CN213638340U

CN213638340U - Multilayer circuit board with high aspect ratio blind hole

Info

Publication number: CN213638340U
Application number: CN202022911682.5U
Authority: CN
Inventors: 潘康超; 潘康基; 叶俊涛
Original assignee: Guangdong Yingshuo Electronics Co ltd
Current assignee: Guangdong Yingshuo Electronics Co ltd
Priority date: 2020-12-07
Filing date: 2020-12-07
Publication date: 2021-07-06
Anticipated expiration: 2030-12-07

Abstract

The utility model discloses a multilayer circuit board with high aspect ratio blind hole, circuit board body both sides all are equipped with the protection piece, and the upper and lower both sides of protection piece all are equipped with the mounting hole, and the upper and lower both sides of circuit board body all are equipped with the buffer block, are connected with the dust screen between the protection piece, are provided with first heat-conducting plate and second heat-conducting plate in the circuit board. The utility model discloses multilayer circuit board with high aspect ratio blind hole, the mounting hole can convenience of customers installation circuit board body, the buffer block has certain buffer capacity for the rubber material, can reduce multilayer circuit board body and receive the vibrations influence, the antidetonation is prevented falling and has been obtained the promotion, prevent effectively that the circuit board from receiving the damage, the setting up of dust screen makes the dustproof ability of circuit board body obtain promoting, effectively reduce the dust accumulation, convenient clearance, the heat-conducting plate has seted up the through-hole for latticed and surface, the inside packing of through-hole has graphite alkene, can derive the heat of circuit board inside to the heating panel in, increase the area of contact of heat and air, increase the radiating effect.

Description

Multilayer circuit board with high aspect ratio blind hole

Technical Field

The utility model relates to a circuit board technical field specifically is a multilayer circuit board with high aspect ratio blind hole.

Background

The circuit board determines the technology degree of difficulty and processing price according to the quantity of wiring face, and ordinary circuit board divides the one-sided to walk the line and two-sided to walk the line, commonly known as single-sided board and double-sided board, but high-end electronic product, because of the restriction of product space design factor, except that surface wiring, inside can superpose multilayer circuit, in the production process, after making each layer of circuit, rethread optical equipment location, pressfitting lets multilayer circuit superpose in a slice circuit board. Commonly known as multilayer circuit boards. All circuit boards with 2 layers or more can be called multilayer circuit boards. The multilayer circuit board can be divided into a multilayer hard circuit board, a multilayer soft and hard circuit board and a multilayer soft and hard combined circuit board. In the prior art, the multilayer circuit board is easy to damage due to collision and poor in dustproof and heat dissipation effects, and the multilayer circuit board with the blind hole with the high aspect ratio is necessary to design aiming at the defects.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a multilayer circuit board with high aspect ratio blind hole has the good and good advantage of dustproof radiating effect of antidetonation effect, can solve the problem among the prior art.

In order to achieve the above object, the utility model provides a following technical scheme: a multilayer circuit board with high aspect ratio blind holes comprises a circuit board body, wherein protective blocks are arranged on two sides of the circuit board body, slots are formed in the inner sides of the protective blocks, two ends of the circuit board body are arranged in the slots, buffer blocks are arranged on the upper side and the lower side of the circuit board body, one side of each buffer block is connected with the circuit board body, the other side of each buffer block is connected with the protective blocks, a dustproof net is connected between the protective blocks, fixed plates are arranged at two ends of the dustproof net, one side of each fixed plate is connected with the dustproof net, through holes are formed in the other side of each fixed plate, clamping rods are arranged in the through holes, grooves are formed in the side faces of the protective blocks, one ends, far away from the dustproof nets, of the clamping rods are clamped into the grooves, sliding blocks are connected to the other ends of the clamping rods, sliding grooves, a spring is arranged between the sliding block and the inner wall of the sliding groove, one end of the spring is connected to the bottom of the sliding block, and the other end of the spring is fixed on the inner wall of the sliding groove;

