JP2005347504A - Electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component which can be manufactured in a manufacture process at inexpensive cost, and in which shock resistance, durability, bending resistance and mounting reliability can be improved, while dispensing with fine adjustment. <P>SOLUTION: The electronic component 1 has an element 2, a pair of terminal parts 4 arranged in the element 2, and a sheath material 5 covering a part of the terminal parts 4 and the element 2. Inclination parts 10 are arranged at corner parts of the base 9 and sides of the sheath material 5. The terminal parts 4 project from corner parts, where the inclination parts 10 and the base 9 of the sheath material cross. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic component suitably used for an electronic device such as a modem, a power supply circuit, a liquid crystal power supply, a DC-DC converter, and a power line communication device.

  Many electronic components are mounted in electronic devices such as modems and power supply circuits. For example, a capacitor is often used for noise removal or DC component cut.

  Here, electronic devices are required to be reduced in size and cost, and accordingly, electronic components are also required to be significantly reduced in size and cost. Furthermore, surface mounting electronic components are often required in order to reduce mounting cost and mounting area by automatic mounting. On the other hand, conflicting specifications such as high performance, reduction of characteristic variation, and improvement of durability have been demanded together with downsizing.

  Furthermore, with the increase in the number of pins of LSI and the like and the increase in the number of bits of signal lines, there is a need for high-density mounting in which a plurality of electronic components are mounted in a place where the line spacing is very narrow.

  In particular, a modem or the like often has a set of two lines for data input and data output, and two electronic components must be mounted on the line.

  In order to satisfy these requirements, various electronic devices have been proposed (see, for example, Patent Document 1 and Patent Document 2).

  In particular, as described in the above-mentioned patent documents, in order to cope with a high breakdown voltage, in an electronic component, the element is covered with an exterior material such as a resin to increase the breakdown voltage, thereby improving durability, heat resistance and moisture resistance. It was broken.

  However, in this case, it is necessary to form the exterior material by using a mold or the like, and it is possible to adopt a configuration in which two formed exterior materials are bonded together and the lead terminal protrudes from the bonded surface. There were many. However, in such a form, the number of manufacturing steps is increased and the cost is often increased. In addition, since the terminal portion and the lead terminal protrude from the middle portion of the side surface of the exterior material, costs such as fine adjustment may be required.

  In order to cope with this, an electronic component manufactured by placing a terminal or lead terminal connected to an element in a frame and pouring resin into the frame and sealing it as an exterior material is produced. Proposed.

  FIG. 41 and FIG. 42 are side views of electronic parts in the prior art, which are shapes resulting from the above-described manufacturing method, and have the advantage of being manufactured at low cost.

  Reference numeral 100 denotes an electronic component, and reference numeral 101 denotes an element, which includes various types of capacitors (single plate capacitors, multilayer capacitors, etc.), resistors, coils, filters, and other electronic elements. 102 is an internal electrode when the element 101 is a multilayer capacitor, 103 is an external electrode, 104 is a lead terminal, and 105 is an exterior material. Note that the lead terminal 104 connected to the element 101 and projecting from the exterior material 105 is called a terminal part when directly connected to the element, and a terminal part directly connected to the element is called a lead terminal. However, they are not strictly distinguished but the same.

As is clear from FIG. 41, in the electronic component 100 in which the resin is poured into the frame and packaged in order to reduce the cost as described above, the lead terminal 104 is a corner (or or between the bottom surface and the side surface of the packaging material 105). The shape protrudes to the outside from substantially the vicinity thereof.
JP 2001-110691 A JP 2002-43170 A

  However, in the conventional electronic component shown in FIG. 41, since the terminal portion and the lead terminal 104 protrude from the corners of the bottom surface and the side surface of the exterior material 105, the exterior material 105, the lead terminal 104, etc. There was no play (margin) between the two, and there was a problem that the resistance to external vibration and impact after mounting was weak.

  Of course, since there is no response due to impact, the impact is concentrated on the outer packaging material 105 or the mounting solder part, etc., and there is a problem such as weak durability such as cracking or damage. there were.

  Further, as shown in FIG. 42, the lead terminals 104 projecting to the outside are likely to be warped and bent, and there are problems that mounting on the board becomes difficult and mounting reliability is lowered.

  Further, in order to manufacture at low cost, the element 101 connected with the lead terminal 104 is placed in a mold, and molten resin is poured into the mold to mold it. In such a manufacturing method, it is necessary to place the protruding lead terminal 104 in an upward state, that is, in a state where the lead terminal 104 is turned upside down, and to pour resin or the like. For this reason, it is difficult to protrude the lead terminal 104 from the side surface. Alternatively, in order to allow play (margin) between the projecting lead terminal 104 and the exterior member 105 by projecting from the side surface, it is necessary to bend the lead terminal 104 in advance in a complicated manner. There are also problems that adjustment is complicated and cost cannot be reduced.

  As described above, in the conventional technique in which the resin is poured into the element 101 and the lead terminal 104 arranged in the frame of the electronic component, it is not necessary to reduce man-hours or make subsequent fine adjustments. In addition, it is possible to reduce the cost, but the lead terminal deflection becomes weak, durability and impact resistance are reduced, mounting reliability and shape retention during transportation are reduced. There were problems such as. For this reason, there has been a problem of insufficient electronic components in practical use.

  The present invention is an electronic component having an element, a pair of terminal portions provided on the element, a part of the terminal portion, and an exterior material that covers the element, and is inclined at a corner between the bottom surface and the side surface of the exterior material A portion is provided, and the terminal portion protrudes from a corner portion where the inclined portion and the bottom surface of the exterior material intersect.

  The present invention can realize an electronic component with improved pressure resistance, impact resistance, durability, and moisture resistance by sealing an element with an exterior material.

  In addition, the terminal part and the lead terminal project from the bottom surface of the exterior material, so that there is play and allowance between the exterior material and the terminal part (lead terminal), which can improve the deflection resistance after mounting. it can.

  In particular, a sloped portion that is cut off is provided at the corner between the bottom and side surfaces of the exterior material, and lead terminals (terminals) are formed from the corner where the slope and the bottom intersect, or from the recess provided on the bottom. Part) protrudes, and the lead terminal (terminal part) protrudes from the position inside the imaginary plane created by the side of the exterior material, so play (between the exterior material and the lead terminal (terminal part)) Margin) occurs. As a result, durability and deflection resistance against vibration and impact are improved.

  At this time, in particular, the protruding terminal portion and lead terminal once protrude downward, and then bent into a substantially L-shape to form a mounting surface, so that there is further play between the exterior material and the lead terminal (terminal portion). The (margin) is increased and the deflection resistance is further improved.

  In particular, at this time, the manufacturing process is almost the same as the conventional process, so that the low-cost manufacturing that is a conventional merit is maintained.

  In addition, a curved portion (curved curved surface or protruding portion), a wavy surface, or a bent portion is appropriately formed as a flexure absorbing portion on the terminal portion or the lead terminal, thereby providing further sufficient bending resistance. It can be used as an electronic component. In particular, the curved surface can be formed either before or after being molded with the exterior material, so that the manufacturing process is easy and requires extra labor and strict procedures. It is unnecessary and can reliably maintain a low cost.

  In addition, while maintaining the same low cost as in the manufacture of electronic components, the thickness of the terminal part or lead terminal protruding outside the exterior material is increased or decreased, or the thickness is gradually changed. By using a shape such as a bend, it is possible to prevent bending or warping due to impact to the terminal part protruding to the outside or the lead terminal during transportation or mounting, and to make the electronic component strong in impact resistance etc. it can.

  In addition, the same structure makes it more resistant to deflection between the mounting surface after mounting and prevents the occurrence of cracks in the exterior material and solder surface due to external impact, external heat, humidity, etc. Thus, an electronic component having high impact resistance, heat resistance, durability, and moisture resistance can be realized while maintaining low cost.

  Furthermore, by providing a reinforcing material or bottom surface reinforcing material in any part of the exterior material or lead terminal (terminal part), it prevents the impact on the impact caused by the terminal part or lead terminal protruding outside. It is possible to provide an electronic component that is strong in impact resistance and durability.

  In addition, downsizing of electronic parts is realized, and downsizing of electronic devices is also realized.

  The element sealed in the exterior material may be anything such as a capacitor (single plate, laminated type), a resistor, an inductor, or a filter, and is particularly suitable for a device that requires a high breakdown voltage.

  Further, the inclined portion is an inclined surface provided such that a corner portion of the exterior material is cut off obliquely, and has a surface where arbitrary positions of the side surface and the bottom surface of the exterior material are connected. The exterior material may be cut off later, or a mold or the like for forming the exterior material may have a shape that forms an inclined surface from the beginning.

The invention according to claim 1 of the present invention is an electronic component including an element, a pair of terminal portions provided on the element, a part of the terminal portion, and an exterior material that covers the element. An electronic component that protrudes from the bottom surface of the material and has a distance of 0.1 mm or more between the bottom surface and the side surface of the exterior material, and can be manufactured at low cost, but is simple The structure can improve the flexibility of the terminal, and as a result, the durability and impact resistance of the exterior material, the terminal, and the mounting portion can be improved, and the life of the electronic component can be extended.

