JP2005317608A - Electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic device which can be manufactured at a low cost through a manufacturing step without any fine adjustment and can realize improved shock resistance, durability, bending resistance, mounting reliability, etc. <P>SOLUTION: The electronic device 1 comprises an element 2, a pair of terminals 4 provided on the element 2, and an exterior facing material 5 to cover a part of the terminals 4 and the element 2. The terminals 4 are projected from a corner between the bottom and side surfaces of the exterior facing material 5, and the terminals 4 projecting from the exterior facing material 5 or the exterior facing material 5 is provided with a reinforcing material 10. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic component suitably used for an electronic device such as a modem, a power supply circuit, a liquid crystal power supply, a DC-DC converter, and a power line communication device.

  Many electronic components are mounted in electronic devices such as modems and power supply circuits. For example, a capacitor is often used for noise removal or DC component cut.

  Here, electronic devices are required to be reduced in size and cost, and accordingly, electronic components are also required to be significantly reduced in size and cost. Furthermore, surface mounting electronic components are often required in order to reduce mounting cost and mounting area by automatic mounting. On the other hand, conflicting specifications such as high performance, reduction of characteristic variation, and improvement of durability have been demanded together with downsizing.

  Furthermore, with the increase in the number of pins of LSI and the like and the increase in the number of bits of signal lines, there is a need for high-density mounting in which a plurality of electronic components are mounted in a place where the line spacing is very narrow.

  In particular, a modem or the like often has a set of two lines for data input and data output, and two electronic components must be mounted on the line.

  In order to satisfy these requirements, various electronic devices have been proposed (see, for example, Patent Document 1 and Patent Document 2).

  In particular, as described in the above-mentioned patent documents, in order to cope with a high breakdown voltage, in an electronic component, the element is covered with an exterior material such as a resin to increase the breakdown voltage, thereby improving durability, heat resistance and moisture resistance. It was broken.

  However, in this case, it is necessary to form the exterior material by using a mold or the like, and it is possible to adopt a configuration in which two formed exterior materials are bonded together and the lead terminal protrudes from the bonded surface. There were many. However, in such a form, the number of manufacturing steps is increased and the cost is often increased. In addition, since the terminal portion and the lead terminal protrude from the middle portion of the side surface of the exterior material, costs such as fine adjustment may be required.

  In order to cope with this, an electronic component manufactured by placing a terminal or lead terminal connected to an element in a frame and pouring resin into the frame and sealing it as an exterior material is produced. Proposed.

  FIG. 28 and FIG. 29 are side views of an electronic component according to the prior art, and the shape is a result of taking the above manufacturing method, which has an advantage that it can be manufactured at low cost.

  Reference numeral 100 denotes an electronic component, and reference numeral 101 denotes an element, which includes various types of capacitors (single plate capacitors, multilayer capacitors, etc.), resistors, coils, filters, and other electronic elements. 102 is an internal electrode when the element 101 is a multilayer capacitor, 103 is an external electrode, 104 is a lead terminal, and 105 is an exterior material. Note that the lead terminal 104 connected to the element 101 and projecting from the exterior material 105 is called a terminal part when directly connected to the element, and a terminal part directly connected to the element is called a lead terminal. However, they are not strictly distinguished but the same.

As is apparent from FIG. 28, in the electronic component 100 which is packaged by pouring resin into the frame to reduce the cost as described above, the lead terminal 104 has a corner portion (or a side where the bottom surface and the side surface of the exterior material 105 intersect. Alternatively, the shape protrudes to the outside from the vicinity thereof.
JP 2001-110691 A JP 2002-43170 A

  However, in the electronic component according to the prior art as shown in FIG. 28, the side surface of the exterior material that does not have a protruding portion in the middle of the side surface is likely to be a flat surface, and the exterior material itself is likely to be a substantially rectangular parallelepiped. In addition, the lead terminal 104 tends to have a shape that protrudes to the outside from the corner where the bottom surface and the side surface of the exterior material 105 intersect or the vicinity thereof, so there is a margin between the exterior material 105 and the projected lead terminal 104. There was a problem that there was no degree (ie, a play portion).

  For this reason, there is no margin between the lead terminal 104 and the mounting surface on which the electronic component is mounted, and there is no margin between the electronic component 100 and the mounting surface. There was a problem that there was no impact resistance. In other words, there is a problem that there is no allowance for deflection, and in an actually mounted electronic board, a crack occurs in the exterior material 105 due to impact or heat, or a crack occurs in a solder portion between the lead terminal 104 and the mounting land. There were also problems such as the occurrence of disconnection and breakage.

  Further, as shown in FIG. 29, since there is no margin, the lead terminal 104 protruding to the outside is likely to be warped or bent, and it becomes difficult to mount on the substrate, and the mounting reliability is lowered. There was also a problem.

  As described above, in the conventional electronic component, the resin is poured into the element 101 and the lead terminal 104 arranged in the frame and the exterior is not required to reduce man-hours or make fine adjustments afterwards. In addition, it is possible to reduce the cost, but the compatibility with terminal deflection is weak, durability and impact resistance are reduced, mounting reliability and shape retention during transportation are reduced, etc. There was a problem. For this reason, it was an insufficient electronic component in actual practical use.

  The present invention is an electronic component having an element, a pair of terminal portions provided on the element, a part of the terminal portion, and an exterior material that covers the element, wherein the terminal portion is a bottom portion and a side corner portion of the exterior material. It is set as the structure by which the reinforcing material was provided in the terminal part or exterior material which protrudes from the exterior material.

  The present invention can realize an electronic component with improved pressure resistance, impact resistance, durability, and moisture resistance by sealing an element with an exterior material.

  Also, the terminal part protruding to the outside, the base part of the lead terminal, or the bottom part, etc. are provided with a reinforcing material such as resin similar to the exterior material, so that the terminal part protruding to the outside and the protruding shape of the lead terminal Even when there is no play or allowance, sufficient strength is ensured, so bending, bending, warping, twisting, etc. due to impact on the terminal part or lead terminal during manufacturing, transportation, mounting, etc. Is prevented. As a result, the deflection resistance after mounting is improved, and the mounting reliability is improved.

In addition, the reinforcing material is provided not only at the projecting root of the terminal portion and the lead terminal, but also around the terminal portion and the lead terminal, at the center portion, or on the bottom surface including the exterior material. Even if there is no play or allowance in the protruding shape of the protruding terminal part or lead terminal, sufficient strength is ensured, so the terminal part and lead terminal during manufacturing, transportation, mounting, etc. Prevents bending, bending, warping, twisting, etc. due to impact on the body. As a result, the deflection resistance after mounting is improved, and the mounting reliability is improved.

  In addition, because the reinforcing material is formed of the same material as the exterior material or integrally formed, the manufacturing process is facilitated, and impact resistance, which is a conventional problem of a main-shaped electronic component that can be manufactured at low cost. It is possible to maintain a low cost while solving performance, durability, flexibility, and mounting reliability.

  In addition, while maintaining the same low cost as in the manufacture of electronic components, the thickness of the terminal part or lead terminal protruding outside the exterior material is increased or decreased, or the thickness is gradually changed. By using a shape such as a bend, it is possible to prevent bending or warping due to impact to the terminal part protruding to the outside or the lead terminal during transportation or mounting, and to make the electronic component strong in impact resistance etc. it can.

  In addition, the same structure makes it more resistant to deflection between the mounting surface after mounting and prevents the occurrence of cracks in the exterior material and solder surface due to external impact, external heat, humidity, etc. Thus, an electronic component having high impact resistance, heat resistance, durability, and moisture resistance can be realized while maintaining low cost.

  Furthermore, since the terminal portion or the lead terminal has a structure that protrudes to the outside of the exterior material from the corner portion where the bottom surface and the side surface of the exterior material intersect or the vicinity thereof, the bottom surface of the lead terminal (that is, the mounting surface). And the bottom surface of the exterior material are close to substantially the same plane, facilitating mounting. Further, since there is no play in the protruding lead terminal, there is an advantage that fine adjustment at the time of mounting becomes unnecessary.

  In addition, in order to project from such a part, after connecting a terminal part or a lead terminal to an element (or multilayer capacitor), it is inverted and placed in a frame such as a mold, and a molten resin, etc. It is possible to realize an electronic component that is sealed by a very simple process and a low-cost process of casting and molding.

  As described above, by forming a reinforcing material in a suitable location and shape for the terminal part protruding from the exterior material, or the lead terminal and the exterior material, it can be transported while maintaining low cost as in the past. It is possible to realize a user-friendly electronic component that is easy to mount and has improved impact resistance, durability, deflection resistance, heat resistance, moisture resistance, high withstand voltage, etc. during, after and after mounting.

