figure 106 is the end view of the electronic component in the embodiments of the present invention.
Figure 107 is the end view of the electronic component in the embodiments of the present invention.
Figure 108 is the end view of the electronic component in the embodiments of the present invention.
Figure 109 is the end view of the electronic component in the embodiments of the present invention.
Figure 110 is the end view of the electronic component in the embodiments of the present invention.
Figure 111 is the end view of the electronic component in the embodiments of the present invention.
Figure 112 is the end view of the electronic component in the embodiments of the present invention.
Figure 113 is the vertical view of the electronic component in the embodiments of the present invention.
Figure 114 is the vertical view of the electronic component in the embodiments of the present invention.
Embodiment
Hereinafter, will use accompanying drawing to describe embodiments of the present invention.
Fig. 1,2,3,4,5,6,7,8,9,10,11,12,13,18,19,20,21,22,23,24,25,26,27,28,29,30,31,32,33,38,39 and 40 is the end view of the electronic component in the embodiments of the present invention, and Figure 14,15,16,17,34,35,36 and 37 is the vertical view of the electronic component in the embodiments of the present invention.
Fig. 1 to 20 is expressed as follows configuration, be that portion of terminal is connected to a certain element, this element is the various electronic devices such as capacitor (single plate capacitor, stacked capacitor, electrolytic capacitor etc.), resistor, inductor, filter and integrated circuit (IC), and portion of terminal is molded over outer covering material, and the part of portion of terminal reaches the outside of outer covering material, and various reinforcing materials are set.
On the other hand, Figure 21 to 41 is expressed as follows configuration: main to represent an example as this inner member as the multi-layer capacitor of inner member, and portion of terminal is connected to multi-layer capacitor, and the pair of lead wires terminal is connected to portion of terminal, and be molded over outer covering material, and the part of lead terminal reaches the outside, and various reinforcing materials are set.Represented configuration is almost corresponding configuration with configuration represented from Figure 21 to Figure 40 from Fig. 1 to Figure 20, except described element is that multi-layer capacitor and lead terminal are connected this situation, and hereinafter, explanation has repetition as required, and under the situation that mainly is repetition, explanation can be omitted.
1 expression electronic component, 2 expression elements, 3 expression electrodes, 4 expression portion of terminal, 5 expression outer covering materials, 6 expression multi-layer capacitors, electrode in 7 expressions, 8 expression lead terminals, 9 expression bottom surfaces, 10 expression rakes, 11 expression angle of cut portions, 12 expression depressed parts, 15 expression curved face part, 16 expression folding parts, the wavy portion of 17 expressions, 30 expression distances, and curved face part 15, folding part 16 and wavy 17 example that is expressed as the deflection absorbent portion.
At first, referring to each accompanying drawing, in the configuration of electronic component 1, briefly be described in the feature in the configuration of electronic component 1 and the advantage thereof that embody in each accompanying drawing.
Fig. 1 shows following configuration, and promptly portion of terminal 49 is stretched out from the bottom surface, and distance 30 is that portion of terminal 4 is stretched out the distance between the corner part of the bottom surface of the position of bottom surface and outer covering material 5 and side.By such configuration, tolerance (tolerance limit) between portion of terminal 4 of stretching out and outer covering material 5, occurs, and improved stiffness from outer covering material 5.
Fig. 2 shows following configuration, and promptly rake 10 is arranged on the corner part of the bottom surface 9 of outer covering material 5 and side, and the corner part that portion of terminal 4 intersects places from rake 10 and bottom surface 9 stretches out.Particularly, it has such surface installation structure: portion of terminal 4 is extended to the bottom side earlier, turns back then and roughly L-shaped.By such configuration, portion of terminal 4 will be from the bottom surface 9 the most outstanding part stretch out, and might guarantee distance between the corner part of the portion of terminal 4 of stretching out laterally and bottom surface 9 and side, and very large tolerance (tolerance limit) occur, and will improve stiffness.
Fig. 3 shows the situation that corner part that portion of terminal 4 intersects places from rake 10 and bottom surface 9 stretches out, and with similar among Fig. 2, and show following configuration: portion of terminal 4 is stretched out the back and stretched with the shape along the bottom surface.That is to say that portion of terminal 4 becomes roughly parallel with the bottom surface 9 of outer covering material 5.In the case, tolerance (tolerance limit) occurs, and will improve stiffness, and manufacturing is easier than the situation of Fig. 2.
Fig. 4 shows that rake becomes the situation of arc surface.Because it is an arc surface, so have such advantage, can realize resisting the strong electronic components of ability such as impact.In addition, with identical with the situation of Fig. 2, the portion of terminal of stretching out is stretched to the bottom side, thereafter, turns back roughly L-shaped, has the portion of terminal 4 of surface installation structure thereby form.
Identical with Fig. 4, Fig. 5 shows that rake 10 is the configuration of arc surface, in addition, shows following configuration, and promptly after portion of terminal 4 was stretched out in the mode identical with Fig. 3, its bottom surface 9 along outer covering material 5 (roughly parallel with bottom surface 9) stretched.
Similar to Fig. 3, Fig. 6 shows following configuration, and promptly portion of terminal 4 is stretched out from the corner part of rake 10 with 9 crossing places, bottom surface, and then, stretch its bottom surface 9 along outer covering material 5.In this case, it is big that the tolerance (tolerance limit) between portion of terminal 4 and the outer covering material 5 further becomes, and improved stiffness fully.
Fig. 7 shows following configuration, and promptly portion of terminal is stretched out from the depressed part 12 that is arranged on the bottom surface 9.In addition, depressed part 12 is set to the otch of general square shape.
Fig. 8 represents the configuration that portion of terminal 4 is stretched out from depressed part in an identical manner, and depressed part 12 is the situation of triangular incision.In the situation of Fig. 7 and Fig. 8, portion of terminal 4 is stretched out from depressed part 12, therefore has tolerance between portion of terminal 4 and outer covering material 5, and has improved stiffness.In addition, Fig. 7 and Fig. 8 all show following configuration, and promptly after portion of terminal 4 was stretched out, it is 9 stretching, extensions and parallel with bottom surface 9 along the bottom surface.
Fig. 9 represents that also portion of terminal 4 stretches out from bend 12, and is such surface installation structure: the portion of terminal 4 of stretching out is stretched to the bottom side, and then turns back in the centre and roughly L-shaped.Equally in this case, the tolerance (tolerance limit) between portion of terminal 4 and the outer covering material 5 becomes very big, and stiffness becomes very big.
The configuration that the portion of terminal 4 that Figure 10 displaying is stretched out increases towards its leading edge direction thickness.By such configuration, can realize stiffness, opposing strongly significantly puts on the stress such as impact of portion of terminal 4 leading edges,, has resistance to impact and durability that is.
Figure 11 shows that the portion of terminal 4 stretch out is towards its leading edge direction and the configuration of less thick.By such configuration, improve the elasticity of portion of terminal 4, and further improve stiffness.
Figure 12 shows following configuration, and promptly existing externally in portion of terminal 4, the part in the outside of cladding material 5 compares the externally inboard thick part of cladding material.By such configuration, may improve resistance to impact in the portion of terminal 4 in the outside.
Figure 13 shows following configuration, and promptly the corner part to the outer covering material 5 the corner part that stretches out the place except that portion of terminal 4 applies chamfering.By such configuration, improved the resistance to impact of outer covering material 5, and might prevent damage such as cracking.
Figure 14 and 15 shows that reinforcing materials 20 are arranged at the configuration on the non-installation surface of portion of terminal 4.Configuration by such has improved stiffness, and in addition, has improved the resistance to impact of portion of terminal 4.Figure 14 shows that reinforcing material 20 roughly is formed at the structure of the core of portion of terminal 4, and Figure 15 shows that reinforcing material 20 is formed at the structure of the outer edge of portion of terminal 4.
Figure 16 represents that a plurality of paired portion of terminal 4 are arranged at an element 2 on the matrix, might use a matrix like this and forms multiple device (composite device).
Figure 17 shows that a plurality of elements 2 are packaged in a structure in the outer covering material 5, and in this mode, might easily form multiple device in an electronic component, and further saves the man-hour of installing.
Figure 18 represents that curved face part 15 is arranged on the structure on the portion of terminal 4 as the deflection absorbent portion.
Figure 19 represents that in an identical manner folding part 16 is arranged on the structure on the portion of terminal 4 as the deflection absorbent portion.
Figure 20 represents that running surface 17 is set to the structure of deflection absorbent portion.
By the deflection absorbent portion as shown in Figure 18 to 20, can improve the stiffness of deflection that opposing causes the vibration of portion of terminal 4, impact etc. etc.
Figure 21 shows following configuration, and promptly lead terminal 89 stretches out from the bottom surface, and the distance that lead terminal 8 stretches out between the corner part of the bottom surface of part and outer covering material 5 and side is not less than 0.1mm.By such configuration, tolerance (tolerance limit) between lead terminal 8 that stretches out from outer covering material 5 and outer covering material 5, occurs, and improve stiffness.
Figure 22 shows following configuration, and promptly rake 10 is arranged on the corner part of the bottom surface 9 of outer covering material 5 and side, and the corner part that lead terminal 8 intersects places from rake 10 and bottom surface 9 stretches out.Particularly, it has following surface installation structure: lead terminal 8 stretches out to the bottom side, then turns back and roughly L-shaped.By such configuration, can guarantee the distance between the bottom surface 9 of the lead terminal 8 that stretches out laterally and outer covering material 5 and the corner part that intersects the side, and produce very large tolerance (tolerance limit), and will improve stiffness.
Figure 23 shows the situation that lead terminal 8 stretches out from the corner part of rake 10 and bottom surface 9 in the mode identical with Figure 22, and after lead terminal 8 stretches out, just stretches with the shape along the bottom surface.That is, lead terminal 8 becomes bottom surface 9 almost parallels with outer covering material 5.Equally, in this case, in an identical manner, produced tolerance (tolerance limit), improved stiffness, and manufacture easier than the situation of Figure 22.
Figure 24 shows that rake 10 forms the situation of arc surface.Because it has the shape of arc surface, therefore has such advantage, the electronic component of the durability that can realize having that opposing is impacted etc.In addition, with identical with the situation of Figure 22, the terminal 8 that stretches out stretches out, and turns back thereafter and roughly L-shaped, thereby forms surface installation structure.
Identical with Figure 24, Figure 25 represents that rake 10 is the configuration of arc surface, and in addition, in the mode identical with Figure 23, after lead terminal 8 stretched out, its bottom surface 9 along outer covering material 5 (roughly parallel with bottom surface 9) stretched.
Identical with Figure 23 (should be Fig. 6), Figure 25 shows following configuration, and promptly lead terminal 8 is from stretching out than rake 10 and the corner part inside that the place is intersected in bottom surface 9, and then, stretch its bottom surface 9 along outer covering material 5.In this case, it is big that the tolerance (tolerance limit) between lead terminal 8 and outer covering material 5 becomes, and significantly improve stiffness.
Figure 27 shows following configuration, and promptly the depressed part 12 of lead terminal 8 from be arranged at bottom surface 9 stretches out.In addition, depressed part 12 is set to the otch of general square shape.
Figure 28 represents the configuration that lead terminal 8 stretches out from depressed part 12 in the same manner, and depressed part 12 is the triangular incision part.In Figure 27 and Figure 28, lead terminal 8 stretches out from depressed part 12, therefore, tolerance occurs between lead terminal 8 and the outer covering material 5, and has improved stiffness.In addition, Figure 27 and Figure 28 show that all lead terminal 89 stretches and the configuration parallel with bottom surface 9 along the bottom surface.
Figure 29 represents the situation that lead terminal 8 stretches out from depressed part 12, and for following surface installation structure: the lead terminal 8 that stretches out stretches out to the bottom side, then turns back at the middle part and roughly L-shaped.In the case, the tolerance (tolerance limit) between lead terminal 8 and the outer covering material 5 becomes very big, and stiffness becomes very big.
The configuration that the lead terminal 8 that Figure 30 displaying is stretched out increases towards leading edge direction thickness.By such configuration, just can realize stiffness, opposing strongly significantly puts on the stress such as impact of portion of terminal 4 leading edges,, guarantees resistance to impact and durability that is.
The terminal 8 that Figure 31 displaying is stretched out is towards the configuration of its leading edge direction less thick.By such configuration, improve the elasticity of lead terminal 8, and further improve stiffness.
Figure 32 shows following configuration, and promptly existing externally in lead terminal 8, the part in cladding material 5 outsides compares the externally inboard thick part of cladding material 5.By such configuration, can improve the resistance to impact of the lead terminal 8 that reaches the outside.
Figure 33 shows following configuration, and promptly the corner part to the outer covering material 5 the corner part that stretches out the place except that lead terminal 8 applies chamfering.By such configuration, improve the resistance to impact of outer covering material 5, and might prevent damage such as cracking.
Figure 34 and 35 shows that reinforcing materials 20 are arranged at the configuration on the non-installation surface of lead terminal 8.Configuration by such has improved resistance to impact, has also improved the stiffness of lead terminal 8.Figure 34 shows that reinforcing material 20 roughly is formed at the structure of the central part of lead terminal 8, and Figure 35 shows that reinforcing material 20 is formed at the structure at the place, outer edge of lead terminal 8.
Figure 36 represents form terminal part 4 to be arranged at a multi-layer capacitor 6 on the matrix more, and might easily form multiple device in a matrix.
Figure 37 shows that a plurality of multi-layer capacitors 6 are packaged in a structure in the outer covering material 5, and in an identical manner, might easily form multiple device in an electronic component, and further saves the man-hour of installing.
Figure 38 represents that curved face part 15 is set at structure on the lead terminal 8 as the deflection absorbent portion.
Figure 39 represents that folding part 16 is set at structure on the lead terminal 8 as the deflection absorbent portion in the same manner.
Figure 40 represents that wavy surface 17 is set to the configuration of deflection absorbent portion.
By the deflection absorbent portion as shown in Figure 38 to 40, can improve the stiffness of deflection that opposing causes by vibration, impact etc. etc.
Aforementioned content is to the structure of each accompanying drawing and wants the description of portion.
Simultaneously, shown in Fig. 1 to 14, stretch out from the bottom surface of outer covering material 5 in order to make portion of terminal 4, electrode 3 is connected to element 2, then portion of terminal 4 is connected to electrode 3, then portion of terminal 4 is turned back arbitrarily, and it is put into metal die with inversion state, with injection metal dies such as molten resins, and under the folding part of portion of terminal 4, stop injecting resin.If these are finished, 9 stretch out from the bottom surface just might guarantee portion of terminal 4 so.
