JPS6281335U - - Google Patents
Info
- Publication number
- JPS6281335U JPS6281335U JP17261885U JP17261885U JPS6281335U JP S6281335 U JPS6281335 U JP S6281335U JP 17261885 U JP17261885 U JP 17261885U JP 17261885 U JP17261885 U JP 17261885U JP S6281335 U JPS6281335 U JP S6281335U
- Authority
- JP
- Japan
- Prior art keywords
- external terminals
- electronic component
- conductor film
- film provided
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Slide Switches (AREA)
Description
第1図はこの考案の実施例を示す側面図、第2
図は要部の平面図、第3図は等価回路図である。
1……基板、2……抵抗素子、3,4……外部
端子、6……可動接触片、8……樹脂モールド部
、9,10……導体膜、11,12……ハンダ。
Figure 1 is a side view showing an embodiment of this invention, Figure 2 is a side view showing an embodiment of this invention.
The figure is a plan view of the main part, and FIG. 3 is an equivalent circuit diagram. DESCRIPTION OF SYMBOLS 1...Substrate, 2...Resistance element, 3, 4...External terminal, 6...Movable contact piece, 8...Resin mold part, 9, 10...Conductor film, 11, 12...Solder.
Claims (1)
品に少なくとも一方が接続される対をなす外部端
子と、前記外部端子間にまたがつてスライド自在
に設けた可動接触片と樹脂モールド部内に設置し
てなるデイツプスイツチにおいて、前記基板の少
なくとも側面および裏面に導体膜を設け、この裏
面に設けた導体膜に前記外部端子を重ねてハンダ
で固定してなるデイツプスイツチ。 A board having an electronic component mounted on its surface, a pair of external terminals with at least one of which is connected to the electronic component, a movable contact piece slidably provided between the external terminals, and a resin molded part. A deep switch comprising: a conductor film provided on at least the side and back surfaces of the substrate, and the external terminals stacked on the conductor film provided on the back surface and fixed with solder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17261885U JPS6281335U (en) | 1985-11-09 | 1985-11-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17261885U JPS6281335U (en) | 1985-11-09 | 1985-11-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6281335U true JPS6281335U (en) | 1987-05-25 |
Family
ID=31109320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17261885U Pending JPS6281335U (en) | 1985-11-09 | 1985-11-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6281335U (en) |
-
1985
- 1985-11-09 JP JP17261885U patent/JPS6281335U/ja active Pending
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