a first conducting layer is arranged at the top of the circuit board body, a blind hole is formed in the first conducting layer, a second dielectric layer is arranged below the first conducting layer, a second conducting layer is arranged below the second dielectric layer, the first dielectric layer is arranged below the second conducting layer, and a third conducting layer is arranged below the first dielectric layer;

be provided with first heat-conducting plate between first conducting layer and the second medium layer, first heat-conducting plate both sides are provided with first connecting block, are provided with the second heat-conducting plate between first medium layer and the third conducting layer, second heat-conducting plate both sides are provided with the second connecting block, the left side of first heat-conducting plate and second heat-conducting plate is connected with first heating panel through first connecting block and second connecting block, the right side of first heat-conducting plate and second heat-conducting plate is connected with the second heating panel through first connecting block and second connecting block.

Preferably, the upper side and the lower side of the protection block are both provided with mounting holes.

Preferably, a first insulating layer and a second insulating layer are arranged on the upper side and the lower side of the second conducting layer, the first insulating layer is arranged between the second conducting layer and the first dielectric layer, and the second insulating layer is arranged between the second conducting layer and the second dielectric layer.

Preferably, the upper end and the lower end of the sliding block are both provided with grooves, balls are arranged in the grooves, and the balls are abutted to the inner side walls of the sliding grooves.

Preferably, the first heat-conducting plate and the second heat-conducting plate are both latticed and have through holes on the surfaces, and the through holes are filled with graphene.

Compared with the prior art, the beneficial effects of the utility model are as follows:

the multilayer circuit board with the high aspect ratio blind holes is characterized in that protective blocks are arranged on two sides of a circuit board body, mounting holes are arranged on the upper side and the lower side of each protective block, the circuit board body can be conveniently installed by a user through the mounting holes, buffer blocks are arranged on the upper side and the lower side of the circuit board body, the buffer blocks are made of rubber materials and have certain buffering capacity, the influence of vibration on the multilayer circuit board body can be reduced, the shock resistance and the falling resistance are improved, the circuit board is effectively prevented from being damaged, a dustproof net is connected between the protective blocks, the dustproof capacity of the circuit board body is improved due to the arrangement of the dustproof net, dust accumulation is effectively reduced, the circuit board is convenient to clean, a first heat conducting plate and a second heat conducting plate are arranged in the circuit board body, the first heat conducting plate and the second heat conducting plate are both in a grid shape, through holes, the contact area of heat and air is increased, and the heat dissipation effect is increased.

Drawings

FIG. 1 is a schematic side sectional view of the present invention;

FIG. 2 is a schematic view of the structure of the circuit board body of the present invention;

FIG. 3 is an enlarged view of A in FIG. 1;

fig. 4 is a schematic view of the dust screen structure of the present invention.