  In addition to the above, the thickness of the terminal portion or lead terminal existing inside the exterior material and the thickness of the portion protruding outside the exterior material are changed, or the thickness of the lead terminal protruding outside is changed. It has a shock resistance and durability after transportation, mounting, and mounting, while maintaining low cost as in the past, such as by providing a thickened base only, or by providing a raised part at the tip, etc. It is possible to realize a user-friendly electronic component that is easy to mount and has improved performance, flexibility, heat resistance, moisture resistance, and high pressure resistance.

  In addition, the electronic component can be miniaturized.

  The element sealed in the exterior material may be anything such as a capacitor (single plate, laminated type), a resistor, an inductor, or a filter, and is particularly suitable for a device that requires a high breakdown voltage.

  The invention according to claim 1 of the present invention is an electronic component including an element, a pair of terminal portions provided on the element, a part of the terminal portion, and an exterior material that covers the element. It is an electronic component characterized in that a reinforcing material is provided on the terminal part or exterior material protruding from the bottom and side corners of the material, and maintaining the low cost in the manufacturing process. Even if there is no spatial margin (play) between the terminal part protruding outside the exterior material and the exterior material, it has strong impact resistance, durability, heat resistance, moisture resistance, and flexibility Thus, an electronic component that can be mounted is realized by a terminal portion having high mounting reliability.

  The invention according to claim 2 of the present invention is the electronic component according to claim 1, wherein the reinforcing material is provided in the exterior material, the terminal portion protruding from the exterior material, and the intersection. Even if there is no space margin (play) between the terminal part projecting outside the exterior material and the exterior material while maintaining the low cost in the manufacturing process, the impact resistance is strong, Electronic components that can be mounted are realized by terminal portions with high durability, heat resistance, moisture resistance, deflection resistance, and mounting reliability.

  According to a third aspect of the present invention, in the electronic component according to the second aspect, the reinforcing material is a member bonded at the intersection with the exterior material and the terminal portion protruding from the exterior material. Even when there is no space margin (play) between the terminal part protruding outside the exterior material and the exterior material while maintaining the low cost in the manufacturing process, it is impact resistant. A strong, durable, heat-resistant, moisture-resistant, flexible, and mountable electronic component can be realized with a highly reliable terminal part.

  The invention according to claim 4 of the present invention is such that the reinforcing material protrudes along the main surface of the terminal portion from the side surface of the exterior material at the intersection of the exterior material and the terminal portion protruding from the exterior material. The electronic component according to claim 1, wherein the reinforcing material can be easily formed.

  The invention according to claim 5 of the present invention is the electronic component according to any one of claims 1 to 4, wherein the reinforcing material is bonded to the surface of the terminal portion protruding from the exterior material. The impact resistance due to the reinforcing material can be improved.

  The invention according to claim 6 of the present invention is the electronic component according to any one of claims 1 to 5, characterized in that the reinforcing material is integrally formed of the same kind of material as the exterior material. A reinforcing material can be formed.

  According to a seventh aspect of the present invention, in addition to or instead of the reinforcing material, at least one of both the exterior material and the terminal portion protruding from the exterior material is the bottom surface of the terminal portion protruding from the exterior material. The electronic component according to claim 1, further comprising a bottom reinforcing member formed so as to cover the portion, and protruding outside the exterior material while maintaining a low cost in the manufacturing process. Even if there is no spatial margin (play) between the terminal part and the exterior material, reinforcement from the bottom side provides strong impact resistance, durability, heat resistance, moisture resistance, and flexibility Thus, an electronic component that can be mounted is realized by a terminal portion having high mounting reliability.

  The invention according to claim 8 of the present invention is the electronic component according to claim 7, wherein the bottom reinforcing material is formed from the entire front surface of the exterior material to a part of the protruding terminal portion. Thus, the effect of reinforcing the bottom surface can be enhanced and the manufacturing can be facilitated.

  The invention according to claim 9 of the present invention is characterized in that the bottom reinforcing material is formed by applying a paste resin after the exterior material is formed. The bottom reinforcing material can be easily formed.

  The invention according to claim 10 of the present invention is characterized in that the bottom reinforcing material is formed by being attached to at least a part of the bottom surface of the exterior material and the lead terminal protruding from the exterior material. The electronic component according to any one of 9 to 9, wherein a reinforcing effect that increases impact resistance and the like is further increased.

  The invention according to claim 11 of the present invention is characterized in that the reinforcing material is provided on at least a part of the peripheral frame of the non-mounting surface of the terminal portion protruding from the exterior material. The electronic component according to 1, wherein an external stress applied to the terminal portion is improved in impact resistance in response to an impact, and an electronic component having high mounting reliability can be realized.

  According to a twelfth aspect of the present invention, the reinforcing material is provided in at least a part of a substantially central portion in the longitudinal direction of the non-mounting surface of the terminal portion protruding from the exterior material. 11. The electronic component according to any one of claims 11 to 11, wherein an external stress applied to the terminal portion is improved in impact resistance corresponding to the impact, an electronic component having high mounting reliability can be realized, and the cost of the reinforcing material can be reduced. .

  According to a thirteenth aspect of the present invention, the reinforcing material is provided on the tip portion of the non-mounting surface of the terminal portion protruding from the exterior material. In this electronic component, the impact resistance against an impact caused by external stress applied to the terminal portion is increased, an electronic component with high mounting reliability can be realized, and the reinforcing material can be easily bonded.

  The invention according to claim 14 of the present invention is characterized in that, in the terminal part, the thickness of the terminal part protruding from the exterior material increases as it goes to the tip. Even if there is no space margin (play) between the terminal part projecting outside the exterior material and the exterior material while maintaining low cost in the manufacturing process, it is an electronic component. Electronic components that can be mounted with a terminal portion that is highly resistant, durable, heat resistant, moisture resistant, flexible, and has high mounting reliability are realized.

  According to the fifteenth aspect of the present invention, in the terminal portion, the thickness of the terminal portion protruding from the exterior material is raised in a mountain shape at a substantially central portion between the base of the protruding portion and the tip portion. 14. The electronic component according to claim 1, wherein a spatial margin is provided between the terminal portion projecting outside the exterior material and the exterior material while maintaining a low cost in the manufacturing process. Even if there is no (play), the force applied to the terminal part is dispersed, and it can be mounted with a terminal part with high impact resistance, durability, heat resistance, moisture resistance, deflection resistance, and high mounting reliability. Electronic components are realized.

  The invention according to claim 16 of the present invention is characterized in that, in the terminal portion, the thickness of the terminal portion protruding from the exterior material becomes thinner toward the tip. Spatial margin between the terminal part projecting outside the exterior material and the exterior material while maintaining the low cost in the manufacturing process by improving the elasticity and pressure contact performance of the terminal part. Even if there is no (play), an electronic component that can be mounted by a terminal portion that is strong in impact resistance and has high durability, heat resistance, moisture resistance, deflection resistance, and mounting reliability is realized.

  The invention according to claim 17 of the present invention is characterized in that in the terminal portion, the terminal portion has a portion where the thickness outside the exterior material is thicker than the thickness inside the exterior material. 17. The electronic component according to claim 1, wherein a spatial margin (play) is provided between the terminal portion projecting outside the exterior material and the exterior material while maintaining a low cost in the manufacturing process. Even if there is no, an electronic component that can be mounted by a terminal portion that is strong in impact resistance and has high durability, heat resistance, moisture resistance, deflection resistance, and mounting reliability is realized.

  The electronic component according to any one of claims 1 to 17, wherein the element is a single plate capacitor having an electrode connected to the dielectric substrate and the terminal portion. Therefore, a single-plate capacitor having a high breakdown voltage can be obtained.

  According to a nineteenth aspect of the present invention, the element is a multilayer capacitor having a dielectric substrate in which internal electrodes are embedded and a pair of terminal portions provided on the dielectric substrate. Item 20. The electronic component according to any one of Items 1 to 17, wherein a high-voltage multilayer capacitor can be realized.

  The invention according to claim 20 of the present invention is the electron according to any one of claims 1 to 19, wherein the element is an element in which a plurality of pairs of terminal portions are provided on a single substrate. A component that is small and can be connected in parallel can be realized.

  According to a twenty-first aspect of the present invention, the position where the terminal portion protrudes is a position where the bottom surface and the side surface of the exterior material intersect with each other. It is an electronic component, and the element and the terminal portion can be molded with an exterior material at low cost.

