JPS6350101U - - Google Patents
Info
- Publication number
- JPS6350101U JPS6350101U JP14421886U JP14421886U JPS6350101U JP S6350101 U JPS6350101 U JP S6350101U JP 14421886 U JP14421886 U JP 14421886U JP 14421886 U JP14421886 U JP 14421886U JP S6350101 U JPS6350101 U JP S6350101U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- terminal
- resin
- terminals
- component element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000012943 hotmelt Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Thermistors And Varistors (AREA)
Description
第１図はこの考案の実施例である電子部品の内
部構造を表す断面図、第２図は同電子部品に用い
られる端子の形状を表す斜視図、第３図および第
４図はこの種の電子部品の使用例を表す回路図で
ある。
１，２……端子、３……絶縁性熱溶融樹脂、３
ａ……導電膜、４……電子部品素子、５……ケー
ス、６……蓋。
Figure 1 is a sectional view showing the internal structure of an electronic component that is an embodiment of this invention, Figure 2 is a perspective view showing the shape of a terminal used in the electronic component, and Figures 3 and 4 are of this type. FIG. 2 is a circuit diagram illustrating an example of how electronic components are used. 1, 2...Terminal, 3...Insulating hot melt resin, 3
a... Conductive film, 4... Electronic component element, 5... Case, 6... Lid.
Claims (1)
の端部をケース外に突出させた電子部品において
、 前記端子の前記電子部品素子に接する箇所に絶
縁性熱溶融樹脂を介在させ、この絶縁性熱溶融樹
脂の表面に前記端子と電気的に導通する導電膜を
形成したことを特徴とする電子部品。[Scope of Claim for Utility Model Registration] An electronic component in which an electronic component element is sandwiched between terminals and the ends of these terminals protrude outside the case, in which an insulating thermal melt is applied to the part of the terminal that comes into contact with the electronic component element. An electronic component characterized in that a resin is interposed and a conductive film electrically connected to the terminal is formed on the surface of the insulating hot melt resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14421886U JPS6350101U (en) | 1986-09-20 | 1986-09-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14421886U JPS6350101U (en) | 1986-09-20 | 1986-09-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6350101U true JPS6350101U (en) | 1988-04-05 |
Family
ID=31054613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14421886U Pending JPS6350101U (en) | 1986-09-20 | 1986-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6350101U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0732904U (en) * | 1993-11-29 | 1995-06-16 | ニチアス株式会社 | Chip type varistor |
-
1986
- 1986-09-20 JP JP14421886U patent/JPS6350101U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0732904U (en) * | 1993-11-29 | 1995-06-16 | ニチアス株式会社 | Chip type varistor |
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