In the figure: 1. a protection block; 2. a circuit board body; 201. blind holes; 202. a first insulating layer; 203. a first dielectric layer; 204. a second insulating layer; 205. a second dielectric layer; 206. a first conductive layer; 207. a second conductive layer; 208. a third conductive layer; 209. a first heat dissipation plate; 210. a second heat dissipation plate; 211. a first heat-conducting plate; 212. a second heat-conducting plate; 213. a first connection block; 214. a second connecting block; 3. a dust screen; 4. a fixing plate; 5. mounting holes; 6. a slot; 7. a buffer block; 8. a clamping rod; 9. a ball bearing; 10. a spring; 11. a telescopic rod; 12. a chute; 13. a slide block.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, a multilayer circuit board with high aspect ratio blind holes comprises a circuit board body 2, wherein protective blocks 1 are respectively arranged on two sides of the circuit board body 2, mounting holes 5 are respectively arranged on the upper side and the lower side of each protective block 1, the circuit board body 2 can be conveniently installed by a user through the mounting holes 5, slots 6 are respectively arranged on the inner sides of the protective blocks 1, two ends of the circuit board body 2 are installed inside the slots 6, buffer blocks 7 are respectively arranged on the upper side and the lower side of the circuit board body 2, one surface of each buffer block 7 is connected with the circuit board body 2, the other surface of each buffer block 7 is connected with the protective block 1, each buffer block 7 is made of rubber material and has certain buffering capacity, the influence of vibration on the multilayer circuit board body 2 can be reduced, the falling resistance is improved, the circuit board is effectively prevented from being damaged, a dust screen 3 is connected between the protective, the dust accumulation is effectively reduced, the cleaning is convenient, the two ends of the dust screen 3 are provided with the fixed plates 4, one side of each fixed plate 4 is connected with the dust screen 3, the other side of each fixed plate 4 is provided with a through hole, a clamping rod 8 is arranged in each through hole, the side surface of each protective block 1 is provided with a groove, one end, far away from the dust screen 3, of each clamping rod 8 is clamped into each groove, the other end of each clamping rod 8 is connected with a sliding block 13, a sliding groove 12 is arranged in each fixed plate 4, each sliding block 13 is slidably mounted in each sliding groove 12, the upper end and the lower end of each sliding block 13 are provided with grooves, each groove is internally provided with a ball 9, each ball 9 abuts against the inner side wall of each sliding groove 12, the bottom of each sliding block 13 is connected with a telescopic rod 11, the other end of each telescopic rod 11, a spring 10 is arranged between the sliding block 13 and the inner wall of the sliding groove 12, one end of the spring 10 is connected to the bottom of the sliding block 13, and the other end of the spring 10 is fixed on the inner wall of the sliding groove 12.

The top of the circuit board body 2 is provided with a first conducting layer 206, the first conducting layer 206 is provided with a blind hole 201, a second dielectric layer 205 is arranged below the first conducting layer 206, a second conducting layer 207 is arranged below the second dielectric layer 205, a first dielectric layer 203 is arranged below the second conducting layer 207, a third conducting layer 208 is arranged below the first dielectric layer 203, a first insulating layer 202 and a second insulating layer 204 are arranged on the upper side and the lower side of the second conducting layer 207, the first insulating layer 202 is arranged between the second conducting layer 207 and the first dielectric layer 203, and the second insulating layer 204 is arranged between the second conducting layer 207 and the second dielectric layer 205.

A first heat conducting plate 211 is arranged between the first conducting layer 206 and the second conducting layer 205, first connecting blocks 213 are arranged on two sides of the first heat conducting plate 211, a second heat conducting plate 212 is arranged between the first conducting layer 203 and the third conducting layer 208, second connecting blocks 214 are arranged on two sides of the second heat conducting plate 212, the left sides of the first heat conducting plate 211 and the second heat conducting plate 212 are connected with a first heat radiating plate 209 through the first connecting blocks 213 and the second connecting blocks 214, the right sides of the first heat conducting plate 211 and the second heat conducting plate 212 are connected with a second heat radiating plate 210 through the first connecting blocks 213 and the second connecting blocks 214, the first heat conducting plate 211 and the second heat conducting plate 212 are both in a grid shape, through holes are arranged on the surfaces of the first heat conducting, the heat inside the circuit board body 2 can be conducted out to the first heat dissipation plate 209 and the second heat dissipation plate 210, so that the contact area between the heat and the air is increased, and the heat dissipation effect is increased.

