JP2006012956A - Electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component that is manufactured by a low-cost manufacturing process, dispenses with a fine adjustment, or the like, and has extremely improved deflection resistance. <P>SOLUTION: The electronic component 1 comprises an element 2, a pair of terminals 4 provided at the element 2, an outer material 5 for covering one portion of the terminal 4 and the element 2, and a projection 10 on a bottom surface 9 in the outer material 5. The electronic component 1 improves deflection resistance by allowing the terminal 4 to project to the outside of the outer material 5 from the projection 10, and allows the terminal 4 to have relaxation absorption force. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic component suitably used for an electronic device such as a modem, a power supply circuit, a liquid crystal power supply, a DC-DC converter, and a power line communication device.

  Many electronic components are mounted in electronic devices such as modems and power supply circuits. For example, a capacitor is often used for noise removal or DC component cut.

  Here, electronic devices are required to be reduced in size and cost, and accordingly, electronic components are also required to be significantly reduced in size and cost. Furthermore, surface mounting electronic components are often required in order to reduce mounting cost and mounting area by automatic mounting. On the other hand, conflicting specifications such as high performance, reduction of characteristic variation, and improvement of durability have been demanded together with downsizing.

  Furthermore, with the increase in the number of pins of LSI and the like and the increase in the number of bits of signal lines, there is a need for high-density mounting in which a plurality of electronic components are mounted in a place where the line spacing is very narrow.

  In particular, a modem or the like often has a set of two lines for data input and data output, and two electronic components must be mounted on the line.

  In order to satisfy these requirements, various electronic devices have been proposed (see, for example, Patent Document 1 and Patent Document 2).

  In particular, as described in the above-mentioned patent documents, in order to cope with a high breakdown voltage, in an electronic component, the element is covered with an exterior material such as a resin to increase the breakdown voltage, thereby improving durability, heat resistance, and moisture resistance. It was broken.

  However, in this case, in order to enhance the deflection resistance of the terminal protruding outside, two exterior materials formed by a method such as transfer molding are bonded together, and the lead terminal protrudes from the bonding surface, etc. The configuration of was often taken. However, in such a form, the number of manufacturing steps is increased and the cost is often increased. In addition, since the terminal portion and the lead terminal protrude from the middle portion of the side surface of the exterior material, costs such as fine adjustment may be required.

  In order to cope with the above, the device with the terminal portion or lead terminal connected to the element is placed inside the mold so that the lead terminal is hooked outside the opening of the mold, and the molten resin is attached to the mold. There have been proposed electronic parts that are manufactured by pouring and the like and sealing them as exterior materials.

  FIG. 39 and FIG. 40 are side views of an electronic component in the prior art, and the shape is the result of taking the manufacturing method as described above, and there is an advantage that it can be manufactured at low cost.

Reference numeral 100 denotes an electronic component, and reference numeral 101 denotes an element, which includes various types of capacitors (single plate capacitors, multilayer capacitors, etc.), resistors, coils, filters, and other electronic elements. 102 is an internal electrode when the element 101 is a multilayer capacitor, 103 is an external electrode, 104 is a lead terminal, and 105 is an exterior material. Note that the lead terminal 104 connected to the element 101 and projecting from the exterior material 105 is called a terminal part when directly connected to the element, and a terminal part directly connected to the element is called a lead terminal. However, they are not strictly distinguished but the same.

As is clear from FIG. 39, in the electronic component 100 that is packaged by pouring resin into the frame in order to reduce the cost as described above, the lead terminal 104 is a corner (or or between the bottom surface and the side surface of the exterior material 105). The shape protrudes to the outside from substantially the vicinity thereof.
JP 2001-110691 A JP 2002-43170 A

  However, in the conventional electronic component shown in FIG. 39, since the terminal portion and the lead terminal 104 protrude from the corners of the bottom surface and the side surface of the exterior material, the exterior material 105, the lead terminal 104, and the like There was no play (margin) between them, and there was a problem that the resistance to external vibration and impact after mounting was weak.

  Of course, since there is no response due to impact, the impact is concentrated on the outer packaging material 105 or the mounting solder part, etc., and there is a problem such as weak durability such as cracking or damage. there were.

  Further, as shown in FIG. 40, the lead terminal 104 protruding to the outside is likely to be warped or bent, and there is a problem that mounting on the board becomes difficult or mounting reliability is lowered.

  As described above, the conventional technique of hooking the lead terminal connected to the element to the edge of the mold and pouring the resin into the exterior does not require reduction in man-hours or subsequent fine adjustment. In addition, it is possible to reduce the cost, but the lead terminal deflection becomes weak, durability and impact resistance are reduced, mounting reliability and shape retention during transportation are reduced. There were problems such as. For this reason, there has been a problem of insufficient electronic components in practical use.

  The present invention includes an element, a pair of terminal portions provided on the element, an exterior material that covers a part of the terminal portion and the element, a convex portion on the bottom surface of the exterior material, and the terminal portion extends from the convex portion to the exterior material. It is the structure which protrudes outside.

  The present invention can realize an electronic component with improved pressure resistance, impact resistance, durability, and moisture resistance by sealing an element with an exterior material.

  In addition, the terminal part and the lead terminal project from the bottom surface of the exterior material, so that there is play and allowance between the exterior material and the terminal part (lead terminal), which can improve the deflection resistance after mounting. it can.

  In particular, since the lead terminal (terminal portion) protrudes from the convex portion provided on the bottom surface at this time, the lead terminal (terminal portion) protrudes from a position entering inside the virtual plane formed by the side surface of the exterior material. And play (margin) arises between an exterior material and a lead terminal (terminal part). As a result, durability and deflection resistance against vibration and impact are improved.

Furthermore, the lead terminal and the terminal portion protrude from the convex portion provided on the bottom surface, so that a space is automatically formed between the bottom surface of the exterior material, and this space is formed between the exterior material and the lead terminal (terminal portion). Play of (
This is a margin. As a result, durability and deflection resistance against vibration and impact are further improved.

  At this time, in particular, the protruding terminal portion and lead terminal once protrude downward, and then bent into a substantially L-shape to form a mounting surface, so that there is further play between the exterior material and the lead terminal (terminal portion). The (margin) is further increased and the deflection resistance is further improved.

  In particular, at this time, the manufacturing process is almost the same as the conventional process, so that the low-cost manufacturing that is a conventional merit is maintained.

  In addition, a curved portion (curved curved surface or protruding portion), a wavy surface, or a bent portion is appropriately formed as a flexure absorbing portion on the terminal portion or the lead terminal, thereby providing further sufficient bending resistance. It can be used as an electronic component. In particular, the curved surface can be formed either before or after being molded with the exterior material, so that the manufacturing process is easy and requires extra labor and strict procedures. It is unnecessary and can reliably maintain a low cost.

  In addition, while maintaining the same low cost as in the manufacture of electronic components, the thickness of the terminal part or lead terminal protruding outside the exterior material is increased or decreased, or the thickness is gradually changed. By using a shape such as a bend, it is possible to prevent bending or warping due to impact to the terminal part protruding to the outside or the lead terminal during transportation or mounting, and to make the electronic component strong in impact resistance etc. it can.

  In addition, by the above structure, it becomes strong against the deflection that occurs between the mounting surface after mounting, and the occurrence of cracks in exterior materials and solder surfaces due to external impact, external heat, humidity, etc. Thus, an electronic component having high impact resistance, heat resistance, durability, and moisture resistance can be realized while maintaining low cost.

  In addition, downsizing of electronic parts is realized, and downsizing of electronic devices is also realized.

  The element sealed in the exterior material may be anything such as a capacitor (single plate, laminated type), a resistor, an inductor, or a filter, and is particularly suitable for a device that requires a high breakdown voltage.

  Further, the convex portion is a portion having a bulge provided on a plane forming the bottom surface of the exterior material, and the shape and size thereof may be various.

  The invention according to claim 1 of the present invention includes an element, a pair of terminal portions provided on the element, a part of the terminal part and an exterior material covering the element, and a convex portion on the bottom surface of the exterior material, It is an electronic component characterized in that the terminal part protrudes from the convex part to the outside of the exterior material, and the space between the exterior material and the terminal part is secured to provide relaxation absorption from vibration and impact. , Can improve the bending resistance.

  The invention according to claim 2 of the present invention is characterized in that the convex portion is formed at an arbitrary position on the bottom surface having an arbitrary distance from the corner portion between the bottom surface and the side surface of the exterior material. Item 2. The electronic component according to Item 1, wherein a space is secured also to the side surface of the exterior material, and the relaxation absorbing power against the stress from the side surface of the exterior material can be improved.