Even under the situation of multi-layer capacitor as shown in Figure 20 to 34 6 and lead terminal 8, also be so, and might realize at an easy rate by low-cost metal die type casting resin encapsulation (metalmold type pour-in resin sealing) of making.
Then, will the details of each part be described.
1 expression electronic component, as shown in Fig. 1 etc., it is the electronic component that comprises electric capacity, resistance, inductance, filter and the other electron component etc. that are molded over the outer covering material such as resin, and be electronic component: promptly be molded over outer covering material owing to it with following feature, therefore improve durability and moisture-proof, resistance to impact, even also can bear high-breakdown-voltage.
Then, element 2 will be described.
2 expression elements, and as mentioned above, any one in capacitor, resistance, inductance, filter, IC and other electronic device all can be used as element 2, and capacitor can be any in single plate capacitor, multi-layer capacitor, the electrolytic capacitor etc.Fig. 1 represents single plate capacitor, and Fig. 2 represents multi-layer capacitor.
Simultaneously, element 2 (or multi-layer capacitor 6) can individually encapsulate with outer covering material 5, and a plurality of element 2 can encapsulate with outer covering material 5.
Perhaps, also be fine, thereby operate as an electronic device even pair of electrodes 3 is arranged on the matrix, even or a plurality of paired electrode 3 be arranged on the matrix and equally also be fine, and operate as a plurality of electronic devices.
The configuration that encapsulates a plurality of elements 2 (or multi-layer capacitor 6) is illustrated in Figure 17 and 37.
Then, electrode 3 will be described.
Electrode 3 is the conductive component that is provided with in pairs on element 2 (or multi-layer capacitor 6) two ends, and realizes the conductivity of outside installation base plate and element 2 (or multi-layer capacitor 6) via portion of terminal 4 and lead terminal 8.Commonly electrode 3 is provided with on the two ends of element 2 (or multi-layer capacitor 6) in pairs, even but be arranged at the middle part of element 2 (or multi-layer capacitor 6) rather than also be fine on two ends.Perhaps, even be arranged at the upper surface and the lower surface of element 2 (or multi-layer capacitor 6) rather than on the side, also be fine, even and be arranged on the whole surface of side, upper surface and lower surface and equally also be fine, even and only be arranged on its part and equally also be fine, even and be set to run off the edge and another surface that arrives equally also is fine.
The material of electrode 3 is at least a metal materials that comprise among Ni, Ag, Pd, Cu, the Au etc.Especially, by using Ni monomer or Ni alloy, it is favourable also to become aspect cost.In addition, also can use the alloy of these materials and to one of these materials application surface electroplating technology.Certainly, can use alloy etc., also can realize by in single or multiple lift electroplating processes, deposition processes, sputter processing, the slurry coating etc. any.
Then, portion of terminal 4 will be described.
Portion of terminal 4 is connected to electrode 3, and is arranged in pairs on the element 2 (or multi-layer capacitor 6).Usually, a lot of situation lower terminal portions 4 (taken in context should be meant portion of terminal 4 here rather than refer to electrode 3) are the two ends that are arranged at element 2 (or multi-layer capacitor 6), even but the place that is arranged at except that two ends also be fine.For example, be arranged at electrode 3 under the situation of upper surface and lower surface, portion of terminal 4 also can be connected with these electrodes 3 that forms on upper surface and lower surface.In addition, even portion of terminal 4 is to constitute by comprising a kind of material among Cu, Zn, Ni, Ag, the Au etc. at least also to be fine, and to its surface applications single or multiple lift electroplating processes.
In addition, even dispose portion of terminal 4 and also be fine by crown cap (metal cap) being joined to element 2.In addition, preferably dispose the most external (surface portion) of portion of terminal 4 by electric conducting material with the above fusing point of 200 degree, and by this configuration, make electronic component be subjected to high temperature even wait because reflux, there is not the situation that makes portion of terminal 4 be subjected to cause thermal damage yet, and might enough obtains stable reflux characteristic.
Portion of terminal 4 is connected to electrode 3, and at random is processed into suitable shape, and forms to the outside of outer covering material 5 and stretch out.
In addition, hereinafter the outer covering material of describing 5 is achieved in that portion of terminal 4 (or lead terminal 8) is connected to element 2 (or multi-layer capacitor 6) puts into mould bases together, and molten resin is cast in this mould bases, therefore, portion of terminal 4 is stretched out from the bottom surface of outer covering material.
That is to say, under portion of terminal 4 is connected to the state of element 2, put it in the mould bases, and think that the state that these portion of terminal 4 are hooked metal die is fixed.By molten resin etc. is cast in this metal die,, realize the structure that portion of terminal 4 is stretched out from the bottom surface at an easy rate until just reaching below the virtual plane that forms by portion of terminal 4.
That is to say, compare,, can make portion of terminal 49 stretch out and become possibility, so that improve stiffness from the bottom surface although the present invention is easy to and cost is low with the expensive manufacturing of for example transfer modling.
At this moment, as shown in fig. 1,9 distances 30 of stretching out between the position are more than the 0.1mm from the bottom surface for the corner part at the crossing place of the extended surface of bottom surface 9 ipsilaterals and portion of terminal 4, therefore, compare from the situation that the corner part of the side of outer covering material 5 and bottom surface 9 stretches out with it, externally produce metric space between cladding material 5 and the portion of terminal 4, and produce tolerance (tolerance limit), thereby improved the stiffness that back opposing shock and vibration are installed.In addition, stiffness improves, and therefore, might prevent for example outer covering material 5 and the damage that scolder appearance cracking is installed, and improve resistance to impact.
Under the situation that the lead terminal 8 shown in Figure 20 and the figure thereafter stretches out, also be like this.
Then, outer covering material 5 will be described.
Shown in Fig. 1 waited, outer covering material 5 was molded over the electronic device such as resistor and inductor, and this electronic device is from element 2 (or multi-layer capacitor 6), and comprised the portion of terminal 4 (or lead terminal 8) that a part is connected with element 2.
As the material of outer covering material 5, preferably select for example epoxy resin of o-cresol formaldehyde resin (opto-cresol-novolack) series, biphenyl (biphenyl) series and pentadiene (pentadiene) series for use.
In addition, the minimum value at the interval between the surface of the surface of outer covering material 5 and element 2 (or multi-layer capacitor 6) (outer covering material 5 thin-walled thickness portion) be set at 0.1mm and more than, therefore, might improve the puncture voltage of extexine.In addition, by being set for this reason value or this more than value, just can realize that puncture voltage height, moisture-proof are good, the electronic component 1 of good heat resistance.
In addition, apply chamfering (R), can improve resistance to impact to external world by corner part to outer covering material 5.At this moment, corner part can be the corner part of rectilinear form and the corner part of circular shape.
In addition, shape about outer covering material 5, if it is fine for post shapes commonly used, even for cuboid roughly, roughly cube, have trapezoidal shape or have other polygon column, all be fine, but consider from the cost aspect, can be cuboid roughly and cube or make the side become the trapezoidal shape on the surface of slight inclination roughly.In addition, with outer covering material 5 moulding the time, on the surface inevitable out-of-flatness can take place and exist.
If shape such as cuboid roughly so just exists bottom surface 9 and side, and can produce corner part (being entirely the corner part of rectilinear form and the corner part of circular shape also is fine) by these surfaces.
Then, multi-layer capacitor 6 will be described.
About multi-layer capacitor 6, get with a plurality of tab laminates by the matrix of dielectric substance configuration, and form interior electrode 7, therefore, under measure-alike situation, also may obtain comparing bigger electric capacity with single plate capacitor.
Dielectric base body is the matrix by dielectric substance configuration, is suitable for using for example dielectric substance of titanium oxide and barium titanate.Perhaps, also use aluminium oxide etc.By using this type of material, matrix at random forms needed shape, size.
Interior electrode 7 is electrodes of imbedding in the dielectric base body inboard, and is at least a metal material and the alloy that comprises among Ni, Ag, Pd, Cu, the Au etc. as the composition material of interior electrode 7.Exactly, by using Ni monomer or Ni alloy, it is favourable also to become aspect cost.In addition, use the alloy of these materials and arbitrary material application surface electroplating processes also is fine.Certainly, use alloy etc. equally also to be fine.In addition, the thickness of interior electrode 7 is configured to 1 μ m to 5 μ m.In addition, wish that distance setting between will adjacent interior electrode 7 is 15 μ m or more than the 15 μ m.
At this moment, exactly, be used as interior electrode 7, and under the situation of anti-reducing material as the dielectric base body that becomes stack layer (stacked sheet), just can realize multi-layer capacitor 6 with low-down cost at the material of mainly forming by Ni.
Interior electrode 7 is electrically connected to electrode 3, and only be connected to electrode 3 one of them interior electrode 7 with only be connected in the electrode 3 another interior electrode 7 toward each other, and between these interior electrodes 7 in opposite directions, produce big electric capacity.
Then, portion of terminal 4 is connected to electrode 3.Portion of terminal 4 is as indicated above.Portion of terminal 4 is connected to electrode 3 in couples together, and pair of lead wires terminal 8 and these portion of terminal 4 corresponding connections.
Length at supposition multi-layer capacitor 6 is L1, highly is L2, and width is when being L3, and the size of multi-layer capacitor 6 is configured to satisfy:
3.0mm≤L1≤5.5mm
0.5mm≤L2≤2.5mm
1.5mm≤L3≤3.5mm
Certainly, even use the size that is different from this also to be fine, also can be that a plurality of rather than single multi-layer capacitor 6 is encapsulated by outer covering material 5.
Simultaneously, when L1 is prescribed a time limit down less than above-mentioned to L3, the formation zone of interior electrode 7 becomes insufficient, and the phase mutual edge distance between the interior electrode 7 must narrow down, and the number of plies of electrode 7 in it must reduce, obtain the big capacitance difficulty that becomes, and the electronic component that will obtain the to have big capacitance range difficulty that becomes.
In addition, for preventing to be molded over a time-out with outer covering material 5 and multi-layer capacitor 6 because the damage of multi-layer capacitor 6 due to being impacted, preferably the corner part to multi-layer capacitor 6 applies chamfering, and the curve that the circular arc bending is arranged in a part or the whole side of each side.
In addition,, preferably a plurality of multi-layer capacitors 6 are molded over together, and are installed on the parallel holding wire, therefore, can reduce the man-hour of installation cost and installation as multiple device although be small-sized component.
Then, lead terminal 8 will be described.
Lead terminal 8 is connected to pair of terminal portion 4, stretches to the outside of outer covering material 5, be installed on the installation base plate, and a pair of setting, like this, lead terminal 8 is used as conducting terminal, to realize element 2, the multi-layer capacitor 6 of inside and the conductivity between the substrate.Simultaneously, corresponding to the number that takes shape in inboard multi-layer capacitor 6, lead terminal 8 is for a pair of or manyly also be fine; As for the shape of lead terminal 8, can be for example rectangular shape, elliptical shape, square configuration and linear shape, the chamfering of corner part and curve shape, formation rake or to form otch or the like all be suitable.In addition, as for its size and width, can come arbitrary decision according to the balance of needed erection space, installation strength, size of component or the like.
Lead terminal 8 is formed by dielectric substance in the mode identical with portion of terminal 4, and is formed by various metals etc.Can be by comprising that at least one the material configuration among Cu, Zn, Ni, Ag, the Au etc. forms, and this material surface is used the single or multiple lift electroplating processes.In addition, can use alloy.
In addition, the reason that lead terminal 8 stretches out from the bottom surface of outer covering material 5 is identical with the description that portion of terminal 4 is done, and might under the low-cost situation about making it be stretched out at an easy rate from the bottom surface and improve stiffness keeping.
At this moment, as shown in Figure 21, it is 0.1mm or more than the 0.1mm that the extended surface of bottom surface ipsilateral intersects distance between the corner part at place and lead terminal 8 stretches out the place from bottom surface 9 the position, therefore, compare from the situation that the corner part of the side of outer covering material 5 and bottom surface 9 stretches out with it, externally produce metric space between cladding material 5 and the lead terminal 8, tolerance (tolerance limit) occurs, therefore, improved the stiffness of back opposing vibration being installed and impacting.In addition, improved stiffness, therefore, just may prevent for example outer covering material 5 and the damage that scolder appearance cracking is installed, and improve resistance to impact.
In addition, as described later, 9 stretch out and have various ways from the bottom surface.
Then, reinforcing material 20 will be described.
Reinforcing material 20 is formed on the non-installation surface of portion of terminal 4 and lead terminal 8.For example, as represented among Figure 14, it can be formed at the approximate center of portion of terminal 4, and as represented among Figure 15, it can form along the periphery of portion of terminal 4.Under the former situation, although form easily, what improve is the resistance to impact of (ability of longitudinally opposing stress is weak) in the vertical, and in the latter case, it forms on periphery, therefore, can greatly improve the resistance to impact of portion of terminal 4.Under the situation of represented lead terminal 8, this is identical in as Figure 34 and 35.
Simultaneously, reinforcing material 20 can have other shapes, also can be formed on other positions.
Use the material as reinforcing material 20 such as resin and pottery, and identical with outer covering material 5, epoxy is that resin etc. is very suitable.In addition, also can use with outer covering material 5 identical materials.That reinforcing material 20 has is bar-shaped, column and tabular, and is provided with a plurality ofly rather than single, also is fine.
In addition, reinforcing material 20 can only be formed on the leading edge or root of portion of terminal 4 or lead terminal 8.
Be formed at reinforcing material 20 under the situation of exterior region, therefore, might be reduced for the influence of the leading edge of the most responsive portion of terminal 4 of the stress due to foreign impacts and lead terminal 8, and improve resistance to impact.In addition, under reinforcing material 20 is arranged at situation on the exterior region, it becomes the weight on the exterior region, and improve the pressure crimp force (pressure crimping force) of opposing installation base plate, and improved installation reliability, especially the opposing durability of impacting etc., thereby, the advantage of the stiffness of improving portion of terminal 4 (or lead terminal 8) also had.Under reinforcing material 20 is arranged at situation on the root, the difficulties that becomes such as rivet tightly (clinch).
Then, will curved face part 15 as the deflection absorbent portion, folding part 16 and wavy 17 be described.The deflection absorbent portion is to alleviate owing to be applied to the part of the flexure effects that vibration on institute's electronic components mounted 1, impact etc. are produced.
Curved face part 15 is for being arranged at the part on portion of terminal 4 and the lead terminal 8, and bends to curve form, and this part is not welded (solder-mounted) on installation base plate, and the effect of its performance padded coaming, therefore improved stiffness.