  The invention according to claim 2 of the present invention is an electronic component having an element, a pair of terminal portions provided on the element, a part of the terminal portion, and an exterior material covering the element, and a bottom surface of the exterior material; An electronic part characterized in that an inclined part is provided at the corner with the side surface, and the terminal part protrudes from the corner where the inclined part and the bottom of the exterior material intersect, and can be manufactured at low cost. However, with a simple structure, it is possible to secure play between the terminal part and the exterior material and improve the terminal's deflection resistance. As a result, durability and impact resistance of the exterior material, terminal, mounting part, etc. The life of electronic parts can be extended.

  The invention according to claim 3 of the present invention is characterized in that the inclined portion is an inclined portion having a shape provided such that corner portions between the bottom surface and the side surface of the exterior material are cut off. The electronic component as described above can be manufactured at low cost, but can secure play between the terminal portion and the exterior material with a simple configuration, and can improve the bending resistance of the terminal portion. As a result, it is possible to improve the durability and impact resistance of exterior materials, terminals, mounting parts, etc., and realize a long life of electronic components.

  In the invention according to claim 4 of the present invention, the inclined portion is formed by a surface connecting an arbitrary position in the middle of the side surface and an arbitrary position in the middle of the bottom surface at the corner between the side surface and the bottom surface of the exterior material. The electronic component according to any one of claims 2 to 3, which can be manufactured at a low cost, while ensuring play between the terminal portion and the exterior material with a simple configuration, The bending resistance of the terminal portion can be improved, and as a result, the durability and impact resistance of the exterior material, the terminal, the mounting portion, etc. can be improved, and the life of the electronic component can be extended.

  The invention according to claim 5 of the present invention is the electronic component according to any one of claims 2 to 4, wherein the inclined portion is an arcuate curved surface. Material damage can also be prevented.

  In the invention according to claim 6 of the present invention, the terminal portion protruding from the intersecting corner portion of the inclined portion and the bottom surface of the exterior member protrudes below the protruding bottom surface, and is bent in an approximately L shape. The electronic component according to any one of claims 2 to 5, wherein the electronic component can sufficiently cope with vibration and impact not only in a horizontal direction but also in a vertical direction with respect to a mounting plane. Flexibility can be realized.

  The invention described in claim 7 of the present invention is characterized in that the terminal portion protruding from the corner portion where the inclined portion and the bottom surface of the exterior material intersect protrudes substantially parallel to the bottom surface of the exterior material. 2. The electronic component according to any one of 2 to 5, wherein the deflection resistance with respect to the mounting plane is improved, and the distance between the electronic component and the mounting substrate is further reduced to improve the impact resistance.

  The invention according to claim 8 of the present invention is the electronic part according to claim 7, characterized in that the terminal portion protruding substantially parallel to the exterior material is not connected to the exterior material. This improves the resistance to flat surfaces and further reduces the distance between the electronic component and the mounting board to improve the impact resistance.

The invention according to claim 9 of the present invention is an electronic component having an element, a pair of terminal portions provided on the element, a part of the terminal portion, and an exterior material covering the element. An electronic component characterized in that a plurality of indentations are provided at any location and the terminal portion protrudes from the indentation portion, and the terminal portion can be manufactured at a low cost but with a simple configuration. The playability of the outer and outer packaging materials can be ensured, and the terminal's flex resistance can be improved. As a result, the durability and impact resistance of the outer packaging materials, terminals, and mounting parts are improved, resulting in a long life of the electronic component. Can be realized.

  The invention according to claim 10 of the present invention is characterized in that the indented portion is a cut portion formed after covering a part of the element and the terminal portion with an exterior material. It is an electronic part, Comprising: A dent part can be formed easily.

  The invention according to claim 11 of the present invention is characterized in that the protruding terminal portion protrudes below the protruding bottom surface and is bent in a substantially L shape. In any one of the electronic components described above, it is possible to realize flexural resistance that can sufficiently cope with vibration and impact in the vertical direction as well as in the horizontal direction with respect to the mounting plane.

  In the invention according to claim 12 of the present invention, the distance between the inclined portion where the terminal portion projects and the bottom surface of the exterior material, and the side where the extended surfaces of the side surface and the bottom surface of the exterior material intersect each other is The electronic component according to any one of claims 2 to 8, wherein the electronic component is 0.1 mm or more, and sufficient deflection resistance can be ensured.

  The invention according to claim 13 of the present invention is characterized in that the distance between the protruding dent portion of the terminal portion and the side where the extended surfaces of the side surface and the bottom surface of the exterior material intersect is 0.1 mm or more. It is an electronic component of any one of Claims 9-11, Comprising: Sufficient deflection resistance is securable.

  The invention according to claim 14 of the present invention is the electronic component according to any one of claims 1 to 13, characterized in that the thickness of the protruding terminal portion increases toward the tip. It is possible to improve the impact resistance and the durability against the impact applied to the tip of the metal.

  The invention according to claim 15 of the present invention is the electronic component according to any one of claims 1 to 13, characterized in that the protruding terminal portion becomes thinner toward the tip. The part can be made elastic, and the terminal itself has the bending resistance, so that the bending resistance is further improved.

  The invention according to claim 16 of the present invention is characterized in that the terminal portion has a portion where the thickness outside the exterior material is thicker than the thickness inside the exterior material. It is an electronic component of description, Comprising: The impact resistance and durability of a terminal part can be improved.

  According to a seventeenth aspect of the present invention, a chamfer or an inclined portion is applied to at least a part of the corner portion other than the corner portion where the inclined portion or the dent portion is provided in the exterior material. The electronic component according to any one of claims 1 to 16, wherein the impact resistance, durability, and long life of the exterior material can be realized.

  The invention according to claim 18 of the present invention is the electronic component according to any one of claims 1 to 17, characterized in that a reinforcing material is provided at any position on the non-mounting surface of the terminal portion. It is possible to improve the impact resistance and durability of the terminal portion.

  According to a nineteenth aspect of the present invention, in the electronic component according to the eighteenth aspect, the reinforcing material is a non-mounting surface of the terminal portion and is formed in a peripheral shape. It is possible to improve the impact resistance and durability of the terminal portion.

The invention according to claim 20 of the present invention is the electronic component according to any one of claims 1 to 19, wherein the element is a single plate capacitor having an electrode connected to the dielectric substrate and the terminal portion. Thus, a high withstand voltage surface mount capacitor can be realized.

  According to a twenty-first aspect of the present invention, the element is a multilayer capacitor having a dielectric substrate in which internal electrodes are embedded and a pair of terminal portions provided on the dielectric substrate. The electronic component according to any one of Items 1 to 20, wherein a surface-mounted capacitor having a high capacity and a high withstand voltage can be realized.

  According to a twenty-second aspect of the present invention, in the multilayer capacitor, the internal electrode is an electrode mainly composed of nickel, and the dielectric substrate is a reduction-resistant material. 21. The electronic component according to any one of 21 to 21, wherein a low-cost multilayer capacitor can be realized.

  The invention according to claim 23 of the present invention is an electron according to any one of claims 1 to 22, wherein the element is an element in which a plurality of pairs of terminal portions are provided on a single substrate. It is a component, and a composite element can be easily realized.

  The invention according to claim 24 of the present invention is the electronic component according to any one of claims 1 to 23, wherein a plurality of elements are sealed inside the exterior material, and the composite element can be easily obtained. This can save the labor and cost of mounting.

  According to a twenty-fifth aspect of the present invention, in the electronic component according to any one of the first to twenty-fourth aspects, a deflection absorbing portion is provided at any position of the protruding terminal portion. In addition to the bending resistance due to the protruding form of the terminal portion, the bending resistance can be further improved.

  The invention according to claim 26 of the present invention is the arcuate curved surface portion, the corrugated surface, the bent portion, or a combination thereof, in which the deflection absorbing portion is provided at any position of the terminal portion. 26. The electronic component according to claim 25, wherein the bending resistance can be further improved in addition to the bending resistance due to the protruding form of the terminal portion.

  According to a twenty-seventh aspect of the present invention, there is provided a dielectric substrate having an internal electrode embedded therein, a plurality of multilayer capacitors having a pair of terminal portions provided on the dielectric substrate, and a pair of terminal portions. An electronic component having a pair of lead terminals, a part of the lead terminals, a multilayer capacitor, and an exterior material that covers the terminal portion, and an inclined portion is provided at a corner between the bottom surface and the side surface of the exterior material, However, it is an electronic component that protrudes from a corner where the inclined portion and the bottom surface of the exterior material intersect, and can be manufactured at a low cost, while the lead terminal and the exterior material can be easily configured. The play space (margin) can be secured and the flex resistance of the lead terminals can be improved. As a result, the durability and impact resistance of exterior materials, lead terminals, mounting parts, etc. are improved, and the length of the electronic component is increased. Life expectancy can be realized.