  The invention according to claim 3 of the present invention is characterized in that the projecting portion is formed so as to expand toward the base of the terminal portion along the protruding terminal portion. In any one of the electronic components, the strength of the terminal protrusion can be ensured.

  The invention according to claim 4 of the present invention is the electronic component according to any one of claims 1 to 3, wherein the convex portion is a substantially semi-cylindrical body, and the strength of the terminal protruding portion is ensured. In addition, a clean appearance can be secured.

  The invention according to claim 5 of the present invention is characterized in that the terminal portion protruding from the convex portion protrudes downward from the bottom surface of the exterior material and is bent in an approximately L shape. 5. The electronic component according to claim 1, wherein the space between the bottom surface of the exterior material and the terminal portion can be further increased, and as a result, the relaxation absorbing power is improved and the flex resistance is improved.

  The invention according to claim 6 of the present invention is the electronic component according to claim 5, wherein the L-shaped bent portion of the terminal portion is substantially parallel to the bottom surface of the exterior member. , Mounting reliability can be improved.

  The invention according to claim 7 of the present invention is the electronic component according to any one of claims 5 to 6, wherein the L-shaped bending of the terminal portion is bent outward. , Mounting strength can be improved.

  The invention according to claim 8 of the present invention is the electronic component according to any one of claims 5 to 6, wherein the L-shaped bending of the terminal portion is bent inward. The mounting area can be reduced.

  The invention according to claim 9 of the present invention is characterized in that the terminal portion protruding from the convex portion is bent at the tip of the convex portion and is substantially parallel to the bottom surface of the exterior material. 4. The electronic component according to any one of 4, wherein the bending resistance can be ensured after the distance between the electronic component and the mounting substrate is minimized.

  According to a tenth aspect of the present invention, the terminal portion protruding from the convex portion has a gap from the bottom surface of the exterior material due to the convex portion. In this electronic component, the space between the terminal portion and the exterior material is reliably ensured.

  According to an eleventh aspect of the present invention, in the electronic component according to any one of the first to tenth aspects, the exterior material is any one of a substantially rectangular parallelepiped, a substantially cubic, and a substantially rectangular pillar. Therefore, it can be easily manufactured at low cost.

  The invention according to claim 12 of the present invention is the electronic component according to any one of claims 1 to 11, characterized in that at least one of the corners of the exterior material is chamfered. Thus, the impact resistance against external impacts can be improved.

  The invention according to claim 13 of the present invention is the electronic component according to any one of claims 1 to 12, wherein the thickness of the protruding terminal portion increases toward the tip. Improves the impact resistance to the impact applied to the tip of the, and improves the durability of electronic components.

  The invention according to claim 14 of the present invention is the electronic component according to any one of claims 1 to 12, characterized in that the protruding terminal portion becomes thinner toward the tip. By imparting elasticity to the part, the bending resistance can be improved.

  The invention according to claim 15 of the present invention is characterized in that the terminal portion has a portion where the thickness outside the exterior material is thicker than the thickness inside the exterior material. In the electronic component described above, the terminal portion can be prevented from being bent or bent.

  The invention according to claim 16 of the present invention is the electronic component according to any one of claims 1 to 15, wherein a reinforcing material is provided at any position on the non-mounting surface of the terminal portion. The impact resistance of the terminal portion can be improved.

  The invention according to claim 17 of the present invention is the electronic component according to claim 16, wherein the reinforcing material is formed on the non-mounting surface of the terminal portion and on the peripheral edge thereof. The impact resistance of the terminal portion can be improved.

  The electronic component according to any one of claims 1 to 17, wherein the element is a single plate capacitor having an electrode connected to the dielectric substrate and the terminal portion. Thus, a capacitor with a high withstand voltage can be realized.

  According to a nineteenth aspect of the present invention, the element is a multilayer capacitor having a dielectric substrate in which internal electrodes are embedded and a pair of terminal portions provided on the dielectric substrate. The electronic component according to any one of Items 1 to 17, wherein a capacitor having a high capacity and an excellent high breakdown voltage can be realized.

  According to a twentieth aspect of the present invention, in the multilayer capacitor, the internal electrode is an electrode mainly composed of nickel, and the dielectric substrate is a reduction resistant material. The low-cost multilayer capacitor can be obtained.

  The invention according to claim 21 of the present invention is characterized in that a material mainly composed of copper is used for the terminal portion, and solder having a melting point of 240 ° C. or more is used for the connection portion between the element and the terminal portion. 21. The electronic component according to claim 1, wherein internal damage during reflow can be prevented.

  The invention according to claim 22 of the present invention is the electronic component according to any one of claims 1 to 20, characterized in that a 42 alloy is used for the terminal portion. Solder wettability can be improved.

  The invention according to claim 23 of the present invention is an electron according to any one of claims 1 to 22, wherein the element is an element in which a plurality of pairs of terminal portions are provided on a single substrate. It is a component, and a composite element can be easily realized.

  The invention according to claim 24 of the present invention is the electronic component according to any one of claims 1 to 23, wherein a plurality of elements are sealed inside the exterior material, and the composite element can be easily obtained. In addition, it is possible to save the mounting effort.

  According to a twenty-fifth aspect of the present invention, in the electronic component according to any one of the first to twenty-fourth aspects, a deflection absorbing portion is provided at any position of the protruding terminal portion. Thus, it is possible to improve the bending resistance against a three-dimensional deflection applied from various directions.

  The invention according to claim 26 of the present invention is the arcuate curved surface portion, the corrugated surface, the bent portion, or a combination thereof, in which the deflection absorbing portion is provided at any position of the terminal portion. 26. The electronic component according to claim 25, wherein the bending resistance against a three-dimensional deflection applied from various directions can be improved.

The invention according to claim 27 of the present invention includes a step of installing an element, a step of connecting a pair of terminal portions to the element, a step of installing an element connected to the terminal portion in a mold, and a mold A method of manufacturing an electronic component, comprising: a step of pouring the melted exterior material to a level at which the terminal portion protrudes from the bottom surface of the exterior material; and a step of solidifying the poured exterior material, It is possible to easily and inexpensively manufacture an electronic component having high resistance to bending.

  According to a twenty-eighth aspect of the present invention, in the process of solidifying the outer packaging material, the temperature of the terminal portion is maintained at a temperature lower than the ambient temperature. It is a method, Comprising: A convex part can be naturally and automatically formed in the protrusion part of a terminal part.

  In the invention according to claim 29 of the present invention, in the process of solidifying the exterior material, the base of the terminal part rises more than the other part by maintaining the temperature of the terminal part at a temperature lower than the ambient temperature. 29. The method of manufacturing an electronic component according to claim 27, wherein a convex portion is formed on a portion that is solidified and is a bottom surface of the exterior material and protrudes from the terminal portion. A convex part can be naturally and automatically formed in the protrusion part of a part.

  According to a thirty-third aspect of the present invention, there is provided a dielectric substrate in which internal electrodes are embedded, a plurality of multilayer capacitors having a pair of terminal portions provided on the dielectric substrate, and a pair of terminal portions. A pair of lead terminals, a part of the lead terminal, a multilayer capacitor, an exterior material that covers the terminal portion, and a convex portion on the bottom surface of the exterior material, and the lead terminal protrudes from the convex portion to the outside of the exterior material. It is possible to realize an electronic component that is characterized by being excellent in deflection resistance.

  The invention according to claim 31 of the present invention is characterized in that the convex portion is formed at an arbitrary position on the bottom surface having an arbitrary distance from the corner portion between the bottom surface and the side surface of the exterior material. Item 30. The electronic component according to Item 30, wherein a space is secured also to the side surface of the exterior material, and the relaxation absorbing power against the stress from the side surface of the exterior material can be improved.

  According to a thirty-second aspect of the present invention, the convex portion is formed so as to extend toward the root of the lead terminal along the projecting lead terminal. In any one of the electronic components, the strength of the lead terminal protruding portion can be ensured and a clean appearance can be ensured.

  The invention according to claim 33 of the present invention is the electronic component according to any one of claims 30 to 32, wherein the convex portion is a substantially semi-cylindrical body, and the strength of the terminal protruding portion is ensured. In addition, a clean appearance can be secured.

  According to a thirty-fourth aspect of the present invention, the lead terminal protruding from the convex portion protrudes downward from the bottom surface of the exterior material and is bent in a substantially L shape. The electronic component according to any one of claims 30 to 33, wherein the space between the bottom surface of the exterior material and the lead terminal can be further increased, and as a result, the relaxation absorbing power is improved and the flex resistance is improved. .

  The invention according to claim 35 of the present invention is the electronic component according to claim 34, wherein the L-shaped bent portion of the lead terminal is substantially parallel to the bottom surface of the exterior material. , Mounting reliability can be improved.