Folding part 16 also is so, and it is easier than the situation that forms curved face part 15 to form folding part 16.Especially, form under the roughly V-shaped situation, therefore, can be easy to form in folding part 16, and identical with the mode of curved face part 15, and folding part 16 is not welded.Be used as in folding part 16 under the situation of buffer area, therefore realized the improvement of stiffness.
Simultaneously, curved face part 15 and folding part 16 can singulative or plural form be arranged on portion of terminal 4 and the lead terminal 8, and can be arranged at the optional position, for example root, pars intermedia and exterior region.
The formation slightly complicated on corrugated 17, but corrugated 17 is more effective as the buffer area that absorbs deflection, and greatly improved stiffness.According to the erection space situations such as (that is, installation strength) of portion of terminal to be installed 4 and lead terminal 8 etc., can select and determine the size on corrugated 17 etc. arbitrarily.
Perhaps, curved face part 15, folding part 16 and wavy 17 etc. can be according to specifications and combination at random.
This type of deflection absorbent portion can be set as required, and as described later, it has further improved the improvement of the stiffness that obtains because of portion of terminal 4 and stretching out of lead terminal 8.
Then, rake 10 will be described.Rake 10 is arranged on the corner part of the bottom surface 9 of outer covering material 5 and side, and has the cut shape of corner part.That is to say that rake 10 is form and the zones that have gradient, surface by arbitrfary point on arbitrfary point and the bottom surface 9 on the connection side.
Rake 10 can solidify back cutting outer covering material by cladding material externally and form, perhaps by form the rake 10 of inclination as shown in Figure 2 at corner part with regard to the shape of adjusting metal die from beginning.Especially, externally cladding material 5 is a cuboid and roughly under the situation of cubical square configuration roughly for example, and rake 10 is formed with gradient.
In addition, rake 10 can have straight plane, but as shown in Fig. 4 and 24, also can have arc surface, and produces out-of-flatness etc. inevitably from the teeth outwards.
The benefit that hereinafter will describe combination rake 10 and portion of terminal 4 and stretching out of lead terminal terminal 8 in detail and bring.
Then, depressed part 12 will be described.
Depressed part 12 is arranged at any two positions on the bottom surface 9, and becomes the zone that portion of terminal 4 or lead terminal 8 stretch out the place.As shown in Fig. 8 and 28, depressed part 12 can be triangular shaped otch, and as shown in Fig. 7 and 27 etc., and depressed part 12 can be the general square shape shape or the otch etc. of semi-spherical shape roughly.These can form by handling outer covering material 5; also can handle like this: the periphery that over cap is connected to portion of terminal 4 or lead terminal 8; and then molten resin is cast in the metal die etc. to form outer covering material 5; remove this over cap, so just formed depressed part 12 thereafter.
Simultaneously, the shape of depressed part 12 is not limited to Fig. 7, Fig. 8 etc., and can be different shape.
Aforementioned content is the description to each configuration section of the electronic component in the present embodiment.
Below, as main points of the present invention, will describe the advantage of the stiffness improved that realizes by above-mentioned configuration with rake 10 in detail, and described configuration allows to make at lower cost.
At first, portion of terminal 4 and lead terminal 89 stretch out from the bottom surface, and, the bottom surface 9 of outer covering material 5 and the extended surface of side intersect the corner part at place and its, and to stretch out distance between the position be 0.1mm or more than the 0.1mm, therefore, can guarantee the distance between portion of terminal 4 or lead terminal 8 and the outer covering material 5, and this distance become and outer covering material between tolerance limit, improved stiffness.At this moment, under the situation of distance less than 0.1mm, such distance is not enough, and the response of stiffness also becomes not enough.
Then, will portion of terminal 4 and lead terminal 8 be described in shape characteristics and advantage thereof.
Figure 10 and 30 is illustrated respectively on the position that portion of terminal 4, lead terminal 8 stretch out to the outside of outer covering material 5, the configuration that increases gradually towards leading edge direction thickness.Portion of terminal 4 of stretching out and lead terminal 8 are in and impact to external world the very sensitive state of the influence of leading edge, but make its edge thickness increase forward by carrying out this type of configuration, avoided this influence, can prevent that portion of terminal 4 and lead terminal 8 are folding, crooked downwards, and resistance to impact and durability in the time of improving manufacturing, transportation and installation, and improve installation reliability.
Then, Figure 11 and 31 is illustrated in the position that portion of terminal 4, lead terminal 8 are stretched out to the outside of outer covering material 5 respectively, towards the leading edge direction thickness structure of attenuation gradually.In the shape of leading edge attenuation, it is big that the elastic force of portion of terminal 4 and lead terminal 8 becomes, and under it is installed in situation on the installation base plate, increase for the pressure of installation base plate, and for the opposing grow that after installation, impacts the deflection due to waiting.Especially, have the material of the metal etc. of higher elasticity and spring performance by use, can further improve stiffness as portion of terminal 4 and lead terminal 9.
Perhaps, the load of portion of terminal 4 and lead terminal 8 be might disperse to be applied to, resistance to impact and proof stress (stress resistance) therefore improved.
Then, Figure 12 and 32 is expressed as follows configuration respectively, and promptly the part of stretching out to the outside of outer covering material 5 at portion of terminal 4, lead terminal 8 has the thickness of the thickness at a position greater than the portion of terminal in the inboard that is present in outer covering material 54, lead terminal 8.By the method, electronic component 1 is stretched out and strengthen and resist for the stress that applies from the external world and the ability of turning back and twisting due to impacting.
Simultaneously, these structures can be used independently, also can at random make up.
As above, the strategy of the shape by portion of terminal 4 and lead terminal 8 might improve resistance to impact, durability and stiffness.
Then, will describe because the improvement of the stiffness that rake 10 and depressed part 12 cause.
Under the situation that forms rake 10, therefore, the turning that places are intersected in rake 10 and bottom surface 9 become summit on the bottom surface 9 (yet, at this, the summit is not only a part of outstanding summit, and being connected to form in the surface on two summits in the localities is bottom surface 9, and it highly waits not special different), and become two positions that pair of terminal portion 4 or pair of lead wires terminal 8 stretch out.
Although hereinafter will be described in greater detail, portion of terminal 4 and lead terminal 8 intersect the corner part at place based on this rake 10 and bottom surface 9 and stretch out.
At this moment, under the situation of stretching out as the bottom surface 9 of the flat plane that forms with constant fully height, the distance between outer covering material 5 and portion of terminal 4 or the lead terminal 8 diminishes to some extent at portion of terminal 4 and lead terminal 8, so its tolerance minimizing.In contrast, form rake 10, and the corner part that places are intersected in rake 10 and bottom surface 9 is used as the position that portion of terminal 4 and lead terminal 9 stretch out, thereby, the position that stretch out bottom surface 9 becomes the extension of portion of terminal 4 grades, therefore, the distance between outer covering material 5 and portion of terminal 4, the lead terminal 8 becomes big.By the method, produce sufficient tolerance (tolerance limit), and substantially improve stiffness.In addition, because the existence of rake 10, the most weak portion of terminal 4 of the resistivity of counter stress or the extension of lead terminal 8 become obtuse angle or circular shape in the electronic component 1, therefore, there is following advantage, promptly might prevents foreign impacts for example and be applied to portion of terminal 4 and the vibration of the lead terminal 8 and damage of cracking takes place for the outer covering material 5 that causes.
Simultaneously, the corner part of the outer covering material except that rake 10 5 is used chamfering, rake etc., therefore, corner part is deducted or is eliminated from outer covering material, therefore, might prevent the damage due to the external impact.
In an identical manner, portion of terminal 4 or lead terminal 8 stretch out from depressed part 12, therefore, in an identical manner, can guarantee and outer covering material 5 between distance and space, thereby, can guarantee tolerance (tolerance limit), improve stiffness.
In addition, description is stretched out or is stretched out from depressed part 12 improvement of the stiffness that causes from the corner part that intersects places such as rake 10 and bottom surface 9 owing to portion of terminal 4 and lead terminal 8.
At first, as shown in Fig. 2 and 22 etc., under the situation that the corner part that portion of terminal 4 and lead terminal 8 intersect places from rake 10 and bottom surface 9 stretches out, and under the situation of following configuration, after promptly they are stretched over the bottom side, turn back and roughly L-shaped, and the formation installation surface has been improved stiffness.
That is to say that because portion of terminal 4 and lead terminal 8 are stretched over the bottom side, so outer covering material 5 becomes greatly with metric space between portion of terminal 4, the lead terminal 8, and the part that becomes tolerance (tolerance limit) becomes very big.Particularly, after the installation, can be very big in the tolerance limit that is approximately perpendicular on the direction of mounting plane, therefore, just may not only respond the vibration that on the horizontal direction of mounting plane, applies and impact due to deflection, and the vibration that on the direction of approximate vertical, applies of response and impact due to deflection, and make up these structures, thereby greatly improve stiffness.
In addition, as shown in Fig. 6 and 26 etc., 9 ratio rake 10 stretches out with the corner part position slightly in the inner part that places are intersected in bottom surface 9 from the bottom surface for portion of terminal 4 and lead terminal 8, and along the bottom surface, on installation surface, stretch invariably with the bottom surface almost parallel.
In this type of configuration, since the metric space between outer covering material 5 and portion of terminal 4, the lead terminal 8 be approximately perpendicular on the direction of mounting plane less, so for the response force of vibration on the direction of approximate vertical and impact a little less than, but in an identical manner, opposing for vibration in the horizontal direction etc. is stronger, and has fully guaranteed stiffness.In addition, in this case,, therefore has the advantage that guarantees to install stability and installation strength because the distance between electronic component 1 and the installation base plate diminishes.
Under the situation that the corner part that intersects the place from rake 10 and bottom surface 9 stretches out, be so, and also be like this under the situation of stretching out not only from depressed part 12.
In addition, although some repetition has formed the deflection absorbent portion, therefore further improve stiffness.As mentioned above, because deflection absorbent portion when mounted becomes and is not that scolder is connected to the buffer area of installation base plate, therefore might absorb various vibrations etc., and might further improve stiffness.
By having as above the electronic component 1 of configuration, might realize stiffness height and long electronic component 1 of life-span under the situation keeping cheaply, and might realize having durability, the electronic device that electronic component 1 is installed that life performance is longer.
In addition, simplifying owing to manufacture process under the situation that is able to keeping cheaply, improving the resistance to impact that prevents outer covering material and damage, durability, thermal endurance, moisture-proof etc., opening and realizing being suitable for the electronic component 1 and the electronic device of practical application.
Figure 43,44,45,46,47,48,49,50,51,52,53,54,55,62,63,64,65,66,67,68,69,70,71,72,73 and 74 is the end view of the electronic component in the embodiments of the present invention, and Figure 56,57,58,59,60,61 and 62 is the vertical view of the electronic component in the embodiments of the present invention.Figure 60,61,79 and 80 is the process drawing of the electronic component of embodiments of the present invention.
Figure 43 to 59 is expressed as follows configuration, be that portion of terminal is connected to the element such as the various electronic devices of capacitor (single plate capacitor, stacked capacitor, electrolytic capacitor etc.), resistor, inductor, filter and IC, and it is molded over outer covering material, and it is molded over outer covering material, and the part of portion of terminal is stretched out from the protuberance on the bottom surface that is arranged at outer covering material.
On the other hand, Figure 19 to 36 is expressed as follows configuration, be that multi-layer capacitor is expressed as inner member, and portion of terminal is connected to multi-layer capacitor, and the pair of lead wires terminal is connected to portion of terminal, and be molded over outer covering material, and the part of lead terminal is stretched out from the protuberance on the bottom surface that is arranged at outer covering material.
Represented configuration almost is corresponding configuration with configuration represented from Figure 61 to Figure 78 from Figure 43 to Figure 60, except element is the multi-layer capacitor and this point that is connected with lead terminal, and hereinafter, as required, illustrate and have outside the repetition, and under the situation that mainly is repetition, explanation can be omitted.
101 expression electronic components, 102 expression elements, 103 expression electrodes, 104 expression portion of terminal, 105 expression outer covering materials, 106 expression multi-layer capacitors, electrode in 107 expressions, 108 expression lead terminals, 109 expression bottom surfaces, 110 expression protuberances, 112 expression chamferings, 115 expression curved face part, 116 expression folding parts, the wavy portion of 117 expressions, 120 expression reinforcing materials, and curved face part 115, folding part 116 and wavy 117 example that is expressed as the deflection absorbent portion.In addition, 130 expression metal dies, 131 expression metal die inboards, 132 expression resin input parts, 133 expression cooling ends, 134 expression molten resins, and 135 expression cooling fans.
At first, in the configuration of electronic component 101, will feature and its advantage of the configuration of representing respectively be described briefly in every width of cloth figure.
Figure 43 shows following configuration, and promptly portion of terminal 104 is stretched out from the protuberance 110 that is arranged on the bottom surface 109, and after the portion of terminal 104 of stretching out is stretched over the bottom side, roughly L-shaped with regard to turning back, just can be used to install.By such configuration, externally produce the space between the bottom surface 109 of cladding material 105 and the portion of terminal 104, and this space becomes tolerance (tolerance limit), improved stiffness.
Figure 44 shows following situation, the protuberance 110 that promptly is arranged on the bottom surface 109 is semicylinder, and in the mode identical with the situation of Figure 43, portion of terminal 104 is turned back and is roughly L-shaped and stretch out, between the bottom surface 109 of itself and outer covering material 105, produce tolerance (tolerance limit), improved stiffness.
Figure 45 is expressed as follows configuration, and promptly portion of terminal 104 is stretched out from the protuberance 110 that is arranged on the bottom surface 109, but portion of terminal 104 turns back from the position that the leading edge of protuberance 110 is left at it, and realizes installable structure.According to this configuration, only, just guaranteed the space between portion of terminal 104 and the bottom surface 109, and, externally produced tolerance limit between cladding material 105 and the portion of terminal 104, and improved stiffness by this space that obtains by protuberance 110.
Figure 46 also shows with Figure 45 and similarly disposes, and the configuration that portion of terminal 104 is turned back to the inside is shown.It is applicable to the minimizing erection space.
Figure 47 represents similarly to dispose with Figure 43, and wherein portion of terminal 104 is as folding to the inside among Figure 46, and same, it is applicable to the erection space that reduces electronic component 101 and keeps stiffness to improve.
Figure 48 represents similarly to dispose with Figure 46, but protuberance is not semicylinder but has the situation of the general triangular shape that broadens towards the root of portion of terminal 104 in this case.As described later, the formation of protuberance 110 is very easy to.
