JPS63200395U - - Google Patents
Info
- Publication number
- JPS63200395U JPS63200395U JP9093587U JP9093587U JPS63200395U JP S63200395 U JPS63200395 U JP S63200395U JP 9093587 U JP9093587 U JP 9093587U JP 9093587 U JP9093587 U JP 9093587U JP S63200395 U JPS63200395 U JP S63200395U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- metal plate
- resin
- base
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図はこの考案の実施例である電子部品の分
解斜視図、第２図は完成された電子部品の外観を
示す斜視図、第３図はシールド用金属板の構造を
示す斜視図、第４図は電子部品の縦断面図、第５
図は従来の電子部品の構造を示す斜視図である。
１０……蓋、１１……樹脂部分、１２……シー
ルド用金属板、１３，１４……アース端子、２０
……表面波素子（電子部品素子）、３０……基台
。
Figure 1 is an exploded perspective view of an electronic component that is an embodiment of this invention, Figure 2 is a perspective view showing the appearance of the completed electronic component, Figure 3 is a perspective view showing the structure of a shielding metal plate, Figure 4 is a vertical cross-sectional view of the electronic component, Figure 5
The figure is a perspective view showing the structure of a conventional electronic component. 10...Lid, 11...Resin part, 12...Metal plate for shielding, 13, 14...Earth terminal, 20
...Surface wave element (electronic component element), 30... Base.
Claims (1)
ド用金属板と樹脂との一体成形からなる蓋を前記
基台に対して接合した電子部品であつて、 前記金属板に複数の貫通孔を形成するとともに
、アースとの接続部分を除く周囲を前記一体成形
樹脂でモールドしたことを特徴とする電子部品。[Scope of Claim for Utility Model Registration] An electronic component in which an electronic component element is fixed on an insulating base, and a lid made of integral molding of a shielding metal plate and resin is bonded to the base, comprising: An electronic component characterized in that a plurality of through holes are formed in a metal plate, and the periphery of the metal plate except for a connection part to earth is molded with the integrally molded resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9093587U JPS63200395U (en) | 1987-06-12 | 1987-06-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9093587U JPS63200395U (en) | 1987-06-12 | 1987-06-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63200395U true JPS63200395U (en) | 1988-12-23 |
Family
ID=30951262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9093587U Pending JPS63200395U (en) | 1987-06-12 | 1987-06-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63200395U (en) |
-
1987
- 1987-06-12 JP JP9093587U patent/JPS63200395U/ja active Pending
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