  The invention according to claim 36 of the present invention is the electronic component according to any one of claims 34 to 35, characterized in that the L-shaped bending of the lead terminal is bent outward. , Mounting strength can be improved.

The invention according to claim 37 of the present invention is the electronic component according to any one of claims 34 to 35, characterized in that the L-shaped bending of the lead terminal is bent inward. The mounting area can be reduced.

  The invention according to claim 38 of the present invention is characterized in that the lead terminal protruding from the convex portion is bent at the tip of the convex portion and is substantially parallel to the bottom surface of the exterior material. 33. The electronic component according to any one of 33, wherein the distance between the electronic component and the mounting substrate is minimized, and the bending resistance can be ensured.

  According to a thirty-ninth aspect of the present invention, in the electronic component according to any one of the thirty-third to thirty-eighth aspects, the lead terminal protruding from the convex portion is not in contact with the exterior material. Thus, the space between the terminal portion and the exterior material is reliably ensured.

  The invention according to claim 40 of the present invention is the electronic component according to any one of claims 30 to 39, wherein the exterior material is any one of a substantially rectangular parallelepiped, a substantially cube, and a substantially rectangular pillar. Therefore, it can be easily manufactured at low cost.

  The electronic component according to any one of claims 30 to 40, wherein the invention according to claim 41 is chamfered on at least one of the corners of the exterior material. In addition, impact resistance against external impacts can be improved.

  The invention according to claim 42 of the present invention is the electronic component according to any one of claims 30 to 41, wherein the protruding lead terminal increases in thickness toward the tip. Improves the impact resistance against impacts that are applied to the tip of the lead terminal and improves the durability of electronic components.

  The invention according to claim 43 of the present invention is the electronic component according to any one of claims 30 to 41, wherein the protruding lead terminal has a thickness that decreases toward the tip. The lead terminal can be made elastic to improve the bending resistance.

  The invention according to Claim 44 of the present invention is characterized in that the lead terminal has a portion where the thickness outside the exterior material is thicker than the thickness inside the exterior material. The electronic component according to 1, wherein the lead terminal can be prevented from being bent or bent.

  The invention according to claim 45 of the present invention is the electronic component according to any one of claims 30 to 44, wherein a reinforcing material is provided at any position on the non-mounting surface of the lead terminal. The impact resistance of the lead terminal can be improved.

  The invention according to claim 46 of the present invention is the electronic component according to claim 45, characterized in that the reinforcing material is formed on the non-mounting surface of the lead terminal and on the peripheral edge thereof. The impact resistance of the lead terminal can be improved.

  According to a 47th aspect of the present invention, in the multilayer capacitor, the internal electrode is an electrode mainly composed of nickel, and the dielectric substrate is a reduction resistant material. 46. The electronic component according to any one of ˜46, which can be a low-cost multilayer capacitor.

  The invention according to claim 48 of the present invention is characterized in that a material mainly composed of copper is used for a lead terminal, and solder having a melting point of 240 ° C. or more is used for a connection portion between the element and the terminal portion. It is an electronic component of any one of Claims 30-47, Comprising: The internal damage at the time of reflow can be prevented.

  The invention according to claim 49 of the present invention is the electronic component according to any one of claims 30 to 48, wherein 42 alloy is used for the lead terminal, and the lead terminal is mounted at the time of solder mounting. Solder wettability can be improved.

  The invention according to claim 50 of the present invention is the element according to any one of claims 30 to 49, wherein the element is an element in which a plurality of pairs of terminal portions are provided on a single substrate. Thus, a composite element can be easily realized.

  The invention according to claim 51 of the present invention is the electronic component according to any one of claims 30 to 50, wherein a plurality of elements are sealed inside the exterior material, and the composite is easily combined. An element can be realized and the labor of mounting can be saved.

  The electronic component according to any one of claims 30 to 51, wherein the deflection absorbing portion is provided at any position of the protruding lead terminal. In addition, it is possible to improve the bending resistance against a three-dimensional deflection applied from various directions.

  The invention according to claim 53 of the present invention is the arcuate curved surface portion, the corrugated surface, the bent portion, or a combination thereof, wherein the deflection absorbing portion is provided at any position of the lead terminal. 53. The electronic component according to claim 52, wherein the deflection resistance against three-dimensional deflection applied from various directions can be improved.

  In the invention according to claim 54 of the present invention, the step of installing the element, the step of connecting the pair of terminal portions to the element, the step of connecting the pair of lead terminals to the terminal portion, and the lead terminal are connected A step in which the element is installed in the mold, a step in which the outer packaging material melted in the mold is poured to a level where the lead terminals protrude from the bottom surface of the outer packaging material, and a step in which the poured outer packaging material is solidified. An electronic component manufacturing method characterized in that an electronic component strong in deflection resistance can be manufactured easily and at low cost.

  According to a 55th aspect of the present invention, in the process of solidifying the exterior material, the temperature of the lead terminal is maintained at a temperature lower than the ambient temperature. In this method, a convex portion can be naturally and automatically formed on the protruding portion of the lead terminal.

  In the invention according to claim 56 of the present invention, in the process of solidifying the exterior material, the base of the lead terminal is raised more than other parts by maintaining the temperature of the lead terminal at a temperature lower than the ambient temperature. The method of manufacturing an electronic component according to any one of claims 54 to 55, wherein a convex portion is formed on a portion of the bottom surface of the outer packaging material that protrudes from the lead terminal. A convex portion can be formed naturally and automatically on the protruding portion of the terminal.

  In the invention according to claim 57 of the present invention, in any one of claims 1 to 26, the terminal portion protrudes from any one of the tip end or side surface of the convex portion. In the electronic component described above, the terminal portion can have a gap between the bottom surface of the exterior material, and this structure improves the bending resistance.

  The invention according to claim 58 of the present invention is as described in any one of claims 30 to 53, wherein the lead terminal protrudes from any one of a tip end or a side surface of the convex portion. In the electronic component described above, the terminal portion can have a gap between the bottom surface of the exterior material, and this structure improves the bending resistance.

  In this specification, a multilayer capacitor is described as an example of an element. However, the present invention is not limited to this, and various elements such as a normal single plate capacitor, a resistor, an inductor, and a filter that are not a multilayer capacitor are used. But the same is true.

  In addition, the terminal part and the lead terminal are described as the terminal part when connected directly to the element, the terminal part directly connected to the element, and the terminal further connected as the lead terminal. It is not something that is, but the same thing.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 20, 21, 22, 23. 24, 25, 26, 27, 28, 29, 30, 31, and 32 are side views of the electronic component according to the embodiment of the present invention, FIG. 14, FIG. 15, FIG. 17, FIG. 34, FIG. 35, FIG. 36, and FIG. 37 are top views of the electronic components in the embodiment of the present invention. FIGS. 18, 19, 37, and 38 are the electronic components in the embodiment of the present invention. It is a manufacturing process figure of components.

  1 to 17, terminals are connected to various electronic elements such as capacitors (single plate, laminated type, electrolysis, etc.), resistors, inductors, filters, ICs, etc. A structure in which a part of the protrusion protrudes from a convex portion provided on the bottom surface of the exterior material is shown.

  On the other hand, in FIGS. 19 to 36, a multilayer capacitor is shown as an internal element, a terminal portion is connected to the multilayer capacitor, a pair of lead terminals are connected to the terminal portion, and molded with an exterior material. Thus, a structure in which a part of the lead terminal protrudes outside from a convex portion provided on the bottom surface of the exterior material is shown.

  The structure shown in FIGS. 1 to 17 and the structure shown in FIGS. 19 to 36 are almost the same except that the element is a multilayer capacitor and lead terminals are connected. The corresponding structure will be described below as necessary, and will be omitted if there is much overlap.

  1 is an electronic component, 2 is an element, 3 is an electrode, 4 is a terminal portion, 5 is an exterior material, 6 is a multilayer capacitor, 7 is an internal electrode, 8 is a lead terminal, 9 is a bottom surface, 10 is a convex portion, 12 is A chamfer 15, a curved surface portion 16, a bent portion 16, a corrugated surface 17, and a reinforcing member 20, the curved surface portion 15, the bent portion 16, and the corrugated surface 17 are shown as examples of a deflection absorbing portion. Further, 30 is a mold, 31 is an inside of the mold, 32 is a resin supply unit, 33 is a cooling unit, 34 is a molten resin, and 35 is a cooling fan.

  First, in the structure of the electronic component 1, the features and effects of the structure shown in each figure will be briefly described.

