JPH0298699U - - Google Patents
Info
- Publication number
- JPH0298699U JPH0298699U JP749189U JP749189U JPH0298699U JP H0298699 U JPH0298699 U JP H0298699U JP 749189 U JP749189 U JP 749189U JP 749189 U JP749189 U JP 749189U JP H0298699 U JPH0298699 U JP H0298699U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- insulating coating
- coating film
- plastic casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 3
- 238000000576 coating method Methods 0.000 claims 3
- 239000011810 insulating material Substances 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案の一部省略断面側面図、第２図
は他の実施例を示す一部省略斜視図、第３図は従
来例を示す一部省略断面側面図である。
図中、１はプリント配線板、２は半導体集積回
路、３は下ケース、４は取付ボス、５は取付ネジ
、６は上ケース、７は上ケース６の取付孔、８は
プリント配線板１の取付孔、９は絶縁塗料、１０
は挿入ガイドである。
FIG. 1 is a partially omitted cross-sectional side view of the present invention, FIG. 2 is a partially omitted perspective view showing another embodiment, and FIG. 3 is a partially omitted cross-sectional side view showing a conventional example. In the figure, 1 is a printed wiring board, 2 is a semiconductor integrated circuit, 3 is a lower case, 4 is a mounting boss, 5 is a mounting screw, 6 is an upper case, 7 is a mounting hole in the upper case 6, and 8 is a printed wiring board 1 mounting hole, 9 is insulation paint, 10
is the insertion guide.
Claims (1)
装着する半導体集積回路等を搭載したプリント配
線板において、プラスチツク筐体に直接接触する
部位およびその周辺に耐熱性および耐湿性樹脂か
らなる絶縁塗膜を形成してなるプリント配線板。 (2) 上記プリント配線板の取付孔およびその周
辺に、上記絶縁塗膜を形成してなる請求項(1)記
載のプリント配線板。 (3) 上記プリント配線板の外周およびその周辺
に、上記絶縁塗膜を形成してなる請求項(1)記載
のプリント配線板。[Scope of Claim for Utility Model Registration] (1) In a printed wiring board mounted with a semiconductor integrated circuit etc. that is directly attached to a plastic casing made of an insulating material, the parts that come into direct contact with the plastic casing and their surroundings must be heat resistant and moisture resistant. A printed wiring board formed with an insulating coating made of synthetic resin. (2) The printed wiring board according to claim (1), wherein the insulating coating film is formed in and around the mounting hole of the printed wiring board. (3) The printed wiring board according to claim (1), wherein the insulating coating film is formed on the outer periphery of the printed wiring board and its periphery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP749189U JPH0298699U (en) | 1989-01-25 | 1989-01-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP749189U JPH0298699U (en) | 1989-01-25 | 1989-01-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0298699U true JPH0298699U (en) | 1990-08-06 |
Family
ID=31212543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP749189U Pending JPH0298699U (en) | 1989-01-25 | 1989-01-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0298699U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012253201A (en) * | 2011-06-03 | 2012-12-20 | Denso Corp | Electronic apparatus |
-
1989
- 1989-01-25 JP JP749189U patent/JPH0298699U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012253201A (en) * | 2011-06-03 | 2012-12-20 | Denso Corp | Electronic apparatus |