JPH0487652U - - Google Patents
Info
- Publication number
- JPH0487652U JPH0487652U JP13000490U JP13000490U JPH0487652U JP H0487652 U JPH0487652 U JP H0487652U JP 13000490 U JP13000490 U JP 13000490U JP 13000490 U JP13000490 U JP 13000490U JP H0487652 U JPH0487652 U JP H0487652U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- electronic component
- aluminum insulating
- bent
- component module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000000088 plastic resin Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第１図は本考案による電子部品モジユールケー
スの一実施例の断面図、第２図は同電子部品モジ
ユールケースに嵌合させるアルミ絶縁基板の一実
施例の平面図、第３図は従来の電子部品モジユー
ルケースの実施例の断面図、第４図は同電子部品
モジユールケースに嵌合させるアルミ絶縁基板の
実施例の平面図である。
図において、１は凸状金属ケース、２は取付け
鍔部、３は折曲げ先端部、４は取付け孔、５はア
ルミ絶縁基板、６は回路部品、７はプラスチツク
樹脂である。
Fig. 1 is a cross-sectional view of an embodiment of an electronic component module case according to the present invention, Fig. 2 is a plan view of an embodiment of an aluminum insulating substrate fitted to the electronic component module case, and Fig. 3 is a conventional example. FIG. 4 is a cross-sectional view of an embodiment of the electronic component module case, and FIG. 4 is a plan view of an embodiment of an aluminum insulating substrate fitted into the electronic component module case. In the figure, 1 is a convex metal case, 2 is a mounting collar, 3 is a bent end, 4 is a mounting hole, 5 is an aluminum insulating board, 6 is a circuit component, and 7 is a plastic resin.
Claims (1)
封止する凸状にした金属ケースとからなる電子部
品モジユールにおいて、前記金属ケースの左右に
形成された鍔部を凸部開口側へ先端部が鍔部内に
位置するように折曲げ、前記アルミ絶縁基板が前
記折曲げ先端部間に嵌合するようにしたことを特
徴とする電子部品モジユールケース。 In an electronic component module consisting of an aluminum insulating substrate on which a circuit component is mounted and a convex metal case that seals it, the flanges formed on the left and right sides of the metal case are moved toward the convex opening side so that the tip of the flanges 1. An electronic component module case characterized in that the aluminum insulating substrate is bent so as to be located within the bent portion, and the aluminum insulating substrate is fitted between the bent end portions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13000490U JPH0487652U (en) | 1990-11-30 | 1990-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13000490U JPH0487652U (en) | 1990-11-30 | 1990-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0487652U true JPH0487652U (en) | 1992-07-30 |
Family
ID=31877374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13000490U Pending JPH0487652U (en) | 1990-11-30 | 1990-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0487652U (en) |
-
1990
- 1990-11-30 JP JP13000490U patent/JPH0487652U/ja active Pending
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