JPH03109393U - - Google Patents
Info
- Publication number
- JPH03109393U JPH03109393U JP1851990U JP1851990U JPH03109393U JP H03109393 U JPH03109393 U JP H03109393U JP 1851990 U JP1851990 U JP 1851990U JP 1851990 U JP1851990 U JP 1851990U JP H03109393 U JPH03109393 U JP H03109393U
- Authority
- JP
- Japan
- Prior art keywords
- case body
- electronic components
- electronic device
- resin
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Description
第１図は、実施例電子装置を示す断面図、第２
図は、実施例の耐水性電子装置を示す断面図、第
３図は、従来の電子装置を示す断面図である。
１…機器ケース、２…回路基板、３…電子部品
、６…樹脂モールド部。
FIG. 1 is a sectional view showing an example electronic device, and FIG.
The figure is a sectional view showing a water-resistant electronic device according to an embodiment, and FIG. 3 is a sectional view showing a conventional electronic device. 1...Equipment case, 2...Circuit board, 3...Electronic component, 6...Resin mold part.
Claims (1)
内装した電子装置において、 前記電子部品を熱伝導性の良い樹脂でモールド
し、この樹脂モールド部の表面適所を上記装置ケ
ース体の内面に接面させたことを特徴とする電子
装置。[Scope of Claim for Utility Model Registration] In an electronic device in which a circuit board on which electronic components are mounted is housed in a device case body, the electronic components are molded with a resin having good thermal conductivity, and the surface of the resin molded portion is placed at an appropriate place on the surface of the device. An electronic device characterized in that the surface is in contact with the inner surface of a case body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1851990U JPH03109393U (en) | 1990-02-26 | 1990-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1851990U JPH03109393U (en) | 1990-02-26 | 1990-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03109393U true JPH03109393U (en) | 1991-11-11 |
Family
ID=31521674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1851990U Pending JPH03109393U (en) | 1990-02-26 | 1990-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03109393U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014080931A1 (en) * | 2012-11-21 | 2014-05-30 | 株式会社カネカ | Heat dissipation structure |
-
1990
- 1990-02-26 JP JP1851990U patent/JPH03109393U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014080931A1 (en) * | 2012-11-21 | 2014-05-30 | 株式会社カネカ | Heat dissipation structure |
| JPWO2014080931A1 (en) * | 2012-11-21 | 2017-01-05 | 株式会社カネカ | Heat dissipation structure |