JPS63152227U - - Google Patents

Info

Publication number
JPS63152227U
JPS63152227U JP4257787U JP4257787U JPS63152227U JP S63152227 U JPS63152227 U JP S63152227U JP 4257787 U JP4257787 U JP 4257787U JP 4257787 U JP4257787 U JP 4257787U JP S63152227 U JPS63152227 U JP S63152227U
Authority
JP
Japan
Prior art keywords
terminal
wrapped
electronic component
products
contact surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4257787U
Other languages
Japanese (ja)
Other versions
JPH051062Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4257787U priority Critical patent/JPH051062Y2/ja
Publication of JPS63152227U publication Critical patent/JPS63152227U/ja
Application granted granted Critical
Publication of JPH051062Y2 publication Critical patent/JPH051062Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Details Of Resistors (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す一部断面図、
第2図は使用状態を示す図である。 1…電子部品、2…樹脂モールド、3…モール
ドフレーム、3a…立ち上部分、4…シリコンリ
ング、6…プリント基板。
FIG. 1 is a partial sectional view showing an embodiment of the present invention;
FIG. 2 is a diagram showing the state of use. DESCRIPTION OF SYMBOLS 1... Electronic component, 2... Resin mold, 3... Mold frame, 3a... Standing part, 4... Silicon ring, 6... Printed circuit board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子素子が樹脂モールドされ、樹脂モールド外
皮から外部引き出し端子を設けたものにおいて、
上記端子を基板接触面との間を膨張を吸収する長
さとし、かつ端子に弾力性のあるもので包むよう
にしたことを特徴とする電子部品。
In products where electronic elements are resin molded and external terminals are provided from the resin mold outer shell,
An electronic component characterized in that the terminal has a length that absorbs expansion between the terminal and the substrate contact surface, and the terminal is wrapped with an elastic material.
JP4257787U 1987-03-25 1987-03-25 Expired - Lifetime JPH051062Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4257787U JPH051062Y2 (en) 1987-03-25 1987-03-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4257787U JPH051062Y2 (en) 1987-03-25 1987-03-25

Publications (2)

Publication Number Publication Date
JPS63152227U true JPS63152227U (en) 1988-10-06
JPH051062Y2 JPH051062Y2 (en) 1993-01-12

Family

ID=30858621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4257787U Expired - Lifetime JPH051062Y2 (en) 1987-03-25 1987-03-25

Country Status (1)

Country Link
JP (1) JPH051062Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005317608A (en) * 2004-04-27 2005-11-10 Matsushita Electric Ind Co Ltd Electronic component
JP2005347503A (en) * 2004-06-03 2005-12-15 Matsushita Electric Ind Co Ltd Electronic component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005317608A (en) * 2004-04-27 2005-11-10 Matsushita Electric Ind Co Ltd Electronic component
JP2005347503A (en) * 2004-06-03 2005-12-15 Matsushita Electric Ind Co Ltd Electronic component

Also Published As

Publication number Publication date
JPH051062Y2 (en) 1993-01-12

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