  In FIG. 1, the terminal part 4 protrudes from the convex part 10 provided in the bottom face 9, and after the terminal part 4 which protruded is once extended | stretched below, it is bend | folded by substantially L shape and can be mounted. Is represented. With this structure, a space is generated between the bottom surface 9 of the exterior member 5 and the terminal portion 4 to be mounted. This space becomes play (margin), and the flex resistance is improved.

  FIG. 2 shows a case in which the convex portion 10 provided on the bottom surface 9 is a semi-cylindrical shape, and the terminal portion 4 is bent into a substantially L shape and protrudes in the same manner as in FIG. Play (margin) with the bottom surface 9 is generated, and the flexibility is improved.

FIG. 3 shows a structure in which the terminal portion 4 protrudes from the convex portion 10 provided on the bottom surface 9, but the terminal portion 4 can be folded and mounted at the end of the convex portion 10. It has a simple structure. According to this structure, a space is secured between the terminal portion 4 and the bottom surface 9 by the amount corresponding to the convex portion 10, and a margin is generated between the exterior material 5 and the terminal portion 4 due to the secured space. , The bending resistance is improved.

  FIG. 4 also shows a structure similar to FIG. 3, but shows a structure in which the terminal portion 4 is bent inward. Suitable for reducing mounting area.

  FIG. 5 shows a structure similar to that of FIG. 1, in which the terminal portion 4 is bent inward as shown in FIG. 4. 1 is suitable for reducing the mounting area.

  FIG. 6 shows the same structure as that in FIG. 4, but the case where the convex portion 10 is not a semi-cylindrical shape but has a substantially triangular prism shape spreading toward the base of the terminal portion 4. As will be described later, the formation of the convex portion 10 is very easy.

  FIG. 7 shows a structure in which the terminal portion 4 that protrudes to the outside and is bent to fit the mounting surface increases in thickness toward the tip. With the terminal portion having this structure, it is possible to ensure the strength of the tip of the terminal portion that is vulnerable to stress such as impact.

  FIG. 8 shows a structure in which the terminal portion 4 that protrudes outside the exterior material 5 and is bent along the mounting surface becomes thinner as it goes toward the tip thereof. The flexibility is further improved.

  FIG. 9 shows a structure in which the terminal portion protruding outside the exterior material 5 has a thicker portion than the terminal portion 4 inside the exterior material 5. By increasing the thickness of the portion protruding to the outside, impact resistance and the like can be improved.

  FIG. 10 shows a structure in which a curved surface portion 15 as a deflection absorbing portion is provided on a part of the terminal portion 4 protruding outside the exterior material 5. With this structure, in addition to improving the flexibility by securing the space between the bottom surface 9 of the exterior member 5 and the terminal portion 4, it is also possible to improve the resistance to vibration mainly applied in the horizontal direction after mounting. is there.

  FIG. 11 shows a structure in which a bent portion 16 is formed as a deflection absorbing portion. Similar to the case of FIG. 10, further improvement in the bending resistance is realized.

  FIG. 12 shows a structure in which a wavy surface 17 is formed as a deflection absorbing portion. Further improvement in flex resistance is realized.

  FIG. 13 shows a structure in which the curved surface portion 15 and the bent portion 16 are formed in the terminal portion 4 as the deflection absorbing portion. By being formed by combining a plurality of flexure absorbing portions, each of which has good flexibility resistance is taken into consideration, and further improvement in flex resistance is realized.

  FIG. 14 shows a structure in which a reinforcing member 20 is provided at a substantially central portion in the longitudinal direction of the non-mounting surface of the terminal portion 4. This structure improves the impact resistance of the terminal portion 4 and the like.

  FIG. 15 shows a structure in which the reinforcing material 20 is provided at the peripheral edge portion of the non-mounting surface of the terminal portion 4. With this structure, the impact resistance of the terminal portion 4 is further improved.

  FIG. 16 shows a structure in which a plurality of pairs of terminal portions 4 are connected to one base, and a composite element can be configured easily and in a small size.

  FIG. 17 shows a structure in which a plurality of elements 2 are sealed inside one exterior member 5, so that a composite element can be easily and compactly configured, and the labor of mounting can be saved.

  FIG. 18 shows a manufacturing process of the electronic component 1.

  FIG. 19 shows the electronic component 1 manufactured according to the manufacturing process shown in FIG.

  In FIG. 20, the lead terminal 8 protrudes from the convex portion 10 provided on the bottom surface 9, and after the protruding lead terminal 8 extends once downward, it is bent into a substantially L shape and can be mounted. Is represented. With this structure, a space is generated between the bottom surface 9 of the exterior member 5 and the lead terminal 8, and this space becomes play (margin) and the flex resistance is improved.

  FIG. 21 shows a case where the convex portion 10 provided on the bottom surface 9 is a semi-cylindrical shape, and the lead terminal 8 is bent into a substantially L shape and protrudes in the same manner as in FIG. Play (margin) with the bottom surface 9 is generated, and the flexibility is improved.

  FIG. 22 shows a structure in which the lead terminal 8 protrudes from the convex portion 10 provided on the bottom surface 9, but the lead terminal 8 can be folded and mounted at the end of the convex portion 10. It has a simple structure. According to this structure, a space is secured between the lead terminal 8 and the bottom surface 9 by the amount of the convex portion 10, and a margin is generated between the exterior material 5 and the lead terminal 8 due to the secured space. , The bending resistance is improved.

  FIG. 23 also shows a structure similar to that in FIG. 22, but shows a structure in which the lead terminals 8 are bent inward. Suitable for reducing mounting area.

  FIG. 24 shows a structure similar to that of FIG. 19, in which the lead terminal 8 is bent inward as shown in FIG. 23. 1 is suitable for reducing the mounting area.

  FIG. 25 shows the same structure as FIG. 23, but the case where the convex portion 10 is not a semi-cylindrical shape but has a substantially triangular prism shape that spreads toward the root of the lead terminal 8. As will be described later, the formation of the convex portion 10 is very easy.

  FIG. 26 shows a structure in which the lead terminal 8 protruding outward and bent in accordance with the mounting surface increases in thickness toward the tip. With the lead terminal 8 having this structure, it is possible to secure the strength of the tip of the lead terminal 8 that is vulnerable to stress such as impact.

  FIG. 27 shows a structure in which the lead terminal 8 that protrudes outside the exterior member 5 and is bent along the mounting surface becomes thinner toward the tip thereof, which causes the lead terminal 8 to be elastic and resistant. The flexibility is further improved.

  FIG. 28 shows a structure in which the lead terminal 8 protruding outside the exterior material 5 has a thicker portion than the lead terminal 8 inside the exterior material 5. By increasing the thickness of the portion protruding to the outside, impact resistance and the like can be improved.

FIG. 29 shows a structure in which a curved surface portion 15 as a deflection absorbing portion is provided on a part of the lead terminal 8 protruding outside the exterior material 5. With this structure, in addition to improving the flexibility by securing the space between the bottom surface 9 of the exterior material 5 and the lead terminal 8, the resistance to vibration mainly applied in the horizontal direction after mounting can also be improved. is there.

  FIG. 30 shows a structure in which a bent portion 16 is formed as a deflection absorbing portion. Similar to the case of FIG. 29, further improvement in the bending resistance is realized.

  FIG. 31 shows a structure in which a wavy surface 17 is formed as a deflection absorbing portion. Further improvement in flex resistance is realized.

  FIG. 32 shows a structure in which a curved surface portion 15 and a bent portion 16 are formed on the lead terminal 8 as a deflection absorbing portion. By being formed by combining a plurality of flexure absorbing portions, each of which has good flexibility resistance is taken into consideration, and further improvement in flex resistance is realized.

  FIG. 33 shows a structure in which the reinforcing material 20 is provided at a substantially central portion in the longitudinal direction of the non-mounting surface of the lead terminal 8. This structure improves the impact resistance of the lead terminal 8 and the like.

  FIG. 34 shows a structure in which the reinforcing material 20 is provided on the peripheral edge portion of the non-mounting surface of the lead terminal 8. With this structure, the impact resistance of the lead terminal 8 is further improved.

  FIG. 35 shows a structure in which a plurality of pairs of terminal portions 4 are connected to one base, and a composite element can be easily and compactly configured.

  FIG. 36 shows a structure in which a plurality of multilayer capacitors 6 are sealed inside one exterior material 5, a composite element can be configured easily and compactly, and mounting effort can be saved. .

  FIG. 37 shows a manufacturing process of the electronic component 1.

  FIG. 38 shows the electronic component 1 manufactured according to the manufacturing process shown in FIG.

  The above is an outline of the structure of each drawing and the points thereof.

  In addition, the electronic component 1 is manufactured by the manufacturing process shown in FIG. 18 and the like, so that the electronic component 1 can be easily manufactured at a low cost. Further, the convex portion 10 can be easily formed on the bottom surface 9. By forming the electronic component 1, the play (margin) of the terminal portion 4 and the lead terminal 8 is ensured, and the deflection resistance is improved.