  The invention according to claim 22 of the present invention is characterized in that the position where the terminal portion protrudes is the bottom surface of the exterior material and is a position close to the intersection of the side surface and the bottom surface of the exterior material. The electronic component according to any one of claims 1 to 20, wherein the element and the terminal portion can be molded with an exterior material at low cost, and the play degree when the terminal portion is mounted by coming out from the bottom surface In addition, the margin and the allowance for deflection increase.

  The invention according to claim 23 of the present invention is characterized in that the position where the terminal portion protrudes is a side surface of the exterior material and is a position close to the intersection of the bottom surface and the side surface of the exterior material. 21. The electronic component according to any one of claims 1 to 20, wherein the element and the terminal part can be molded with an exterior material at low cost, and the play degree when the terminal part is mounted by coming out of the side surface. In addition, the margin and the allowance for deflection increase.

  According to a twenty-fourth aspect of the present invention, there is provided a dielectric substrate in which an internal electrode is embedded, a plurality of multilayer capacitors having a pair of terminal portions provided on the dielectric substrate, and a pair of terminal portions. An electronic component having a pair of lead terminals, a part of the lead terminals, a multilayer capacitor, and an exterior material covering the terminal portion, wherein the lead terminal portion protrudes from a corner intersecting the bottom surface of the exterior material, A lead terminal projecting from the exterior or an exterior material is provided with a reinforcing material, and the lead terminal projecting outside the exterior material and the exterior material while maintaining a low cost in the manufacturing process Even if there is no spatial margin (play) between the two, the electronic components that can be mounted by the terminal part with high impact resistance, durability, heat resistance, moisture resistance, deflection resistance, and high mounting reliability Parts are realized.

  According to a twenty-fifth aspect of the present invention, in the electronic component according to the twenty-fourth aspect, the reinforcing material is provided at an intersection between the outer packaging material and the lead terminal protruding from the outer packaging material. Even if there is no space margin (play) between the terminal part protruding outside the exterior material and the exterior material while maintaining the low cost in the manufacturing process, it has high impact resistance. Electronic components that can be mounted are realized by lead terminals with high durability, heat resistance, moisture resistance, deflection resistance, and mounting reliability.

According to a twenty-sixth aspect of the present invention, in the electronic component according to the twenty-fourth aspect, the reinforcing material is a member bonded at an intersecting portion with an exterior material and a lead terminal protruding from the exterior material. Even when there is no space (play) between the lead terminal protruding outside the exterior material and the exterior material, while maintaining the low cost in the manufacturing process, it is impact resistant. A strong, durable, heat-resistant, moisture-resistant, flexible, and mountable electronic component can be realized with a highly reliable terminal part.

  According to a twenty-seventh aspect of the present invention, the reinforcing member protrudes along the main surface of the lead terminal from the side surface of the outer covering material at the intersection between the outer covering material and the lead terminal protruding from the outer covering material. 27. The electronic component according to claim 24, wherein the reinforcing material can be easily formed.

  The invention according to claim 28 of the present invention is the electronic component according to any one of claims 24 to 27, wherein the reinforcing material is bonded to the surface of the lead terminal protruding from the exterior material. The impact resistance due to the reinforcing material can be improved.

  The invention according to claim 29 of the present invention is the electronic component according to any one of claims 24 to 28, wherein the reinforcing material is integrally formed of the same kind of material as the exterior material. A reinforcing material can be formed.

  According to a thirty-third aspect of the present invention, in addition to or instead of the reinforcing member, at least one of both the outer member and the lead terminal protruding from the outer member is the bottom surface of the lead member protruding from the outer member. 25. The electronic component according to claim 24, wherein a bottom reinforcing material formed so as to cover the portion is provided, and the electronic component protrudes outside the exterior material while maintaining a low cost in the manufacturing process. Even if there is no spatial margin (play) between the terminal part and the exterior material, reinforcement from the bottom side provides strong impact resistance, durability, heat resistance, moisture resistance, and flexibility Thus, an electronic component that can be mounted is realized by a terminal portion having high mounting reliability.

  The invention according to claim 31 of the present invention is the electronic component according to claim 30, wherein the bottom reinforcing material is formed from the entire front surface of the exterior material to a part of the protruding lead terminal. Thus, the effect of reinforcing the bottom surface can be enhanced and the manufacturing can be facilitated.

  The invention according to claim 32 of the present invention is characterized in that the bottom reinforcing material is formed by applying a paste resin after the exterior material is formed. The bottom reinforcing material can be easily formed.

  According to a thirty-third aspect of the present invention, the bottom reinforcing material is formed by being attached to the bottom surface of the outer packaging material and at least a part of the lead terminal protruding from the outer packaging material. The electronic component according to any one of? 32, the reinforcement effect that increases impact resistance and the like is further enhanced.

  The invention according to claim 34 of the present invention is characterized in that the reinforcing material is provided on at least a part of the peripheral frame of the non-mounting surface of the lead terminal protruding from the exterior material. The electronic component according to 1, wherein an impact resistance against an impact caused by an external stress applied to the lead terminal is increased, and an electronic component having high mounting reliability can be realized.

  According to a thirty-fifth aspect of the present invention, the reinforcing material is provided in at least a part of a substantially central portion in the longitudinal direction of the non-mounting surface of the lead terminal protruding from the exterior material. 34. The electronic component according to any one of 34, wherein an external stress applied to the lead terminal is improved in impact resistance corresponding to the impact, an electronic component having high mounting reliability can be realized, and a cost of the reinforcing material can be reduced. .

The invention as set forth in claim 36 of the present invention is characterized in that the reinforcing material is provided at the tip portion of the lead terminal which is not mounted on the lead terminal protruding from the exterior material. In the electronic component described in the above, it is possible to realize an electronic component having high mounting reliability with an increase in impact resistance in response to an impact caused by an external stress applied to the lead terminal, and to facilitate adhesion of the reinforcing material.

  The invention according to claim 37 of the present invention is the lead terminal according to any one of claims 24 to 36, characterized in that in the lead terminal, the thickness of the lead terminal protruding from the exterior material increases toward the tip. Even if there is no space margin (play) between the lead terminal protruding outside the exterior material and the exterior material while maintaining the low cost in the manufacturing process, An electronic component that can be mounted with a terminal portion that is strong in impact resistance, durable, heat resistant, moisture resistant, flexible, and has high mounting reliability is realized.

  In the lead terminal according to the thirty-eighth aspect of the present invention, in the lead terminal, the thickness of the lead terminal protruding from the exterior material is raised in a mountain shape at a substantially central portion between the root and the tip of the protruding portion. 37. The electronic component according to claim 24, wherein a space is provided between the lead terminal protruding outside the exterior material and the exterior material while maintaining low cost in the manufacturing process. Even if there is no allowance (play), the force applied to the lead terminals is dispersed to provide high impact resistance, durability, heat resistance, moisture resistance, deflection resistance, and high mounting reliability. A mountable electronic component is realized.

  According to a thirty-ninth aspect of the present invention, in the lead terminal, the thickness of the lead terminal protruding from the outer packaging material decreases as it goes to the tip. It is an electronic component described in the above, and the space between the lead terminal protruding outside the exterior material and the exterior material is maintained while improving the elasticity and pressure contact performance of the lead terminal and maintaining the low cost in the manufacturing process. Even when there is no margin (play), an electronic component that can be mounted by a terminal portion that is strong in impact resistance and has high durability, heat resistance, moisture resistance, deflection resistance, and mounting reliability is realized.

  The invention according to claim 40 of the present invention is characterized in that, in the lead terminal, the lead terminal has a portion where the thickness outside the exterior material is thicker than the thickness inside the exterior material. 39. The electronic component according to any one of 39, wherein there is no space margin (play) between the lead terminal projecting outside the exterior material and the exterior material while maintaining low cost in the manufacturing process. Even in such a case, an electronic component that can be mounted by a terminal portion that is strong in impact resistance, has durability, heat resistance, moisture resistance, deflection resistance, and mounting reliability is realized.

  The invention according to claim 41 of the present invention is that the multilayer capacitor is a multilayer capacitor in which a plurality of pairs of terminal portions are provided on a single substrate. 1 is an electronic component according to the first aspect of the present invention, which can realize a more efficiently miniaturized composite element.

  In the invention according to claim 42 of the present invention, the position where the lead terminal protrudes is a position where the bottom surface and the side surface of the exterior material intersect each other. In this electronic component, an element and a lead terminal can be molded with an exterior material at low cost.