Figure 49 is expressed as follows configuration, promptly stretch out laterally and turn back and the portion of terminal 104 consistent with installation surface forward edge thickness increase.By the portion of terminal of this configuration, realized that the intensity of the leading edge of the portion of terminal that stress that opposing for example impacts is more weak guarantees.
Figure 50 is expressed as follows configuration, promptly stretch out laterally and turn back and the portion of terminal 104 consistent with installation surface towards the leading edge attenuation, and on portion of terminal 104, produce elasticity, and further improved stiffness.
Figure 51 is expressed as follows configuration, and in portion of terminal 104, the part in the outside that is projected into outer covering material 105 is bigger than the thickness of the part within the cladding material 105 externally.The thickness of the part of stretching out laterally increases, and therefore, might improve resistance to impact etc.
Figure 52 is expressed as follows configuration, and promptly curved face part 115 is arranged on the part of the portion of terminal 104 of stretching out to the outside of outer covering material 105 as the deflection absorbent portion.By this configuration, remove because the stiffness that the space that is guaranteed between the bottom surface 109 of outer covering material 105 and the portion of terminal 104 causes improves, can also improve the stiffness of the main vibration that applies in the horizontal direction after the opposing installation etc.
Figure 53 shows that folding part 116y forms the configuration of deflection absorbent portion.In the mode identical, realize the further improvement of stiffness with Figure 52.
Figure 54 shows that corrugated 117 forms the configuration of deflection absorbent portion.Realize the further improvement of stiffness.
Figure 55 shows that curved face part 115 and folding part 116 are formed on configuration on the portion of terminal 104 as the deflection absorbent portion.Combination also forms the deflection absorbent portion with a plurality of shapes, therefore, obtains the advantage of stiffness separately, and further improves stiffness.
Figure 56 represents that reinforcing material 120 is arranged at the configuration of about center on the longitudinal direction of the non-installation surface of portion of terminal 104.By this configuration, improved the resistance to impact of portion of terminal 104 etc.
Figure 57 represents that reinforcing material 120 is arranged at the configuration at periphery place of the non-installation portion of portion of terminal 104.By this configuration, improved the resistance to impact of portion of terminal 104.
Figure 58 represents that a plurality of paired portion of terminal 104 are connected to the configuration of a matrix, and can be at an easy rate with small size configuration multiple device.
Figure 59 shows that a plurality of elements 102 are packaged in a configuration in the outer covering material 105, and can dispose multiple device with small size at an easy rate, and saves installation work-hour.
Figure 60 represents the manufacture process of electronic component 101.
Figure 61 represents the electronic component 101 according to manufacture process manufacturing represented among Figure 60.
Figure 62 is expressed as follows configuration, and promptly lead terminal 108 stretches out from the protuberance 110 that is arranged on the bottom surface, and after the lead terminal 108 that is stretched out is stretched over the bottom side, roughly L-shaped with regard to turning back, thereby, can be used for installing.By this configuration, will produce the space between the bottom surface 109 of cladding material 105 externally and the lead terminal 108, and this space becomes tolerance (tolerance limit), and improved stiffness.
Figure 63 shows that the protuberance 110 that is arranged on the bottom surface 109 is the situation of semicylinder, identical with the situation of Figure 61, lead terminal 108 turns back and is roughly L-shaped and stretch out, and produces tolerance (tolerance limit) between the bottom surface of itself and outer covering material 105, and has improved stiffness.
Figure 64 is expressed as follows configuration, and promptly lead terminal 108 stretches out from the protuberance 110 that is arranged on the bottom surface 109, and lead terminal 108 turns back on the position of the leading edge of leaving protuberance 110, realizes installable structure.According to this configuration, only utilize protuberance 110, just guaranteed the space between lead terminal 108 and the bottom surface 109, and, externally produced tolerance limit between cladding material 105 and the lead terminal 108, and improved stiffness by this guaranteed space.
Figure 65 has also showed with Figure 64 and has similarly disposed, and showed the configuration that lead terminal 108 turns back to the inside.It is applicable to the minimizing erection space.
Figure 66 represents similarly to dispose with Figure 64, and wherein portion of terminal 104 is as turning back to the inside among Figure 65, and same, it is applicable to that the erection space that reduces electronic component 101 but still can improve stiffness.
Figure 67 represents similarly to dispose with Figure 63, but protuberance is not semicylinder but has the situation of the general triangular shape that broadens towards the root of portion of terminal 104.As described later, it is very easy forming protuberance 110.
Figure 68 is expressed as follows configuration, promptly stretches out laterally and turns back and the lead terminal 108 consistent with installation surface increases towards leading edge direction thickness.By the lead terminal 108 of configuration like this, realized that the intensity of the leading edge of the lead terminal 108 that stress that opposing for example impacts is more weak guarantees.
Figure 69 is expressed as follows configuration, promptly stretch out laterally and turn back and the lead terminal 108 consistent with installation surface towards the leading edge direction and attenuation, and on lead terminal 108, produce elasticity, and further improved stiffness.
Figure 70 is expressed as follows configuration, lead terminal 108 externally the part in the outside of cladding material 105 externally the thickness of the part within the cladding material 105 is bigger than it.The thickness of the portion of stretching out laterally increases, and therefore, might improve resistance to impact etc.
Figure 71 is expressed as follows configuration, reaches on the part of lead terminal 108 in the outside of outer covering material 105 and curved face part 115 is set as the deflection absorbent portion.By this configuration, not only because the bottom surface 109 of outer covering material 105 guarantee with the space between the lead terminal 108 and improved stiffness, and can improve the stiffness that the main vibration that applies in the horizontal direction in back etc. is installed in opposing.
Figure 72 shows that folding part 116y forms the configuration of deflection absorbent portion.In the mode identical, realize the further improvement of stiffness with Figure 71.
Figure 73 shows that corrugated 117 forms the configuration of deflection absorbent portion.Realize the further improvement of stiffness.
Figure 74 is illustrated on the portion of terminal 104 and forms the configuration as the deflection absorbent portion of curved face part 115 and folding part 116.Combination also forms the deflection absorbent portion with a plurality of shapes, thereby, can obtain the advantage on the stiffness separately, and realize the further improvement of stiffness.
Figure 75 represents that reinforcing material 120 is arranged on the approximately configuration of center on the longitudinal direction of non-installation surface of lead terminal 108.By this configuration, improved the resistance to impact of lead terminal 108 etc.
Figure 76 represents that reinforcing material 120 is arranged at the configuration at periphery place of the non-installation portion of lead terminal 108.By this configuration, the resistance to impact of lead terminal 108 further improves.
Figure 77 represents that a plurality of paired lead terminals 108 are connected to the configuration of a matrix, and is easy to be configured to undersized multiple device.
Figure 78 represents that a plurality of multi-layer capacitors 106 are packaged in a configuration in outer covering material 105 inboards, and is easy to be configured to undersized multiple device, and saves the man-hour of installing.
Figure 79 represents the manufacture process of electronic component 101.
Figure 80 represents the electronic component 101 according to manufacture process manufacturing represented among Figure 79.
Aforementioned content is the description to summary He its main points of the configuration in each accompanying drawing.
Simultaneously, make electronic component 101 by represented manufacture process among Figure 60 etc., therefore, the low cost of manufacture of electronic component 101 and manufacturing easily, in addition, by on bottom surface 109, forming protuberance 110 simply, and guarantee the tolerance (tolerance limit) of 108 of portion of terminal 104 and lead terminals, can make the electronic component 101 that has through the stiffness of improving.
Then, will the details of each one be described.
101 expression electronic components, shown in Figure 43 waits, it wherein is the electronic component that capacitor, resistor, inductor, filter and other electron component etc. are molded over the outer covering material such as resin, and electronic component: owing to be molded over outer covering material with following feature, therefore durability, moisture-proof and resistance to impact have been improved, in addition, also can bear high-breakdown-voltage.
Then, element 102 will be described.
102 expression elements, and as mentioned above, in capacitor, resistor, inductor, filter, IC and other electronic device any one all can be used as element 102, and capacitor can be the arbitrary capacitor in single plate capacitor, multi-layer capacitor, the electrolytic capacitor etc.Figure 43 represents single plate capacitor.
Simultaneously, element 102 (or multi-layer capacitor 106) can individually encapsulate with outer covering material 105, and a plurality of element 102 also can be encapsulated by outer covering material 105.
Perhaps, also can be that pair of electrodes 103 is arranged on the matrix, therefore, have operation as an electronic device, even or a plurality of paired electrode 103 be arranged on the matrix and equally also be fine, and have operation as a plurality of electronic devices.
The configuration of the expression a plurality of elements 102 of encapsulation such as Figure 78 (or multi-layer capacitor 106).
Then, electrode 103 will be described.
Electrode 103 is the conductive component on a pair of two ends that are arranged on element 102 (or multi-layer capacitor 106), and realizes the conductivity of outside installation base plate and element 102 (or multi-layer capacitor 106) via portion of terminal 104 and lead terminal 108.Commonly electrode 103 is provided with on the two ends of element 102 (or multi-layer capacitor 106) in pairs, even but its be arranged at the mid portion of element 102 (or multi-layer capacitor 106) rather than on two ends, also be fine.Perhaps, even it is arranged at the upper surface and the lower surface of element 102 (or multi-layer capacitor 106) rather than also is fine on the side, even and it is arranged on the whole surface of side and upper surface and lower surface and equally also is fine, even and it only is arranged on the part on whole surface and equally also is fine, even and be set to cross the edge and another surface that arrives equally also is fine.
As the material of electrode 103, comprise a kind of metal material among Ni, Ag, Pd, Cu, the Au etc. at least.Particularly, by using Ni monomer or Ni alloy, also very favourable aspect cost.In addition, also be fine even use the alloy of these materials and certain material is carried out the electroplating surface processing.Certainly, can use alloy etc., also can be by any realization the in single or multiple lift electroplating processes, deposition processes, sputter processing, the slurry coating etc.
In addition, when Connection Element 102 and portion of terminal 104, this is realized by electrode 103, but preferably uses the scolder with melt temperature more than 240 ℃ or 240 ℃ as the link in connecting.Use this type of to have the scolder of high melting temperature, therefore such problem can not appear: wait the externally fusion in the inboard of cladding material 105 of the connecting portion that causes between element 102 and the portion of terminal 104 owing to reflux when mounted, and the electronic component 101 that can realize having high reliability.
Then, portion of terminal 104 will be described.
Portion of terminal 104 is connected to electrode 103, and goes up setting in pairs at element 102 (or multi-layer capacitor 106).Usually, be that it is arranged on the two ends of element 102 (or multi-layer capacitor 106) under a lot of situations, even but its place that is arranged at except that two ends also be fine.For example, be arranged at electrode 103 under the situation of upper surface and lower surface, be fine even these electrodes 103 that form on upper surface and lower surface are connected equally also with portion of terminal 104.In addition, also can be portion of terminal 104 by comprising that at least a material among Cu, Zn, Ni, Ag, the Au etc. disposes and to its surface applications single or multiple lift electroplating processes.
In addition, portion of terminal 104 main by the situation that particularly material of copper and alloy composition forms under, the infiltrating problem that has the scolder between installation base plate and the portion of terminal 104 (or lead terminal 108), therefore, need at high temperature to carry out to reflux, but as mentioned above, head it off can be to use the scolder with melt temperature more than 240 ℃ or 240 ℃ as the parts on the connecting portion between element 102 and the portion of terminal 104.
Perhaps, it is suitable using 42 alloys to be used for portion of terminal 104 (lead terminal 108), therefore, has improved solder wettability, so that install easily, and improved installation strength.
In addition, even dispose portion of terminal 104 and also be fine by crown cap being joined to element 102.In addition, need dispose the most external (surface portion) of portion of terminal 104 by electric conducting material with 200 degree or the above fusing point of 200 degree, and by this configuration, even make electronic component be subjected to high temperature owing to backflow waits, do not exist portion of terminal 104 situation of cause thermal damage to occur yet, and might obtain stable reflux characteristic.
Portion of terminal 104 is connected to electrode 103, and at random is processed into suitable shape, and forms to the outside of outer covering material 105 and stretch out.
In addition, the outer covering material 105 that will be described is later put into mould bases together by portion of terminal 104 (or lead terminal 108) is connected to element 102 (or multi-layer capacitor 106), and molten resin is cast in this mould bases and realizes, therefore, portion of terminal 104 is stretched out from the bottom surface of outer covering material.
That is to say that the state that is connected to element 102 with portion of terminal 104 is put into mould bases, and under the state that these portion of terminal 104 are hooked by metal die, be fixed.By molten resin etc. is cast in this metal die,, just realized the configuration that portion of terminal 104 is stretched out from the bottom surface at an easy rate until reaching the position that just is lower than the virtual plane that forms by portion of terminal 104.
That is to say, compare,, can make portion of terminal 49 stretch out and become possibility, so that improve stiffness from the bottom surface although the present invention is easy to and cost is low with the expensive manufacturing of for example transfer modling.
At this moment, externally produce the space to some extent between the bottom surface 109 of cladding material 105 and the portion of terminal 104 (lead terminal 108), therefore, produce tolerance (tolerance limit), and improved the stiffness that back opposing shock and vibration are installed.In addition, owing to improved stiffness, just might prevent for example outer covering material 105 and the damage that scolder appearance cracking is installed, and improve resistance to impact.
Simultaneously, portion of terminal 104 (or lead terminal 108) can externally be turned back on the bottom surface 109 of cladding material 105 as shown in Figure 46 to the inside, and can turn back laterally as shown in Figure 43.Under its situation of turning back to the inside, reduced erection space, and under its situation of turning back laterally, guaranteed installation strength.
Then, outer covering material 105 will be described.
Shown in Figure 43 waited, outer covering material 5 was molded over the electronic device such as resistor and inductor, and this electronic device is from element 102 (or multi-layer capacitor 6), and comprised the portion of terminal 104 (or lead terminal 8) that a part is connected with element 2.
Preferably use the material of the epoxy resin of for example o-cresol formaldehyde resin series, biphenyl series and pentadiene series as outer covering material 105.
In addition, the minimum value at the interval between the surface of the surface of outer covering material 105 and element 102 (or multi-layer capacitor 106) (the thin-walled thickness portion of outer covering material 105) is set at 0.1mm or more than the 0.1mm, therefore, might improve the puncture voltage of extexine.In addition, by being set for this reason value or this more than value, might realize puncture voltage, moisture-proof, the electronic component 101 that thermal endurance is strong.