  According to a twenty-eighth aspect of the present invention, in the twenty-seventh aspect, the inclined portion is an inclined portion having a shape provided such that a corner portion between a bottom surface and a side surface of the exterior material is cut off. The electronic component as described above can be manufactured at low cost, and it has a simple structure to ensure a play space (margin) between the lead terminal and the exterior material, thereby improving the flex resistance of the lead terminal. As a result, it is possible to improve the durability and impact resistance of the exterior material, the lead terminal, the mounting portion, and the like, thereby realizing a long life of the electronic component.

In the invention according to claim 29 of the present invention, the inclined portion is formed by a surface connecting an arbitrary position in the middle of the side surface and an arbitrary position in the middle of the bottom surface at the corner between the side surface and the bottom surface of the exterior material. 29. The electronic component according to claim 27, wherein the electronic component can be manufactured at a low cost, and a play space (margin) between the lead terminal and the exterior material with a simple configuration. To ensure the flexibility of lead terminals and, as a result, improve the durability and impact resistance of exterior materials, lead terminals, mounting parts, etc., and realize longer life of electronic components. Can do.

  The invention according to claim 30 of the present invention is the electronic component according to any one of claims 27 to 29, characterized in that the inclined portion is an arcuate curved surface, in addition to the bending resistance. In addition, damage to the exterior material can be prevented.

  In the invention according to claim 31 of the present invention, the lead terminal protruding from the corner where the inclined portion and the bottom surface of the exterior material intersect is protruded below the protruding bottom surface, and then bent into a substantially L shape. 31. The electronic component according to claim 27, wherein the electronic component can sufficiently cope with vibrations and impacts in a vertical direction as well as in a horizontal direction with respect to a mounting plane. Flexibility can be realized.

  According to a thirty-second aspect of the present invention, the lead terminal protruding from a corner portion where the inclined portion and the bottom surface of the exterior material intersect protrudes substantially parallel to the bottom surface of the exterior material. 27. The electronic component according to any one of 27 to 30, wherein the deflection resistance with respect to the mounting plane is improved, and the distance between the electronic component and the mounting substrate is further reduced to improve the impact resistance.

  According to a thirty-third aspect of the present invention, in the electronic component according to the thirty-second aspect, the lead terminal protruding substantially parallel to the outer packaging material is not connected to the outer packaging material. This improves the resistance to flat surfaces and further reduces the distance between the electronic component and the mounting board to improve the impact resistance.

  According to a thirty-fourth aspect of the present invention, there is provided a dielectric substrate having an internal electrode embedded therein, a plurality of multilayer capacitors having a pair of terminal portions provided on the dielectric substrate, and a pair of terminal portions. An electronic component having a pair of lead terminals, a part of the lead terminals, a multilayer capacitor, and an exterior material that covers the terminal portion, wherein a plurality of indentations are provided at arbitrary locations on the bottom surface of the exterior material. However, it is an electronic component characterized by protruding from the indented part, and it can be manufactured at a low cost, while ensuring a play space (margin) between the lead terminal and the exterior material with a simple configuration. Thus, the bending resistance of the lead terminal can be improved, and as a result, the durability and impact resistance of the exterior material, the lead terminal, the mounting portion, etc. can be improved, and the life of the electronic component can be extended.

  According to a thirty-fifth aspect of the present invention, the indented portion is a cut portion formed after a part of the element and the lead terminal is covered with an exterior material. It is an electronic part, Comprising: A dent part can be formed easily.

  The invention according to claim 36 of the present invention is characterized in that the protruding lead terminal protrudes below the protruding bottom surface and is bent in an approximately L shape. In any one of the electronic components described above, it is possible to realize flexural resistance that can sufficiently cope with vibration and impact in the vertical direction as well as in the horizontal direction with respect to the mounting plane.

  According to the thirty-seventh aspect of the present invention, there is provided a distance between a corner portion between the inclined portion and the bottom surface of the exterior material, and a side where the extended surfaces of the side surface and the bottom surface of the exterior material intersect with each other. The electronic component according to any one of claims 27 to 36, wherein the deflection resistance can be further improved.

According to a thirty-eighth aspect of the present invention, the distance between the protruding dent portion of the lead terminal and the side where the extension surfaces of the side surface and the bottom surface of the exterior material intersect is 0.1 mm or more. The electronic component according to any one of claims 34 to 37, wherein the deflection resistance can be further improved.

  The invention according to claim 39 of the present invention is the electronic component according to any one of claims 27 to 38, wherein the protruding lead terminal increases in thickness toward the tip. The impact resistance and durability of the lead terminal can be improved.

  The invention according to claim 40 of the present invention is the electronic component according to any one of claims 27 to 38, wherein the thickness of the protruding lead terminal decreases toward the tip. The terminal has elasticity, and the lead terminal itself has flexibility, and the deflection resistance due to the protruding structure of the lead terminal is taken into account, thereby improving the flexibility.

  The invention according to claim 41 of the present invention is characterized in that the lead terminal has a portion where the thickness outside the exterior material is thicker than the thickness inside the exterior material. 1. The electronic component according to 1, wherein the impact resistance and durability of the lead terminal are improved.

  According to the invention of claim 42 of the present invention, in the exterior material, chamfering is applied to at least some corners of the corner other than the corner provided with the inclined portion or the dent. 42. The electronic component according to any one of claims 27 to 41, which can prevent damage to an exterior material and improve durability and the like.

  The invention according to claim 43 of the present invention is the electronic component according to any one of claims 27 to 42, wherein a reinforcing material is provided at any position on the non-mounting surface of the lead terminal. It is intended to improve the impact resistance and durability of the lead terminal.

  The invention according to claim 44 of the present invention is the electronic component according to claim 43, characterized in that the reinforcing material is a non-mounting surface of the lead terminal and is formed in a peripheral shape thereof. It is intended to improve the impact resistance and durability of the lead terminal.

  According to a forty-fifth aspect of the present invention, in the multilayer capacitor, the internal electrode is an electrode mainly composed of nickel, and the dielectric substrate is a reduction resistant material. The electronic component according to any one of 1 to 44, which is a low-cost multilayer capacitor and can realize a high withstand voltage capacitor by surface mounting.

  The invention according to claim 46 of the present invention is the element according to any one of claims 27 to 45, wherein the element is an element in which a plurality of pairs of terminal portions are provided on a single substrate. Therefore, a composite element can be easily realized.

  The invention according to claim 47 of the present invention is the electronic component according to any one of claims 27 to 46, wherein a plurality of elements are sealed inside the exterior material, and the composite element can be easily obtained. And can save the labor and cost of mounting.

  The electronic component according to any one of claims 27 to 47, wherein the deflection absorbing portion is provided at any position of the protruding lead terminal. And in addition to the bending resistance by the protrusion form of a terminal part, it becomes possible to improve a bending resistance further.

The invention according to claim 49 of the present invention is the arcuate curved surface portion, the wavy surface, the bent portion, or a combination thereof, wherein the deflection absorbing portion is provided at any position of the lead terminal. 49. The electronic component according to claim 48, wherein the bending resistance can be further improved in addition to the bending resistance due to the protruding form of the terminal portion.

  According to a 50th aspect of the present invention, the exterior material is a substantially rectangular parallelepiped or a substantially cubic body, and an inclined portion is provided at a corner between the bottom surface and the side surface. 49. The electronic component according to any one of -49, wherein a free space (margin) between the lead terminal and the exterior material can be secured with a simple configuration while being manufactured at a low cost. As a result, it is possible to improve the durability and impact resistance of exterior materials, lead terminals, mounting parts, and the like, and to extend the life of electronic components.

  In this specification, a multilayer capacitor is described as an example of an element. However, the present invention is not limited to this, and various elements such as a normal single plate capacitor, a resistor, an inductor, and a filter that are not a multilayer capacitor are used. But the same is true.

  In addition, the terminal part and the lead terminal are described as the terminal part when connected directly to the element, the terminal part directly connected to the element, and the terminal further connected as the lead terminal. It is not something that is, but the same thing.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 18, 19, 20, 21. 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 38, 39, and 40 are implemented according to the present invention. 14, 15, 16, 17, 34, 35, 36, and 37 are top views of the electronic component according to the embodiment of the present invention.

  1 to 20, terminals are connected to various electronic elements such as capacitors (single plate, laminated type, electrolysis, etc.), resistors, inductors, filters, ICs, etc. A structure in which a part of the projection protrudes outside the exterior material and various reinforcing materials are provided is shown.

  On the other hand, in FIGS. 21 to 40, as an internal element, a multilayer capacitor is mainly shown as an example of the element, a terminal portion is connected to the multilayer capacitor, and a pair of lead terminals are connected to the terminal portion. A structure in which a part of the lead terminal protrudes to the outside and is provided with various reinforcing materials is molded with an exterior material. The structure shown in FIGS. 1 to 20 and the structure shown in FIGS. 21 to 40 are almost the same except that the element is a multilayer capacitor and lead terminals are connected. In the following, the description will be repeated as necessary, and will be omitted when there is much overlap.