  The invention according to claim 43 of the present invention is characterized in that the position where the lead terminal protrudes is the bottom surface of the exterior material and is a position close to the intersection between the side surface and the bottom surface of the exterior material. The electronic component according to any one of claims 24 to 41, wherein the element and the lead terminal can be molded with an exterior material at a low cost, and the play when the lead terminal is mounted by coming out of the bottom surface. This increases the degree, margin, and deflection tolerance.

The invention according to claim 44 of the present invention is characterized in that the position where the lead terminal protrudes is a side surface of the exterior material and a position close to the intersection of the bottom surface and the side surface of the exterior material. The electronic component according to any one of claims 24 to 41, wherein the element and the terminal portion can be molded with an exterior material at a low cost, and play when the lead terminal is mounted by exiting from the bottom surface. This increases the degree, margin, and deflection tolerance.

  The invention according to claim 45 of the present invention is the electronic component according to any one of claims 1 to 23, wherein a plurality of elements are sealed inside the exterior material. An electronic component to be a composite element can be realized.

  The invention according to claim 46 of the present invention is the electronic component according to any one of claims 24 to 44, wherein a plurality of multilayer capacitors are sealed inside the exterior material. Thus, it is possible to efficiently realize an electronic component that becomes a composite element.

  The invention according to claim 47 of the present invention is an electronic component having an element, a pair of terminal portions provided on the element, a part of the terminal portion, and an exterior material covering the element, and protruding from the exterior material. This is an electronic component characterized in that a reinforcing material is provided on the terminal part or exterior material, which has strong impact resistance, durability, heat resistance, moisture resistance, deflection resistance, and high mounting reliability. Thus, an electronic component that can be mounted is realized.

  According to a forty-eighth aspect of the present invention, there is provided a dielectric substrate having an internal electrode embedded therein, a plurality of multilayer capacitors having a pair of terminal portions provided on the dielectric substrate, and a pair of terminal portions. The electronic device has a pair of lead terminals, a part of the lead terminals, a multilayer capacitor, and an exterior material that covers the terminal portion, and a reinforcing material is provided on the lead terminal or the exterior material protruding from the exterior material The electronic component can be mounted by a terminal portion having high impact resistance, durability, heat resistance, moisture resistance, deflection resistance, and high mounting reliability.

  In this specification, a multilayer capacitor is described as an example of an element. However, the present invention is not limited to this, and various elements such as a normal single plate capacitor, a resistor, an inductor, and a filter that are not a multilayer capacitor are used. But the same is true.

  In addition, the terminal part and the lead terminal are described as the terminal part when connected directly to the element, the terminal part directly connected to the element, and the terminal further connected as the lead terminal. It is not something that is, but the same thing.

  Hereinafter, it demonstrates using drawing.

  1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 15, 16, 17, 18, 19, 20, 21. 22, FIG. 23, and FIG. 24 are side views of the electronic component according to the embodiment of the present invention. FIGS. 7, 8, 9, 25, 26, and 27 are electronic components according to the embodiment of the present invention. FIG. 14 is a perspective view of the electronic component in the embodiment of the present invention.

  1 to 13, terminals are connected to various electronic elements such as capacitors (single plate, laminated type, electrolysis, etc.), resistors, inductors, filters, ICs, etc. A structure in which a part of the projection protrudes outside the exterior material and various reinforcing materials are provided is shown.

On the other hand, in FIGS. 15 to 27, as an internal element, a multilayer capacitor is mainly shown as an example of the element, a terminal portion is connected to the multilayer capacitor, and a pair of lead terminals are connected to the terminal portion. A structure in which a part of a lead terminal protrudes to the outside and is provided with various reinforcing materials is molded with an exterior material. The structure shown in FIGS. 1 to 13 and the structure shown in FIGS. 15 to 27 are almost the same except that the element is a multilayer capacitor and lead terminals are connected. In the following, the description will be repeated as necessary, and will be omitted when there is much overlap.

  1 is an electronic component, 2 is an element, 3 is an electrode, 4 is a terminal portion, 5 is an exterior material, 6 is a multilayer capacitor, 7 is an internal electrode, 8 is a lead terminal, 10 is a reinforcing material, 11 is a protruding portion, 12 , 13 are bottom reinforcing materials, and 14, 15 and 16 are reinforcing materials.

  First, an outline of the structure shown in each figure will be described.

  FIG. 1 shows a structure in which a reinforcing material 10 is provided so as to fill an intersecting corner portion of the exterior material 5 and the terminal portion 4 protruding from the exterior material 5. The reinforcing material 10 improves the impact resistance with respect to the terminal portion 4 and improves the mounting reliability.

  FIG. 2 shows a structure in which the reinforcing member 10 in FIG. 1 is provided extending from the corner portion along the side surface of the exterior member 5. It has the effect of becoming stronger.

  FIG. 3 shows a structure in which the protruding portion 11 is provided on the exterior material 5 itself at the root where the terminal portion 4 projects from the exterior material 5 as the reinforcing material 10. A reinforcing material can be easily formed.

  FIG. 4 shows a structure in which the bottom surface reinforcing material 12 is provided so as to cover a part of the bottom surface of the terminal portion 4 and the exterior material 5 protruding in addition to the corner reinforcing material 10. Thereby, the strength to the impact resistance from the bottom side increases.

  In FIG. 5, the bottom reinforcing member 12 is provided in the same manner as in FIG. 4, but a stepped portion is formed in the terminal portion 4 in order to cope with the bulge on the bottom surface due to the bottom reinforcing member, A structure is shown in which no space is created between the mounting surface of the terminal portion 4 and the mounting substrate.

  FIG. 6 shows a structure in which the bottom surface reinforcing material 13 is provided over a part of the terminal portion 4 protruding from the entire surface of the exterior material 5. The reinforcing effect from the bottom side is further enhanced.

  FIG. 7 shows a structure in which a reinforcing material is provided on the peripheral frame of the terminal portion 4 protruding to the outside. Although the state of being formed over the entire circumference of the peripheral frame is shown, it may be formed only in part. Thereby, the impact resistance of the lead terminal 8 is increased.

  FIG. 8 shows a structure in which a reinforcing material 15 is provided at a substantially central portion of the terminal portion 4 protruding to the outside. Similarly, it may be provided only in some parts. Thereby, the impact resistance of the lead terminal 8 is increased.

  FIG. 9 shows a structure in which a reinforcing member 16 is provided at the tip of the terminal portion 4 protruding to the outside. Similar to the above, it may be provided only in a part. Thereby, the impact resistance of the lead terminal 8 is increased.

  FIG. 10 shows a structure in which the terminal portion 4 protruding to the outside increases in thickness toward the tip. Thereby, it becomes the terminal part 4 strong against the external impact which is easy to apply to a front-end | tip part.

FIG. 11 shows a structure in which a terminal portion 4 having a chevron-like thickness is formed, with the base portion and the tip portion of the terminal portion 4 protruding to the outside approximately at the center. This makes it stronger against deflection.

  FIG. 12 shows a structure in which the terminal portion 4 protruding to the outside is made thinner as it goes to the tip. Since the force for pressing down the mounting board is increased, the mounting reliability is improved.

  FIG. 13 shows a structure in which the thickness of the terminal portion 4 protruding outside the exterior material 5 is thicker than the thickness of the terminal portion 4 inside the exterior material 5. As a result, there is an effect that it is strong in impact resistance and the mounting reliability is increased.

  10 to 13 also show the reinforcing member 10, the bottom reinforcing member 13, and the like.

  FIG. 14 shows a structure in which a plurality of elements are molded. The element 2 may be a multilayer capacitor 6 or the like. Moreover, not only two but three or more may be molded.

  15 to 27 show a structure in which the element 2 is a multilayer capacitor 6 and the lead terminal 8 protrudes to the outside. Each of the elements corresponds to a structure substantially the same as that shown in FIGS. It is what is expressed.

  FIG. 15 shows a structure in which the reinforcing material 10 is provided so as to fill the corners where the exterior material 5 and the lead terminals 8 protruding from the exterior material 5 intersect. The reinforcing material 10 improves the impact resistance with respect to the terminal portion 4 and improves the mounting reliability.

  FIG. 16 shows a structure in which the reinforcing member 10 in FIG. 15 is provided extending from the corner portion along the side surface of the exterior member 5. There is an effect of strengthening.

  FIG. 17 shows a structure in which the projecting portion 11 is provided on the exterior material 5 itself at the root where the lead terminal 8 projects from the exterior material 5 as the reinforcing material 10. A reinforcing material can be easily formed.

  FIG. 18 shows a structure in which the bottom surface reinforcing material 12 is provided so as to cover a part of the bottom surface of the lead terminal 8 and the exterior material 5 that protrude beyond the corner reinforcing material 10. Impact resistance can be improved from the bottom side.