In addition, apply chamfering 112, can improve resistance to impact to external world by corner part to outer covering material 105.At this moment, chamfering 112 can have circular shape, and can be the chamfering of rectilinear form.
In addition, shape about outer covering material 105, if it is fine for post shapes commonly used, and promptly be roughly cuboid, roughly cube, have trapezoidal shape or have other polygon column and all be fine, but consider from the cost aspect, be preferably cuboid roughly and roughly cube or side become the trapezoidal shape on slight inclination surface.In addition, with outer covering material 105 moulding the time, on the surface inevitable out-of-flatness can take place and exist.
If it for cuboid roughly etc., exists bottom surface 109 and side so, and by these surfaces, has corner part (also being to be entirely the corner part of rectilinear form and the corner part of circular shape).
Then, multi-layer capacitor 106 will be described.
About multi-layer capacitor 106, get with a plurality of tab laminates by the matrix of dielectric substance configuration, and form interior electrode 107, therefore, under measure-alike situation, also may obtain comparing bigger electric capacity with single plate capacitor.
Dielectric base body is the matrix by dielectric substance configuration, and is suitable for using for example dielectric substance of titanium oxide and barium titanate.Perhaps, also use aluminium oxide etc.By using this type of material, it at random forms with needed shape, size.
Interior electrode 107 is for being embedded in the electrode in the dielectric base body inboard, and is at least a metal material and the alloys that comprise among Ni, Ag, Pd, Cu, the Au etc. as the composition material of interior electrode 107.Exactly, by using Ni monomer or Ni alloy, it is favourable also to become aspect cost.In addition, even use the alloy of these materials and arbitrary material application surface electroplating processes also be fine.Certainly, use alloy etc. equally also to be fine.In addition, the thickness of interior electrode 107 is configured to 1 to 5 μ m.In addition, wish that distance setting between will adjacent interior electrode 107 is 15 μ m or more than the 15 μ m.
At this moment, exactly, electrode 107 in the material of mainly being made up of Ni is used for, and anti-reducing material is used to become under the situation of dielectric base body of stack layer, and just can be with low-down cost realization multi-layer capacitor 106.
Interior electrode 107 is electrically connected to electrode 103, and only be connected in the electrode 103 one of them interior electrode 107 with only be connected in the electrode 103 another interior electrode 107 toward each other, and between these interior electrodes 107 in opposite directions, produce big electric capacity.
Then, portion of terminal 104 is connected to electrode 103.Portion of terminal 104 is as indicated above.Portion of terminal 104 is connected to electrode 103 in couples together, and pair of lead wires terminal 108 and these portion of terminal 104 corresponding connections.
Simultaneously, the length of supposing multi-layer capacitor 106 is L1, highly is L2, and width is when being L3, and the dimensional configurations of multi-layer capacitor 106 is for satisfying:
3.0mm≤L1≤5.5mm
0.5mm≤L2≤2.5mm
1.5mm≤L3≤3.5mm
Certainly, even use the size that is different from this also to be fine, also can be that a plurality of rather than single multi-layer capacitor 106 is encapsulated by outer covering material 105.
Simultaneously, when L1 is prescribed a time limit down less than above-mentioned to L3, the formation zone of interior electrode 107 becomes insufficient, and the phase mutual edge distance between the interior electrode 107 must narrow down, and the number of plies of electrode 7 in it must reduce, obtain the big capacitance difficulty that becomes, and the electronic component that will obtain the to have big capacitance range difficulty that becomes.
In addition, for preventing to be molded over a time-out with outer covering material 105 and multi-layer capacitor 106 because the damage of multi-layer capacitor 6 due to being impacted, preferably the corner part to multi-layer capacitor 106 applies chamfering, and the buckling curve that circular shape is set on the part of each side or whole side.
In addition,, preferably a plurality of multi-layer capacitors 106 are molded over together, and are installed on the parallel holding wire, become multiple device, therefore, can reduce the man-hour of installation cost and installation although be small-sized component.This configuration is illustrated among Figure 78.
Then, lead terminal 108 will be described.
Lead terminal 108 is connected to pair of terminal portion 104, stretch to the outside of outer covering material 105, be installed on the installation base plate, and be provided with in pairs, lead terminal 108 is used as conducting terminal like this, to realize element 102, the multi-layer capacitor 106 of inside and the conductivity between the substrate.Simultaneously, corresponding to the number that takes shape in inboard multi-layer capacitor 106, lead terminal 108 is for a pair of or manyly also be fine; As for the shape of lead terminal 108, can be for example rectangular shape, elliptical shape, square configuration and linear shape, the chamfering of corner part and curve shape, formation rake or form otch or the like all are suitable.In addition, as for its size and width, come arbitrary decision also to be fine according to the balance of needed erection space, installation strength, size of component or the like.
Lead terminal 108 is formed by dielectric substance in the mode identical with portion of terminal 104, and is formed by various metals etc.Even it also is fine by comprising at least a material configuration among Cu, Zn, Ni, Ag, the Au etc. and this material surface being used the single or multiple lift electroplating processes.In addition, can utilize alloy.
In addition, lead terminal 108 stretches out from the protuberance 110 on the bottom surface 109 that is arranged at outer covering material 105, and therefore, it is with identical about the description of portion of terminal 104, and might improve stiffness keeping under the low-cost situation about making.
Certainly, improved stiffness, therefore, just may prevent for example outer covering material 105 and the damage that scolder appearance cracking is installed, and also improve resistance to impact.
Can be laterally or this situation of turning back to the inside about lead terminal 108, it is with identical about portion of terminal 104 described situations.
Then, protuberance 110 will be described.
Protuberance 110 is arranged on the bottom surface 109 of outer covering material 105, and portion of terminal 104 and lead terminal 108 stretch out from protuberance 110.
Protuberance 110 can be integrally formed with outer covering material 105, and can integrate after forming separately again.In addition, it can be formed by the material identical materials with outer covering material, and can be formed by different materials.
Yet, as by shown in the process drawing of for example Figure 60, molten resin etc. is being cast under the situation of the metal die 130 of putting into element 102, in molten resin, owing to capillary reason, have only from the bottom surface 109 portion of terminal of stretching out 104 and lead terminal 108 around resin rise.In addition, solidify under the situation of the resin of being poured into a mould in that portion of terminal 104 and lead terminal 108 are maintained under the temperature lower than ambient temperature, form outer covering material 105 with described rising part.By the method, automatically formed protuberance 110.
Perhaps, also can be after forming outer covering material 105, form rising part at the periphery place of portion of terminal 104 of stretching out and lead terminal 108 by resin respectively, it is used as protuberance 110.
Simultaneously, protuberance 110 can be the general triangular post, and can be semicircular pillar, and under the situation of the manufacture process shown in experience Figure 60, usually protuberance 110 is shapes that the root towards portion of terminal 104 and lead terminal 108 broadens, and certainly, it can have shape in addition.
In addition, protuberance 110 can be formed at any position on the bottom surface 109, locates more in the inner part but preferably place it in the corner part that intersects the place than the side and the bottom surface 109 of outer covering material 105 on the bottom surface.Because pass through the method, the stretching out of portion of terminal 104 and lead terminal 108 could guarantee and the side of outer covering material 105 between fixed range is arranged, it has the relaxation absorption power (relaxation absorbing force) of opposing from stress of side surface direction etc.
Portion of terminal 104 and lead terminal 108 stretch out from protuberance 110, therefore, have improved stiffness, improve but hereinafter will describe stiffness in detail.
Then, reinforcing material 120 will be described.
Reinforcing material 120 is formed on the non-installation surface of portion of terminal 104 and lead terminal 108.For example, as represented among Figure 56, it can be formed at the approximate center of portion of terminal 104, and as represented among Figure 47, it can form along the periphery of portion of terminal 104.Under the former situation, although its easy formation, what can improve is the resistance to impact of (opposing of longitudinal direction counter stress is weak) on the longitudinal direction, and in the latter case, it forms on periphery, therefore, can greatly improve the resistance to impact of portion of terminal 104.Even in as Figure 75 and 76, also be like this under the situation of represented lead terminal 108.
Simultaneously, reinforcing material 120 can have other shapes, and is formed on other positions.
Identical with outer covering material 105, use the material as reinforcing material 120 such as resin and pottery, and epoxy series plastics etc. is suitable for also.In addition, also be fit to even use with outer covering material 105 identical materials.Even reinforcing material 120 has rod shape, post shapes and plate shape, and be provided with and a plurality of rather than singlely also be fine.
In addition, reinforcing material 120 can only be formed on the leading edge or root of portion of terminal 104 or lead terminal 108.
Be formed at reinforcing material 120 under the situation of exterior region, therefore, the influence that is subjected to for the leading edge of the most responsive portion of terminal 104 of the stress due to foreign impacts and lead terminal 108 is reduced, and improves resistance to impact.In addition, under reinforcing material 120 is arranged at situation on the exterior region, it becomes the weight on the exterior region, and improve the pressure crimp force of opposing installation base plate, and improved installation reliability, especially the opposing durability of impacting etc., thereby, the advantage of the stiffness of improving portion of terminal 104 (or lead terminal 108) also had.
Under reinforcing material 120 is arranged at situation on the root, the difficulties that becomes such as rivet tightly (clinch).
Then, will curved face part 115 as the deflection absorbent portion, folding part 116 and wavy 117 be described.The deflection absorbent portion is the part that alleviates the flexure effects that is produced owing to institute's electronic components mounted 1 vibrates, impact etc.
109 protuberance 110 stretches out portion of terminal (or lead terminal 108) from the bottom surface, therefore, externally produces the space between the bottom surface 109 of cladding material 105 and the portion of terminal 104 (or lead terminal 108), and this space becomes tolerance (tolerance limit), and has improved stiffness.In addition, by the deflection absorbent portion is set, opposing waits particularly the ability grow of the deflection of generation in the horizontal direction by vibration, and stiffness is all strengthened on three dimensions.
Simultaneously, certainly, the deflection that is absorbed by the deflection absorbent portion is not only by the generations such as vibration that apply in the horizontal direction.
Curved face part 115 is for being arranged at the part on portion of terminal 104 and the lead terminal 108, and bend to curve form, and this part is not with being welded (solder-mounted) on installation base plate, and therefore the effect of its performance padded coaming, has improved stiffness.
Folding part 116 also is so, and it is easier than the situation that forms curved face part 115 to form folding part 116.Especially, form in folding part 116 under the situation of V-shaped shape roughly, therefore, can form at an easy rate, and identical with the mode of curved face part 115, and folding part 116 is not welded.Be used as in folding part 116 under the situation of buffer area, therefore, realized the improvement of stiffness.
Simultaneously, curved face part 115 and folding part 116 can singulative or plural form be arranged on portion of terminal 104 and the lead terminal 108, and can be arranged at any place, for example root, pars intermedia and exterior region.
The formation slightly complicated on corrugated 117, but more effective as the buffer area that absorbs deflection, and greatly improved stiffness.Consider the erection space (that is, installation strength) of portion of terminal to be installed 104 and lead terminal 108 etc., can select and determine the size on corrugated 117 etc. arbitrarily.
Perhaps, curved face part 15, folding part 116 and wavy 117 etc. can be according to specifications and combination at random.
In Figure 55 and 74, curved face part 115 and folding part 116 are provided with in the mode of combination.Curved face part 115 is mixed mutually with folding part 116 characteristic separately, and has further improved the deflection absorption.
This type of deflection absorbent portion can be set as required, and can consider that the balance with specification decides.
Aforementioned content is the description to the each several part of the configuration of the electronic component in this execution mode.
Then, will describe situation about improving in detail with the stiffness that above-mentioned configuration was realized, and no matter whether this configuration might realize low-cost the manufacturing.
At first, from the configuration that the protuberance 110 that is arranged on the bottom surface 109 stretches out, realized the stiffness improvement by portion of terminal 104 and lead terminal 108.
That is to say, shown in Figure 45 and 46 etc., only pass through the height part of protuberance 110, even in portion of terminal 104 with lead terminal 108 stretches out from protuberance 110 and under the leading edge of protuberance 110 is turned back the situation that just allows to install, at the installation portion of portion of terminal 104 and lead terminal 108 and become between the bottom surface 109 of outer covering material 105 of main body of electronic component 101 and produced the space.By this space, externally produce tolerance (tolerance limit) between cladding material 105 and the portion of terminal 104 (lead terminal 108), and carry out relaxation absorption is applied to electronic component 101 with opposing vibration, impact etc., and improved stiffness.
In addition, shown in Figure 43 and 44 etc., be stretched over the bottom side, thereafter under the folding and roughly L-shaped situation, the space enlargement between itself and the bottom surface 109 at the portion of terminal 104 of stretching out and lead terminal 108 from protuberance 110.In addition, portion of terminal 104 of being stretched out and lead terminal 108 have fixed range on the approximate vertical direction of protuberance 110, therefore, have fixed range with protuberance 110, and further improve the relaxation absorption power of opposing vibration etc., and have improved stiffness.
In this way, simply by protuberance 110 is set and make portion of terminal 104 and lead terminal 108 from then on protuberance 110 stretch out, just might guarantee the tolerance limit of portion of terminal 104 and lead terminal 108, and guarantee stiffness at an easy rate.In addition, kept low-cost manufacturing.
In addition, as to described in the description of deflection absorbent portion, the deflection absorbent portion is arranged on portion of terminal 104 and the lead terminal 108, therefore, might be to external world comprising that the vibration and the impact that are applied on three dimensions of horizontal direction carry out relaxation absorption, and might realize very strong stiffness.
Next the situation of also having improved stiffness and resistance to impact by the shape facility of portion of terminal 104 and lead terminal 108 is described.
At first, Figure 49 and 126 is illustrated respectively on the position that portion of terminal 104, lead terminal 108 stretch out to the outside of outer covering material 105, the configuration that increases gradually towards leading edge direction thickness.Portion of terminal 104 of being stretched out and lead terminal 108 are in and impact to external world the very sensitive state of the influence of leading edge, but make its edge thickness increase forward by carrying out this type of configuration, avoided this influence, can prevent that portion of terminal 4 and lead terminal 108 are folding, crooked downwards, and resistance to impact and durability in the time of improving manufacturing, transportation and installation, and improve installation reliability.
Then, Figure 50 and 127 is illustrated in the part that portion of terminal 104, lead terminal 108 are stretched out to the outside of outer covering material 105 respectively, in the structure of attenuation gradually of thickness on the direction of leading edge.In the shape of leading edge attenuation, it is big that the elastic force of portion of terminal 104 and lead terminal 108 becomes, and under it is installed in situation on the installation base plate, increase for the pressure of installation base plate, and for the opposing grow that after installation, impacts the deflection due to waiting.Exactly, have the material of the metal etc. of high resiliency and spring performance by use, can further improve stiffness as portion of terminal 104 and lead terminal 109.