  DESCRIPTION OF SYMBOLS 1 is an electronic component, 2 is an element, 3 is an electrode, 4 is a terminal part, 5 is an exterior material, 6 is a multilayer capacitor, 7 is an internal electrode, 8 is a lead terminal, 9 is a bottom surface, 10 is an inclined part, 11 is Crossing corner portion, 12 is a recessed portion, 15 is a curved portion, 16 is a bent portion, 17 is a corrugated surface, and 30 is a distance. ing.

  First, for each figure, the characteristics and effects of the structure shown in each figure in the structure of the electronic component 1 will be briefly described.

FIG. 1 shows a structure in which the terminal portion 4 protrudes from the bottom surface 9 and the distance 30 between the protruding position and the corner portion between the bottom surface and the side surface of the exterior material 5 is 0.1 mm or more. Yes. With such a structure, play (margin) occurs between the terminal portion 4 projecting from the exterior material 5 and the exterior material 5, and the flex resistance is improved.

  FIG. 2 shows a structure in which an inclined portion 10 is provided at a corner portion between the bottom surface 9 and the side surface of the exterior material 5 and the terminal portion 4 protrudes from a corner portion where the inclined portion 10 and the bottom surface 9 intersect. ing. In particular, it has a structure that once protrudes downward and can be surface-mounted by being bent into a substantially L-shape. With such a structure, the terminal portion 4 protrudes from the most protruding portion of the bottom surface 9, and the distance between the terminal portion 4 protruding outside and the corner portion between the bottom surface 9 and the side surface of the exterior material 5 is set. As a result, a very large play (margin) is generated, and the deflection resistance is improved.

  FIG. 3 shows a case where the terminal portion 4 protrudes from a corner portion where the inclined portion 10 and the bottom surface 9 intersect as in FIG. 2, but after the terminal portion 4 protrudes, along the bottom surface 9. A structure extending in a different shape is shown. That is, the terminal portion 4 is substantially parallel to the bottom surface 9 of the exterior material 5. In this case as well, play (margin) occurs, and the flex resistance is improved, which is easier to manufacture than in the case of FIG.

  FIG. 4 shows a case where the inclined portion 10 is an arc surface. The circular arc surface has the merit of becoming an electronic component having high durability against impact. Similarly to the case of FIG. 2, the protruding terminal portion 4 protrudes downward, and then is bent into a substantially L shape to form a terminal portion 4 having a structure that can be surface mounted.

  FIG. 5 shows a structure in which the inclined portion 10 is an arc surface as in FIG. 4, and further along the bottom surface 9 of the exterior member 5 after the terminal portion 4 protrudes as in FIG. 3. A stretched (substantially parallel) structure is shown.

  FIG. 6 is the same as FIG. 3, but the terminal portion 4 protrudes from the inner side of the corner portion where the inclined portion 10 and the bottom surface 9 intersect and extends along the bottom surface 9 of the exterior material 5. The structure is shown. In this case, the play (margin) between the terminal portion 4 and the exterior material 5 is further increased, and the deflection resistance is sufficiently improved.

  FIG. 7 shows a structure in which the terminal portion 4 protrudes from a recessed portion 12 provided on the bottom surface 9. Further, as the indentation portion 12, a substantially rectangular cut is provided.

  FIG. 8 shows a structure in which the terminal portion 4 similarly protrudes from the dent portion 12 and the dent portion 12 is a triangular cut portion. In either case of FIG. 7 and FIG. 8, the play between the terminal portion 4 and the exterior material 5 occurs by projecting from the indented portion 12, and the flex resistance is improved. Moreover, the structure which is extended | stretched along the substantially parallel to the bottom face 9 is shown after all protruding.

  FIG. 9 also shows a structure in which the terminal portion 4 protrudes from the indented portion 12, and after the protruding terminal portion 4 protrudes downward, it can be bent into a substantially L shape in the middle and can be surface mounted. Has been. In this case, the play (margin) between the terminal portion 4 and the exterior material 5 becomes very large, and the flex resistance becomes very large.

  FIG. 10 shows a structure in which the protruding terminal portion 4 increases in thickness as it goes to the tip. With such a structure, it is possible to realize flex resistance while securing resistance to impact such as impact that is applied to the tip of the terminal portion 4, that is, impact resistance and durability.

  FIG. 11 shows a structure in which the protruding terminal portion 4 becomes thinner as it goes to the tip. With such a structure, the elasticity of the terminal portion 4 is increased, and the deflection resistance is further improved.

  FIG. 12 shows a structure in which a portion thicker than the thickness inside the exterior material 5 in the terminal portion 4 exists outside the exterior material. With such a structure, it is possible to improve the impact resistance of the terminal portion 4 that is exposed to the outside.

  FIG. 13 shows a structure in which chamfering is performed at corners other than the projecting corners of the terminal portion 4 of the exterior member 5. With such a structure, the impact resistance of the exterior member 5 is increased, and damage such as generation of cracks can be prevented.

  14 and 15 show a structure in which the reinforcing member 20 is provided on the non-mounting surface of the terminal portion 4. Such a structure improves the impact resistance of the terminal portion 4 in addition to improving the flex resistance. FIG. 14 shows a structure in which a reinforcing material 20 is formed at a substantially central portion of the terminal portion 4, and FIG. 15 shows a structure in which the reinforcing material 20 is formed at an outer edge portion of the terminal portion 4.

  FIG. 16 shows an element 2 in which a plurality of pairs of terminal portions 4 are provided on a single base, and a composite element can be easily formed on a single base.

  FIG. 17 shows a structure in which a plurality of elements 2 are sealed in one exterior material 5, and similarly, a composite element can be easily formed with a single electronic component, further saving the labor of mounting. It is.

  FIG. 18 shows a structure in which the terminal portion 4 is provided with a curved surface portion 15 as a deflection absorbing portion.

  FIG. 19 similarly shows a structure in which the terminal portion 4 is provided with a bent portion 16 as a flexure absorbing portion.

  FIG. 20 shows a structure in which a wavy surface 17 is provided as a deflection absorbing portion.

  The deflection absorbing portion as shown in FIGS. 18 to 20 can improve the bending resistance against the deflection caused by vibration or impact on the terminal portion 4.

  FIG. 21 shows a structure in which the lead terminal 8 protrudes from the bottom surface 9 and the distance 30 between the protruding position and the corner between the bottom surface and the side surface of the exterior material 5 is 0.1 mm or more. Yes. With such a structure, play (margin) occurs between the lead terminal 8 projecting from the exterior material 5 and the exterior material 5, and the flex resistance is improved.

  FIG. 22 shows a structure in which an inclined portion 10 is provided at a corner portion between the bottom surface 9 and the side surface of the exterior member 5 and the lead terminal 8 protrudes from a corner portion where the inclined portion 10 and the bottom surface 9 intersect. ing. In particular, it has a structure that once protrudes downward and can be surface-mounted by being bent into a substantially L-shape. With such a structure, the lead terminal 8 protrudes from the most protruding portion of the bottom surface 9, and the distance between the lead terminal 8 protruding outside and the corner between the bottom surface 9 and the side surface of the exterior member 5 is set. As a result, a very large play (margin) is generated, and the deflection resistance is improved.

FIG. 23 shows the case where the lead terminal 8 protrudes from the corner where the inclined portion 10 and the bottom surface 9 intersect as in FIG. 22, but after the lead terminal 8 protrudes, along the bottom surface 9. A structure extending in a different shape is shown. That is, the lead terminal 8 is substantially parallel to the bottom surface 9 of the exterior material 5. In this case as well, play (margin) occurs, and the flex resistance is improved, which is easier to manufacture than in the case of FIG.

  FIG. 24 shows a case where the inclined portion 10 is an arc surface. The circular arc surface has the merit of becoming an electronic component having high durability against impact. Similarly to the case of FIG. 22, the protruding lead terminal 8 is formed in a structure that can be surface mounted by protruding downward and then bent into a substantially L shape.

  FIG. 25 shows a structure in which the inclined portion 10 is an arc surface as in FIG. 24, and further along the bottom surface 9 of the exterior member 5 after the lead terminal 8 protrudes as in FIG. 23. A stretched (substantially parallel) structure is shown.

  26 is the same as FIG. 23, but the lead terminal 8 protrudes from the inner side of the corner portion where the inclined portion 10 and the bottom surface 9 intersect and extends along the bottom surface 9 of the exterior material 5. The structure is shown. In this case, the play (margin) between the lead terminal 8 and the exterior member 5 is further increased, and the deflection resistance is sufficiently improved.

  FIG. 27 shows a structure in which the lead terminal 8 protrudes from a recess 12 provided on the bottom surface 9. Further, as the indentation portion 12, a substantially rectangular cut is provided.

  FIG. 28 shows a case where the lead terminal 8 similarly protrudes from the recess 12 and the recess 12 is a triangular cutout. In either case of FIG. 27 and FIG. 28, protrusion between the lead terminal 8 and the exterior member 5 is caused by projecting from the indented portion 12, and the deflection resistance is improved. Moreover, the structure which is extended | stretched along the substantially parallel to the bottom face 9 is shown after all protruding.

  FIG. 29 also shows a structure in which the lead terminal 8 protrudes from the indented portion 12 and can be surface-mounted by being bent into a substantially L shape in the middle after the protruding lead terminal 8 protrudes downward. Has been. In this case, the play (margin) between the lead terminal 8 and the exterior member 5 becomes very large, and the flex resistance becomes very large.

