JPS6333659U - - Google Patents
Info
- Publication number
- JPS6333659U JPS6333659U JP1986126790U JP12679086U JPS6333659U JP S6333659 U JPS6333659 U JP S6333659U JP 1986126790 U JP1986126790 U JP 1986126790U JP 12679086 U JP12679086 U JP 12679086U JP S6333659 U JPS6333659 U JP S6333659U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible
- flexible circuit
- rigid
- rigid circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
Description
第1図は、本考案にかかるリジツド回路基板と
フレキシブル回路基板の接続部分の構造を示す図
。第2図は、第1図に示した実施例の接続部分を
樹脂モールドした状態を示す図。第3図は、第2
図A部拡大図。第4図は、従来の接続部分を示す
図。第5図は、第4図接続部をモールドした図。
第6図は、第5図B部拡大図。第7図は、本考案
による他の実施例を示す図。
1……リジツド回路基板、2……フレキシブル
回路基板、2a……フレキシブルフイルム、2b
……導電部、2c……フレキシブルフイルム切欠
き部、3……モールド樹脂、4……電極パターン
、5……空気層。
FIG. 1 is a diagram showing the structure of a connecting portion between a rigid circuit board and a flexible circuit board according to the present invention. FIG. 2 is a diagram showing a state in which the connecting portion of the embodiment shown in FIG. 1 is molded with resin. Figure 3 shows the second
Enlarged view of part A in the figure. FIG. 4 is a diagram showing a conventional connection part. FIG. 5 is a molded view of the connection portion shown in FIG. 4.
FIG. 6 is an enlarged view of part B in FIG. FIG. 7 is a diagram showing another embodiment of the present invention. 1... Rigid circuit board, 2... Flexible circuit board, 2a... Flexible film, 2b
...Conductive part, 2c...Flexible film notch, 3...Mold resin, 4...Electrode pattern, 5...Air layer.
Claims (1)
こし易い導電性物質でされたリジツド回路基板と
、 フレキシブルな材料でできたフレキシブル回路
基板を電気的に接続してなる部品において、 前記フレキシブル回路基板のリジツド回路基板
との電気的接続を行なう部分は、配線パターン部
以外のフレキシブルフイルム部分はとりのぞいた
構造になつている事を特徴とするリジツド回路基
板とフレキシブル回路基板の接続部の構造。 (2) 第1項記載の前記フレキシブル回路基板の
電気的接続を行なう部分は、配線パターン部以外
のフレキシブルフイルム部分の一部がとりのぞい
た構造になつていることを特徴とするリジツド回
路基板とフレキシブル回路基板の接続部の構造。[Scope of Claim for Utility Model Registration] (1) In a component formed by electrically connecting a rigid circuit board made of a conductive material whose circuit pattern tends to migrate and a flexible circuit board made of a flexible material. , A connection between a rigid circuit board and a flexible circuit board, characterized in that the part of the flexible circuit board that makes electrical connection with the rigid circuit board has a structure in which the flexible film part other than the wiring pattern part is removed. Department structure. (2) A rigid circuit board characterized in that the part of the flexible circuit board described in item 1 that performs electrical connection has a structure in which a part of the flexible film other than the wiring pattern part is removed. Structure of flexible circuit board connections.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986126790U JPS6333659U (en) | 1986-08-20 | 1986-08-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986126790U JPS6333659U (en) | 1986-08-20 | 1986-08-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6333659U true JPS6333659U (en) | 1988-03-04 |
Family
ID=31020935
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986126790U Pending JPS6333659U (en) | 1986-08-20 | 1986-08-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6333659U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005183451A (en) * | 2003-12-16 | 2005-07-07 | Fujikura Ltd | Bonding body and manufacturing method thereof |
-
1986
- 1986-08-20 JP JP1986126790U patent/JPS6333659U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005183451A (en) * | 2003-12-16 | 2005-07-07 | Fujikura Ltd | Bonding body and manufacturing method thereof |
JP4526813B2 (en) * | 2003-12-16 | 2010-08-18 | 株式会社フジクラ | Manufacturing method of joined body |
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