  In FIG. 19, the bottom surface reinforcing member 12 is provided in the same manner as in FIG. 18. A structure is shown in which a space is not formed between the mounting surface of the lead terminal 8 and the mounting substrate.

  FIG. 20 shows a structure in which the bottom surface reinforcing material 13 is provided over a part of the lead terminal 8 protruding from the entire surface of the exterior material 5. The reinforcing effect from the bottom side is further enhanced.

  FIG. 21 shows a structure in which the lead terminal 8 protruding to the outside increases in thickness toward the tip. Thereby, it becomes the lead terminal 8 strong against the external impact which is easy to be applied to a front-end | tip part.

FIG. 22 shows a structure in which a lead terminal 8 having a chevron-like thickness is formed, with the base portion of the lead terminal 8 projecting to the outside and the approximate center of the tip end portion being formed. As a result, it is strong against deflection.

  FIG. 23 shows a structure in which the lead terminal 8 protruding to the outside is made thinner as it goes to the tip. Since the force for pressing down the mounting board is increased, the mounting reliability is improved.

  FIG. 24 shows a structure in which the thickness of the lead terminal 8 protruding outside the exterior material 5 is thicker than the thickness of the lead terminal 8 inside the exterior material 5. As a result, there is an effect that it is strong in impact resistance and the mounting reliability is increased.

  21 to 24 also show the reinforcing member 10, the bottom reinforcing member 13, and the like.

  FIG. 25 shows a structure in which a reinforcing material is provided on the peripheral frame of the lead terminal 8 protruding to the outside. Although the state of being formed over the entire circumference of the peripheral frame is shown, it may be formed only in part. Thereby, the impact resistance of the lead terminal 8 is increased.

  FIG. 26 shows a structure in which a reinforcing material 15 is provided at a substantially central portion of the lead terminal 8 projecting to the outside. Similarly, it may be provided only in some parts. Thereby, the impact resistance of the lead terminal 8 is increased.

  FIG. 27 shows a structure in which a reinforcing member 16 is provided at the tip of the lead terminal 8 protruding to the outside. Similar to the above, it may be provided only in a part. Thereby, the impact resistance of the lead terminal 8 increases.

  Next, the detail of each part is demonstrated.

  Reference numeral 1 denotes an electronic component. As shown in FIG. 1 and the like, a capacitor, a resistor, an inductor, a filter, and other electronic elements are molded with an exterior material such as a resin, and are molded with the exterior material. As a result, it is an electronic component that has improved durability, moisture resistance, and impact resistance, and can withstand high pressure resistance.

  Next, the element 2 will be described.

  2 is an element, and the element may be any of a capacitor, a resistor, an inductor, a filter, an IC, and other electronic elements as described above. The capacitor may be a single plate capacitor or a multilayer capacitor. Any capacitor such as an electrolytic capacitor may be used. FIG. 1 shows a single plate capacitor, and FIG. 2 shows a multilayer capacitor.

  Note that a single element 2 (or multilayer capacitor 6) may be sealed with the exterior material 5, and a plurality may be sealed with the exterior material 5.

  Alternatively, a pair of electrodes 3 may be provided on a single substrate to function as a single electronic device, or a plurality of pairs of electrodes 3 may be provided on a single substrate to provide a plurality of electronic devices. It may have a function as.

A form in which a plurality of elements 2 (or multilayer capacitors 6) are sealed is shown in FIG.

  Next, the electrode 3 will be described.

  The electrodes 3 are a pair of conductive members provided at both ends of the element 2 (or the multilayer capacitor 6), and are electrically connected to an external mounting substrate through the terminal portion 4, the lead terminal 8, and the like. (Or the multilayer capacitor 6). The electrodes 3 are usually provided as a pair at both ends of the element 2 (or the multilayer capacitor 6), but may be provided at an intermediate portion of the element 2 (or the multilayer capacitor 6), not at both ends. It is. Alternatively, not the side surface of the element 2 (or the multilayer capacitor 6), it may be provided on the upper and lower surfaces, or may be provided on the side surface and the front surface of the upper and lower surfaces, and only a part thereof. It may be provided or may be provided so as to protrude from the other surface.

  Examples of the material of the electrode 3 include a metal material containing at least one of Ni, Ag, Pd, Cu, Au, and the like. In particular, using Ni alone or an Ni alloy is advantageous in terms of cost. Moreover, these alloys and the thing by which the plating process was given to the surface may be used. Of course, an alloy or the like may be used, and it may be realized by any one of single layer and multilayer plating, vapor deposition, sputtering, and paste application.

  Next, the terminal part 4 will be described.

  The terminal portions 4 are connected to the electrodes 3 and are provided as a pair on the element 2 (or the multilayer capacitor 6). Usually, it is often provided at both ends, but may be provided at both ends. For example, when the electrode 3 is provided on the upper and lower surfaces, the electrode 3 and the terminal portion 4 formed on the upper and lower surfaces may be connected. The terminal portion 4 is made of a material containing at least one of Cu, Zn, Ni, Ag, Au, etc., and the surface thereof may be subjected to single layer or multilayer plating.

  The terminal portion 4 may be configured by bonding a metal cap to the dielectric substrate 2. Furthermore, it is preferable that the outermost part (outermost part) of the terminal part 4 is made of a conductive material having a melting point of 200 ° C. or higher. With this structure, even if a high temperature is applied to the electronic component by reflow or the like, the terminal The part 4 is not thermally damaged, and a stable reflow characteristic can be obtained.

  The terminal portion 4 is connected to the electrode 3 and is formed so as to be appropriately lowered to protrude outside the exterior material 5. At this time, for example, as shown in FIG. 1, it may be bent linearly with corners, may be linearly inclined, or may be stretched so as to draw a loose curve. If it is bent, the workability is good, and when it is formed to draw a curve, there is an advantage that strength is increased.

  Further, the exterior material 5 described later is realized by placing the element 2 (or multilayer capacitor 6) with the terminal portion 4 (or lead terminal 8) connected in a frame and pouring molten resin into the frame. Therefore, the terminal portion 4 is a corner portion where the bottom surface and the side surface of the exterior material intersect, or the bottom surface or the side surface, and protrudes from the vicinity of the corner portion.

  That is, the terminal portion 4 is connected to the element 2, the terminal portion 4 is processed to be bent and inserted into the frame in an upside down state, and the terminal portion 4 is fixed in a state of being caught so as to protrude from the frame. When the resin is poured into the frame, the resin serving as the exterior material 5 is filled up to the virtual plane created by the terminal portion 4. As a result, the terminal portion 4 intersects the bottom surface and the side surface of the exterior material 5. The shape protrudes from the corner or the vicinity thereof. This is the state shown in FIG. With such a manufacturing process, man-hours and fine adjustment are not required and costs can be reduced.

  Although the terminal portion 4 has been described above, the same applies to the lead terminal 8 to be described later, even if it protrudes from the exterior material.

  Here, the characteristic of the shape of the terminal part 4 and its merit are demonstrated.

  As shown in FIG. 10, when the terminal portion 4 protruding from the exterior material 5 has a shape that gradually increases in thickness as it goes to the tip, the protruding terminal portion 4 is affected by an impact from the outside toward the tip. Although it is in an easy state, the shape that increases in thickness as it goes to the tip can avoid this influence and prevent the terminal part from bending, bending, etc. Impact resistance and durability can be improved, and mounting reliability can be improved.

  Alternatively, as shown in FIG. 11, in the case of a mountain shape where the central portion between the protruding base and the tip is thick, it becomes a fulcrum such as a bend, so that the stress is easily applied to the base and the influence of impact. It is possible to balance the forces applied to the tips that are susceptible to the impact, and to effectively disperse the impact from the outside on the terminal portion 4.

  For this reason, it is excellent in durability and impact resistance, As a result, it can be set as an electronic component with high mounting reliability.

  Next, as shown in FIG. 12, when the terminal portion 4 protruding to the outside of the exterior material 5 becomes thinner toward the tip, the elastic force of the terminal portion 4 increases, and the mounting substrate In the case of mounting, the pressure applied to the mounting substrate becomes high, and it becomes strong against deflection due to impact after mounting. In particular, the use of a metal having high elasticity or springiness as the material of the terminal portion 4 further improves the bending resistance.

  Alternatively, as shown in FIG. 13, by increasing the thickness of the portion protruding to the outside rather than the terminal portion 4 existing inside the exterior material 5, the terminal portion 4 is naturally strong in impact resistance. It is excellent in durability, impact resistance, heat resistance, etc., and is the same at the time of manufacture, transportation, mounting, and after mounting, and it can be a terminal portion 4 that can improve mounting reliability. In order to realize low-cost manufacturing, even if there is no play or allowance in the protrusion of the terminal portion 4 from the exterior material 5, it is possible to improve the bending resistance and the like.