  Next, the detail of each part is demonstrated.

  Reference numeral 1 denotes an electronic component. As shown in FIG. 1 and the like, a capacitor, a resistor, an inductor, a filter, and other electronic elements are molded with an exterior material such as a resin, and are molded with the exterior material. As a result, it is an electronic component that has improved durability, moisture resistance, and impact resistance, and can withstand high pressure resistance.

  Next, the element 2 will be described.

2 is an element. As described above, the element 2 may be any of a capacitor, a resistor, an inductor, a filter, an IC, and other electronic elements. The capacitor may be a single plate capacitor or a multilayer capacitor. Any capacitor such as an electrolytic capacitor may be used. In FIG. 1, a single plate capacitor is shown.

  Note that a single element 2 (or multilayer capacitor 6) may be sealed with the exterior material 5, and a plurality may be sealed with the exterior material 5.

  Alternatively, a pair of electrodes 3 may be provided on a single substrate to function as a single electronic device, or a plurality of pairs of electrodes 3 may be provided on a single substrate to provide a plurality of electronic devices. It may have a function as.

  A form in which a plurality of elements 2 (or multilayer capacitors 6) are sealed is shown in FIG.

  Next, the electrode 3 will be described.

  The electrodes 3 are a pair of conductive members provided at both ends of the element 2 (or the multilayer capacitor 6), and are electrically connected to an external mounting substrate through the terminal portion 4, the lead terminal 8, and the like. (Or the multilayer capacitor 6). The electrodes 3 are usually provided as a pair at both ends of the element 2 (or the multilayer capacitor 6), but may be provided at an intermediate portion of the element 2 (or the multilayer capacitor 6), not at both ends. It is. Alternatively, not the side surface of the element 2 (or the multilayer capacitor 6), it may be provided on the upper and lower surfaces, or may be provided on the side surface and the front surface of the upper and lower surfaces, and only a part thereof. It may be provided or may be provided so as to protrude from the other surface.

  Examples of the material of the electrode 3 include a metal material containing at least one of Ni, Ag, Pd, Cu, Au, and the like. In particular, using Ni alone or an Ni alloy is advantageous in terms of cost. Moreover, these alloys and the thing by which the plating process was given to the surface may be used. Of course, an alloy or the like may be used as long as it is realized by any one of single layer and multilayer plating, vapor deposition, sputtering, and paste application.

  Further, when the element 2 and the terminal portion 4 are connected, the electrode 3 is interposed therebetween. However, it is preferable that a solder having a melting temperature of 240 ° C. or higher is used for the connection member in the connection. By using such a solder having a high melting temperature, the reflow performed at the time of mounting does not cause a problem such as melting of the connection portion between the element 2 and the terminal portion 4 inside the exterior material 5, A highly reliable electronic component 1 can be realized.

  Next, the terminal part 4 will be described.

  The terminal portions 4 are connected to the electrodes 3 and are provided as a pair on the element 2 (or the multilayer capacitor 6). Usually, it is often provided at both ends, but may be provided at both ends. For example, when the electrode 3 is provided on the upper and lower surfaces, the electrode 3 and the terminal portion 4 formed on the upper and lower surfaces may be connected. The terminal portion 4 is made of a material containing at least one of Cu, Zn, Ni, Ag, Au, etc., and the surface thereof may be subjected to single layer or multilayer plating.

  In particular, when it is formed of a material or alloy mainly composed of copper, there is a problem that the wettability of the solder between the mounting substrate and the terminal portion 4 (or the lead terminal 8) is weakened. However, as described above, it is possible to solve the problem by using a solder having a melting temperature of 240 ° C. or higher for the member at the connection portion between the element 2 and the terminal portion 4.

  Alternatively, it is also preferable to use 42 alloy for the terminal portion 4 (lead terminal 8) to improve solder wettability, facilitate mounting, and improve mounting strength.

  Further, the terminal portion 4 may be configured by bonding a metal cap to the dielectric substrate 2. Furthermore, it is preferable that the outermost part (outermost part) of the terminal part 4 is made of a conductive material having a melting point of 200 degrees or more. With this structure, even if a high temperature is applied to the electronic component by reflow or the like, the terminal The portion 4 is not thermally damaged and stable reflow characteristics can be obtained.

  The terminal portion 4 is connected to the electrode 3 and is formed so as to be appropriately lowered to protrude outside the exterior material 5.

  Further, the exterior material 5 described later is realized by placing the element 2 (or multilayer capacitor 6) with the terminal portion 4 (or lead terminal 8) connected in a frame and pouring molten resin into the frame. Therefore, the terminal part 4 protrudes from the bottom surface of the exterior material.

  In other words, the terminal 2 is connected to the element 2 in a frame such as a mold, and the terminal 4 is fixed while being hooked on the mold. A structure in which the terminal portion 4 protrudes from the bottom surface can be easily realized by pouring molten resin or the like into the mold before the virtual plane created by the terminal portion 4.

  That is, the terminal portion 4 can be protruded from the bottom surface 9 in order to improve the deflection resistance while being very easy and low-cost as compared with costly manufacturing such as a transfer mold. It is.

  At this time, since a space is always generated between the bottom surface 9 of the exterior material 5 and the terminal portion 4 (lead terminal 8), play (margin) is generated, and the resistance to impact and vibration after mounting is improved. To do. Furthermore, since the resistance to bending is improved, it is possible to prevent damage such as the occurrence of cracks in the outer packaging material 5 and the mounting solder, and the impact resistance is also improved.

  The terminal portion 4 (or the lead terminal 8) may be bent inward as shown in FIG. 4 or bent outward as shown in FIG. When it is bent inward, the mounting area is reduced, and when it is bent outward, the mounting strength is ensured.

  Next, the exterior material 5 will be described.

  As shown in FIG. 1 and the like, the exterior material 5 is one of electronic elements such as a resistor and an inductor including the element 2 (or multilayer capacitor 6), and a terminal portion 4 (or lead terminal 8) connected thereto. The part is molded.

  As the material of the exterior material 5, an epoxy resin such as an optocresol novolac type, a biphenyl type, or a pentadiene type is suitably used.

  Further, the minimum value of the distance between the surface of the outer packaging material 5 and the surface of the element 2 (or the multilayer capacitor 6) (the thinnest portion of the outer packaging material 5) is set to 0.1 mm or more to improve the outer skin pressure resistance. be able to. Furthermore, the electronic component 1 strong against pressure | voltage resistance, moisture resistance, and heat resistance is realizable by setting it as a value beyond this.

Further, by providing chamfers 12 at the corners of the exterior material 5, it is possible to improve the impact resistance from the outside. At this time, the chamfer 12 may be arcuate or may be a straight planar chamfer.

  The shape of the exterior member 5 may be a general columnar shape, may be a substantially rectangular parallelepiped, may be a substantially cubic shape, may be a trapezoidal shape, or other polygonal column. However, from the viewpoint of cost and manufacturability, a substantially rectangular parallelepiped, a substantially cube, or a trapezoidal shape having a slightly inclined side surface is preferable. In addition, there are unavoidable irregularities on the surface when the exterior material 5 is molded.

  If it is a substantially rectangular parallelepiped or the like, the bottom surface 9 and the side surface are generated, and the corner portion (which may be a perfect linear corner portion or an arc-shaped corner portion) is generated by these.

  Next, the multilayer capacitor 6 will be described.

  The multilayer capacitor 6 is formed by laminating a substrate made of a dielectric material with a plurality of sheets to form the internal electrode 7, and can have the same size and higher capacity than a single plate capacitor or the like.

  The dielectric base is a base made of a dielectric, and a dielectric material such as titanium oxide or barium titanate is preferably used. Alternatively, alumina or the like is also used. Using such a material, it is appropriately formed in a necessary shape and size.

  The internal electrode 7 is an electrode embedded in the dielectric substrate, and examples of the constituent material of the internal electrode 7 include metal materials and alloys containing at least one of Ni, Ag, Pd, Cu, Au, and the like. . In particular, using Ni alone or an Ni alloy is advantageous in terms of cost. Moreover, these alloys and the thing by which the plating process was given to the surface may be used. Of course, an alloy or the like may be used. The internal electrode 7 has a thickness of 1 to 5 μm. Moreover, it is preferable that the space | interval of adjacent internal electrodes 7 shall be 15 micrometers or more.

  At this time, in particular, when a material mainly composed of Ni is used for the internal electrode 7 and a reduction-resistant material is used for the dielectric substrate serving as a laminated sheet, the multilayer capacitor 6 is realized at a very low cost. .