Perhaps, the load of portion of terminal 104 and lead terminal 108 be can disperse to be applied to, resistance to impact and proof stress therefore improved.
Then, Figure 51 and 70 is expressed as follows configuration respectively, promptly at portion of terminal 104, lead terminal 108 thickness of the thickness at a position greater than the portion of terminal in the inboard that is present in outer covering material 5 104, lead terminal 108 is arranged on the part that stretch out in the outside of outer covering material.By the method, electronic component 101 is stretched out and strengthen and resist for the stress that applies from the external world and the ability of turning back and twisting due to impacting.
Simultaneously, these can use independently, and can at random make up.
As above, the shape strategy by portion of terminal 104 and lead terminal 108 might improve resistance to impact, durability and stiffness.
This configuration of stretching out from the protuberance 110 on the bottom surface 109 that is arranged at outer covering material 105 by portion of terminal 104 and lead terminal 108, or by being arranged at deflection absorbent portion and the reinforcing material 120 on portion of terminal 104 etc., or the strategy of the thickness shape by portion of terminal 104 etc., just can improve the stiffness of electronic component 101, in addition, can improve resistance to impact and durability etc.In addition, these configurations and shape can at random make up according to specification.
At last, will the manufacture process of electronic component 101 be described.
The manufacture process of Figure 60,61,79 and 80 expression electronic components 101.
Figure 60 and 61 expressions are used from the manufacture process of the electronic component 101 of the element 102 of beginnings such as single plate capacitor, and the manufacture process of the electronic component 101 of multi-layer capacitor 106 is used in Figure 79 and 80 expressions, and in these manufacture processes, there is not different especially parts, therefore, by using the situation of Figure 60 and 61, will repeatedly describe it.
Top among Figure 60 represents that portion of terminal 104 is connected to the state of element 102.
Then, as from the top down shown in second figure, the element that is connected with portion of terminal 104 is placed in the inboard 131 of metal die 130.At this moment, desirable is with the state placing element from stretching out in the middle part of the peristome of the inboard 131 of metal die 120, so that portion of terminal 104 (or lead terminal 108) is stretched out from the bottom surface of outer covering material 105.
Then, from resin supply part 131 molten resin 134 is cast in the inboard 131 of metal die 130.At this moment, make cooling-part 133 contact terminal portions 104 (lead terminal 108), and portion of terminal 104 (lead terminal 108) is maintained the temperature lower than ambient temperature.
At last, after the cast of finishing molten resin 143, wait the solidification of molten resin by using cooling fan 135, and by using outer covering material 105 to finish encapsulation.At this moment, cooling-part 133 contact terminal portions 104 and lead terminal 108 etc., and keep the temperature lower than ambient temperature, therefore, be cast in the process of the molten resin 134 in the metal die inboard 131 in curing, resin is cured into like this: the periphery in portion of terminal 104 (lead terminal 108) has because the rising part that the surface tension of molten resin produces so just has been formed naturally protuberance 110 on the extending area of portion of terminal 104 (lead terminal 108).
At last, shown in Figure 61, electronic component 101 pulled out from metal die 130 just finish electronic component 101.At this moment, shown in Figure 61, it should be apparent that portion of terminal 104 stretches out from the protuberance 110 on the bottom surface 109 of outer covering material 105.
Even these aspects are used under the Figure 79 of situation of multi-layer capacitor 106 and 80 the situation in expression also be like this.
By having as above the electronic component 101 of configuration, realize that stiffness height and long electronic component 101 of life-span become possibility under the situation keeping cheaply, and might realize being equipped with durability, the life performance more of a specified duration of the electronic device of electronic component 101.
In addition, simplifying owing to manufacture process under the situation of keeping cheaply, improving the resistance to impact that prevents outer covering material and damage, durability, thermal endurance, moisture-proof etc., and realizing being suitable for the electronic component 101 and the electronic device of actual use.
Hereinafter, will embodiments of the invention be described by using accompanying drawing.
Figure 81,82,83,84,85,86,87,88,89,90,91,92,93,94,98,99,100,101,102,103,104,105,106,107,108,109,110,111 and 112 is the end view of the electronic component in the embodiments of the present invention, and Figure 95,96,97,113 and 114 is the vertical view of the electronic component in the embodiments of the present invention.
201 expression electronic components, 203 expression external electrodes, 205 expression outer covering materials, 206 expression multi-layer capacitors, electrode in 207 expressions, 208 expression lead terminals, 209 expression bottom surfaces, 210 expression reinforcing materials, 211 expression protuberance type reinforcing materials, 212 expression bottom surface reinforcing materials, 213 expression reinforcing materials, 215 expression curved face part, 216 expression folding parts, the wavy portion of 217 expressions, 220 expression rakes, 221 expression chamferings, 222 expression depressed parts, and 223 expression protuberances.
At first, in the configuration of electronic component 201, will the feature and the advantage thereof of the configuration of representing respectively be described briefly in every width of cloth figure.
Fig. 1 shows following configuration, be the two ends that a pair of external electrode 203 is connected to multi-layer capacitor 206, connect pair of lead wires terminal 208 via this external electrode 203, the laminate that comprises a plurality of dielectric base body in multi-layer capacitor 206 is laminated on interior electrode 207, and the part of multi-layer capacitor 206 and lead terminal 208 is by outer covering material 205 encapsulation (moulding).In addition, at this moment, interior electrode 207 is formed by the material of mainly being made up of Ag and Pd, and has following advantage, that is, high temperature resistant, and strong to the resistivity of high temperature that when encapsulating, is subjected to and the high temperature that when the generation backflow is installed, is subjected to owing to outer covering material 205.In addition, lead terminal 208 is from cuboid roughly, roughly the bottom surface of the outer covering material of cube or general square shape post and the corner part of side stretch out.By this configuration, only use following manufacture process just passable, promptly, the multi-layer capacitor that reversing is connected with lead terminal 208, and put into metal die, and make lead terminal 208 be hooked by metal pattern, be cast in molten resin in this metal die and solidify, therefore, might realize the low-down electronic component 201 of cost.
Figure 82 shows following configuration, and in lead terminal 208, externally the thickness of the part in the outside of cladding material is greater than its part of the inboard of cladding material 205 externally.Figure 82 shows the configuration that lead terminal 208 general thickness in the outside stretch out from outer covering material 205 all increase, even but thickness partly increase also and be fine.By this configuration, improved the resistance to impact of lead terminal 208.
Figure 83 represents the situation opposite with Figure 82, and such part is promptly arranged, promptly lead terminal externally the thickness on the outside of cladding material 205 less than its part of the inboard of cladding material 205 externally.By this configuration, improve the elasticity of lead terminal, and improve stiffness.
Figure 84 represents the configuration of the lead terminal 208 edge thickness attenuation forward of stretching out to the outside of outer covering material 205.By this configuration, in the mode identical, improve the elasticity of lead terminal 208, and improve stiffness with Figure 83.
Figure 85 represents the configuration that increases of edge thickness forward of the lead terminal 208 that stretches out to the outside of outer covering material 205.By this configuration, the external impact that opposing such as the leading edge of lead terminal 208 subjects to and the ability grow of the stress that produces, and improve resistance to impact, for example prevent that lead terminal 208 from turning back.
Figure 86 shows following configuration, and promptly the stretching out on the root of the lead terminal that stretches out to the outside of outer covering material 205, its thickness is the thickest.By this configuration, might prevent that lead terminal 208 is folding owing to the impact of the root that is applied to lead terminal 208 downwards, and might improve resistance to impact and durability.
Figure 87 is expressed as follows configuration, and promptly on the exterior region of the lead terminal 208 that stretches out to the outside of outer covering material 205, its thickness is the thickest.By this configuration, might prevent to be applied to strongly the stress of the leading edge of lead terminal 208, and might improve resistance to impact.
Figure 88 shows following configuration, promptly lead terminal 208 from the bottom surface of outer covering material 205 the bottom surface of approaching outer covering material 205 and the position of the corner part of side stretch out.By this configuration, between lead terminal 208 and outer covering material 205, produce the gap, and might improve stiffness.
Figure 89 shows following configuration, and promptly stretch out at lead terminal 208 position of approaching the corner part of the bottom surface of outer covering material 205 and side from the side of outer covering material 205.By this configuration, between lead terminal 208 and outer covering material 205, produce the gap, and might improve stiffness.
Figure 90 shows that reinforcing material 210 is formed at the configuration on any one of them part in outer covering material 205 and the lead terminal 208.Among Figure 90, it is arranged on the intersection area of outer covering material 205 and the extension of lead terminal 208, but it can be arranged in addition the zone.By this configuration, improve the resistance to impact of lead terminal 208 and outer covering material 205.
Figure 91 represents to use and the configuration of the integrally formed protuberance type reinforcing material 211 of outer covering material 205 as reinforcing material 210.By this configuration, might easily form reinforcing material 210.
Figure 92 represents to form the configuration of bottom surface reinforcing material 212.By bottom surface reinforcing material 212, might prevent owing to be applied to bending due to the impact of lead terminal 208 etc., and improve resistance to impact.
Figure 93 also represents to form the configuration of bottom surface reinforcing material 212, and the whole bottom surface of its covering outer covering material 205, therefore, might further improve resistance to impact.
Figure 94 represents to form the configuration of bottom surface reinforcing material 212, and lead terminal 208 shape therewith matches.By this configuration, even under the situation that bottom surface reinforcing material 212 is set, also can eliminate the installation surface of lead terminal 208 and the gap between the installation base plate, and no longer need solder bump (solder raise), and improve installation strength.
Figure 95 represents that reinforcing material 213 is arranged at the configuration of approximate center on the longitudinal direction on the non-installation surface of lead terminal 208.By this configuration, might prevent that lead terminal 208 from turning back, and might improve proof stress and durability.
Figure 96 represents that reinforcing material 213 is formed at the configuration of the periphery on the non-installation surface of lead terminal 208.By this configuration, might prevent that lead terminal 208 from turning back, and might improve resistance to impact and durability.
Figure 97 represents that reinforcing material 213 is formed at the configuration at leading edge place on the non-installation surface of lead terminal 208.By this configuration, might prevent that lead terminal 208 from turning back, and might improve resistance to impact and durability.
Figure 98 represents that curved face part 215 is formed at configuration on the lead terminal 208 as the example of deflection absorbent portion.By this configuration, improve the stiffness of lead terminal 208.
Figure 99 represents that folding part 216 is formed at the configuration on the part of lead terminal 208 as the example of deflection absorbent portion.By this configuration, on lead terminal 208, produce relaxation absorption power, and improve stiffness.
Figure 100 shows that corrugated 217 is formed at configuration on the lead terminal 218 as the example of deflection absorbent portion.In mode same as above, on lead terminal 208, produce relaxation absorption power and improve stiffness.
Figure 101 shows on the lead terminal 208 with the curved face part 215 of compound mode formation and the configuration of folding part 216.By this configuration, stiffness is improved greatly and is increased.Simultaneously, in addition, combination can be multiple mode in addition, for example combination of corrugated 217 and folding part 16.
Figure 102 represents that the deflection absorbent portion is arranged at the configuration on the root of the lead terminal 208 that stretches out to the outside of outer covering material 205.By this configuration, the stiffness of improving opposing vibration etc. on the part that approaches outer covering material 205 becomes possibility.
Figure 103 represents that the deflection absorbent portion is arranged at the configuration on the leading edge of the lead terminal 108 that stretches out to the outside of outer covering material 205.By this configuration, the virtual scope zone (virtual rangearea) that absorbs deflection broadens, and can respond bigger vibration etc.
Figure 104 shows the bottom surface 209 uneven configurations of the lead terminal 208 that stretches out to the outside of outer covering material 205 and outer covering material 205.By this configuration, lead terminal 208 has elasticity, and can improve the stiffness after installing.
Figure 105 is illustrated in the configuration that rake 220 is set on the corner part that lead terminal 208 stretches out the place.By this configuration, can avoid influence, and might improve resistance to impact as the extension of most fragile part in the outer covering material 205.
Figure 106 represents that lead terminal 208 intersects the configuration that the corner part at place stretches out from the rake 220 and the bottom surface of outer covering material 205.By this configuration, improve the resistance to impact of outer covering material, and might improve stiffness by the degree of freedom that improves between outer covering material 205 and the lead terminal 208.
Figure 107 represents that rake 220 has the roughly configuration of arc surface shape.Therefore the surface of rake 220 is an arc surface, has following advantage, and promptly it is to the resistivity grow of the impact of the extension of the most fragile that is applied to outer covering material 205.
Figure 108 represents that chamfering 221 is formed at the corner part of outer covering material 205 and the configuration on the corner part except that the extension of lead terminal 208.By this configuration, improve the resistance to impact and the durability of outer covering material 205.
Figure 109 represents that depressed part 222 is arranged on the outer covering material 205 and is arranged on configuration on the extension of lead terminal 208.By this depressed part 222, externally produce the space between cladding material 205 and the lead terminal 208, and produce the relaxation absorption power of lead terminal 208, and improve stiffness.
Figure 110 is expressed as follows configuration, promptly externally form protuberance 223 on the bottom surface of cladding material 205, and lead terminal 208 stretches out from protuberance 223.By this configuration, between the bottom surface 209 of lead terminal 208 and outer covering material 205, produce the space, and improve stiffness.
Figure 111 shows following configuration, and promptly lead terminal stretches out from the leading edge of protuberance 123, and stretches to the bottom side of bottom surface 109, turns back thereafter and roughly L-shaped.By this configuration, externally the bottom surface 109 of cladding material 105 and the amount of space between the lead terminal 108 become very big, and greatly improve stiffness and improve.
Figure 112 represents the configuration that lead terminal 208 stretches out from any zone of the side of for example protuberance 223 except that leading edge, and has improved the structural strength of the extension of protuberance 223 and lead terminal 208, and has also improved stiffness.
Figure 113 represents that a plurality of multi-layer capacitors 206 are packaged in the configuration in the inboard of outer covering material 205, and by this configuration, might be easy to form compound electronic component, and further might save the man-hour of installing on recombination line.
Figure 114 represents that a plurality of paired lead terminals 208 are connected to the configuration as the multi-layer capacitor 206 of a matrix, and by the method, might form compound electronic component easily.
Below, with the details of each one of description.