  FIG. 30 shows a structure in which the protruding lead terminal 8 increases in thickness toward the tip. With such a structure, it is possible to realize resistance to bending while ensuring resistance to stress such as impact that is applied to the tip of the lead terminal 8, that is, resistance to impact and durability.

  FIG. 31 shows a structure in which the protruding lead terminal 8 decreases in thickness toward the tip. With such a structure, the elasticity of the lead terminal 8 is increased, and the deflection resistance is further improved.

  FIG. 32 shows a structure in which the lead terminal 8 has a portion thicker than the thickness inside the exterior material 5 outside the exterior material 5. With such a structure, it is possible to improve the impact resistance of the lead terminals 8 that are exposed to the outside.

  FIG. 33 shows a structure in which chamfering is performed at a corner other than the protruding corner of the lead terminal 8 of the exterior member 5. With such a structure, the impact resistance of the exterior member 5 is increased, and damage such as generation of cracks can be prevented.

34 and 35 show a structure in which the reinforcing material 20 is provided on the non-mounting surface of the lead terminal 8. Such a structure improves the impact resistance of the lead terminal 8 in addition to improving the flex resistance. FIG. 34 shows a structure in which the reinforcing material 20 is formed at substantially the center of the lead terminal 8, and FIG. 35 shows a structure in which the reinforcing material 20 is formed at the outer edge of the lead terminal 8.

  FIG. 36 shows a multilayer capacitor 6 in which a plurality of pairs of terminal portions 4 are provided on a single base, and a composite element can be easily formed on a single base.

  FIG. 37 shows a structure in which a plurality of multilayer capacitors 6 are sealed in one exterior material 5. Similarly, a composite element can be easily formed with one electronic component, and the mounting effort is further reduced. It is something to omit.

  FIG. 38 shows a structure in which the lead terminal 8 is provided with a curved surface portion 15 as a deflection absorbing portion.

  Similarly, FIG. 39 shows a structure in which a bent portion 16 as a flexure absorbing portion is provided on the lead terminal 8.

  FIG. 40 shows a structure in which a waved surface 17 is provided as a deflection absorbing portion.

  The flexure absorbing portion as shown in FIGS. 38 to 40 can improve the flex resistance against the flexure caused by the vibration or impact to the lead terminal 8.

  The above is an outline of the structure of each drawing and the points thereof.

  As shown in FIGS. 1 to 14, in order to project the terminal portion 4 from the bottom surface 9 of the exterior member 5, after connecting the electrode 3 to the element 2, the terminal portion 4 is connected to the electrode 3. If it is properly folded, it is placed upside down on the mold, and molten resin is poured into the mold, so that the resin pouring is finished before the bent portion of the terminal part 4 is finished. The terminal part 4 can be protruded from the bottom surface 9.

  This is the same even in the case of the multilayer capacitor 6 and the lead terminal 8 as shown in FIGS. 20 to 34, and can be easily realized by mold-type casting resin sealing that can be manufactured at low cost.

  Next, the detail of each part is demonstrated.

  Reference numeral 1 denotes an electronic component. As shown in FIG. 1 and the like, a capacitor, a resistor, an inductor, a filter, and other electronic elements are molded with an exterior material such as a resin, and are molded with the exterior material. As a result, it is an electronic component that has improved durability, moisture resistance, and impact resistance, and can withstand high pressure resistance.

  Next, the element 2 will be described.

  2 is an element. As described above, the element 2 may be any of a capacitor, a resistor, an inductor, a filter, an IC, and other electronic elements. The capacitor may be a single plate capacitor or a multilayer capacitor. Any capacitor such as an electrolytic capacitor may be used. FIG. 1 shows a single plate capacitor, and FIG. 2 shows a multilayer capacitor.

  Note that a single element 2 (or multilayer capacitor 6) may be sealed with the exterior material 5, and a plurality may be sealed with the exterior material 5.

  Alternatively, a pair of electrodes 3 may be provided on a single substrate to function as a single electronic device, or a plurality of pairs of electrodes 3 may be provided on a single substrate to provide a plurality of electronic devices. It may have a function as.

  A form in which a plurality of elements 2 (or multilayer capacitors 6) are sealed is shown in FIGS.

  Next, the electrode 3 will be described.

  The electrodes 3 are a pair of conductive members provided at both ends of the element 2 (or the multilayer capacitor 6), and are electrically connected to an external mounting substrate through the terminal portion 4, the lead terminal 8, and the like. (Or the multilayer capacitor 6). The electrodes 3 are usually provided as a pair at both ends of the element 2 (or the multilayer capacitor 6), but may be provided at an intermediate portion of the element 2 (or the multilayer capacitor 6), not at both ends. It is. Alternatively, not the side surface of the element 2 (or the multilayer capacitor 6), it may be provided on the upper and lower surfaces, or may be provided on the side surface and the front surface of the upper and lower surfaces, and only a part thereof. It may be provided or may be provided so as to protrude from the other surface.

  Examples of the material of the electrode 3 include a metal material containing at least one of Ni, Ag, Pd, Cu, Au, and the like. In particular, using Ni alone or an Ni alloy is advantageous in terms of cost. Moreover, these alloys and the thing by which the plating process was given to the surface may be used. Of course, an alloy or the like may be used as long as it is realized by any one of single layer and multilayer plating, vapor deposition, sputtering, and paste application.

  Next, the terminal part 4 will be described.

  The terminal portions 4 are connected to the electrodes 3 and are provided as a pair on the element 2 (or the multilayer capacitor 6). Usually, it is often provided at both ends, but may be provided at both ends. For example, when the electrode 3 is provided on the upper and lower surfaces, the electrode 3 and the terminal portion 4 formed on the upper and lower surfaces may be connected. The terminal portion 4 is made of a material containing at least one of Cu, Zn, Ni, Ag, Au, etc., and the surface thereof may be subjected to single layer or multilayer plating.

  Further, the terminal portion 4 may be configured by joining a metal cap to the element 2. Furthermore, it is preferable that the outermost part (outermost part) of the terminal part 4 is made of a conductive material having a melting point of 200 degrees or more. With this structure, even if a high temperature is applied to the electronic component by reflow or the like, the terminal The portion 4 is not thermally damaged and stable reflow characteristics can be obtained.

  The terminal portion 4 is connected to the electrode 3 and is formed so as to be appropriately lowered to protrude outside the exterior material 5.

  Further, the exterior material 5 described later is realized by placing the element 2 (or multilayer capacitor 6) with the terminal portion 4 (or lead terminal 8) connected in a frame and pouring molten resin into the frame. Therefore, the terminal part 4 protrudes from the bottom surface of the exterior material.

In other words, the terminal 2 is connected to the element 2 in a frame such as a mold, and the terminal 4 is fixed while being hooked on the mold. A structure in which the terminal portion 4 protrudes from the bottom surface can be easily realized by pouring molten resin or the like into the mold before the virtual plane created by the terminal portion 4.

  That is, the terminal portion 4 can be protruded from the bottom surface 9 in order to improve the deflection resistance while being very easy and low-cost as compared with costly manufacturing such as a transfer mold. It is.

  At this time, as shown in FIG. 1, the distance 30 between the position where the terminal portion 4 protrudes from the bottom surface 9 and the corner portion where the bottom surface 9 intersects the extended surface of the side surface is 0.1 mm or more. Compared to the case where the exterior material 5 protrudes from the bottom surface 9 and the corners of the side surface, a distance space is generated between the exterior material 5 and the terminal portion 4, and play (margin) is generated. This improves the resistance to shock and vibration. Furthermore, since the resistance to bending is improved, it is possible to prevent damage such as the occurrence of cracks in the outer packaging material 5 and the mounting solder, and the impact resistance is also improved.

  These are the same even when the lead terminal 8 protrudes as shown in FIG.

  Next, the exterior material 5 will be described.

  As shown in FIG. 1 and the like, the exterior material 5 is one of electronic elements such as a resistor and an inductor including the element 2 (or multilayer capacitor 6), and a terminal portion 4 (or lead terminal 8) connected thereto. The part is molded.

  As the material of the exterior material 5, an epoxy resin such as an optocresol novolac type, a biphenyl type, or a pentadiene type is suitably used.

  Further, the minimum value of the distance between the surface of the outer packaging material 5 and the surface of the element 2 (or the multilayer capacitor 6) (the thinnest portion of the outer packaging material 5) is set to 0.1 mm or more to improve the outer skin pressure resistance. be able to. Furthermore, the electronic component 1 strong against pressure | voltage resistance, moisture resistance, and heat resistance is realizable by setting it as a value beyond this.

  Further, by providing chamfering (R) at the corners of the exterior member 5, it is possible to improve the impact resistance from the outside. At this time, the corner is a straight corner or an arc corner.

  The shape of the exterior member 5 may be a general columnar shape, may be a substantially rectangular parallelepiped, may be a substantially cubic shape, may be a trapezoidal shape, or other polygonal column. However, from the viewpoint of cost, a substantially rectangular parallelepiped or a substantially cubic shape, or a trapezoidal shape having a slightly inclined side surface is preferable. In addition, there are unavoidable irregularities on the surface when the exterior material 5 is molded.