  The internal electrode 7 is electrically connected to the electrode 3. The internal electrode 7 connected to only one of the electrodes 3 and the internal electrode 7 connected to only the other of the electrodes 3 are opposed to each other. The main capacity is generated between the seven.

  Next, the terminal portion 4 is connected to the electrode 3. The terminal portion 4 is as described above. A pair of terminal portions 4 are connected to the electrodes, and a pair of lead terminals 8 are connected to the terminal portions 4.

The size of the multilayer capacitor 6 is as follows: when the length is L1, the height is L2, and the width is L3.
3.0mm ≦ L1 ≦ 5.5mm
0.5mm ≦ L2 ≦ 2.5mm
1.5mm ≦ L3 ≦ 3.5mm
Of course, the size may be other than this, and a plurality of multilayer capacitors 6 may be sealed by the outer packaging material 5 instead of a single size.

If L1 to L3 are made smaller than the above lower limit value, the formation area of the internal electrodes 3 becomes insufficient, or the interval between the internal electrodes 3 becomes inevitably narrow, and the number of internal electrodes 3 must be reduced. It becomes difficult to obtain a large capacitance value and it becomes difficult to obtain an electronic component having a wide capacity.

  Further, when the multilayer capacitor 6 is molded with the exterior material 5, in order to prevent damage to the multilayer capacitor 6 due to impact, chamfering is provided at the corner of the multilayer capacitor 6 or an arc-shaped curve curve is formed. It is also preferable to provide a part or all of each side surface.

  It is also preferable to reduce the mounting cost and mounting effort by molding a plurality of multilayer capacitors 6 and mounting them on parallel signal lines as a composite element while being compact. It is the structure represented by FIG.

  Next, the lead terminal 8 will be described.

  The lead terminals 8 are connected to the pair of terminal portions 4, pulled out of the exterior material 5, and mounted on the mounting board, thereby realizing electrical conduction between the internal element 2 and the multilayer capacitor 6 and the board. It is used as an electrical terminal for doing so, and is formed as a pair. Depending on the number of multilayer capacitors 6 molded inside, a pair or more may be used, and the shape of the lead terminals 8 may be various, such as a rectangle, an ellipse, a square, and a line. Chamfering, a curve shape, formation of an inclined portion, formation of a slit or the like is also suitable. Further, the size and width may be determined as appropriate according to the balance with the required mounting area, mounting strength, element size, and the like.

  The lead terminal 8 is formed of a conductor like the terminal portion 4 and is formed of various metals. It is made of a material containing at least one of Cu, Zn, Ni, Ag, Au and the like, and the surface thereof may be subjected to single layer or multilayer plating. An alloy may also be used.

  Moreover, since the lead terminal 8 protrudes from the convex part 10 provided in the bottom face 9 of the exterior | packing material 5, it is the same as that of the description in the terminal part 4, and improves bending resistance, maintaining low cost. It is something that can be done.

  Of course, by improving the flex resistance, it is possible to prevent damage such as generation of cracks in the outer packaging material 5 and the mounting solder, and the impact resistance is also improved.

  The lead terminal 8 may be bent either on the outside or on the inside, as in the case described for the terminal portion 4.

  Next, the convex part 10 is demonstrated.

  The convex portion 10 is provided on the bottom surface 9 of the exterior material 5 and is a portion from which the terminal portion 4 and the lead terminal 8 protrude.

  The convex portion 10 may be formed integrally with the exterior material 5, or may be integrated after being formed separately. Moreover, the same material as an exterior material may be sufficient, and another material may be sufficient.

  However, as shown in the manufacturing process diagram of FIG. 18 and the like, when molten resin or the like is poured into the mold 30 or the like on which the element 2 is disposed, the terminal protruding from the bottom surface 9 of the molten resin Only the periphery of the portion 4 and the lead terminal 8 is raised by the surface tension. Furthermore, when the poured resin is solidified while the terminal portion 4 and the lead terminal 8 are maintained at a temperature lower than the surrounding temperature, the exterior material 5 is formed while the swell remains. Thereby, the convex part 10 is formed automatically.

  Alternatively, after the exterior material 5 is once formed, the protrusions 10 may be formed by forming a bulge of the resin around the terminal portions 4 and lead terminals 8 that are separately projected.

  In addition, the convex part 10 may be a substantially triangular prism or a semi-cylindrical, and when it goes through the manufacturing process shown in FIG. Of course, other shapes may be used.

  Moreover, although the convex part 10 may be formed in any position in the bottom face 9, it is located inside the bottom face 9 rather than the corner | angular part where the side surface and the bottom face 9 of the exterior material 5 cross | intersect. Is preferred. This is because the protrusion of the terminal portion 4 and the lead terminal 8 can secure a certain distance from the side surface of the exterior member 5 and has a relaxation absorption force against stress from the side surface direction. .

  The terminal portion 4 and the lead terminal 8 protrude from the convex portion 10 to improve the bending resistance. Details on the improvement of the bending resistance will be described later.

  Next, the reinforcing material 20 will be described.

  The reinforcing material 20 is formed on the non-mounting surface of the terminal portion 4 or the lead terminal 8. For example, as shown in FIG. 14, it may be formed substantially at the center of the terminal portion 4, and may be formed along the peripheral edge of the terminal portion 4 as shown in FIG. 15. . In the case of the former, the impact resistance in the longitudinal direction, which is weak against stress, can be improved while being easy to form. It becomes possible to greatly improve the impact property. This is the same even in the case of the lead terminal 8 as shown in FIGS.

  In addition, the reinforcing material 20 may have other shapes, and may be formed at other positions.

  As the material of the reinforcing material 20, a resin, ceramic, or the like is used, and an epoxy-based resin or the like is preferably used in the same manner as the exterior material 5. It is also preferable to use the same material as the exterior material 5. The reinforcing member 20 may be rod-shaped, columnar, or plate-shaped, and may be provided in a plural number instead of a single one.

  Further, the reinforcing member 20 may be formed only at the tip or the base of the terminal portion 4 or the lead terminal 8.

  When formed at the tip, it is possible to reduce the influence at the tip of the terminal portion 4 and the lead terminal 8 that is most susceptible to stress due to an impact from the outside, and to improve impact resistance. Furthermore, by being provided at the tip portion, it becomes a weight at the tip portion, the press-contact force against the mounting substrate is increased, the mounting reliability is improved, particularly the durability against impacts is improved, and as a result, the terminal portion 4 ( Alternatively, there is an advantage that the bending resistance of the lead terminal 8) is also improved.

  On the other hand, when it is provided at the base, it is difficult for bending and the like to occur.

  Next, the curved surface portion 15, the bent portion 16, and the wavy surface 17 as the deflection absorbing portion will be described. The deflection absorbing portion is a portion that alleviates the influence of deflection caused by vibration or impact applied to the mounted electronic component 1.

Since the terminal portion 4 (or the lead terminal 8) protrudes from the convex portion 10 of the bottom surface 9, a space is generated between the bottom surface 9 of the exterior material 5 and the terminal portion 4 (or the lead terminal 8). It becomes play (margin) and the flexibility resistance is improved. In addition to this, by providing a flexure absorbing portion, it is also strong against the deflection to the terminal portion 4 and the lead terminal 8 after mounting, particularly against horizontal vibration, etc., and the flex resistance is three-dimensional. It will be strengthened.

  Of course, the deflection absorbed by the deflection absorbing portion does not arise only from vibrations applied in the horizontal direction.

  The curved surface portion 15 is a curved portion that is also received by the terminal portion 4 and the lead terminal 8, and this portion is not solder-mounted with the mounting substrate, but acts as a cushioning material, so It improves the performance.

  The bent portion 16 is the same, and its formation is easier than when the curved surface portion 15 is formed. In particular, by forming a substantially square shape, it can be easily formed, and, as with the curved surface portion 15, by using a buffer portion that is not solder-mounted, the flex resistance can be improved.

  The curved surface portion 15 and the bent portion 16 may be provided singly or plurally in the terminal portion 4 or the lead terminal 8, and may be provided at the root portion, the intermediate portion, or the tip portion. Even so, it may be provided at an arbitrary location.

  The wavy surface 17 is somewhat troublesome to form, but is most effective as a buffering part that absorbs deflection, and greatly improves the bending resistance. The corrugated surface 17 may be appropriately selected in relation to the mounting area (that is, mounting strength) with the terminal portion 4 or the lead terminal 8 to be mounted, and the size thereof may be determined. .

  Alternatively, the curved surface portion 15, the bent portion 16, the wavy surface 17, and the like may be appropriately combined according to specifications.

