JPH01143178U - - Google Patents
Info
- Publication number
- JPH01143178U JPH01143178U JP4005288U JP4005288U JPH01143178U JP H01143178 U JPH01143178 U JP H01143178U JP 4005288 U JP4005288 U JP 4005288U JP 4005288 U JP4005288 U JP 4005288U JP H01143178 U JPH01143178 U JP H01143178U
- Authority
- JP
- Japan
- Prior art keywords
- lid
- base
- electronic component
- peripheral wall
- component element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図は、実施例に係るケースを開いて電子部
品素子と共に示す図である。第２図はおよび第３
図は、それぞれ、従来のケースを開いて示す図で
ある。
２２…ベース、２２ａ…接着代、２３…金属端
子、２３ａ…露出部、２４…蓋、２４ａ…接着面
、２５…周壁、２６…電子部品素子。
FIG. 1 is a diagram showing the case according to the embodiment when opened and shown together with electronic component elements. Figures 2 and 3
Each of the figures is an open view of a conventional case. 22...Base, 22a...Adhesive allowance, 23...Metal terminal, 23a...Exposed portion, 24...Lid, 24a...Adhesive surface, 25...Peripheral wall, 26...Electronic component element.
Claims (1)
のを備え、このベース上に電子部品素子を乗せ、
その上から蓋を被せてそれとベース間を接着剤で
接着する構造のケースであつて、しかも前記ベー
スには、その周縁部に前記蓋との接着代を取つて
、前記電子部品素子がほぼきつちりと入る周壁が
一体成形されており、かつ外部接続用の金属端子
が、その一部分が前記周壁内であつて前記電子部
品素子と電気的に接続できる位置の表面に露出す
るようにインサート成形されていることを特徴と
する電子部品のケース。 A base and a box-shaped lid are both made of insulating resin, and electronic components are mounted on this base.
The case has a structure in which a lid is placed over the lid and the lid and the base are bonded with adhesive, and the electronic component element is held almost tightly on the base with an adhesive margin around the periphery of the lid. A dust-permeable peripheral wall is integrally molded, and a metal terminal for external connection is insert-molded so that a portion thereof is exposed on the surface of the peripheral wall at a position where it can be electrically connected to the electronic component element. An electronic component case characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4005288U JPH01143178U (en) | 1988-03-26 | 1988-03-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4005288U JPH01143178U (en) | 1988-03-26 | 1988-03-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01143178U true JPH01143178U (en) | 1989-10-02 |
Family
ID=31266528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4005288U Pending JPH01143178U (en) | 1988-03-26 | 1988-03-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01143178U (en) |
-
1988
- 1988-03-26 JP JP4005288U patent/JPH01143178U/ja active Pending
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