201 expression electronic components are electronic components that multi-layer capacitor 206 is wherein arranged, but are not limited to multi-layer capacitor 206, and it can be one of any in resistor, inductor, filter, IC and the other electron component.
Below, multi-layer capacitor 206 will be described.
Multi-layer capacitor 206 disposes as follows, and promptly the matrix by dielectric substance configuration get with a plurality of tab laminates, and forms interior electrode 207, and therefore, it is bigger to make it compare under measure-alike situation electric capacity with single plate capacitor.
In addition, for this multi-layer capacitor 206 is electrically connected to lead terminal 208, a pair of external electrode 203 is set.
Dielectric base body is the matrix by dielectric substance configuration, is suitable for using for example dielectric substance of titanium oxide and barium titanate.Perhaps, also use aluminium oxide etc.By using this type of material, matrix at random forms needed shape, size.
Interior electrode 207 is for being embedded in the electrode in the dielectric base body inboard, and is one of them metal material and the alloy at least that comprises among Ni, Ag, Pd, Cu, the Au etc. as the composition material of interior electrode 207.
Here, by using the metal material of mainly forming to form interior electrode 207 by Ag and Pd, there is following advantage, promptly improve durability to high temperature, and because high temperature when cast becomes the molten resin of outer covering material 205 and damage that the interior electrode 207 due to the high temperature when refluxing is installed are seldom, therefore, need to use Ag and Pd as main component.
In addition, the composition material of interior electrode 207 can be the material of handling through electroplating surface.In addition, the thickness of interior electrode 207 is configured to 1 to 5 μ m.In addition, preferably be 15 μ m or more than the 15 μ m with the distance setting between the electrode 207 in adjacent.
Electrode 207 is electrically connected to external electrode 203 in some, and only be connected in the electrode 103 one of them interior electrode 207 with only be connected in the electrode 103 another interior electrode 207 toward each other, and between these interior electrodes 207 in opposite directions, produce big electric capacity.
Simultaneously, lead terminal 208 is electrically connected to multi-layer capacitor 206 via external electrode 203, and when connecting, uses the material of mainly being made up of copper, therefore, has improved high temperature durability.
Simultaneously, when the length of supposition multi-layer capacitor 206 is L1, highly be L2, and width is when being L3, the size of multi-layer capacitor 206 is configured and satisfies:
3.0mm≤L1≤5.5mm
0.5mm≤L2≤2.5mm
1.5mm≤L3≤3.5mm
But certainly, even use different sizes also to be fine, even and a plurality of rather than single multi-layer capacitor 206 equally also be fine by outer covering material 205 encapsulation.This information slip is shown among Figure 113.Perhaps, a plurality of paired external electrodes 203 are arranged on the multi-layer capacitor 206 independently, and lead terminal 208 is connected respectively to these independently external electrodes 203, therefore, form a plurality of elements on a matrix, and can be configured to composite component easily.This information slip is shown among Figure 114.
Simultaneously, when L1 is prescribed a time limit down less than above-mentioned to L3, the formation zone of interior electrode 207 becomes insufficient, and the phase mutual edge distance between the interior electrode 207 must narrow down, and the number of plies of electrode 207 in it must reduce, obtain the big capacitance difficulty that becomes, and the electronic component that will obtain the to have big capacitance range difficulty that becomes.
In addition, for preventing to be molded over a time-out with outer covering material 205 and multi-layer capacitor 6 because the damage of multi-layer capacitor 206 due to being impacted, preferably the corner part to multi-layer capacitor 206 applies chamfering, and the buckling curve that circular arc is arranged in a part or the whole side of each side.
Below, external electrode 203 will be described.
External electrode 203 is the conductive component that is provided with in pairs on the two ends of aforesaid multi-layer capacitor 206, and for being electrically connected the conductive component of multi-layer capacitor 206 and lead terminal 208.Commonly external electrode 203 is provided with on the two ends of multi-layer capacitor 206 in pairs, even but its be arranged at the middle part of multi-layer capacitor 206 rather than on two ends, also be fine.Perhaps, even it is arranged on the upper surface of multi-layer capacitor 206 and the lower surface rather than also is fine on the side, even and it is arranged on the whole surface of side, upper surface and lower surface and equally also is fine, even and it only is arranged on the part on whole surface and equally also is fine, even and be set to extend out to another surface and equally also be fine.
Quote is the metal material of one of them at least that comprises among Ni, Ag, Pd, Cu, the Au etc. as external electrode 203 materials.In addition, even use the alloy of these materials and one of these materials application surface electroplating processes also be fine.Certainly, can use alloy etc., also can be by any realization the in single or multiple lift electroplating processes, deposition processes, sputter processing, the slurry coating etc.
In addition, when using this external electrode 203 to connect multi-layer capacitor 206 and lead terminal 208, preferably use the scolder of mainly forming to be used for this connection by tin.Because tin is main component, therefore might eliminate the harm reagent (challenging agent) that is unfavorable for environment, and, might improve fusing point, therefore, can prevent middle fusion and damage and the electronic components 201 that can be configured to have high reliability of taking place such as backflow when mounted.Particularly, preferably use scolder with fusing point more than 240 ℃ or 240 ℃.In addition, at this moment, lead terminal 208 is preferably formed by the material that mainly comprises copper.By the method, for lead terminal 208 self, the durability of high temperature when having improved opposing cast molten resin and the high temperature when refluxing, and the electronic component 201 that might realize having height reliability.
Then, lead terminal 208 will be described.
Lead terminal 208 is provided with in pairs, and is connected to multi-layer capacitor 206 via external electrode 203.Usually, exist many it to be arranged at the situation at the two ends of multi-layer capacitor 206, even but its position that is arranged at except that two ends also be fine.For example, be arranged at external electrode 203 under the upper surface and the situation on the lower surface of multi-layer capacitor 206, even lead terminal 208 correspondingly is connected to upper surface and lower surface also is fine.In addition, lead terminal 208 is by comprising that at least a material among Cu, Zn, Ni, Ag, the Au etc. disposes, and can be to its surface applications single or multiple lift electroplating processes.
At this moment, as mentioned above, as the high temperature countermeasure, under the situation that lead terminal 208 is formed by the material that mainly comprises copper or alloy, the problem that has the wettability variation of the scolder between installation base plate and the lead terminal 208, and need at high temperature to carry out to reflux, but as mentioned above, use has the scolder of the scolder of melt temperature more than 240 ℃ or 240 ℃ as external electrode 203, and this problem has just been solved.
Perhaps, preferably by using 42 alloys to be used for lead terminal 208, improve solder wettability so that installation is easier.
Then, lead terminal 208 is connected to external electrode 203, and at random is processed into suitable shape, and forms to the outside of outer covering material 205 and stretch out.
In addition, by following moulding by casting (pouring type mold), promptly the multi-layer capacitor 206 that is connected with lead terminal 208 is put into metal die and is made lead terminal 208 be hooked at the metal die place, and molten resin is cast in this metal die to form outer covering material 205, can simplifies manufacture process like this and make electronic component 201 with low-down cost.
Do not consider easy to manufacture and cost is low, will describe the situation that improves its resistance to impact and stiffness by the configuration of lead terminal 208 below.
Shown in Figure 82, externally have under the situation of the thickness part thicker on cladding material 205 outsides at lead terminal 208 than the thickness in outer covering material 205 inboards, the influence that might prevent that lead terminal 208 from being impacted in the outside etc., and can improve resistance to impact.
Perhaps, as shown in Figure 83, externally have under the situation of thickness than the part of the thin thickness in outer covering material 205 inboards on cladding material 205 outsides, might improve the elasticity of lead terminal 208, therefore, might improve stiffness at lead terminal 208.
Perhaps, under the situation of the shape of leading edge attenuation, same at lead terminal 208 thickness as shown in Figure 84, might improve the elasticity of lead terminal 208 and improve stiffness.
Otherwise, as shown in Figure 85, under the situation of lead terminal 208 configuration that increases of edge thickness forward, there is following advantage, promptly might improve and be impacted by fully applying and the resistance to impact at the exterior region place of stress.
In addition, thicker by the root portion that lead terminal 208 is stretched out as shown in Figure 86, can prevent turning back at the root portion place.
Otherwise, as shown in Figure 87,, make the opposing of its stress that exterior region is subjected to strong, heavier by the weight that makes leading edge in addition by making lead terminal 208 exterior regions thicker, may improve installation strength.
Then, as shown in Figure 88, at lead terminal 208 from stretching out with corner part bottom surface adjacent 209, rather than under the situation about disposing from the mode that the corner part of the bottom surface 209 of outer covering material 205 and side stretches out, between itself and bottom surface 209, produce the gap, and produce relaxation absorption power, and improve stiffness.
Perhaps, as shown in Figure 89, under the situation that the mode that lead terminal 208 stretches out from the adjacent side of corner part of intersecting with the bottom surface 209 of outer covering material 205 and side disposes, between itself and side, produce the gap, and produce relaxation absorption power, and improve stiffness.
Then, reinforcing material 210, protuberance type reinforcing material 211 and bottom surface reinforcing material 212 will be described.
Reinforcing material 210 is arranged in outer covering material 205 and the lead terminal 209 one of them, and for example, shown in Figure 90, it is arranged at outer covering material 205 and intersects on the part at places with lead terminal 208.By such reinforcing material 210 is set, might prevent impact, or prevent impact outer covering material 205 self to lead terminal 208.
Simultaneously, reinforcing material 210 forms the independent body that separates with outer covering material 205 earlier, is engaged then, also can be similar protuberance type reinforcing material 11 equally integrally formed.
About protuberance type reinforcing material 211, the part that becomes protuberance sets in advance on outer covering material 205, is used as reinforcing material, at this moment, by it being joined to lead terminal 208 etc., might improve the resistance to impact of lead terminal 208.
Bottom surface reinforcing material 212 is for being arranged at the reinforcing material on the installation surface, with with outer covering material 205 and lead terminal 208 in each at least a portion overlapping, and shown in Figure 92, by forming the bottom surface side of bottom surface reinforcing material 212, improved the resistance to impact of lead terminal 208 with the extension of supporting wire terminal 208.
At this moment, even bottom surface reinforcing material 212 is set also to be fine with a part that supports bottom surface 209 and lead terminal 208, and as shown in Figure 93, also can be on bottom surface 209, to form a slice bottom surface reinforcing material 212, except that width institute region surrounded, also overlapping with the part of lead terminal 208 by lead terminal 208.By such configuration, there is the advantage that is easy to form bottom surface reinforcing material 212.
In addition, even being provided with also arbitrarily with compound mode, bottom surface reinforcing material 212, reinforcing material 210 or protuberance type reinforcing material 11 be fine.By being used in combination, further realized the intensity assurance.
In addition, by reinforcing material 212 these situations in bottom surface are set, a part and the installation base plate of the installation surface of lead terminal 208 have distance, therefore, as shown in Figure 94, depressed part is arranged in the lead terminal 208, and bottom surface reinforcing material 212 is put into depressed part just, therefore, eliminated the distance between the installation surface of extended installation base plate and lead terminal 208, and might strengthen installation strength.
In addition, as shown in Figure 95 to 97, wish reinforcing material 213 is arranged on the non-installation surface of lead terminal 208.Be arranged at this situation on the non-installation surface of lead terminal 208 by reinforcing material 213, improved resistance to impact, therefore might prevent for example lead terminal 208 influence of folding and crooked impact downwards.
Be formed at reinforcing material 213 on the non-installation surface of lead terminal 208 and can be formed at any position on the non-installation surface of lead terminal 208, even and be formed on shown in Figure 95 that approximate center also is fine on the longitudinal direction of lead terminal 208, even and the periphery that is formed at lead terminal 208 shown in Figure 96 equally also is fine, even and shown in Figure 97, be formed on the exterior region of lead terminal 208 and equally also be fine.Certainly, it can be arranged on the root of lead terminal 208, maybe can be arranged on root and the leading edge, maybe can be arranged at center and leading edge place, or can the various forms setting.
Then, the deflection absorbent portion will be described.
The deflection absorbent portion is the part that is arranged on the lead terminal 208, and has for after-applied to the vibration of electronic component 201 and the relaxation absorption power of impact in installation, and improves the stiffness of lead terminal 208.About this deflection absorbent portion, have curved face part 215, folding part 216, wavy 217 etc., even and select arbitrarily and form any one of them also be fine, even and with their combination in any and form and also be fine.In addition, can form a plurality ofly, maybe can form single.In addition, even having the shape that is different from curved face part 215 grades, it equally also is fine.
Folding part 216 can form V-arrangement roughly in its side cross section, and in the case, is easy to make.In addition, by when making lead terminal 208, suppressing (flatting with pressure) and arbitrary shape corrugate to form corrugated 217.
Can select each in curved face part 215, folding part 216 and the corrugated 217 arbitrarily, and for example, under the very long situation of lead terminal 208, when forming corrugated 217, it is best that the balance of installation strength and stiffness becomes.
In addition, curved face part 215 can be used for optimizing the property easy to manufacture of lead terminal 208 and the balance between the assurance of self intensity.So because of wishing its folding part 216 easy to manufacture.
Simultaneously, in order to have relaxation absorption power, the deflection absorbent portion has following state, and is promptly not soldered when mounted, and floats on installation base plate.In addition, if these shapes of combination in any might be mixed superperformance separately so, therefore, the stiffness that might be fit to various degree is improved.
By this type of form, increase relaxation absorption power, and improve stiffness.
In addition, the deflection absorbent portion can be arranged at lead terminal 208 root, can be arranged at leading edge, maybe can be arranged between root and the leading edge.Under it was arranged at situation on the root, the leading edge portion of the deflection absorbent portion of lead terminal 208 increased, and has improved installation strength.Otherwise, being arranged in the deflection absorbent portion under the situation on the leading edge of lead terminal 208, the Virtual Space that is centered on by the deflection absorbent portion broadens, and therefore, increases the deflection absorbability of the bigger vibration of opposing.
Simultaneously, as shown in Figure 104, even under the situation that the deflection absorbent portion is not set, and under the bottom surface 209 uneven situations that make lead terminal 208 and outer covering material 205, also might on lead terminal 208, produce elasticity, even and improve stiffness by elasticity and also be fine.
Then, rake 220 will be described.
Rake 220 stretches out rake on the corner part at place for being arranged at lead terminal 208 from outer covering material 205, and has the cut shape of corner part, and, can under the situation that forms outer covering material 205, form rake 220 in advance, also can be with its excision after forming outer covering material 205.
In addition, about this rake 220, as described in Figure 105, its inclined surface can be roughly flat plane, and can be as the roughly arc surface among Figure 107, and if its be flat plane roughly, be easy to so form, if and it is arc surface roughly, improve the resistance to impact that opposing outer covering material 205 is hit so.