  13 and 32, the curved surface portion 15 and the bent portion 16 are provided in combination. The respective characteristics of the curved surface portion 15 and the bent portion 16 are mixed, and the deflection absorption is further improved.

  Such a deflection absorbing portion may be provided as necessary, and may be determined based on a balance with specifications.

  The above is the description of each part of the structure of the electronic component in the present embodiment.

  Next, details of improving the bending resistance while being a structure capable of low-cost manufacturing realized from the above structure will be described.

  First, an improvement in flexibility is realized by a structure in which the terminal portion 4 and the lead terminal 8 protrude from the convex portion 10 provided on the bottom surface 9.

  That is, as shown in FIG. 3, FIG. 4, etc., even when the terminal portion 4 or the lead terminal 8 protrudes from the convex portion 10, is bent at the tip of the convex portion 10, and can be mounted, A space is generated between the mounting portion of the terminal portion 4 and the lead terminal 8 and the bottom surface 9 of the exterior material 5 that is the main body of the electronic component 1 by the height of the convex portion 10. This space creates play (margin) between the exterior material 5 and the terminal portion 4 (lead terminal 8), and relaxes and absorbs vibrations and shocks applied to the electronic component 1 to provide flexibility. Will improve.

  Further, as shown in FIG. 1 and FIG. 2, when the terminal portion 4 and the lead terminal 8 protruding from the convex portion 10 are once extended downward and then bent into a substantially L shape, the bottom surface is further reduced. The space with 9 becomes larger. In addition, since the protruding terminal portion 4 and lead terminal 8 have a certain distance from the convex portion 10 in a substantially vertical direction, the convex portion 10 itself has a constant interval, and mitigates against vibration and the like. Absorbing power is further increased, and flexibility resistance is improved.

  Thus, by providing the convex portion 10 and projecting the terminal portion 4 and the lead terminal 8 from the convex portion 10, the margin of the terminal portion 4 and the lead terminal 8 can be ensured, and the flex resistance is easily achieved. It can be secured. Furthermore, low cost manufacturing is still maintained.

  In addition, as described in the explanation of the deflection absorbing portion, the terminal portion 4 and the lead terminal 8 are provided with the deflection absorbing portion, so that external vibration and impact applied in a three-dimensional manner including the horizontal direction can be prevented. It can be relaxed and absorbed, and a very strong deflection resistance can be realized.

  Next, it will be described that the flexibility and impact resistance are improved by the features of the shape of the terminal portion 4 and the lead terminal 8.

  First, FIG. 7 and FIG. 26 show a structure in which the thickness is gradually increased toward the tip in the portion where the terminal portion 4 and the lead terminal 8 protrude from the exterior material 5, respectively. The protruding terminal portion 4 and lead terminal 8 are more susceptible to the impact from the outside as they approach the tip, but this effect can be avoided by increasing the thickness as they go to the tip. Thus, the terminal portion 4 and the lead terminal 8 can be prevented from being bent or bent, and the impact resistance and durability at the time of manufacture, transportation and mounting can be improved, and the mounting reliability can be improved.

  Next, FIG. 8 and FIG. 27 show a structure in which the thickness gradually decreases toward the tip in the portion where the terminal portion 4 and the lead terminal 8 protrude from the exterior material, respectively. In a shape that becomes thinner toward the tip, the elastic force of the terminal portion 4 and the lead terminal 8 increases, and when mounted on the mounting board, the pressure applied to the mounting board increases, and impact after mounting, etc. It becomes strong against the deflection by. In particular, the use of a metal having high elasticity or spring property as the material of the terminal portion 4 or the lead terminal 8 further improves the bending resistance.

  Or the load concerning the terminal part 4 or the lead terminal 8 can be disperse | distributed, and impact resistance and stress resistance increase.

  Next, in FIGS. 9 and 28, the thicknesses of the terminal portion 4 and the lead terminal 8 existing inside the exterior material 5 are thicker at the portions where the terminal portion 4 and the lead terminal 8 protrude outside the exterior material, respectively. The structure in which the part exists is shown. Thereby, it can be set as the electronic component 1 which is strong with respect to bending, a twist, etc. with respect to the stress and impact which protrude and are applied from the outside.

  In addition, these may be used independently and may be combined suitably.

  As described above, the impact resistance, durability, and deflection resistance can be improved by devising the shapes of the terminal portion 4 and the lead terminal 8.

  A structure in which the protrusion of the terminal portion 4 and the lead terminal 8 protrudes from the convex portion 10 provided on the bottom surface 9 of the exterior material 5, or a deflection absorbing portion, a reinforcing material 20, or a terminal provided in the terminal portion 4 or the like. By devising the thickness shape of the part 4 and the like, it is possible to improve the deflection resistance of the electronic component 1 and further improve the impact resistance and durability. Furthermore, these structures and shapes may be combined as appropriate according to specifications.

  Finally, the manufacturing process of the electronic component 1 will be described.

  18, 19, 37, and 38 show the manufacturing process of the electronic component 1. FIG.

  18 and 19 show the manufacturing process of the electronic component 1 using the element 2 including a single plate capacitor, and FIGS. 37 and 38 show the manufacturing process of the electronic component 1 using the multilayer capacitor 6. Since there is no particular difference in the manufacturing process, the description will be repeated using the case of FIGS.

  The state where the terminal portion 4 is connected to the element 2 is shown at the top of FIG.

  Next, as shown second from the top, the state where the element to which the terminal portion 4 is connected is installed in the interior 31 of the mold 30 is shown. At this time, it is preferable that the terminal portion 4 (or the lead terminal 8) is installed in a state where it protrudes from the middle portion of the opening portion of the interior 31 of the mold 30 so that the terminal portion 4 (or the lead terminal 8) protrudes from the bottom surface of the exterior member 5.

  Next, the molten resin 34 is poured from the resin supply unit 32 into the interior 31 of the mold 30. At this time, the cooling section 33 is brought into contact with the terminal section 4 (lead terminal 8) so that the terminal section 4 (lead terminal 8) is maintained at a lower temperature than the surroundings.

  Finally, after the molten resin 43 is completely poured, the molten resin is solidified by using the cooling fan 35 or the like to complete the sealing with the exterior material 5. At this time, the cooling part 33 is in contact with the terminal part 4 and the lead terminal 8 and is maintained at a lower temperature than the surroundings, so that the molten resin 34 poured into the mold interior 31 is solidified in the process of solidifying. In the vicinity of (lead terminal 8), the protruding portion 10 is naturally formed on the protruding portion of the terminal portion 4 (lead terminal 8) by solidifying with the raised portion caused by the surface tension of the molten resin remaining. Become.

  Finally, as shown in FIG. 19, the electronic component 1 is completed by pulling it out from the mold 30. At this time, as shown in FIG. 19, it is clear that the terminal portion 4 protrudes from the convex portion 10 of the bottom surface 9 of the exterior material 5.

  These are the same even in the case of FIGS. 37 and 38 when the multilayer capacitor 6 is used.

  The electronic component 1 having the above-described structure enables the electronic component 1 to have a high flexibility and a long life while maintaining a low cost, and the electronic device on which the electronic component 1 is mounted It is possible to realize durability and long life.

  Furthermore, while maintaining the low cost by simplifying the manufacturing process, preventing damage to the exterior material, improving the impact resistance, durability, heat resistance, moisture resistance, etc., the electronic component 1 suitable for practical use, and An electronic device is realized.

  The present invention relates to an electronic component having an element, a pair of terminal portions provided on the element, a part of the terminal part, and an exterior material that covers the element, and an inclined portion at a corner between the bottom surface and the side surface of the exterior material Is provided, and the terminal part protrudes from the corner part where the inclined part and the bottom surface of the exterior material intersect, so that the terminal projects outside the exterior material while maintaining the low cost as in the conventional manufacturing of electronic components. It can also be applied to applications that require highly flexible electronic parts against external impacts and vibrations that occur during manufacturing, transportation, and mounting of the parts or lead terminals.