  If it is a substantially rectangular parallelepiped or the like, the bottom surface 9 and the side surface are generated, and the corner portion (which may be a perfect linear corner portion or an arc-shaped corner portion) is generated by these.

  Next, the multilayer capacitor 6 will be described.

  The multilayer capacitor 6 is formed by laminating a substrate made of a dielectric material with a plurality of sheets to form the internal electrode 7, and can have the same size and higher capacity than a single plate capacitor or the like.

The dielectric base is a base made of a dielectric, and a dielectric material such as titanium oxide or barium titanate is preferably used. Alternatively, alumina or the like is also used. Using such a material, it is appropriately formed in a necessary shape and size.

  The internal electrode 7 is an electrode embedded in the dielectric substrate, and examples of the constituent material of the internal electrode 7 include metal materials and alloys containing at least one of Ni, Ag, Pd, Cu, Au, and the like. . In particular, using Ni alone or an Ni alloy is advantageous in terms of cost. Moreover, these alloys and the thing by which the plating process was given to the surface may be used. Of course, an alloy or the like may be used. The internal electrode 7 has a thickness of 1 to 5 μm. Moreover, it is preferable that the space | interval of adjacent internal electrodes 7 shall be 15 micrometers or more.

  At this time, in particular, when a material mainly composed of Ni is used for the internal electrode 7 and a reduction-resistant material is used for the dielectric substrate serving as a laminated sheet, the multilayer capacitor 6 is realized at a very low cost. .

  The internal electrode 7 is electrically connected to the electrode 3. The internal electrode 7 connected to only one of the electrodes 3 and the internal electrode 7 connected to only the other of the electrodes 3 are opposed to each other. The main capacity is generated between the seven.

  Next, the terminal portion 4 is connected to the electrode 3. The terminal portion 4 is as described above. A pair of terminal portions 4 are connected to the electrodes 3, and a pair of lead terminals 8 are connected to the terminal portions 4.

The size of the multilayer capacitor 6 is as follows: when the length is L1, the height is L2, and the width is L3.
3.0mm ≦ L1 ≦ 5.5mm
0.5mm ≦ L2 ≦ 2.5mm
1.5mm ≦ L3 ≦ 3.5mm
Of course, the size may be other than this, and a plurality of multilayer capacitors 6 may be sealed by the outer packaging material 5 instead of a single size.

  If L1 to L3 are made smaller than the above lower limit value, the formation area of the internal electrodes 7 becomes insufficient, or the interval between the internal electrodes 7 becomes inevitably narrow, and the number of internal electrodes 7 must be reduced. It becomes difficult to obtain a large capacitance value and it becomes difficult to obtain an electronic component having a wide capacity.

  Further, when the multilayer capacitor 6 is molded with the exterior material 5, in order to prevent damage to the multilayer capacitor 6 due to impact, chamfering is provided at the corner of the multilayer capacitor 6 or an arc-shaped curve curve is formed. It is also preferable to provide a part or all of each side surface.

  It is also preferable to reduce the mounting cost and mounting effort by molding a plurality of multilayer capacitors 6 and mounting them on parallel signal lines as a composite element while being compact.

  Next, the lead terminal 8 will be described.

The lead terminals 8 are connected to the pair of terminal portions 4, pulled out of the exterior material 5, and mounted on the mounting board, thereby realizing electrical conduction between the internal element 2 and the multilayer capacitor 6 and the board. It is used as an electrical terminal to do this, and is formed as a pair. Depending on the number of multilayer capacitors 6 molded inside, a pair or more may be used, and the shape of the lead terminals 8 may be various, such as a rectangle, an ellipse, a square, and a line. Also suitable are chamfering, curve shapes, the formation of inclined portions, the formation of slits, and the like. Further, the size and width may be determined as appropriate according to the balance with the required mounting area, mounting strength, element size, and the like.

  The lead terminal 8 is formed of a conductor like the terminal portion 4 and is formed of various metals. It is made of a material containing at least one of Cu, Zn, Ni, Ag, Au and the like, and the surface thereof may be subjected to single layer or multilayer plating. An alloy may also be used.

  Further, the lead terminal 8 protrudes from the bottom surface of the outer packaging material 5 in the same manner as described for the terminal portion 4, and can be easily protruded from the bottom surface with low cost manufacturing to improve the bending resistance. It is something that can be done.

  At this time, as shown in FIG. 21, the distance between the position where the lead terminal 8 protrudes from the bottom surface 9 and the corner where the bottom surface 9 and the extended surface of the side surface cross each other is 0.1 mm or more. Compared to the case where the material 5 protrudes from the bottom surface 9 and the corners of the side surface, a distance space is created between the exterior material 5 and the lead terminal 8 and play (margin) is generated, so that the impact after mounting And the resistance to vibration is improved. Furthermore, since the resistance to bending is improved, it is possible to prevent damage such as the occurrence of cracks in the outer packaging material 5 and the mounting solder, and the impact resistance is also improved.

  Further, as will be described later, the protrusion from the bottom surface 9 has various forms.

  Next, the reinforcing material 20 will be described.

  The reinforcing material 20 is formed on the non-mounting surface of the terminal portion 4 or the lead terminal 8. For example, as shown in FIG. 14, it may be formed substantially at the center of the terminal portion 4, and may be formed along the peripheral edge of the terminal portion 4 as shown in FIG. 15. . In the former case, the impact resistance in the longitudinal direction, which is weak against stress, can be improved while being easy to form, and in the latter case, it is formed over the peripheral portion, so that the resistance of the terminal portion 4 is improved. It becomes possible to greatly improve the impact property. This is the same even in the case of the lead terminal 8 as shown in FIGS.

  In addition, the reinforcing material 20 may have other shapes, and may be formed at other positions.

  As the material of the reinforcing material 20, a resin, ceramic, or the like is used, and an epoxy resin or the like is preferably used as in the case of the exterior material 5. It is also preferable to use the same material as the exterior material 5. The reinforcing member 20 may be rod-shaped, columnar, or plate-shaped, and may be provided in a plural number instead of a single one.

  Further, the reinforcing member 20 may be formed only at the tip or the base of the terminal portion 4 or the lead terminal 8.

  By being formed at the tip, it is possible to reduce the influence at the tip of the terminal portion 4 and the lead terminal 8, which is most susceptible to stress due to an impact from the outside, and to improve impact resistance. Furthermore, by being provided at the tip portion, it becomes a weight at the tip portion, the press-contact force against the mounting substrate is increased, the mounting reliability is improved, particularly the durability against impacts is improved, and as a result, the terminal portion 4 ( Alternatively, there is an advantage that the bending resistance of the lead terminal 8) is also improved. When it is provided at the base, it is difficult for bending and the like to occur.

  Next, the curved surface portion 15, the bent portion 16, and the wavy surface 17 as the deflection absorbing portion will be described. The deflection absorbing portion is a portion that alleviates the influence of deflection caused by vibration or impact applied to the mounted electronic component 1.

  The curved surface portion 15 is a curved portion provided in the terminal portion 4 or the lead terminal 8, and this portion is not solder-mounted with the mounting substrate, and acts as a cushioning material, thereby being flexible. Is to improve.

  The bent portion 16 is the same, and its formation is easier than when the curved surface portion 15 is formed. In particular, by forming a substantially square shape, it can be easily formed, and, as with the curved surface portion 15, by using a buffer portion that is not solder-mounted, the flex resistance can be improved.

  The curved surface portion 15 and the bent portion 16 may be provided singly or plurally in the terminal portion 4 or the lead terminal 8, and may be provided at the root portion, the intermediate portion, or the tip portion. Even so, it may be provided at an arbitrary location.

  The wavy surface 17 is somewhat troublesome to form, but is most effective as a buffering part that absorbs deflection, and greatly improves the bending resistance. The corrugated surface 17 may be appropriately selected in relation to the mounting area (that is, mounting strength) with the terminal portion 4 or the lead terminal 8 to be mounted, and the size thereof may be determined. .

  Alternatively, the curved surface portion 15, the bent portion 16, the wavy surface 17, and the like may be appropriately combined according to specifications.

  Such a deflection absorbing portion may be provided as necessary, and further improves the improvement in deflection resistance due to the protrusion of the terminal portion 4 and the lead terminal 8, as will be described later.

  Next, the inclined portion 10 will be described. The inclined portion 10 is provided at a corner portion between the bottom surface 9 and the side surface of the exterior material 5 and has a shape such that the corner portion is cut off. That is, it is a portion having an inclination formed by a surface connecting an arbitrary point on the side surface and an arbitrary point on the bottom surface 9.

  The inclined portion 10 may be formed by cutting after the exterior material is solidified, or by forming the shape of the mold from the beginning, the inclined portion 10 that is inclined at the corner as shown in FIG. 2 is formed. can do. In particular, when the exterior material 5 is a rectangle such as a substantially rectangular parallelepiped or a substantially cube, the inclined portion 10 is formed with an inclination.