Stretch out this situation by lead terminal 208 from rake 220, improved the resistance to impact in the zone of the ability of impact resistant to external world the most weak and easy generation cracking on the cladding material 205 externally etc., and by strengthening resistance to impact, eliminated the appearance of crackle etc., improve moisture-proof, and also improved reliability.In addition, stretch out this situation from rake 220, externally produce tolerance limit between cladding material 205 and the lead terminal 208, and produce relaxation absorption power, and improve stiffness by lead terminal 208.
In addition, the corner part that intersects places from rake 220 and bottom surface 209 by lead terminal 208 stretches out this situation, and as shown in Figure 106, the tolerance limit between itself and the outer covering material 205 further enlarges, and further improves stiffness.
Simultaneously,, or form consistently, or be formed on than also being fine on the bigger width of the width of lead terminal 208 with the width of the lead terminal 208 that is stretched out even rake 220 is not formed on the whole surface of corner part that lead terminal 208 stretches out the place.
Then, depressed part 222 will be described.
Depressed part 222 stretches out depressed part on the corner part at place for being arranged at lead terminal 208 from outer covering material 205, and owing to there is depressed part 222, between lead terminal 208 that is stretched out and outer covering material, produce the space, and become tolerance limit, therefore improve the stiffness of lead terminal 208.
Simultaneously, depressed part 222 is can be in advance integrally formed by employed metal die when forming outer covering material 205, maybe can form by pruning after forming outer covering material 205 etc.
In addition, depressed part 222 can be formed on the whole corner part, or only can be formed on the width segments that lead terminal 208 stretches out the place.In addition, depressed part 222 can be rectangular shaped dent portion 222, can be the depressed part 222 of semicircular in shape, can have other shape, and can have various forms.
Then, chamfering 272 will be described.
Chamfering 221 is arranged on the corner part except that lead terminal 208 stretches out the corner part of outer covering material 205 at place, and can be the shape with circular shape and/or the otch on flat plane roughly.In addition, when forming outer covering material 205, chamfering 221 can be as one man integrally formed with its metal pattern, or can handle after forming outer covering material 205.
By forming this type of chamfering 221 these situations, improve the resistance to impact of the more weak corner part of the opposing of impact, and the durability that realizes outer covering material is improved, corresponding moisture-proof is improved or the like therewith.
Then, protuberance 223 will be described.
Protuberance 223 is the part on the bottom surface 209 that is arranged at outer covering material 205, and lead terminal 208 therefrom stretches out.
Protuberance 223 can be integrally formed with outer covering material 205, also can be integrated again after forming separately.In addition, protuberance 223 can be formed by the material identical materials with outer covering material, and can be formed by different materials.
Yet, for example,, in molten resin,, have only the resin of the periphery of 209 lead terminals that stretch out 208 to rise from the bottom surface owing to capillary reason in that molten resin etc. is cast under the situation of the metal die of putting into multi-layer capacitor 206.In addition, maintain the temperature lower and get off to solidify under the situation of the resin of being poured into a mould, form outer covering material 205 with this rising part than ambient temperature.By the method, form protuberance 223 automatically.
Perhaps, also can be after forming outer covering material 205, form the rising part that is formed from a resin at the periphery place of the lead terminal 208 that stretches out, it is used as protuberance 223.
Simultaneously, protuberance 223 can be the general triangular post, and can be semicircular pillar, and as mentioned above, when the solidification of molten resin, utilize surface tension to form under the situation of protuberance 223, the shape that broadens for root under a lot of situations towards lead terminal 208, the shape that certainly, also can have other.
In addition, protuberance 223 can be formed at any position on the bottom surface 209, but preferably places it in the corner part position more in the inner part of intersecting the place than the side and the bottom surface 209 of outer covering material 205 on the bottom surface 209.Exactly because by the method, the stretching out of lead terminal 208 can guarantee the fixed range with the side of outer covering material 205, and has the relaxation absorption power of the stress etc. of opposing side surface direction.
In addition, stretch out from protuberance 223, between lead terminal 208 and outer covering material 205, produce the space naturally, and in fact this space become tolerance limit, improved the stiffness of opposing electronic component 201 suffered vibrations etc. by lead terminal 209.In addition, as indicated above, be arranged at protuberance 223 under the situation of corner part position more in the inner part of ratio side on the bottom surface 209 and bottom surface, between protuberance 223 and side, produce distance, and can respond the vibration that applies in the horizontal direction, the vibration that applies in vertical direction and both in conjunction with and the three-dimensional vibrating of vibration, thereby and the stiffness of lead terminal 208 become and can respond three-dimensional vibrating very by force.
In addition, as shown in figure 31, lead terminal 208 is stretched over the bottom side of bottom surface 209 and stretches out, and turns back and roughly L-shaped thereafter, and therefore, stiffness is improved manyly.
Simultaneously, no matter whether protuberance 223 is arranged, lead terminal 208 can be after it stretches out laterally or the inboard turn back.Under the situation of turning back laterally, might improve installation strength, and under the situation of turning back to the inside, might reduce erection space.
In addition, lead terminal 208 can stretch out from the leading edge of protuberance 223, and also portion stretches out from the side.
By having as above the electronic component 201 of configuration, can realize stiffness height and long electronic component 201 of life-span under the situation keeping cheaply, and can realize being equipped with durability, the life performance more of a specified duration of the electronic device of electronic component 201.
Exactly, by using mainly the material formed by Ag and Pd interior electrode as multi-layer capacitor, can realize the interior electrode of excellent heat resistance, therefore, can tolerate the high temperature when when cast forms the molten resin of outer covering material 205 and in installation, taking place to reflux, and form by simple manufacture process, and can realize to have high-impact, the molded electronic component with high capacitance and high-breakdown-voltage 201 of the outer covering material encapsulation of durability and stiffness, although its cost is low, the reliability that it helps to realize long-life more and improves the electronic device that uses electronic component 201.
Industrial usability
The present invention is electronic component, and it has element; Pair of terminal section, it is arranged on the described element; With outside coating member, it covers a part and the described element of portion of terminal, and by such structure: Be that rake is arranged on the corner part of the bottom surface of outer covering material and side, and portion of terminal is from tilting The corner part that the place is intersected in the bottom surface of section and outer covering material stretches out, applicable to such application: Make in the electronic component and keep normal low cost, need simultaneously to resist the stiffness of foreign impacts and vibration High electronic component, described shock and vibration make, transportation and act on when installing and reach the outside and cover On the portion of terminal or lead terminal in the outside of cover material.
The present invention is electronic component, and it has: element; Pair of terminal section, it is arranged on the described element; With outside coating member, it covers a part and the described element of portion of terminal, and by such structure: Rake be arranged on the corner part of the bottom surface of outer covering material and side and portion of terminal from rake with The corner part that the place is intersected in the bottom surface of outer covering material stretches out, applicable to such application: make electricity Keep normal low cost in the sub-element, the resistance to deflection that needs simultaneously to resist foreign impacts and vibration is high Electronic component, described shock and vibration make, transportation and when installing to reaching outer covering material On the portion of terminal or lead terminal in the outside.
The present invention is electronic component, and it has the multi-layer capacitor that comprises dielectric base body, and interior electrode is imbedded In described dielectric base body; The pair of lead wires terminal, it is arranged on the multi-layer capacitor; Cover with the outside Material, it covers a part and the multi-layer capacitor of lead terminal, by following configuration: namely electrode by The material that comprises Ag and Pd forms and outer covering material is cuboid roughly, cube and greatly roughly Cause any in the square column, and lead terminal is from the corner part of bottom surface and the side of outer covering material Or stretch out near it, applicable to keeping on the basis of low cost fabrication, need resistance to impact, moisture-proof The application of the electronic component that property, durability and stiffness are high.
The application's case is based on Japanese patent application No.2004-184737 that submits in the Japanese patent application No.2004-165279 that submitted on June 3rd, 2004, on June 23rd, 2004 and the Japanese patent application No.2004-184738 that submitted on June 23rd, 2004, this by quoting in full with its content quotation in this.

Claims (25)

1. electronic component, it comprises:
Element;
Pair of terminal portion, its be arranged on the described element and turn back with allow mounted on surface and
Outer covering material, it covers the part of described element and described portion of terminal;
Wherein said pair of terminal portion stretches out from the bottom surface of described outer covering material respectively.
2. electronic component according to claim 1 is characterized in that,
It is 0.1mm or more than the 0.1mm that the extended surface of the extended surface of the side of described outer covering material and the described bottom surface of described outer covering material intersects distance between the corner part at place and described portion of terminal is stretched out the place from described outer covering material the position.
3. electronic component according to claim 1 is characterized in that,
The described bottom surface of described outer covering material has rake, and described rake connects the optional position on the described bottom surface of optional position on the side of described outer covering material and described outer covering material; With
Described pair of terminal portion stretches out from the border of described rake or described rake and described bottom surface respectively.
4. electronic component according to claim 3 is characterized in that,
Described rake is a curve form.
5. electronic component according to claim 1 is characterized in that,
The described bottom surface of described outer covering material have depressed part and
Described pair of terminal portion stretches out from described depressed part respectively.
6. electronic component according to claim 5 is characterized in that,
Described depressed part is an otch, and it forms after a part that covers described element and described portion of terminal with described outer covering material.
7. electronic component according to claim 1 is characterized in that,
Described pair of terminal portion increases towards leading edge direction thickness.
8. electronic component according to claim 1 is characterized in that,
Described pair of terminal portion reduces towards leading edge direction thickness.
9. electronic component according to claim 1 is characterized in that,
Described pair of terminal portion is bigger than the thickness in the inboard at described outer covering material at the thickness in the outside of described outer covering material.
10. electronic component according to claim 1 is characterized in that,
Described pair of terminal portion is not carrying out having reinforcing material on the non-installation surface of mounted on surface.
11. electronic component according to claim 10 is characterized in that,
Described pair of terminal portion has described reinforcing material on the periphery of the described non-installation surface of not carrying out mounted on surface.
12. electronic component according to claim 1 is characterized in that,
Described element comprises dielectric body.
13. electronic component according to claim 12 is characterized in that,
Described dielectric body is a plurality of multilayer dielectric base body, and
Interior electrode is embedded in the described dielectric base body.
14. electronic component according to claim 13 is characterized in that,
Wherein said in electrode comprise at least silver and palladium in a kind of.
15. electronic component according to claim 14 is characterized in that,
Described in electrode mainly comprise nickel and
Described dielectric base body is anti-reducing material.
16. electronic component according to claim 1 is characterized in that,
Described element is a plurality of.
17. electronic component according to claim 1 is characterized in that,
Described portion of terminal has the deflection absorbent portion.
18. electronic component according to claim 17 is characterized in that,
Described deflection absorbent portion is the arbitrary shape in curved surface, corrugated and the folding part, or is the combination of these shapes.
19. electronic component according to claim 1 is characterized in that,
Described outer covering material is roughly cuboid or roughly cubical shape.
20. electronic component according to claim 1 is characterized in that,
Described outer covering material on described bottom surface, have protuberance and
Described pair of terminal portion stretches out from described protuberance respectively.
21. electronic component according to claim 1 is characterized in that,
Described protuberance has the substantial cylindrical shape.
22. electronic component according to claim 1 is characterized in that,
Described portion of terminal mainly comprises copper; And
Described element and described portion of terminal are that scolder more than 240 ℃ or 240 ℃ is connected by fusing point.
23. electronic component according to claim 1 is characterized in that,
Described portion of terminal comprises 42 alloys.
24. a manufacturing method of electronic elements, it comprises:
Placing element;
Pair of terminal portion is connected to described element;
In metal die, put into the described element that is connected with described portion of terminal;
The outer covering material of fusion is cast in the described metal die, until reaching the degree that described portion of terminal is stretched out from the bottom surface of described outer covering material; And
Solidify the outer covering material of being poured into a mould.
25. manufacturing method of electronic elements according to claim 25 is characterized in that,
Under the temperature that the keeps described portion of terminal condition lower, solidify described outer covering material than ambient temperature.
CN 200580017881 2004-06-03 2005-06-03 Electronic component Pending CN1961624A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004165279A JP2005347504A (en) 2004-06-03 2004-06-03 Electronic component
JP165279/2004 2004-06-03
JP184737/2004 2004-06-23
JP184738/2004 2004-06-23

Publications (1)

Publication Number Publication Date
CN1961624A true CN1961624A (en) 2007-05-09

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JP (1) JP2005347504A (en)
CN (1) CN1961624A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104766835A (en) * 2015-04-15 2015-07-08 江苏晟芯微电子有限公司 Low-temperature and shock-resistant semiconductor package structure
CN105047440A (en) * 2015-08-11 2015-11-11 湖南艾华集团股份有限公司 Terminal pin flattening device for chip aluminum electrolytic capacitor and production method of capacitor
CN105047413A (en) * 2015-08-11 2015-11-11 湖南艾华集团股份有限公司 Chip aluminum electrolytic capacitor and production method
CN105047439A (en) * 2015-08-11 2015-11-11 湖南艾华集团股份有限公司 Method for flattening terminal pins of chip aluminum electrolytic capacitor and application of method
CN116230409A (en) * 2023-05-05 2023-06-06 丰宾电子科技股份有限公司 Anti-vibration semi-solid capacitor applied to electronic radium tube

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104766835A (en) * 2015-04-15 2015-07-08 江苏晟芯微电子有限公司 Low-temperature and shock-resistant semiconductor package structure
CN104766835B (en) * 2015-04-15 2017-07-28 苏州聚达晟芯微电子有限公司 A kind of semiconductor package of low temperature antidetonation
CN105047440A (en) * 2015-08-11 2015-11-11 湖南艾华集团股份有限公司 Terminal pin flattening device for chip aluminum electrolytic capacitor and production method of capacitor
CN105047413A (en) * 2015-08-11 2015-11-11 湖南艾华集团股份有限公司 Chip aluminum electrolytic capacitor and production method
CN105047439A (en) * 2015-08-11 2015-11-11 湖南艾华集团股份有限公司 Method for flattening terminal pins of chip aluminum electrolytic capacitor and application of method
CN116230409A (en) * 2023-05-05 2023-06-06 丰宾电子科技股份有限公司 Anti-vibration semi-solid capacitor applied to electronic radium tube
CN116230409B (en) * 2023-05-05 2024-03-29 丰宾电子科技股份有限公司 Anti-vibration semi-solid capacitor applied to electronic radium tube

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