  The above-described devices for the shape of the terminal portion 4 may be combined as appropriate.

  Next, the exterior material 5 will be described.

  As shown in FIG. 1 and the like, the exterior material 5 is one of electronic elements such as a resistor and an inductor including the element 2 (or multilayer capacitor 6), and a terminal portion 4 (or lead terminal 8) connected thereto. The part is molded.

  As the material of the exterior material 5, an epoxy resin such as an optocresol novolac type, a biphenyl type, or a pentadiene type is suitably used.

  Further, the minimum value of the distance between the surface of the outer packaging material 5 and the surface of the element 2 (or the multilayer capacitor 6) (the thinnest portion of the outer packaging material 5) is set to 0.1 mm or more to improve the outer skin pressure resistance. be able to. Furthermore, the electronic component 1 strong against pressure | voltage resistance, moisture resistance, and heat resistance is realizable by setting it as a value beyond this.

Further, by providing chamfering (R) at the corners of the exterior member 5, it is possible to improve the impact resistance from the outside. At this time, the corner is a straight corner or an arc corner.

  Further, the shape of the exterior member 5 may be a general columnar shape, may be a substantially rectangular parallelepiped, may be a substantially cube, or may be a trapezoid as shown in FIG. Alternatively, although other polygons may be used, a trapezoidal shape in which a substantially rectangular parallelepiped or a side surface is a tapered surface is preferable from the viewpoint of cost. In addition, there are unavoidable irregularities on the surface when the exterior material 5 is molded. In the case of a substantially rectangular parallelepiped or the like, a bottom surface and a side surface are generated, and a corner portion (which may be a perfect linear corner portion or an arc-shaped corner portion) is generated by these.

  Next, the multilayer capacitor 6 will be described.

  The multilayer capacitor 6 is formed by laminating a substrate made of a dielectric material with a plurality of sheets to form the internal electrode 7, and can have the same size and higher capacity than a single plate capacitor or the like.

  The dielectric base is a base made of a dielectric, and a dielectric material such as titanium oxide or barium titanate is preferably used. Or alumina etc. are also used. Using such a material, it is appropriately formed in a necessary shape and size.

  The internal electrode 7 is an electrode embedded in the dielectric substrate, and examples of the constituent material of the internal electrode 7 include metal materials and alloys containing at least one of Ni, Ag, Pd, Cu, Au, and the like. . In particular, using Ni alone or an Ni alloy is advantageous in terms of cost. Moreover, these alloys and the thing by which the plating process was given to the surface may be used. Of course, an alloy or the like may be used. The internal electrode 7 has a thickness of 1 to 5 μm. Moreover, it is preferable that the space | interval of adjacent internal electrodes 7 shall be 15 micrometers or more.

  The internal electrode 7 is electrically connected to the electrode 3. The internal electrode 7 connected to only one of the electrodes 3 and the internal electrode 7 connected to only the other of the electrodes 3 are opposed to each other. The main capacity is generated between the seven.

  Next, the terminal portion 4 is connected to the electrode 3. The terminal portion 4 is as described above. A pair of terminal portions 4 are connected to the electrodes, and a pair of lead terminals 8 are connected to the terminal portions 4.

The size of the multilayer capacitor 6 is as follows: L1 is the length, L2 is the height, and L3 is the width.
3.0mm ≦ L1 ≦ 5.5mm
0.5mm ≦ L2 ≦ 2.5mm
1.5mm ≦ L3 ≦ 3.5mm
Of course, the size may be other than this, and a plurality of multilayer capacitors 6 may be sealed by the outer packaging material 5 instead of a single size.

  If L1 to L3 are made smaller than the above lower limit value, the formation area of the internal electrodes 7 becomes insufficient, or the interval between the internal electrodes 7 becomes inevitably narrow, and the number of internal electrodes 7 must be reduced. It becomes difficult to obtain a large capacitance value and it becomes difficult to obtain an electronic component having a wide capacity.

Further, when the multilayer capacitor 6 is molded with the exterior material 5, in order to prevent damage to the multilayer capacitor 6 due to an impact, chamfering is provided at the corner of the multilayer capacitor 6 or an arc-shaped curve curve is formed. It is also preferable to provide a part or all of each side surface.

  Next, the lead terminal 8 will be described.

  The lead terminals 8 are connected to the pair of terminal portions 4, pulled out of the exterior material 5, and mounted on the mounting board, thereby realizing electrical conduction between the internal element 2 and the multilayer capacitor 6 and the board. It is formed by a pair used as a terminal for doing. Depending on the number of elements molded inside, one or more pairs may be used, and the shape of the lead terminal 8 may be various, such as a rectangle, an ellipse, a square, and a line. A shape, formation of a tapered portion, formation of a slit or the like is also suitable. Further, the size and width may be determined as appropriate according to the balance with the required mounting area, mounting strength, element size, and the like.

  The lead terminal 8 is formed of a conductor like the terminal portion 4 and is formed of various metals. It is made of a material containing at least one of Cu, Zn, Ni, Ag, Au and the like, and the surface thereof may be subjected to single layer or multilayer plating. An alloy may also be used.

  Further, the lead terminal 8 protrudes from a corner portion between the bottom surface and the side surface of the exterior member 5, and this corner portion is a straight corner portion or a circular corner portion, so-called square shape. It protrudes from the position.

  Or although it is from the bottom face or side surface of the exterior material 5, it protrudes from the position where a bottom face and a side surface cross | intersect, ie, the position close | similar to the corner | angular part.

  At this time, the exterior material is not limited to the corners between the bottom surface and the side surface formed when the exterior material is a substantially rectangular parallelepiped or a trapezoidal column, and even if the exterior material is rounded as a whole, the virtual bottom surface It may protrude from the corner where the surfaces regarded as side surfaces intersect. The same applies to the protrusion of the terminal portion 4.

  The terminal portion 4 and the lead terminal 8 are provided not only on the side surfaces of the element 2 and the multilayer capacitor 6 but also on the upper and lower surfaces, and may be drawn out of the exterior material 5 therefrom.

  Here, as in the case of the terminal portion 4, the feature of the shape of the lead terminal 8 and its merit will be described.

  First, as shown in FIG. 21, when the lead terminal 8 protruding from the outer packaging material 5 has a shape that gradually increases in thickness toward the tip, the tip of the protruding lead terminal 8 is affected by an external impact. Although it is in a state where it is easy to receive, the shape that increases in thickness as it goes to the tip can avoid this influence and prevent the lead terminal 8 from being bent, bent, etc. The impact resistance and durability at the time can be improved, and the mounting reliability can be improved.

  Alternatively, as shown in FIG. 22, in the case where the central portion between the protruding base and the tip becomes thicker, it becomes a fulcrum such as a bend, so that the stress is easily applied to the root or impact. The force applied to the sensitive tip can be balanced, and the impact from the outside can be well distributed on the lead terminal 8.

  For this reason, it is excellent in durability and impact resistance, As a result, it can be set as an electronic component with high mounting reliability.

Next, as shown in FIG. 23, when the lead terminal 8 protruding to the outside of the exterior member 5 becomes thinner toward the tip, the elastic force of the lead terminal 8 increases, and the mounting substrate is In the case of mounting, the pressure applied to the mounting substrate becomes high, and it becomes strong against deflection due to impact after mounting. In particular, the use of a metal having high elasticity or springiness as the material of the lead terminal 8 further improves the bending resistance.

  Alternatively, as shown in FIG. 24, the lead terminal 8 having a high impact resistance is naturally formed by increasing the thickness of the portion protruding to the outside rather than the lead terminal 8 existing inside the exterior member 5. It is excellent in durability, impact resistance, heat resistance, etc., and is the same at the time of manufacturing, transportation, mounting, and after mounting, and can be a lead terminal 8 that can improve mounting reliability. In order to realize low-cost manufacturing, even if there is no play or allowance in the protrusion of the lead terminal 8 from the exterior member 5, it is possible to improve the flexibility resistance and the like.

  The above-described devices for the shape of the lead terminals 8 may be combined as appropriate. These are the same as the device of the shape of the terminal part 4 described above, and a structure in which the terminal part 4 protrudes directly to the outside of the outer packaging material 5 and a lead terminal 8 connected to the terminal part 4 are provided. The structure of projecting the exterior of the exterior material 5 is not particularly different, and is determined and selected as appropriate from the specifications such as the characteristics of the element to be sealed in terms of manufacturing, cost, structure, and the like. is there.