  Further, the inclined portion 10 may be a straight plane, but may be a circular arc surface as shown in FIG. 4 or FIG. 24, and irregularities or the like may inevitably occur on the surface.

  The effect of the combination of the inclined portion 10 and the protrusions of the terminal portion 4 and the lead terminal 8 will be described in detail later.

  Next, the dent part 12 will be described.

  The recessed portions 12 are provided at two arbitrary locations on the bottom surface 9 and serve as portions from which the terminal portions 4 or the lead terminals 8 protrude. The indentation 12 may be a triangular cutout as shown in FIGS. 8 and 28, or a substantially square or substantially hemispherical cutout as shown in FIGS. May be. These may be formed by processing the exterior material 5. A protective cover or the like is attached around the terminal portion 4 or the lead terminal 8, and a molten resin is poured into a mold or the like to flow the exterior material 5. After forming, the cover may be removed, and the recess 12 may be formed thereafter.

In addition, the shape of the dent part 12 is not restricted to FIG. 7, FIG. 8, etc., Various shapes may be sufficient.

  The above is the description of each part of the structure of the electronic component in the present embodiment.

  Next, the effect of improving the bending resistance while being a structure that can be manufactured at a low cost, realized by the above structure, will be described in detail together with the inclined portion 10 as a point of the present invention. .

  First, the terminal portion 4 and the lead terminal 8 protrude from the bottom surface 9, and the protruding position is 0.1 mm or more away from the corner where the bottom surface 9 and the extended surface of the side surface of the exterior material 5 intersect. A distance between the terminal portion 4 or the lead terminal 8 and the exterior material 5 can be secured, and this distance becomes a margin between the exterior material and the flexibility is improved. At this time, if it is smaller than 0.1 mm, the distance is insufficient and the response to the bending resistance is insufficient.

  Next, the shape features and merits of the terminal portion 4 and the lead terminal 8 will be described.

  FIGS. 10 and 30 each show a structure in which the thickness is gradually increased toward the tip in the portion where the terminal portion 4 and the lead terminal 8 protrude from the exterior material 5. The protruding terminal portion 4 and lead terminal 8 are more susceptible to the impact from the outside as they approach the tip, but this effect can be avoided by increasing the thickness as they go to the tip. Thus, the terminal portion 4 and the lead terminal 8 can be prevented from being bent or bent, and the impact resistance and durability at the time of manufacture, transportation and mounting can be improved, and the mounting reliability can be improved.

  Next, FIGS. 11 and 31 each show a structure in which the thickness is gradually reduced toward the tip in the portion where the terminal portion 4 and the lead terminal 8 protrude from the exterior material, respectively. In a shape that becomes thinner toward the tip, the elastic force of the terminal portion 4 and the lead terminal 8 increases, and when mounted on the mounting board, the pressure applied to the mounting board increases, and impact after mounting, etc. It becomes strong against the deflection by. In particular, the use of a metal having high elasticity or spring property as the material of the terminal portion 4 or the lead terminal 8 further improves the bending resistance.

  Or the load concerning the terminal part 4 or the lead terminal 8 can be disperse | distributed, and impact resistance and stress resistance increase.

  Next, in FIG. 12 and FIG. 32, the portions where the terminal portion 4 and the lead terminal 8 protrude outside the exterior material, respectively, are thicker than the thickness of the terminal portion 4 and the lead terminal 8 existing inside the exterior material 5. The structure in which is present. Thereby, it can be set as the electronic component 1 which is strong with respect to bending, a twist, etc. with respect to the stress and impact which protrude and are applied from the outside.

  In addition, these may be used independently and may be combined suitably.

  As described above, the impact resistance, durability, and deflection resistance can be improved by devising the shapes of the terminal portion 4 and the lead terminal 8.

  Next, the improvement of the bending resistance by the inclination part 10 and the dent part 12 is demonstrated.

  By forming the inclined portion 10, the corner portion where the inclined portion 10 and the bottom surface 9 intersect becomes a vertex on the bottom surface 9 (however, not only a partially protruding vertex but a vertex formed in two places) The surface where the two are connected is the bottom surface 9 and the height or the like is not particularly different), and there are two positions where the pair of terminal portions 4 or the pair of lead terminals 8 protrude.

  As will be described in detail later, the terminal portion 4 and the lead terminal 8 protrude with reference to a corner portion where the inclined portion 10 and the bottom surface 9 intersect.

  At this time, when the terminal portion 4 or the lead terminal 8 protrudes from the bottom surface 9 in a straight plane formed with a completely constant height, the exterior material 5 and the terminal portion 4 or the lead terminal 8 are inevitably formed. Since the distance is close, the amount of play is reduced. On the other hand, the inclined portion 10 is formed, and the corner portion where the inclined portion 10 and the bottom surface 9 intersect is used as the protruding portion of the terminal portion 4 or the lead terminal 8, so that the bottom surface 9 protrudes as a result. Since the portion becomes a protruding portion such as the terminal portion 4, the distance between the exterior material 5 and the terminal portion 4 or the lead terminal 8 is increased. As a result, sufficient play (margin) occurs, and the bending resistance is greatly improved. Furthermore, since the inclined portion 10 is present, the protruding portion of the terminal portion 4 or the lead terminal 8 that is the most vulnerable to stress in the electronic component 1 has an obtuse angle or an arc shape. There is a merit that damages such as cracks to the exterior member 5 that can be caused by vibration applied to the terminal portion 4 and the lead terminal 8 can be prevented.

  In addition, since chamfering, an inclined part, etc. are given to the corner | angular part of the exterior materials 5 other than the inclined part 10, a corner | angular part reduces or disappears from an exterior material, Therefore The damage by an external impact can be prevented. Is.

  Similarly, since the terminal portion 4 or the lead terminal 8 protrudes from the indented portion 12, the distance and space between the outer packaging material 5 can be secured in the same manner, so that play (margin) can be secured. Flexibility is improved.

  Further, the improvement of the bending resistance due to the protruding shape of the terminal portion 4 or the lead terminal 8 from the corner portion where the inclined portion 10 and the bottom surface 9 intersect or the protrusion from the dent portion 12 will be described.

  First, as shown in FIGS. 2 and 22, when the terminal portion 4 or the lead terminal 8 protrudes from the corner where the inclined portion 10 and the bottom surface 9 intersect, once extended downward, In the case of a structure in which a mounting surface is formed by being bent into a substantially L shape, the bending resistance is improved.

  That is, since it is once extended downward, the distance space between the outer packaging material 5 and the terminal portion 4 or the lead terminal 8 becomes large, and the portion that becomes play (margin) becomes very large. In particular, since there is a large margin in the direction perpendicular to the mounting plane after mounting, not only vibration due to vibration or impact applied in the horizontal direction of the mounting plane but also deflection due to vibration or impact applied in the substantially vertical direction can be handled. Thus, the combination of these structures greatly improves the bending resistance.

  Further, as shown in FIG. 6 and FIG. 26, the terminal portion 4 and the lead terminal 8 protrude from the position of the bottom surface 9 which is slightly inside the corner portion where the inclined portion 10 and the bottom surface 9 intersect, and the bottom surface 9 is directly intact. There is also a structure that extends to the mounting surface substantially parallel to the mounting surface.

  In the case of such a structure, in the direction substantially perpendicular to the mounting plane, since the distance space between the exterior material 5 and the terminal portion 4 and the lead terminal 8 is small, the response force to vibration and impact in the substantially vertical direction is Although it is weak, it is similarly strong against vibrations in the horizontal direction, and the flexibility is sufficiently secured. In addition, in this case, since the distance between the electronic component 1 and the mounting board is reduced, there is an advantage that mounting stability and mounting strength are ensured.

  These are the same not only when protruding from the corner where the inclined portion 10 and the bottom surface 9 intersect but also when protruding from the recessed portion 12.

In addition, although it is repeated, the bending resistance is further improved by forming the bending absorbing portion. As described above, the flexure absorbing portion serves as a buffer portion that is not solder-connected to the mounting substrate at the time of mounting, and therefore can absorb various vibrations and can further improve the flexibility.

  The electronic component 1 having the above-described structure enables the electronic component 1 to have a high flexibility and a long life while maintaining a low cost, and the electronic device on which the electronic component 1 is mounted It is possible to realize durability and long life.

  Furthermore, while maintaining low cost by simplifying the manufacturing process, preventing damage to the exterior material, improving impact resistance, durability, heat resistance, moisture resistance, etc., the electronic component 1 suitable for practical use, and An electronic device is realized.

  The present invention is an electronic component having an element, a pair of terminal portions provided on the element, a part of the terminal portion, and an exterior material that covers the element, and is inclined at a corner between the bottom surface and the side surface of the exterior material Part is provided, and the terminal part protrudes from the corner part where the inclined part and the bottom surface of the exterior material intersect, thereby maintaining the low cost as usual in the manufacture of electronic components, and outside the exterior material. It can also be applied to applications that require highly flexible electronic components against external impacts and vibrations that occur during manufacture, transportation, and mounting on protruding terminal portions or lead terminals.