In summary, according to the multilayer circuit board with the blind holes with high aspect ratio, the protection blocks 1 are arranged on both sides of the circuit board body 2, the mounting holes 5 are arranged on both the upper side and the lower side of the protection blocks 1, the circuit board body 2 can be conveniently installed by a user through the mounting holes 5, the buffer blocks 7 are arranged on both the upper side and the lower side of the circuit board body 2, the buffer blocks 7 are made of rubber materials and have certain buffer capacity, the influence of vibration on the multilayer circuit board body 2 can be reduced, the shock resistance and the falling resistance are improved, the circuit board is effectively prevented from being damaged, the dustproof mesh 3 is connected between the protection blocks 1, the dustproof capacity of the circuit board body 2 is improved through the arrangement of the dustproof mesh 3, the dust accumulation is effectively reduced, the cleaning is convenient, the first heat conduction plate 211 and the second heat conduction plate 212 are arranged in the circuit board body 2, the first, the heat inside the circuit board body 2 can be conducted out to the first heat dissipation plate 209 and the second heat dissipation plate 210, so that the contact area between the heat and the air is increased, and the heat dissipation effect is increased.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A multilayer wiring board having a high aspect ratio blind via, comprising a wiring board body (2), characterized in that: the circuit board comprises a circuit board body (2), protective blocks (1) are arranged on two sides of the circuit board body (2), slots (6) are formed in the inner sides of the protective blocks (1), two ends of the circuit board body (2) are mounted inside the slots (6), buffer blocks (7) are arranged on the upper side and the lower side of the circuit board body (2), one side of each buffer block (7) is connected with the circuit board body (2), the other side of each buffer block (7) is connected with the corresponding protective block (1), a dustproof net (3) is connected between the protective blocks (1), fixing plates (4) are arranged at two ends of each dustproof net (3), one side of each fixing plate (4) is connected with the corresponding dustproof net (3), through holes are formed in the other side of each fixing plate (4), clamping rods (8) are arranged inside the through holes, grooves are formed in the side faces of the protective blocks (1), one ends, far away from the dustproof nets (3), a sliding chute (12) is arranged in the fixed plate (4), a sliding block (13) is slidably mounted in the sliding chute (12), the bottom of the sliding block (13) is connected with an expansion link (11), the other end of the expansion link (11) is connected with the inner wall of the sliding chute (12), a spring (10) is arranged between the sliding block (13) and the inner wall of the sliding chute (12), one end of the spring (10) is connected to the bottom of the sliding block (13), and the other end of the spring (10) is fixed on the inner wall of the sliding chute (12);

a first conducting layer (206) is arranged at the top of the circuit board body (2), a blind hole (201) is formed in the first conducting layer (206), a second dielectric layer (205) is arranged below the first conducting layer (206), a second conducting layer (207) is arranged below the second dielectric layer (205), a first dielectric layer (203) is arranged below the second conducting layer (207), and a third conducting layer (208) is arranged below the first dielectric layer (203);

be provided with first heat-conducting plate (211) between first conducting layer (206) and second dielectric layer (205), first heat-conducting plate (211) both sides are provided with first connecting block (213), be provided with second heat-conducting plate (212) between first dielectric layer (203) and third conducting layer (208), second heat-conducting plate (212) both sides are provided with second connecting block (214), the left side of first heat-conducting plate (211) and second heat-conducting plate (212) is connected with first heating panel (209) through first connecting block (213) and second connecting block (214), the right side of first heat-conducting plate (211) and second heat-conducting plate (212) is connected with second heating panel (210) through first connecting block (213) and second connecting block (214).

2. A multilayer circuit board having high aspect ratio blind vias as defined in claim 1, wherein: the upper side and the lower side of the protection block (1) are both provided with mounting holes (5).

3. A multilayer circuit board having high aspect ratio blind vias as defined in claim 1, wherein: a first insulating layer (202) and a second insulating layer (204) are arranged on the upper side and the lower side of the second conducting layer (207), the first insulating layer (202) is arranged between the second conducting layer (207) and the first dielectric layer (203), and the second insulating layer (204) is arranged between the second conducting layer (207) and the second dielectric layer (205).

4. A multilayer circuit board having high aspect ratio blind vias as defined in claim 1, wherein: the upper end and the lower end of the sliding block (13) are respectively provided with a groove, a ball (9) is arranged in each groove, and the ball (9) is abutted to the inner side wall of the sliding groove (12).

5. A multilayer circuit board having high aspect ratio blind vias as defined in claim 1, wherein: first heat-conducting plate (211) and second heat-conducting plate (212) are latticed and the surface has all seted up the through-hole, and the through-hole is inside to be filled there is graphite alkene.