  Next, the reinforcing members 10, 14, 15, 16, the protruding portion 11, and the bottom reinforcing members 12, 13 will be described.

  The reinforcing material 10 is provided at the corner of the base portion where the terminal portion 4 and the lead terminal 8 protrude from the exterior material 5. Due to the presence of the reinforcing material 10, durability against stress that tends to be applied to the protruding terminal portions 4 and the root portions of the lead terminals 8 is increased. The reinforcing material 10 is bonded to the surface of the exterior material 5 and the terminal portion 4 or the base portion of the lead terminal 8 respectively, and can resist stress at the base portion of the terminal portion 4 or the lead terminal 8.

  As the material of the reinforcing material 10, a resin, a ceramic, or the like is used, and an epoxy resin or the like is preferably used as in the case of the exterior material 5. It is also preferable to use the same material as the exterior material 5.

  Further, as shown in FIG. 2 and the like, the reinforcing material 10 is extended above the side surface of the exterior material 5, thereby expanding the bonding area between the exterior material and the reinforcement material 10 and further improving its impact resistance. It is also suitable. Of course, contrary to FIG. 2, it is also preferable to extend along the terminal portion 4 or the lead terminal 8 side to enlarge the bonding area of the reinforcing material 10 and further improve the impact resistance.

  Further, the reinforcing material 10 may be a method in which a separate member is adhered after the electronic component 1 is formed, but as shown in FIG. 3, a protruding portion 11 is formed on the exterior material 5 itself (for example, It may be bonded to the terminal portion 4 or the lead terminal 8 by, for example, providing a shape to be the protruding portion 11 in advance in a mold into which the exterior material is poured. In this case, there is an advantage that the process is reduced and the cost is reduced.

  Further, as shown in FIGS. 1, 2, 15 and the like, the reinforcing material is a corner portion where the exterior material and the terminal portion 4 (or the lead terminal 8) intersect, and may be provided on the non-mounting surface. As shown in FIG. 4 and the like, it is also preferable to use the bottom reinforcing members 12 and 13 on the mounting surface side of the electronic component 1.

In FIG. 4 and the like, the bottom surface reinforcing material 12 is formed so as to cover at least part of the bottom surface of the exterior material 5 and the terminal portion 4 (or the lead terminal 8). By forming in this way, FIG.
In the same way as when the reinforcing material 10 is formed at the corner, the electronic component 1 is improved in the impact resistance by enhancing the strength of the protruding root portion that is most likely to be bent and stressed. It is something that can be done. In addition, by being provided on the bottom surface, the appearance after mounting is good, and further, play (margin) between the exterior material 5 and the mounting substrate can be generated, so that durability against deflection can be improved. It can be done.

  Furthermore, as shown in FIG. 5 and the like, the bottom reinforcing material 12 is formed on a part of the bottom surface of the terminal portion 4 and the lead terminal 8, thereby creating a space with the mounting substrate. The terminal portion 4 and the lead terminal 8 are provided with a recess, and the bottom reinforcing member 12 is fitted into the recess so that the mounting surface of the terminal portion 4 and the lead terminal 8 does not form a space between the mounting substrate and the mounting surface. It is also suitable to do. In this case, the thickness of the protruding portion of the terminal portion 4 and the lead terminal 8 is inevitably increased, and a positive effect of further improving impact resistance can be expected.

  Alternatively, when the concave portion is not formed in this way, a mounting land provided on the mounting substrate side may be raised, and the space generated by forming the bottom surface reinforcing material by the rising may be filled.

  Further, it is necessary to provide the bottom reinforcing member 12 as shown in FIG. 4 at at least two places. However, the bottom reinforcing member 13 shown in FIGS. 6, 13, and 20 has the entire bottom surface of the exterior member 5 and the terminal portion 4. Since it is provided over a part of (or the lead terminal 8), it is only necessary to provide it at one place, and there is an advantage that manufacture is easier. Furthermore, since the entire bottom surface of the exterior material 5 is covered and is reinforced with one bottom surface reinforcing material over the terminal portion 4 (or the lead terminal 8) protruding from both ends, the protruding base portion is applied from the outside. There is also a merit that it will become more resistant to stress.

  The bottom reinforcing members 12 and 13, the reinforcing member 10, or the protruding portion 11 may be used in combination as necessary.

  Further, the bottom reinforcing material may be applied or pasted with a resin paste or the like.

  Further, a reinforcing material may be provided on the non-mounting surface of the terminal portion 4 or the lead terminal 8 like the reinforcing materials 14, 15, 16.

  The reinforcing material 14 may be provided at least in part along the peripheral frame that is the outer periphery of the terminal portion 4 (or the lead terminal 8). The material of the reinforcing material 14 may be the same as that of the reinforcing material 10, and a separately formed member may be bonded to the non-mounting surface of the terminal portion 4 or the lead terminal 8, or integrated with the exterior material 5. It may be formed and bonded to the terminal portion 4 or the like. Moreover, it may be provided over the entire circumference of the outer periphery, or may be provided in part, and may be determined as appropriate depending on the required strength required for impact resistance and the like.

  The reinforcing material 15 is formed along substantially the center of the terminal portion 4 (or the lead terminal 8) in the longitudinal direction (direction from the root portion to the end portion). As a result, the impact resistance in the longitudinal direction, which is weak against stress, is improved, and further, the mounting pressing force is increased when the terminal portion 4 and the lead terminal 8 are mounted, so that the mounting reliability is improved. . Alternatively, since the mounting pressing force is increased, durability against the flexibility after mounting is improved, and there is an advantage that the flexibility is improved.

  The reinforcing material 15 may be provided in the longitudinal direction even if it is not substantially in the center, and the reinforcing material 15 may be rod-shaped, columnar, or plate-shaped, and may be provided in a plural number instead of a single one.

  Next, the reinforcing material 16 is formed at the tip of the terminal portion 4 or the lead terminal 8.

  By forming at the tip portion, it is possible to reduce the influence at the tip portion of the terminal portion 4 and the lead terminal 8, which is easily subjected to stress due to an impact from the outside, and to improve impact resistance. Furthermore, by being provided at the tip portion, it becomes a weight at the tip portion, the press-contact force against the mounting substrate is increased, the mounting reliability is improved, especially the durability against impact, etc. is improved. Although there is no allowance or tolerance between the terminal portion 4 (or the lead terminals 8), there is an advantage that the bending resistance is improved.

  Further, compared to the other reinforcing materials 14 and 15, the amount of members used for the reinforcing material 16 can be reduced, and there is an advantage that the cost can be reduced.

  In addition to the reinforcing material 10 and the bottom surface reinforcing material 12 provided on the exterior material 5, these reinforcing materials provided on the terminal portion 4 or the lead terminal 8 may be used in combination as appropriate. Well, by combining variously, it is possible to realize the electronic component 1 having extremely high durability, impact resistance, and flexibility, and high mounting reliability.

  Such an electronic component 1 makes it possible to make the electronic component 1 with a long life, and it is possible to realize the durability and long life of the electronic device on which the electronic component 1 is mounted. .

  With the structure as described above, the manufacturing process is simplified and the cost is kept low, while the impact resistance, durability, heat resistance, and moisture resistance in the lead terminal 8 and the terminal portion 4, which have been problems in the conventional technology, are maintained. The electronic component 1 suitable for practical use is realized by improving the performance, the mounting reliability, the deflection resistance, and the like, and has an effect for extending the life of the electronic device on which the electronic component 1 is mounted.

  The present invention is an electronic component having an element, a pair of terminal portions provided on the element, a part of the terminal portion, and an exterior material that covers the element, wherein the terminal portion is a bottom portion and a side corner portion of the exterior material. The terminal portion protruding from the exterior material, while maintaining the low cost as in the past in the manufacture of electronic components, by the configuration provided with a reinforcing material in the terminal portion or exterior material protruding from the exterior material, Or, it is possible to prevent bending or warping caused by external impact during manufacturing, transportation or mounting on lead terminals, and it is necessary to have electronic components with high mounting reliability by strengthening impact resistance and durability. It can also be applied to applications.