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Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component 2 Element 3 Electrode 4 Terminal part 5 Exterior material 6 Multilayer capacitor 7 Internal electrode 8 Lead terminal 9 Bottom face 10 Inclined part 11 Crossing angle part 12 Indented part 15 Curved part 16 Bending part 17 Wave-like surface 20 Reinforcement material 100 Electronic component 101 element 102 internal electrode 103 external electrode 104 lead terminal

Claims (50)

Elements,
A pair of terminal portions provided on the element;
An electronic component having an exterior material covering a part of the terminal portion and the element,
The electronic component, wherein the terminal portion protrudes from a bottom surface of the exterior material, and a distance between a bottom surface and a corner portion of the exterior material is 0.1 mm or more. Elements,
A pair of terminal portions provided on the element;
An electronic component having an exterior material covering a part of the terminal portion and the element,
An electronic component, wherein an inclined portion is provided at a corner portion between a bottom surface and a side surface of the exterior material, and the terminal portion protrudes from a corner portion where the inclined portion and the bottom surface of the exterior material intersect. The electronic component according to claim 2, wherein the inclined portion is an inclined portion having a shape provided such that a corner portion between a bottom surface and a side surface of the exterior material is cut off. The inclined portion is formed by a surface connecting an arbitrary position in the middle of the side surface and an arbitrary position in the middle of the bottom surface at a corner between the side surface and the bottom surface of the exterior material. Electronic component in any one of thru | or 3. The electronic component according to claim 2, wherein the inclined portion is an arcuate curved surface. The terminal portion protruding from a corner portion where the inclined portion and the bottom surface of the exterior material intersect with each other protrudes below the protruding bottom surface and is bent in an approximately L shape. The electronic component according to any one of 2 to 5. 6. The electron according to claim 2, wherein a terminal portion that protrudes from a corner portion where the inclined portion and the bottom surface of the exterior material intersect protrudes substantially parallel to the bottom surface of the exterior material. parts. The electronic component according to claim 7, wherein a terminal portion protruding substantially parallel to the exterior material is not connected to the exterior material. Elements,
A pair of terminal portions provided on the element;
An electronic component having an exterior material covering a part of the terminal portion and the element,
An electronic component comprising: a plurality of dent portions provided at arbitrary locations on the bottom surface of the exterior material; and the terminal portion protruding from the dent portion. 10. The electronic component according to claim 9, wherein the indented portion is a cut portion formed after the device and a part of the terminal portion are covered with the exterior material. 11. The electronic component according to claim 9, wherein the protruding terminal portion protrudes below the protruding bottom surface and is bent in an approximately L shape. The distance between the corner portion between the protruding inclined portion of the terminal portion and the bottom surface of the exterior material and the side where the extended surfaces of the side surface and the bottom surface of the exterior material intersect each other is 0.1 mm or more. The electronic component according to any one of claims 2 to 8. The distance between the indented part from which the terminal part protrudes and the side where the extended surfaces of the side surface and the bottom surface of the exterior material intersect each other is 0.1 mm or more. Electronic components described in The electronic component according to claim 1, wherein the protruding terminal portion increases in thickness as it goes to the tip. The electronic component according to claim 1, wherein the protruding terminal portion has a thickness that decreases toward a tip. The electronic component according to any one of claims 1 to 15, wherein the terminal portion includes a portion where the thickness outside the exterior material is thicker than the thickness inside the exterior material. 2. The exterior material according to claim 1, wherein a chamfer or an inclined portion is provided on at least a part of corners other than the corner portion where the inclined portion or the recessed portion is provided. Electronic component of any one of -16. The electronic component according to claim 1, wherein a reinforcing material is provided at any position on the non-mounting surface of the terminal portion. The electronic component according to claim 18, wherein the reinforcing material is a non-mounting surface of the terminal portion and is formed in a peripheral shape. The electronic component according to any one of claims 1 to 19, wherein the element is a single plate capacitor having a dielectric substrate and electrodes connected to the terminal portion. 21. The multilayer capacitor having a dielectric substrate in which an internal electrode is embedded and a pair of terminal portions provided on the dielectric substrate. Electronic components. The electronic component according to any one of claims 1 to 21, wherein in the multilayer capacitor, the internal electrode is an electrode mainly composed of nickel, and the dielectric substrate is a reduction-resistant material. . 23. The electronic component according to claim 1, wherein the element is an element in which a plurality of pairs of terminal portions are provided on a single substrate. The electronic component according to claim 1, wherein a plurality of the elements are sealed inside the exterior material. The electronic component according to any one of claims 1 to 24, wherein a deflection absorbing portion is provided at any position of the protruding terminal portion. 26. The deflection absorbing portion is an arcuate curved surface portion, a wavy surface, a bent portion, or a combination thereof provided at any position of the terminal portion. Electronic components described in A dielectric substrate having an internal electrode embedded therein, a plurality of multilayer capacitors having a pair of terminal portions provided on the dielectric substrate;
A pair of lead terminals connected to the pair of terminal portions;
An electronic component having an exterior material covering a part of the lead terminal, the multilayer capacitor, and the terminal portion,
An electronic component, wherein an inclined portion is provided at a corner portion between a bottom surface and a side surface of the exterior material, and the lead terminal protrudes from a corner portion where the inclined portion and the bottom surface of the exterior material intersect. 28. The electronic component according to claim 27, wherein the inclined portion is an inclined portion having a shape provided such that a corner portion between a bottom surface and a side surface of the exterior material is cut off. The inclined portion is formed by a surface connecting an arbitrary position in the middle of the side surface and an arbitrary position in the middle of the bottom surface at a corner between the side surface and the bottom surface of the exterior material. The electronic component according to any one of Items 28 to 28. 30. The electronic component according to claim 27, wherein the inclined portion is an arcuate curved surface. The lead terminal protruding from a corner portion where the inclined portion and the bottom surface of the exterior material intersect with each other protrudes below the protruding bottom surface and is bent in an approximately L shape. The electronic component according to any one of 27 to 30. 31. The lead terminal protruding from a corner portion where the inclined portion and the bottom surface of the exterior material intersect with each other protrudes substantially parallel to the bottom surface of the exterior material. Electronic components. The electronic component according to claim 32, wherein a lead terminal protruding substantially parallel to the exterior material is not connected to the exterior material. A dielectric substrate having an internal electrode embedded therein, a plurality of multilayer capacitors having a pair of terminal portions provided on the dielectric substrate;
A pair of lead terminals connected to the pair of terminal portions;
An electronic component having an exterior material covering a part of the lead terminal, the multilayer capacitor, and the terminal portion,
An electronic component comprising: a plurality of dent portions provided at arbitrary locations on the bottom surface of the exterior material; and the lead terminals projecting from the dent portions. 35. The electronic component according to claim 34, wherein the indented portion is a cut portion formed after the element and a part of the lead terminal are covered with the exterior material. 36. The electronic component according to claim 34, wherein the protruding lead terminal protrudes below the protruding bottom surface and is bent in an approximately L shape. The distance between the corner portion between the inclined portion and the bottom surface of the exterior material, and the side where the extended surfaces of the side surface and the bottom surface of the exterior material intersect with each other is 0.1 mm or more. The electronic component according to any one of claims 27 to 36, wherein the electronic component is any one of claims 27 to 36. The distance between the indented portion from which the lead terminal protrudes and the side where the extended surfaces of the side surface and the bottom surface of the exterior material intersect each other is 0.1 mm or more. The electronic component according to 1. The electronic component according to any one of claims 27 to 38, wherein the thickness of the protruding lead terminal increases toward the tip. The electronic component according to any one of claims 27 to 38, wherein the protruding lead terminal has a thickness that decreases toward the tip. The electronic component according to any one of claims 27 to 40, wherein the lead terminal has a portion that is thicker outside the exterior material than inside the exterior material. The chamfering is given to the corner | angular part at least one part of the corner | angular parts other than the corner | angular part in which the said inclination part or dent part is provided in the said exterior material. Or the electronic component according to claim 1. The electronic component according to any one of claims 27 to 42, wherein a reinforcing material is provided at any position on the non-mounting surface of the lead terminal. 44. The electronic component according to claim 43, wherein the reinforcing material is a non-mounting surface of the lead terminal and has a peripheral shape. 45. The multilayer capacitor according to claim 27, wherein the internal electrode is an electrode containing nickel as a main component, and the dielectric substrate is a reduction-resistant material. Electronic components. 46. The electronic component according to claim 27, wherein the element is an element in which a plurality of pairs of terminal portions are provided on a single base. 47. The electronic component according to any one of claims 27 to 46, wherein a plurality of the elements are sealed inside the exterior material. 48. The electronic component according to claim 27, wherein a deflection absorbing portion is provided at any position of the protruding lead terminal. 49. The deflection absorbing portion is an arcuate curved surface portion, a wavy surface, a bent portion, or a combination thereof provided at any position of the lead terminal. Electronic components described in The electronic component according to any one of claims 1 to 49, wherein the exterior material is a substantially rectangular parallelepiped or a substantially cubic body, and an inclined portion is provided at a corner between a bottom surface and a side surface thereof. .

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