JPH0291390U - - Google Patents
Info
- Publication number
- JPH0291390U JPH0291390U JP17140988U JP17140988U JPH0291390U JP H0291390 U JPH0291390 U JP H0291390U JP 17140988 U JP17140988 U JP 17140988U JP 17140988 U JP17140988 U JP 17140988U JP H0291390 U JPH0291390 U JP H0291390U
- Authority
- JP
- Japan
- Prior art keywords
- wall portion
- insulating resin
- circuit board
- resin case
- standing wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案に係る電子回路組立体に用いら
れる絶縁樹脂ケースの部分斜視図、第２図は同ケ
ースに回路基板を組付けて示す説明図である。
１：絶縁樹脂ケース、２：立壁部、３：回路基
板、４：電子部品。
FIG. 1 is a partial perspective view of an insulating resin case used in an electronic circuit assembly according to the present invention, and FIG. 2 is an explanatory view showing a circuit board assembled into the case. 1: Insulating resin case, 2: Standing wall, 3: Circuit board, 4: Electronic components.
Claims (1)
突出させて一体成形し、その立壁部２を回路基板
３に搭載する所望の電子部品４と対応位置させて
絶縁樹脂ケース１と回路基板３とを互いに組立て
たことを特徴とする電子回路組立体。 (2) 上記電子部品４を挿置可能な立体形に立壁
部２を成形したことを特徴とする請求項１記載の
電子回路組立体。[Scope of Claim for Utility Model Registration] (1) A standing wall portion 2 is integrally molded by protruding from the inner surface of an insulating resin case 1, and the standing wall portion 2 is positioned corresponding to a desired electronic component 4 to be mounted on a circuit board 3. An electronic circuit assembly characterized in that an insulating resin case 1 and a circuit board 3 are assembled together. (2) The electronic circuit assembly according to claim 1, wherein the vertical wall portion 2 is formed into a three-dimensional shape into which the electronic component 4 can be inserted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17140988U JPH0291390U (en) | 1988-12-28 | 1988-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17140988U JPH0291390U (en) | 1988-12-28 | 1988-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0291390U true JPH0291390U (en) | 1990-07-19 |
Family
ID=31463219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17140988U Pending JPH0291390U (en) | 1988-12-28 | 1988-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0291390U (en) |
-
1988
- 1988-12-28 JP JP17140988U patent/JPH0291390U/ja active Pending