The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The top view of the electronic component in embodiment of this invention The top view of the electronic component in embodiment of this invention The top view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The perspective view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The top view of the electronic component in embodiment of this invention The top view of the electronic component in embodiment of this invention The top view of the electronic component in embodiment of this invention Side view of electronic components in the prior art Side view of electronic components in the prior art

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component 2 Element 3 Electrode 4 Terminal part 5 Exterior material 6 Multilayer capacitor 7 Internal electrode 8 Lead terminal 10, 14, 15, 16 Reinforcing material 11 Protruding part 12, 13 Bottom surface reinforcing material 100 Electronic component 101 Element 102 Internal electrode 103 Electrode 104 Lead terminal 105 Exterior material

Claims (48)

Elements,
A pair of terminal portions provided on the element;
An electronic component having an exterior material covering a part of the terminal portion and the element,
An electronic component, wherein the terminal portion protrudes from a corner portion of a bottom surface and a side surface of the exterior material, and a reinforcing material is provided on the terminal portion or the exterior material projecting from the exterior material. 2. The electronic component according to claim 1, wherein the reinforcing material is provided at an intersection with the exterior material and a terminal portion protruding from the exterior material. The electronic component according to claim 2, wherein the reinforcing material is a member bonded at the intersection with the exterior material and a terminal portion protruding from the exterior material. The reinforcing material is a projecting portion that protrudes from the side surface of the exterior material along the main surface of the terminal portion at the intersection of the exterior material and the terminal portion projecting from the exterior material. The electronic component according to claim 1. The electronic component according to claim 1, wherein the reinforcing material is bonded to a surface of the terminal portion protruding from the exterior material. The electronic component according to claim 1, wherein the reinforcing material is integrally formed of the same material as the exterior material. In addition to or instead of the reinforcing material, it is formed on the bottom surface of the exterior material and the protruding terminal portion so as to cover at least a part of both the exterior material and the terminal portion protruding from the exterior material. The electronic component according to claim 1, further comprising a bottom reinforcing material. The electronic component according to claim 7, wherein the bottom reinforcing material is formed from the entire front surface of the exterior material to a part of the protruding terminal portion. 9. The electronic component according to claim 7, wherein the bottom reinforcing material is formed by applying a paste resin after the exterior material is formed. The electronic component according to any one of claims 7 to 9, wherein the bottom reinforcing material is formed by being attached to at least a part of a bottom surface of the exterior material and a terminal portion protruding from the exterior material. . The electronic component according to claim 1, wherein the reinforcing material is provided on at least a part of a peripheral frame of a non-mounting surface of the terminal portion protruding from the exterior material. The electronic component according to claim 1, wherein the reinforcing material is provided at least at a part of a substantially central portion in a longitudinal direction of a non-mounting surface of the terminal portion protruding from the exterior material. The electronic component according to any one of claims 1 to 12, wherein the reinforcing material is provided at a tip portion of the non-mounting surface of the terminal portion protruding from the exterior material. 14. The electronic component according to claim 1, wherein a thickness of the terminal portion protruding from the exterior material is increased toward a tip in the terminal portion. The thickness of the terminal part which protrudes from the said exterior material in the said terminal part is rising in the mountain shape in the approximate center part between the root of a protrusion part, and a front-end | tip part, The one of Claims 1-13 characterized by the above-mentioned. 1 is an electronic component. 14. The electronic component according to claim 1, wherein in the terminal portion, the thickness of the terminal portion protruding from the exterior material becomes thinner toward the tip. The electronic component according to claim 1, wherein the terminal portion has a portion where the thickness outside the exterior material is thicker than the thickness inside the exterior material. . 18. The electronic component according to claim 1, wherein the element is a single plate capacitor having a dielectric substrate and an electrode connected to the terminal portion. 18. The multilayer capacitor having a dielectric base body in which an internal electrode is embedded and a pair of terminal portions provided on the dielectric base body, wherein the element is a multilayer capacitor. Electronic components. The electronic device according to claim 1, wherein the device is a device in which a plurality of pairs of terminal portions are provided on a single base. 21. The electronic component according to claim 1, wherein the position where the terminal portion protrudes is a position where a bottom surface and a side surface of the exterior material intersect. The position where the terminal portion protrudes is a bottom surface of the exterior material, and is a position close to an intersection between the side surface and the bottom surface of the exterior material. The electronic component described. 21. The position according to claim 1, wherein the position where the terminal portion protrudes is a side surface of the exterior material, and is a position close to an intersection between the bottom surface and the side surface of the exterior material. Electronic components. A dielectric substrate having an internal electrode embedded therein, and a plurality of multilayer capacitors having a pair of terminal portions provided on the dielectric substrate;
A pair of lead terminals connected to the pair of terminal portions;
An electronic component having an exterior material covering a part of the lead terminal, the multilayer capacitor, and the terminal portion,
An electronic component, wherein the lead terminal portion protrudes from a corner portion between a bottom surface and a side surface of the exterior material, and a reinforcing material is provided on the lead terminal projecting from the exterior material or the exterior material. 25. The electronic component according to claim 24, wherein the reinforcing material is provided at an intersection between the exterior material and a lead terminal protruding from the exterior material. 25. The electronic component according to claim 24, wherein the reinforcing material is a member bonded at an intersection with the exterior material and a lead terminal protruding from the exterior material. The reinforcing material is a projecting portion that protrudes from a side surface of the exterior material along the main surface of the lead terminal at an intersection between the exterior material and the lead terminal projecting from the exterior material. The electronic component according to any one of claims 24 to 26. 28. The electronic component according to claim 24, wherein the reinforcing material is bonded to a surface of a lead terminal protruding from the exterior material. The electronic component according to any one of claims 24 to 28, wherein the reinforcing material is integrally formed of the same material as the exterior material. In addition to or instead of the reinforcing material, the outer material and the bottom surface of the protruding lead terminal are formed so as to cover at least a part of both the outer material and the lead terminal protruding from the outer material. 25. The electronic component according to claim 24, further comprising a bottom reinforcing material. 31. The electronic component according to claim 30, wherein the bottom reinforcing material is formed from the entire front surface of the exterior material to a part of the protruding lead terminal. 32. The electronic component according to claim 30, wherein the bottom reinforcing material is formed by applying a paste resin after the exterior material is formed. The electronic component according to any one of claims 30 to 32, wherein the bottom reinforcing material is formed by being attached to at least a part of a bottom surface of the exterior material and a lead terminal protruding from the exterior material. . 34. The electronic component according to claim 24, wherein the reinforcing material is provided on at least a part of a peripheral frame of a non-mounting surface of the lead terminal protruding from the exterior material. The electronic component according to any one of claims 24 to 34, wherein the reinforcing material is provided at least at a part of a substantially central portion in a longitudinal direction of a non-mounting surface of the lead terminal protruding from the exterior material. 36. The electronic component according to any one of claims 24 to 35, wherein the reinforcing material is provided at a front end portion of the lead terminal that protrudes from the exterior material. 37. The electronic component according to claim 24, wherein in the lead terminal, the thickness of the lead terminal protruding from the exterior material increases toward the tip. 37. The lead terminal according to claim 24, wherein a thickness of the lead terminal protruding from the exterior material is raised in a mountain shape at a substantially central portion between the root and the tip of the protruding portion. Or the electronic component according to claim 1. 37. The electronic component according to claim 24, wherein in the lead terminal, the thickness of the lead terminal protruding from the exterior material becomes thinner toward the tip. 40. The electronic component according to any one of claims 24 to 39, wherein the lead terminal has a portion where the thickness outside the exterior material is thicker than the thickness inside the exterior material. . 41. The electronic component according to claim 24, wherein the multilayer capacitor is a multilayer capacitor in which a plurality of pairs of terminal portions are provided on a single substrate. 42. The electronic component according to any one of claims 24 to 41, wherein the position where the lead terminal protrudes is a position where a bottom surface and a side surface of the exterior material intersect. 42. The position according to any one of claims 24 to 41, wherein the position where the lead terminal protrudes is a bottom surface of the exterior material and a position close to an intersection of the side surface and the bottom surface of the exterior material. The electronic component described. The position where the lead terminal protrudes is a side surface of the exterior material, and is a position close to the intersection of the bottom surface and the side surface of the exterior material. Electronic components described in The electronic component according to claim 1, wherein a plurality of the elements are sealed inside the exterior material. 45. The electronic component according to claim 24, wherein a plurality of the multilayer capacitors are sealed inside the exterior material. Elements,
A pair of terminal portions provided on the element;
An electronic component having an exterior material covering a part of the terminal portion and the element,
An electronic component comprising a terminal member protruding from the exterior material or a reinforcement material on the exterior material. A dielectric substrate having an internal electrode embedded therein, a plurality of multilayer capacitors having a pair of terminal portions provided on the dielectric substrate;
A pair of lead terminals connected to the pair of terminal portions;
An electronic component having an exterior material covering a part of the lead terminal, the multilayer capacitor, and the terminal portion,
An electronic component comprising a lead terminal protruding from the exterior material or a reinforcing material provided on the exterior material.

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