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Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component 2 Element 3 Electrode 4 Terminal part 5 Exterior material 6 Multilayer capacitor 7 Internal electrode 8 Lead terminal 9 Bottom face 10 Convex part 12 Chamfering 15 Curved part 16 Bending part 17 Wavy surface 20 Reinforcing material 30 Mold 31 Mold inside 32 Resin supply part 33 Cooling part 34 Molten resin 35 Cooling fan 100 Electronic component 101 Element 102 Internal electrode 103 Electrode 104 Lead terminal

Claims (58)

Elements,
A pair of terminal portions provided on the element;
An exterior material covering a part of the terminal portion and the element;
It has a convex part on the bottom of the exterior material,
The electronic component, wherein the terminal portion protrudes from the convex portion to the outside of the exterior material. The electronic component according to claim 1, wherein the convex portion is formed at an arbitrary position on the bottom surface having an arbitrary distance from a corner portion between the bottom surface and the side surface of the exterior material. 3. The electronic component according to claim 1, wherein the convex portion is formed so as to expand toward the base of the terminal portion along the protruding terminal portion. 4. The electronic component according to claim 1, wherein the convex portion is a substantially semi-cylindrical body. The terminal portion protruding from the convex portion protrudes downward from the bottom surface of the exterior material, and is bent in a substantially L shape. Electronic components. 6. The electronic component according to claim 5, wherein the L-shaped bent portion of the terminal portion is substantially parallel to the bottom surface of the exterior material. The electronic component according to any one of claims 5 to 6, wherein the L-shaped bending of the terminal portion is bent outward. The electronic component according to claim 5, wherein the L-shaped bending of the terminal portion is bent inward. 5. The electron according to claim 1, wherein the terminal portion protruding from the convex portion is bent at a tip of the convex portion and is substantially parallel to a bottom surface of the exterior material. parts. The electronic component according to claim 1, wherein a terminal portion protruding from the convex portion has a gap from a bottom surface of the exterior material by the convex portion. The electronic component according to claim 1, wherein the exterior material is any one of a substantially rectangular parallelepiped, a substantially cube, and a substantially rectangular pillar. The electronic component according to claim 1, wherein chamfering is performed on at least one of the corners of the exterior material. The electronic component according to claim 1, wherein the protruding terminal portion increases in thickness as it goes to the tip. The electronic component according to claim 1, wherein the protruding terminal portion has a thickness that decreases toward a tip. The electronic component according to claim 1, wherein the terminal portion includes a portion where the thickness outside the exterior material is thicker than the thickness inside the exterior material. 16. The electronic component according to claim 1, wherein a reinforcing material is provided at any position on the non-mounting surface of the terminal portion. The electronic component according to claim 16, wherein the reinforcing material is formed on a peripheral portion of the non-mounting surface of the terminal portion. 18. The electronic component according to claim 1, wherein the element is a single plate capacitor having a dielectric substrate and an electrode connected to the terminal portion. 18. The multilayer capacitor having a dielectric base body in which an internal electrode is embedded and a pair of terminal portions provided on the dielectric base body, wherein the element is a multilayer capacitor. Electronic components. 20. The electronic component according to claim 19, wherein in the multilayer capacitor, the internal electrode is an electrode containing nickel as a main component, and the dielectric base is a reduction resistant material. 21. The material according to claim 1, wherein a material mainly composed of copper is used for the terminal portion, and solder having a melting point of 240 degrees or more is used for a connection portion between the element and the terminal portion. Electronic components described in 21. The electronic component according to claim 1, wherein a 42 alloy is used for the terminal portion. 23. The electronic component according to claim 1, wherein the element is an element in which a plurality of pairs of terminal portions are provided on a single substrate. The electronic component according to claim 1, wherein a plurality of the elements are sealed inside the exterior material. The electronic component according to any one of claims 1 to 24, wherein a deflection absorbing portion is provided at any position of the protruding terminal portion. 26. The deflection absorbing portion is an arcuate curved surface portion, a wavy surface, a bent portion, or a combination thereof provided at any position of the terminal portion. Electronic components described in A step of installing the element;
Connecting a pair of terminal portions to the element;
A step in which an element to which the terminal portion is connected is installed in a mold;
Pouring the melted exterior material into the mold to a level where the terminal portion protrudes from the bottom surface of the exterior material;
The manufacturing method of the electronic component characterized by having the process of solidifying the poured exterior material. 28. The method of manufacturing an electronic component according to claim 27, wherein the temperature of the terminal portion is maintained at a temperature lower than the ambient temperature in the process of solidifying the exterior material. In the process of solidifying the exterior material, by maintaining the temperature of the terminal portion at a temperature lower than the ambient temperature, the base of the terminal portion rises and solidifies more than other portions, and at the bottom surface of the exterior material 28. The convex portion is formed at a protruding portion of the terminal portion.
The manufacturing method of the electronic component in any one of thru | or 28. A dielectric substrate having an internal electrode embedded therein, a plurality of multilayer capacitors having a pair of terminal portions provided on the dielectric substrate;
A pair of lead terminals connected to the pair of terminal portions;
An exterior material covering a part of the lead terminal, the multilayer capacitor, and the terminal portion;
It has a convex part on the bottom of the exterior material,
The electronic component, wherein the lead terminal protrudes from the convex portion to the outside of the exterior material. 31. The electronic component according to claim 30, wherein the convex portion is formed at an arbitrary position on the bottom surface having an arbitrary distance from a corner portion between the bottom surface and the side surface of the exterior material. 32. The electronic component according to claim 30, wherein the convex portion is formed so as to expand toward the base of the lead terminal along the protruding lead terminal. The electronic component according to any one of claims 30 to 32, wherein the convex portion is a substantially semi-cylindrical body. The lead terminal protruding from the convex portion protrudes downward from the bottom surface of the exterior material, and is bent in a substantially L shape. The electronic component described. 35. The electronic component according to claim 34, wherein the L-shaped bent portion of the lead terminal is substantially parallel to the bottom surface of the exterior material. 36. The electronic component according to claim 34, wherein the L-shaped bending of the lead terminal is bent outward. 36. The electronic component according to claim 34, wherein the L-shaped bending of the lead terminal is bent inward. The lead terminal protruding from the convex portion is bent at the tip of the convex portion, and is substantially parallel to the bottom surface of the exterior material. Electronic components. The electronic component according to any one of claims 30 to 38, wherein the lead terminal protruding from the convex portion is not in contact with the exterior material. 40. The electronic component according to any one of claims 30 to 39, wherein the exterior material is any one of a substantially rectangular parallelepiped, a substantially cube, and a substantially rectangular pillar. 41. The electronic component according to any one of claims 30 to 40, wherein chamfering is performed on at least one of the corners of the exterior material. The electronic component according to any one of claims 30 to 41, wherein the protruding lead terminal increases in thickness toward the tip. The electronic component according to any one of claims 30 to 41, wherein the protruding lead terminal has a thickness that decreases toward a tip. 44. The electronic component according to any one of claims 30 to 43, wherein the lead terminal has a portion whose thickness outside the exterior material is thicker than the thickness inside the exterior material. The electronic component according to any one of claims 30 to 44, wherein a reinforcing material is provided at any position on the non-mounting surface of the lead terminal. 46. The electronic component according to claim 45, wherein the reinforcing material is a non-mounting surface of the lead terminal and is formed on a peripheral portion thereof. 47. The multilayer capacitor according to any one of claims 30 to 46, wherein the internal electrode is an electrode containing nickel as a main component, and the dielectric substrate is a reduction-resistant material. Electronic components. 48. The material according to claim 30, wherein a material containing copper as a main component is used for the lead terminal, and solder having a melting point of 240 degrees or more is used for a connection portion between the element and the terminal portion. Electronic components described in The electronic component according to any one of claims 30 to 48, wherein a 42 alloy is used for the lead terminal. 50. The electronic component according to any one of claims 30 to 49, wherein the element is an element in which a plurality of pairs of terminal portions are provided on a single base. The electronic component according to any one of claims 30 to 50, wherein a plurality of the elements are sealed inside the exterior material. 52. The electronic component according to any one of claims 30 to 51, wherein a deflection absorbing portion is provided at any position of the protruding lead terminal. 53. The deflection absorbing portion is an arcuate curved surface portion, a wavy surface, a bent portion, or a combination thereof provided at any position of the lead terminal. Electronic components described in A step of installing the element;
Connecting a pair of terminal portions to the element;
Connecting a pair of lead terminals to the terminal portion;
A step of installing an element connected to the lead terminal in a mold;
Pouring the melted exterior material into the mold to a level where the lead terminals protrude from the bottom surface of the exterior material;
The manufacturing method of the electronic component characterized by having the process of solidifying the poured exterior material. 55. The method of manufacturing an electronic component according to claim 54, wherein a temperature of the lead terminal is maintained at a temperature lower than an ambient temperature in the process of solidifying the exterior material. In the process of solidifying the exterior material, by maintaining the temperature of the lead terminal at a temperature lower than the ambient temperature, the root of the lead terminal rises and solidifies more than other parts, and the bottom surface of the exterior material The method of manufacturing an electronic component according to any one of claims 54 to 55, wherein the protrusion is formed at a portion where the lead terminal protrudes. The electronic component according to any one of claims 1 to 26, wherein the terminal portion protrudes from any portion of the tip or side surface of the convex portion. 54. The electronic component according to any one of claims 30 to 53, wherein the lead terminal protrudes from any portion of the tip or side surface of the convex portion.

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